Global IC Packaging Solder Ball Supply, Demand and Key Producers, 2023-2029

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Published Date: 25 Aug 2023

Category: Electronics & Semiconductor

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Description
Table of Contents
Table of Figures
Research Methodology
Companies Mentioned
Related Reports
Product Tags

Description

The global IC Packaging Solder Ball market size is expected to reach $ 380.4 million by 2029, rising at a market growth of 6.2% CAGR during the forecast period (2023-2029).

Senju Metal, Accurus and DS HiMetal occupy more than 73% of the global market share.

In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules. The Solder Ball can be placed manually or by automated equipment, and are held in place with a tacky flux.

Solder Ball are very small spheres of high-purity solder for micro soldering system. The most important advantages of Solder Ball are their very clean surfaces and exact solder quantity control. Most suitable for Ball Grid Array, Multi-Chip Module, Chip On board Flip Chip and CSP.

This report studies the global IC Packaging Solder Ball production, demand, key manufacturers, and key regions.

This report is a detailed and comprehensive analysis of the world market for IC Packaging Solder Ball, and provides market size (US$ million) and Year-over-Year (YoY) Growth, considering 2022 as the base year. This report explores demand trends and competition, as well as details the characteristics of IC Packaging Solder Ball that contribute to its increasing demand across many markets.

Highlights and key features of the study
Global IC Packaging Solder Ball total production and demand, 2018-2029, (Million Units)
Global IC Packaging Solder Ball total production value, 2018-2029, (USD Million)
Global IC Packaging Solder Ball production by region & country, production, value, CAGR, 2018-2029, (USD Million) & (Million Units)
Global IC Packaging Solder Ball consumption by region & country, CAGR, 2018-2029 & (Million Units)
U.S. VS China: IC Packaging Solder Ball domestic production, consumption, key domestic manufacturers and share
Global IC Packaging Solder Ball production by manufacturer, production, price, value and market share 2018-2023, (USD Million) & (Million Units)
Global IC Packaging Solder Ball production by Type, production, value, CAGR, 2018-2029, (USD Million) & (Million Units)
Global IC Packaging Solder Ball production by Application production, value, CAGR, 2018-2029, (USD Million) & (Million Units).

This reports profiles key players in the global IC Packaging Solder Ball market based on the following parameters – company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Senju Metal, DS HiMetal, MKE, YCTC, Nippon Micrometal, Accurus, PMTC, Shanghai hiking solder material and Shenmao Technology, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals, COVID-19 and Russia-Ukraine War Influence.

Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World IC Packaging Solder Ball market.

Detailed Segmentation:
Each section contains quantitative market data including market by value (US$ Millions), volume (production, consumption) & (Million Units) and average price (USD/Million Units) by manufacturer, by Type, and by Application. Data is given for the years 2018-2029 by year with 2022 as the base year, 2023 as the estimate year, and 2024-2029 as the forecast year.

Global IC Packaging Solder Ball Market, By Region:
United States
China
Europe
Japan
South Korea
ASEAN
India
Rest of World

Global IC Packaging Solder Ball Market, Segmentation by Type
Lead Solder Ball
Lead Free Solder Ball

Global IC Packaging Solder Ball Market, Segmentation by Application
BGA
CSP & WLCSP
Flip-Chip & Others

Companies Profiled:
Senju Metal
DS HiMetal
MKE
YCTC
Nippon Micrometal
Accurus
PMTC
Shanghai hiking solder material
Shenmao Technology
Indium Corporation
Jovy Systems

Key Questions Answered
1. How big is the global IC Packaging Solder Ball market?
2. What is the demand of the global IC Packaging Solder Ball market?
3. What is the year over year growth of the global IC Packaging Solder Ball market?
4. What is the production and production value of the global IC Packaging Solder Ball market?
5. Who are the key producers in the global IC Packaging Solder Ball market?

