Semiconductor Advanced Packaging Accounts for 77% of TGV Electroplating Machine Application

A TGV (Through-Glass Via) Electroplating Machine is specialized semiconductor processing equipment used to deposit conductive metal layers, typically copper (Cu), into microscopic vias (holes) formed in glass substrates. These machines enable the creation of vertical electrical interconnections through insulating glass, which are essential for advanced packaging, 3D integration, RF devices, MEMS, and photonic applications.

TGV Electroplating Machine Market Summary

According to the new market research report “Global TGV Electroplating Machine Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031”, published by Global Info Research, the global TGV Electroplating Machine market size is projected to reach USD 0.38 billion by 2031, at a CAGR of 7.2% during the forecast period.

Figure1. Global TGV Electroplating Machine Market Size (US$ Million), 2020-2031

Figure2. Global TGV Electroplating Machine Top 11 Players Ranking and Market Share (Ranking is based on the revenue of 2024, continually updated)

This report profiles key players of TGV Electroplating Machine such as Lam Research, HISEMICO, Applied Materials. In 2023, the global top five TGV Electroplating Machine players account for 74.42% of market share in terms of revenue. Above figure shows the key players ranked by revenue in TGV Electroplating Machine.

Figure3. TGV Electroplating Machine, Global Market Size, Split by Product Segment

In terms of product type, Automatic Type is the largest segment, hold a share of 89.26%,

Figure4. TGV Electroplating Machine, Global Market Size, Split by Application Segment

In terms of product application, Semiconductor Advanced Packaging is the largest application, hold a share of 76.74%,

Figure5. TGV Electroplating Machine, Global Market Size, Split by Region

Market Drivers:

Growing Demand for Advanced Packaging in Semiconductors

The shift toward 2.5D/3D IC packaging, heterogeneous integration, and high-density interconnects drives the adoption of TGV technology, which requires precision electroplating equipment.

Rising Applications in High-Performance Computing and 5G/AI Devices

The need for faster signal transmission, lower latency, and miniaturization in 5G base stations, AI accelerators, and data centers accelerates the use of glass substrates with TGVs, boosting demand for electroplating machines.

Restraint:

High Manufacturing and Equipment Costs

TGV electroplating machines require advanced precision engineering, specialized plating chemistries, and high capital investment, which limits adoption, especially for small and mid-sized fabs.

Process Complexity and Yield Challenges

Achieving uniform metal deposition inside deep and narrow vias is technically challenging, and yield losses during plating or subsequent steps (CMP, annealing) increase production costs and slow down scaling.

Opportunity:

Rising Adoption of 3D and 2.5D IC Packaging

Increasing demand for high-density interconnects and miniaturized electronics in smartphones, AI accelerators, and high-performance computing drives growth for TGV technology and related electroplating machines.

Expansion of 5G, AI, and IoT Applications

The proliferation of 5G networks, AI chips, and IoT devices requires faster, smaller, and more reliable interconnects, creating opportunities for TGV-based glass substrates and advanced electroplating equipment.

The subject content of the TGV Electroplating Machine report research consists of 13 chapters:
Chapter 1, to describe TGV Electroplating Machine product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top players of TGV Electroplating Machine, with revenue, gross margin, and global market share of TGV Electroplating Machine from 2019 to 2024.
Chapter 3, the TGV Electroplating Machine competitive situation, revenue, and global market share of top players are analyzed emphatically by landscape contrast.
Chapter 4 and 5, to segment the market size by Type and by Application, with consumption value and growth rate by Type, by Application, from 2019 to 2030.
Chapter 6, 7, 8, 9, and 10, to break the market size data at the country level, with revenue and market share for key countries in the world, from 2019 to 2024.and TGV Electroplating Machine market forecast, by regions, by Type and by Application, with consumption value, from 2025 to 2031.
Chapter 11, market dynamics, drivers, restraints, trends, Porters Five Forces analysis.
Chapter 12, the key raw materials and key suppliers, and industry chain of TGV Electroplating Machine.
Chapter 13, to describe TGV Electroplating Machine research findings and conclusion.

For more information, please refer to "Global TGV Electroplating Machine Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031". This report analyzes the supply and demand situation, development status, and changes in the industry, focusing on the development status of the industry, how to face the development challenges of the industry, industry development suggestions, industry competitiveness, and industry investment analysis and trend forecasts. The report also summarizes the overall development dynamics of the industry, including the impact of the latest US tariffs on the global supply chain, the supply relationship analysis of the industrial chain, and provides reference suggestions and specific solutions for the industry in terms of products.