TSMC’s 2nm Production in 2025 to Drive Next Wave of Multi-beam Mask Writer Adoption

Mask writers are devices that use irradiation by electron beams to draw a fine electronic circuit pattern onto a template (the mask), which has been formed by a silica glass substrate with photosensitive resin.
Single-beam mask writers write data to the mask by concentrating the single electron beam on a single position over an electromagnetic field and then deflecting the beam to the position to be irradiated by the polarizer. Large circuit patterns can be created by repeating beam deflection and then moving the stage upon which the substrate is mounted. Using thousands of tiny beamlets, multi-beam mask writers can pattern or write advanced masks at a faster rate compared to VSB-based tools. With chip miniaturization making device designs more complex and requiring the use of more masks, multibeam systems are coming into demand.

Multi-beam mask writers can be categorized by production node into 7nm and above, 5nm, and 3nm and below. The 7nm and above category is used for consumer electronics such as high-performance computing devices like smartphones, tablets, and laptops, as well as data center servers and networking equipment. It is also applied in automotive systems like ADAS and infotainment systems, and in IoT devices such as smart home devices and connected sensors. The 5nm category is designed for high-performance computing (HPC) tasks, including AI and machine learning, flagship smartphone processors, and high-performance networking equipment. The 3nm and below category targets ultra-high-performance chips for next-generation consumer electronics, such as advanced smartphones and portable devices, and advanced HPC applications like next-generation data centers, supercomputers, and AI accelerators. It also supports emerging technologies in quantum computing and advanced AI systems. TSMC is expected to install and begin production of its 2nm lithography machine in 2025.

Multi-beam mask writer market can be segmented by application into wafer manufacturers and EUV mask manufacturers. Leading wafer manufacturers such as TSMC and Samsung typically produce their own photomasks to meet the demands of advanced process nodes. EUV mask manufacturers include prominent commercial photomask suppliers like Photronics and DNP, which require multi-beam mask writers to produce high-precision EUV masks. As chip manufacturing technology advances, the demand for EUV masks continues to grow, driving the expansion of the multi-beam mask writer market. The growth of the EUV mask market is primarily driven by the rapid development of the semiconductor industry, particularly in advanced process nodes where EUV masks are essential.

According to the new market research report “Global Multi-beam Mask Writer Supply, Demand and Key Producers, 2025-2031”, published by Global Info Research, the global Multi-beam Mask Writer market size is projected to reach USD 2.17 billion by 2031, at a CAGR of 13.8% during the forecast period.

Figure1. Global Multi-beam Mask Writer Market Size (US$ Million), 2020-2031

The growth of the multi-beam mask writer market is driven by several key factors. First, the increasing demand for advanced semiconductor devices in industries such as consumer electronics, automotive, telecommunications, and healthcare is driving the market for multi-beam mask writers, as these tools are essential for creating high-precision photomasks. Second, the trend toward smaller semiconductor node sizes, such as 5nm, 3nm, and beyond, has made multi-beam mask writers indispensable due to their ability to write masks faster and more precisely compared to traditional single-beam systems. Additionally, the rapid adoption of artificial intelligence (AI), the Internet of Things (IoT), and 5G technologies is fueling the need for high-performance chips, which in turn boosts the demand for efficient and high-performance mask writing systems. Finally, as chip designs become more complex, multi-beam mask writers provide the precision and throughput needed to effectively handle these intricate designs.

Figure2. Global Multi-beam Mask Writer Top 2 Players Ranking and Market Share (Ranking is based on the revenue of 2024, continually updated)

According to Global Info Research, the global main manufacturers of multi-beam mask writer include IMS Nanofabrication and NuFlare Technology. IMS Nanofabrication develop and produce the world’s first multi-beam mask writers for the global semiconductor industry. IMS Nanofabrication hold a revenue share of 81.52% in 2024.

The multi-beam mask writer industry faces numerous opportunities for development. With the continuous advancement of semiconductor technology, especially the widespread application of extreme ultraviolet lithography (EUV) technology, the demand for high-precision masks continues to grow. Leading wafer manufacturers such as TSMC and Samsung typically produce their own photomasks to meet the demands of advanced process nodes. Additionally, the growth of the EUV mask market is primarily driven by the rapid development of the semiconductor industry, particularly in the application of advanced process nodes, where EUV masks have become an essential key material. As chip manufacturing technology advances, the demand for EUV masks continues to grow, driving the expansion of the multi-beam mask writer market. Furthermore, technological progress and the impetus of emerging technologies have brought new opportunities to the industry, making multi-beam mask writers more competitive in the high-end market.

However, the multi-beam mask writer industry also faces several challenges. Firstly, there are high market entry barriers, with new entrants needing to overcome the obstacles of technical complexity and high costs. Secondly, price fluctuations and changes in supply and demand increase market uncertainty. High-performance products are priced higher, but this also means greater room for profit margin adjustment, leading to significant price fluctuations in the high-end market. Additionally, geopolitical situations and exchange rate fluctuations increase export risks, prompting some companies to accelerate the transfer of production capacity. The increasingly strict environmental regulations also bring transformation pressure to small and medium-sized enterprises. Finally, as chip designs become increasingly complex, multi-beam mask writers need to continuously innovate to meet higher precision and efficiency requirements.

Traditional e-beam lithography systems are increasingly struggling to meet the demands of smaller nodes due to limitations in writing speed and resolution. MBMWs offer a solution by using multiple beams simultaneously, significantly improving throughput and enabling finer patterning. Major semiconductor foundries and IDMs are key customers for MBMWs as they push the boundaries of Moore's Law. These companies are investing in advanced lithography tools to maintain competitiveness in the market.

The content of the study subjects, includes a total of 15 chapters
Chapter 1, to describe Multi-beam Mask Writer product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Multi-beam Mask Writer, with price, sales, revenue and global market share of Multi-beam Mask Writer from 2020 to 2025.
Chapter 3, the Multi-beam Mask Writer competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Multi-beam Mask Writer breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2020 to 2025.and Multi-beam Mask Writer market forecast, by regions, type and application, with sales and revenue, from 2025 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Multi-beam Mask Writer.
Chapter 14 and 15, to describe Multi-beam Mask Writer sales channel, distributors, customers, research findings and conclusion.

For more information, please refer to "Global Multi-beam Mask Writer Supply, Demand and Key Producers, 2025-2031". This report analyzes the supply and demand situation, development status, and changes in the industry, focusing on the development status of the industry, how to face the development challenges of the industry, industry development suggestions, industry competitiveness, and industry investment analysis and trend forecasts. The report also summarizes the overall development dynamics of the industry, including the impact of the latest US tariffs on the global supply chain, the supply relationship analysis of the industrial chain, and provides reference suggestions and specific solutions for the industry in terms of products.