Table of Contents

1 Supply Summary
    1.1 IC Packaging Solder Ball Introduction
    1.2 World IC Packaging Solder Ball Supply & Forecast
        1.2.1 World IC Packaging Solder Ball Production Value (2018 & 2022 & 2029)
        1.2.2 World IC Packaging Solder Ball Production (2018-2029)
        1.2.3 World IC Packaging Solder Ball Pricing Trends (2018-2029)
    1.3 World IC Packaging Solder Ball Production by Region (Based on Production Site)
        1.3.1 World IC Packaging Solder Ball Production Value by Region (2018-2029)
        1.3.2 World IC Packaging Solder Ball Production by Region (2018-2029)
        1.3.3 World IC Packaging Solder Ball Average Price by Region (2018-2029)
        1.3.4 North America IC Packaging Solder Ball Production (2018-2029)
        1.3.5 Europe IC Packaging Solder Ball Production (2018-2029)
        1.3.6 China IC Packaging Solder Ball Production (2018-2029)
        1.3.7 Japan IC Packaging Solder Ball Production (2018-2029)
        1.3.8 South Korea IC Packaging Solder Ball Production (2018-2029)
    1.4 Market Drivers, Restraints and Trends
        1.4.1 IC Packaging Solder Ball Market Drivers
        1.4.2 Factors Affecting Demand
        1.4.3 IC Packaging Solder Ball Major Market Trends

2 Demand Summary
    2.1 World IC Packaging Solder Ball Demand (2018-2029)
    2.2 World IC Packaging Solder Ball Consumption by Region
        2.2.1 World IC Packaging Solder Ball Consumption by Region (2018-2023)
        2.2.2 World IC Packaging Solder Ball Consumption Forecast by Region (2024-2029)
    2.3 United States IC Packaging Solder Ball Consumption (2018-2029)
    2.4 China IC Packaging Solder Ball Consumption (2018-2029)
    2.5 Europe IC Packaging Solder Ball Consumption (2018-2029)
    2.6 Japan IC Packaging Solder Ball Consumption (2018-2029)
    2.7 South Korea IC Packaging Solder Ball Consumption (2018-2029)
    2.8 ASEAN IC Packaging Solder Ball Consumption (2018-2029)
    2.9 India IC Packaging Solder Ball Consumption (2018-2029)

3 World IC Packaging Solder Ball Manufacturers Competitive Analysis
    3.1 World IC Packaging Solder Ball Production Value by Manufacturer (2018-2023)
    3.2 World IC Packaging Solder Ball Production by Manufacturer (2018-2023)
    3.3 World IC Packaging Solder Ball Average Price by Manufacturer (2018-2023)
    3.4 IC Packaging Solder Ball Company Evaluation Quadrant
    3.5 Industry Rank and Concentration Rate (CR)
        3.5.1 Global IC Packaging Solder Ball Industry Rank of Major Manufacturers
        3.5.2 Global Concentration Ratios (CR4) for IC Packaging Solder Ball in 2022
        3.5.3 Global Concentration Ratios (CR8) for IC Packaging Solder Ball in 2022
    3.6 IC Packaging Solder Ball Market: Overall Company Footprint Analysis
        3.6.1 IC Packaging Solder Ball Market: Region Footprint
        3.6.2 IC Packaging Solder Ball Market: Company Product Type Footprint
        3.6.3 IC Packaging Solder Ball Market: Company Product Application Footprint
    3.7 Competitive Environment
        3.7.1 Historical Structure of the Industry
        3.7.2 Barriers of Market Entry
        3.7.3 Factors of Competition
    3.8 New Entrant and Capacity Expansion Plans
    3.9 Mergers, Acquisition, Agreements, and Collaborations

4 United States VS China VS Rest of the World
    4.1 United States VS China: IC Packaging Solder Ball Production Value Comparison
        4.1.1 United States VS China: IC Packaging Solder Ball Production Value Comparison (2018 & 2022 & 2029)
        4.1.2 United States VS China: IC Packaging Solder Ball Production Value Market Share Comparison (2018 & 2022 & 2029)
    4.2 United States VS China: IC Packaging Solder Ball Production Comparison
        4.2.1 United States VS China: IC Packaging Solder Ball Production Comparison (2018 & 2022 & 2029)
        4.2.2 United States VS China: IC Packaging Solder Ball Production Market Share Comparison (2018 & 2022 & 2029)
    4.3 United States VS China: IC Packaging Solder Ball Consumption Comparison
        4.3.1 United States VS China: IC Packaging Solder Ball Consumption Comparison (2018 & 2022 & 2029)
        4.3.2 United States VS China: IC Packaging Solder Ball Consumption Market Share Comparison (2018 & 2022 & 2029)
    4.4 United States Based IC Packaging Solder Ball Manufacturers and Market Share, 2018-2023
        4.4.1 United States Based IC Packaging Solder Ball Manufacturers, Headquarters and Production Site (States, Country)
        4.4.2 United States Based Manufacturers IC Packaging Solder Ball Production Value (2018-2023)
        4.4.3 United States Based Manufacturers IC Packaging Solder Ball Production (2018-2023)
    4.5 China Based IC Packaging Solder Ball Manufacturers and Market Share
        4.5.1 China Based IC Packaging Solder Ball Manufacturers, Headquarters and Production Site (Province, Country)
        4.5.2 China Based Manufacturers IC Packaging Solder Ball Production Value (2018-2023)
        4.5.3 China Based Manufacturers IC Packaging Solder Ball Production (2018-2023)
    4.6 Rest of World Based IC Packaging Solder Ball Manufacturers and Market Share, 2018-2023
        4.6.1 Rest of World Based IC Packaging Solder Ball Manufacturers, Headquarters and Production Site (State, Country)
        4.6.2 Rest of World Based Manufacturers IC Packaging Solder Ball Production Value (2018-2023)
        4.6.3 Rest of World Based Manufacturers IC Packaging Solder Ball Production (2018-2023)

5 Market Analysis by Type
    5.1 World IC Packaging Solder Ball Market Size Overview by Type: 2018 VS 2022 VS 2029
    5.2 Segment Introduction by Type
        5.2.1 Lead Solder Ball
        5.2.2 Lead Free Solder Ball
    5.3 Market Segment by Type
        5.3.1 World IC Packaging Solder Ball Production by Type (2018-2029)
        5.3.2 World IC Packaging Solder Ball Production Value by Type (2018-2029)
        5.3.3 World IC Packaging Solder Ball Average Price by Type (2018-2029)

6 Market Analysis by Application
    6.1 World IC Packaging Solder Ball Market Size Overview by Application: 2018 VS 2022 VS 2029
    6.2 Segment Introduction by Application
        6.2.1 BGA
        6.2.2 CSP & WLCSP
        6.2.3 Flip-Chip & Others
    6.3 Market Segment by Application
        6.3.1 World IC Packaging Solder Ball Production by Application (2018-2029)
        6.3.2 World IC Packaging Solder Ball Production Value by Application (2018-2029)
        6.3.3 World IC Packaging Solder Ball Average Price by Application (2018-2029)

7 Company Profiles
    7.1 Senju Metal
        7.1.1 Senju Metal Details
        7.1.2 Senju Metal Major Business
        7.1.3 Senju Metal IC Packaging Solder Ball Product and Services
        7.1.4 Senju Metal IC Packaging Solder Ball Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.1.5 Senju Metal Recent Developments/Updates
        7.1.6 Senju Metal Competitive Strengths & Weaknesses
    7.2 DS HiMetal
        7.2.1 DS HiMetal Details
        7.2.2 DS HiMetal Major Business
        7.2.3 DS HiMetal IC Packaging Solder Ball Product and Services
        7.2.4 DS HiMetal IC Packaging Solder Ball Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.2.5 DS HiMetal Recent Developments/Updates
        7.2.6 DS HiMetal Competitive Strengths & Weaknesses
    7.3 MKE
        7.3.1 MKE Details
        7.3.2 MKE Major Business
        7.3.3 MKE IC Packaging Solder Ball Product and Services
        7.3.4 MKE IC Packaging Solder Ball Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.3.5 MKE Recent Developments/Updates
        7.3.6 MKE Competitive Strengths & Weaknesses
    7.4 YCTC
        7.4.1 YCTC Details
        7.4.2 YCTC Major Business
        7.4.3 YCTC IC Packaging Solder Ball Product and Services
        7.4.4 YCTC IC Packaging Solder Ball Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.4.5 YCTC Recent Developments/Updates
        7.4.6 YCTC Competitive Strengths & Weaknesses
    7.5 Nippon Micrometal
        7.5.1 Nippon Micrometal Details
        7.5.2 Nippon Micrometal Major Business
        7.5.3 Nippon Micrometal IC Packaging Solder Ball Product and Services
        7.5.4 Nippon Micrometal IC Packaging Solder Ball Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.5.5 Nippon Micrometal Recent Developments/Updates
        7.5.6 Nippon Micrometal Competitive Strengths & Weaknesses
    7.6 Accurus
        7.6.1 Accurus Details
        7.6.2 Accurus Major Business
        7.6.3 Accurus IC Packaging Solder Ball Product and Services
        7.6.4 Accurus IC Packaging Solder Ball Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.6.5 Accurus Recent Developments/Updates
        7.6.6 Accurus Competitive Strengths & Weaknesses
    7.7 PMTC
        7.7.1 PMTC Details
        7.7.2 PMTC Major Business
        7.7.3 PMTC IC Packaging Solder Ball Product and Services
        7.7.4 PMTC IC Packaging Solder Ball Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.7.5 PMTC Recent Developments/Updates
        7.7.6 PMTC Competitive Strengths & Weaknesses
    7.8 Shanghai hiking solder material
        7.8.1 Shanghai hiking solder material Details
        7.8.2 Shanghai hiking solder material Major Business
        7.8.3 Shanghai hiking solder material IC Packaging Solder Ball Product and Services
        7.8.4 Shanghai hiking solder material IC Packaging Solder Ball Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.8.5 Shanghai hiking solder material Recent Developments/Updates
        7.8.6 Shanghai hiking solder material Competitive Strengths & Weaknesses
    7.9 Shenmao Technology
        7.9.1 Shenmao Technology Details
        7.9.2 Shenmao Technology Major Business
        7.9.3 Shenmao Technology IC Packaging Solder Ball Product and Services
        7.9.4 Shenmao Technology IC Packaging Solder Ball Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.9.5 Shenmao Technology Recent Developments/Updates
        7.9.6 Shenmao Technology Competitive Strengths & Weaknesses
    7.10 Indium Corporation
        7.10.1 Indium Corporation Details
        7.10.2 Indium Corporation Major Business
        7.10.3 Indium Corporation IC Packaging Solder Ball Product and Services
        7.10.4 Indium Corporation IC Packaging Solder Ball Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.10.5 Indium Corporation Recent Developments/Updates
        7.10.6 Indium Corporation Competitive Strengths & Weaknesses
    7.11 Jovy Systems
        7.11.1 Jovy Systems Details
        7.11.2 Jovy Systems Major Business
        7.11.3 Jovy Systems IC Packaging Solder Ball Product and Services
        7.11.4 Jovy Systems IC Packaging Solder Ball Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.11.5 Jovy Systems Recent Developments/Updates
        7.11.6 Jovy Systems Competitive Strengths & Weaknesses

8 Industry Chain Analysis
    8.1 IC Packaging Solder Ball Industry Chain
    8.2 IC Packaging Solder Ball Upstream Analysis
        8.2.1 IC Packaging Solder Ball Core Raw Materials
        8.2.2 Main Manufacturers of IC Packaging Solder Ball Core Raw Materials
    8.3 Midstream Analysis
    8.4 Downstream Analysis
    8.5 IC Packaging Solder Ball Production Mode
    8.6 IC Packaging Solder Ball Procurement Model
    8.7 IC Packaging Solder Ball Industry Sales Model and Sales Channels
        8.7.1 IC Packaging Solder Ball Sales Model
        8.7.2 IC Packaging Solder Ball Typical Customers

9 Research Findings and Conclusion

10 Appendix
    10.1 Methodology
    10.2 Research Process and Data Source
    10.3 Disclaimer

Table of Figures

List of Tables
    Table 1. World IC Packaging Solder Ball Production Value by Region (2018, 2022 and 2029) & (USD Million)
    Table 2. World IC Packaging Solder Ball Production Value by Region (2018-2023) & (USD Million)
    Table 3. World IC Packaging Solder Ball Production Value by Region (2024-2029) & (USD Million)
    Table 4. World IC Packaging Solder Ball Production Value Market Share by Region (2018-2023)
    Table 5. World IC Packaging Solder Ball Production Value Market Share by Region (2024-2029)
    Table 6. World IC Packaging Solder Ball Production by Region (2018-2023) & (Million Units)
    Table 7. World IC Packaging Solder Ball Production by Region (2024-2029) & (Million Units)
    Table 8. World IC Packaging Solder Ball Production Market Share by Region (2018-2023)
    Table 9. World IC Packaging Solder Ball Production Market Share by Region (2024-2029)
    Table 10. World IC Packaging Solder Ball Average Price by Region (2018-2023) & (USD/Million Units)
    Table 11. World IC Packaging Solder Ball Average Price by Region (2024-2029) & (USD/Million Units)
    Table 12. IC Packaging Solder Ball Major Market Trends
    Table 13. World IC Packaging Solder Ball Consumption Growth Rate Forecast by Region (2018 & 2022 & 2029) & (Million Units)
    Table 14. World IC Packaging Solder Ball Consumption by Region (2018-2023) & (Million Units)
    Table 15. World IC Packaging Solder Ball Consumption Forecast by Region (2024-2029) & (Million Units)
    Table 16. World IC Packaging Solder Ball Production Value by Manufacturer (2018-2023) & (USD Million)
    Table 17. Production Value Market Share of Key IC Packaging Solder Ball Producers in 2022
    Table 18. World IC Packaging Solder Ball Production by Manufacturer (2018-2023) & (Million Units)
    Table 19. Production Market Share of Key IC Packaging Solder Ball Producers in 2022
    Table 20. World IC Packaging Solder Ball Average Price by Manufacturer (2018-2023) & (USD/Million Units)
    Table 21. Global IC Packaging Solder Ball Company Evaluation Quadrant
    Table 22. World IC Packaging Solder Ball Industry Rank of Major Manufacturers, Based on Production Value in 2022
    Table 23. Head Office and IC Packaging Solder Ball Production Site of Key Manufacturer
    Table 24. IC Packaging Solder Ball Market: Company Product Type Footprint
    Table 25. IC Packaging Solder Ball Market: Company Product Application Footprint
    Table 26. IC Packaging Solder Ball Competitive Factors
    Table 27. IC Packaging Solder Ball New Entrant and Capacity Expansion Plans
    Table 28. IC Packaging Solder Ball Mergers & Acquisitions Activity
    Table 29. United States VS China IC Packaging Solder Ball Production Value Comparison, (2018 & 2022 & 2029) & (USD Million)
    Table 30. United States VS China IC Packaging Solder Ball Production Comparison, (2018 & 2022 & 2029) & (Million Units)
    Table 31. United States VS China IC Packaging Solder Ball Consumption Comparison, (2018 & 2022 & 2029) & (Million Units)
    Table 32. United States Based IC Packaging Solder Ball Manufacturers, Headquarters and Production Site (States, Country)
    Table 33. United States Based Manufacturers IC Packaging Solder Ball Production Value, (2018-2023) & (USD Million)
    Table 34. United States Based Manufacturers IC Packaging Solder Ball Production Value Market Share (2018-2023)
    Table 35. United States Based Manufacturers IC Packaging Solder Ball Production (2018-2023) & (Million Units)
    Table 36. United States Based Manufacturers IC Packaging Solder Ball Production Market Share (2018-2023)
    Table 37. China Based IC Packaging Solder Ball Manufacturers, Headquarters and Production Site (Province, Country)
    Table 38. China Based Manufacturers IC Packaging Solder Ball Production Value, (2018-2023) & (USD Million)
    Table 39. China Based Manufacturers IC Packaging Solder Ball Production Value Market Share (2018-2023)
    Table 40. China Based Manufacturers IC Packaging Solder Ball Production (2018-2023) & (Million Units)
    Table 41. China Based Manufacturers IC Packaging Solder Ball Production Market Share (2018-2023)
    Table 42. Rest of World Based IC Packaging Solder Ball Manufacturers, Headquarters and Production Site (States, Country)
    Table 43. Rest of World Based Manufacturers IC Packaging Solder Ball Production Value, (2018-2023) & (USD Million)
    Table 44. Rest of World Based Manufacturers IC Packaging Solder Ball Production Value Market Share (2018-2023)
    Table 45. Rest of World Based Manufacturers IC Packaging Solder Ball Production (2018-2023) & (Million Units)
    Table 46. Rest of World Based Manufacturers IC Packaging Solder Ball Production Market Share (2018-2023)
    Table 47. World IC Packaging Solder Ball Production Value by Type, (USD Million), 2018 & 2022 & 2029
    Table 48. World IC Packaging Solder Ball Production by Type (2018-2023) & (Million Units)
    Table 49. World IC Packaging Solder Ball Production by Type (2024-2029) & (Million Units)
    Table 50. World IC Packaging Solder Ball Production Value by Type (2018-2023) & (USD Million)
    Table 51. World IC Packaging Solder Ball Production Value by Type (2024-2029) & (USD Million)
    Table 52. World IC Packaging Solder Ball Average Price by Type (2018-2023) & (USD/Million Units)
    Table 53. World IC Packaging Solder Ball Average Price by Type (2024-2029) & (USD/Million Units)
    Table 54. World IC Packaging Solder Ball Production Value by Application, (USD Million), 2018 & 2022 & 2029
    Table 55. World IC Packaging Solder Ball Production by Application (2018-2023) & (Million Units)
    Table 56. World IC Packaging Solder Ball Production by Application (2024-2029) & (Million Units)
    Table 57. World IC Packaging Solder Ball Production Value by Application (2018-2023) & (USD Million)
    Table 58. World IC Packaging Solder Ball Production Value by Application (2024-2029) & (USD Million)
    Table 59. World IC Packaging Solder Ball Average Price by Application (2018-2023) & (USD/Million Units)
    Table 60. World IC Packaging Solder Ball Average Price by Application (2024-2029) & (USD/Million Units)
    Table 61. Senju Metal Basic Information, Manufacturing Base and Competitors
    Table 62. Senju Metal Major Business
    Table 63. Senju Metal IC Packaging Solder Ball Product and Services
    Table 64. Senju Metal IC Packaging Solder Ball Production (Million Units), Price (USD/Million Units), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 65. Senju Metal Recent Developments/Updates
    Table 66. Senju Metal Competitive Strengths & Weaknesses
    Table 67. DS HiMetal Basic Information, Manufacturing Base and Competitors
    Table 68. DS HiMetal Major Business
    Table 69. DS HiMetal IC Packaging Solder Ball Product and Services
    Table 70. DS HiMetal IC Packaging Solder Ball Production (Million Units), Price (USD/Million Units), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 71. DS HiMetal Recent Developments/Updates
    Table 72. DS HiMetal Competitive Strengths & Weaknesses
    Table 73. MKE Basic Information, Manufacturing Base and Competitors
    Table 74. MKE Major Business
    Table 75. MKE IC Packaging Solder Ball Product and Services
    Table 76. MKE IC Packaging Solder Ball Production (Million Units), Price (USD/Million Units), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 77. MKE Recent Developments/Updates
    Table 78. MKE Competitive Strengths & Weaknesses
    Table 79. YCTC Basic Information, Manufacturing Base and Competitors
    Table 80. YCTC Major Business
    Table 81. YCTC IC Packaging Solder Ball Product and Services
    Table 82. YCTC IC Packaging Solder Ball Production (Million Units), Price (USD/Million Units), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 83. YCTC Recent Developments/Updates
    Table 84. YCTC Competitive Strengths & Weaknesses
    Table 85. Nippon Micrometal Basic Information, Manufacturing Base and Competitors
    Table 86. Nippon Micrometal Major Business
    Table 87. Nippon Micrometal IC Packaging Solder Ball Product and Services
    Table 88. Nippon Micrometal IC Packaging Solder Ball Production (Million Units), Price (USD/Million Units), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 89. Nippon Micrometal Recent Developments/Updates
    Table 90. Nippon Micrometal Competitive Strengths & Weaknesses
    Table 91. Accurus Basic Information, Manufacturing Base and Competitors
    Table 92. Accurus Major Business
    Table 93. Accurus IC Packaging Solder Ball Product and Services
    Table 94. Accurus IC Packaging Solder Ball Production (Million Units), Price (USD/Million Units), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 95. Accurus Recent Developments/Updates
    Table 96. Accurus Competitive Strengths & Weaknesses
    Table 97. PMTC Basic Information, Manufacturing Base and Competitors
    Table 98. PMTC Major Business
    Table 99. PMTC IC Packaging Solder Ball Product and Services
    Table 100. PMTC IC Packaging Solder Ball Production (Million Units), Price (USD/Million Units), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 101. PMTC Recent Developments/Updates
    Table 102. PMTC Competitive Strengths & Weaknesses
    Table 103. Shanghai hiking solder material Basic Information, Manufacturing Base and Competitors
    Table 104. Shanghai hiking solder material Major Business
    Table 105. Shanghai hiking solder material IC Packaging Solder Ball Product and Services
    Table 106. Shanghai hiking solder material IC Packaging Solder Ball Production (Million Units), Price (USD/Million Units), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 107. Shanghai hiking solder material Recent Developments/Updates
    Table 108. Shanghai hiking solder material Competitive Strengths & Weaknesses
    Table 109. Shenmao Technology Basic Information, Manufacturing Base and Competitors
    Table 110. Shenmao Technology Major Business
    Table 111. Shenmao Technology IC Packaging Solder Ball Product and Services
    Table 112. Shenmao Technology IC Packaging Solder Ball Production (Million Units), Price (USD/Million Units), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 113. Shenmao Technology Recent Developments/Updates
    Table 114. Shenmao Technology Competitive Strengths & Weaknesses
    Table 115. Indium Corporation Basic Information, Manufacturing Base and Competitors
    Table 116. Indium Corporation Major Business
    Table 117. Indium Corporation IC Packaging Solder Ball Product and Services
    Table 118. Indium Corporation IC Packaging Solder Ball Production (Million Units), Price (USD/Million Units), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 119. Indium Corporation Recent Developments/Updates
    Table 120. Jovy Systems Basic Information, Manufacturing Base and Competitors
    Table 121. Jovy Systems Major Business
    Table 122. Jovy Systems IC Packaging Solder Ball Product and Services
    Table 123. Jovy Systems IC Packaging Solder Ball Production (Million Units), Price (USD/Million Units), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 124. Global Key Players of IC Packaging Solder Ball Upstream (Raw Materials)
    Table 125. IC Packaging Solder Ball Typical Customers
    Table 126. IC Packaging Solder Ball Typical Distributors
List of Figure
    Figure 1. IC Packaging Solder Ball Picture
    Figure 2. World IC Packaging Solder Ball Production Value: 2018 & 2022 & 2029, (USD Million)
    Figure 3. World IC Packaging Solder Ball Production Value and Forecast (2018-2029) & (USD Million)
    Figure 4. World IC Packaging Solder Ball Production (2018-2029) & (Million Units)
    Figure 5. World IC Packaging Solder Ball Average Price (2018-2029) & (USD/Million Units)
    Figure 6. World IC Packaging Solder Ball Production Value Market Share by Region (2018-2029)
    Figure 7. World IC Packaging Solder Ball Production Market Share by Region (2018-2029)
    Figure 8. North America IC Packaging Solder Ball Production (2018-2029) & (Million Units)
    Figure 9. Europe IC Packaging Solder Ball Production (2018-2029) & (Million Units)
    Figure 10. China IC Packaging Solder Ball Production (2018-2029) & (Million Units)
    Figure 11. Japan IC Packaging Solder Ball Production (2018-2029) & (Million Units)
    Figure 12. South Korea IC Packaging Solder Ball Production (2018-2029) & (Million Units)
    Figure 13. IC Packaging Solder Ball Market Drivers
    Figure 14. Factors Affecting Demand
    Figure 15. World IC Packaging Solder Ball Consumption (2018-2029) & (Million Units)
    Figure 16. World IC Packaging Solder Ball Consumption Market Share by Region (2018-2029)
    Figure 17. United States IC Packaging Solder Ball Consumption (2018-2029) & (Million Units)
    Figure 18. China IC Packaging Solder Ball Consumption (2018-2029) & (Million Units)
    Figure 19. Europe IC Packaging Solder Ball Consumption (2018-2029) & (Million Units)
    Figure 20. Japan IC Packaging Solder Ball Consumption (2018-2029) & (Million Units)
    Figure 21. South Korea IC Packaging Solder Ball Consumption (2018-2029) & (Million Units)
    Figure 22. ASEAN IC Packaging Solder Ball Consumption (2018-2029) & (Million Units)
    Figure 23. India IC Packaging Solder Ball Consumption (2018-2029) & (Million Units)
    Figure 24. Producer Shipments of IC Packaging Solder Ball by Manufacturer Revenue ($MM) and Market Share (%): 2022
    Figure 25. Global Four-firm Concentration Ratios (CR4) for IC Packaging Solder Ball Markets in 2022
    Figure 26. Global Four-firm Concentration Ratios (CR8) for IC Packaging Solder Ball Markets in 2022
    Figure 27. United States VS China: IC Packaging Solder Ball Production Value Market Share Comparison (2018 & 2022 & 2029)
    Figure 28. United States VS China: IC Packaging Solder Ball Production Market Share Comparison (2018 & 2022 & 2029)
    Figure 29. United States VS China: IC Packaging Solder Ball Consumption Market Share Comparison (2018 & 2022 & 2029)
    Figure 30. United States Based Manufacturers IC Packaging Solder Ball Production Market Share 2022
    Figure 31. China Based Manufacturers IC Packaging Solder Ball Production Market Share 2022
    Figure 32. Rest of World Based Manufacturers IC Packaging Solder Ball Production Market Share 2022
    Figure 33. World IC Packaging Solder Ball Production Value by Type, (USD Million), 2018 & 2022 & 2029
    Figure 34. World IC Packaging Solder Ball Production Value Market Share by Type in 2022
    Figure 35. Lead Solder Ball
    Figure 36. Lead Free Solder Ball
    Figure 37. World IC Packaging Solder Ball Production Market Share by Type (2018-2029)
    Figure 38. World IC Packaging Solder Ball Production Value Market Share by Type (2018-2029)
    Figure 39. World IC Packaging Solder Ball Average Price by Type (2018-2029) & (USD/Million Units)
    Figure 40. World IC Packaging Solder Ball Production Value by Application, (USD Million), 2018 & 2022 & 2029
    Figure 41. World IC Packaging Solder Ball Production Value Market Share by Application in 2022
    Figure 42. BGA
    Figure 43. CSP & WLCSP
    Figure 44. Flip-Chip & Others
    Figure 45. World IC Packaging Solder Ball Production Market Share by Application (2018-2029)
    Figure 46. World IC Packaging Solder Ball Production Value Market Share by Application (2018-2029)
    Figure 47. World IC Packaging Solder Ball Average Price by Application (2018-2029) & (USD/Million Units)
    Figure 48. IC Packaging Solder Ball Industry Chain
    Figure 49. IC Packaging Solder Ball Procurement Model
    Figure 50. IC Packaging Solder Ball Sales Model
    Figure 51. IC Packaging Solder Ball Sales Channels, Direct Sales, and Distribution
    Figure 52. Methodology
    Figure 53. Research Process and Data Source

Research Methodology

Client Requirements

Review and analyze client requirements

Discussion of all the project requirements and queries

Flexibility Check

Project Feasibility Analysis

Finalizing tentative research programme

Structuring project proposal with scope, timeline, and costs

Analyzing Market Dynamics

Determination of key drivers, restraints, challenge, and opportunity

Identifies market needs and trends

Market Size Estimation & Forecast

Estimation of historical data based on secondary and primary data

Anticipating market recast by assigning weightage to market forces (drivers, restraints, opportunities)

Freezing historical and forecast market size estimations based on evolution, trends, outlook, and strategies

Consideration of geography, region-specific product/service demand for region segments

Consideration of product utilization rates, product demand outlook for segments by application or end-user.

Data Source

Secondary Source
Data collections from annual reports, presentations,associations, journals, analyst reports, paid database, press releases, blogs, newsletters,and GIR repositories.

Primary Source
Research discussion with manufacturers, distributors, suppliers, end user, industry experts to verify insights.

Validation and
triangulation of
secondary and primary source.

Collection of data

Cumulating and collating the essential qualitative and quantitative data

Generation of report in client requested format by research analysts

Reviews by expert analysts

Final quality check

Clarifying queries

Receiving feedback

Ensuring satisfaction

01 Identification of data

This step involves identification of several primary and secondary data research sources, including Global Info Research's internal data sources. The primary sources consist of in-depth discussions and interviews with policy makers, industry experts, and data evaluators, whereas secondary sources include a thorough study of market journals, press releases, annual reports, and government and non-government agencies websites.
02 Evaluation of Market Dynamic

This phase includes a detailed evaluation of several factors that are likely to affect the market dynamics. It involves a comprehensive assessment of major market pain points, drivers, and trends. It also comprises a detailed study of research plans and methodology.
03 Collection of Data

This process consists of gathering data, accessing proprietary databases, and reaching out to key industry participants that operate in the market across the value chain. It also involves studying several patterns in the historical data and comparing it with the current scenario.
04 Collaboration of Data

This stage involves the validation of data and arrival at actual statistics, and evolution of the market over the years. It entails the study and analyzes various segments and verticals of the market. An impact analysis is also performed to observe which factors will affect the market in the next few years.
05 Verification and Analysis

This is the final stage, which involves both quantity and quality checks. Although the process of data verification is an integral part of the research process, all data points and statistics and figures are re-checked to uphold their authenticity and validity.

Companies Mentioned

Senju Metal
DS HiMetal
MKE
YCTC
Nippon Micrometal
Accurus
PMTC
Shanghai hiking solder material
Shenmao Technology
Indium Corporation
Jovy Systems

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