Global IC Packaging Substrate (SUB) Market 2023 by Manufacturers, Regions, Type and Application, Forecast to 2029

Page: 123

Published Date: 03 Jan 2023

Category: Electronics & Semiconductor

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Description
Table of Contents
Table of Figures
Research Methodology
Companies Mentioned
Related Reports
Product Tags

Description

According to our (Global Info Research) latest study, the global IC Packaging Substrate (SUB) market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029 with a CAGR of % during review period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.

This report is a detailed and comprehensive analysis for global IC Packaging Substrate (SUB) market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2023, are provided.

Key Features:
Global IC Packaging Substrate (SUB) market size and forecasts, in consumption value ($ Million), sales quantity (M Pcs), and average selling prices (US$/Pc), 2018-2029
Global IC Packaging Substrate (SUB) market size and forecasts by region and country, in consumption value ($ Million), sales quantity (M Pcs), and average selling prices (US$/Pc), 2018-2029
Global IC Packaging Substrate (SUB) market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (M Pcs), and average selling prices (US$/Pc), 2018-2029
Global IC Packaging Substrate (SUB) market shares of main players, shipments in revenue ($ Million), sales quantity (M Pcs), and ASP (US$/Pc), 2018-2023
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for IC Packaging Substrate (SUB)
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global IC Packaging Substrate (SUB) market based on the following parameters - company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Samsung Electro-Mechanics, MST, NGK, KLA Corporation and Panasonic, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals, COVID-19 and Russia-Ukraine War Influence.

Market Segmentation
IC Packaging Substrate (SUB) market is split by Type and by Application. For the period 2018-2029, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type
    Organic Substrate
    Inorganic Substrate
    Composite Substrate

Market segment by Application
    Smart Phones
    PC (Tablet, Laptop)
    Wearable Devices
    Others

Major players covered
    Samsung Electro-Mechanics
    MST
    NGK
    KLA Corporation
    Panasonic
    Simmtech
    Daeduck
    ASE Material
    Kyocera
    Ibiden
    Shinko Electric Industries
    AT&S
    LG InnoTek
    Fastprint Circuit Tech
    ACCESS
    Danbond Technology
    TTM Technologies
    Unimicron
    Nan Ya PCB
    Kinsus
    SCC

Market segment by region, regional analysis covers
    North America (United States, Canada and Mexico)
    Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
    Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
    South America (Brazil, Argentina, Colombia, and Rest of South America)
    Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe IC Packaging Substrate (SUB) product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of IC Packaging Substrate (SUB), with price, sales, revenue and global market share of IC Packaging Substrate (SUB) from 2018 to 2023.
Chapter 3, the IC Packaging Substrate (SUB) competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the IC Packaging Substrate (SUB) breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2018 to 2029.
Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2018 to 2029.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2017 to 2022.and IC Packaging Substrate (SUB) market forecast, by regions, type and application, with sales and revenue, from 2024 to 2029.
Chapter 12, market dynamics, drivers, restraints, trends, Porters Five Forces analysis, and Influence of COVID-19 and Russia-Ukraine War.
Chapter 13, the key raw materials and key suppliers, and industry chain of IC Packaging Substrate (SUB).
Chapter 14 and 15, to describe IC Packaging Substrate (SUB) sales channel, distributors, customers, research findings and conclusion.

Table of Contents

1 Market Overview
    1.1 Product Overview and Scope of IC Packaging Substrate (SUB)
    1.2 Market Estimation Caveats and Base Year
    1.3 Market Analysis by Type
        1.3.1 Overview: Global IC Packaging Substrate (SUB) Consumption Value by Type: 2018 Versus 2022 Versus 2029
        1.3.2 Organic Substrate
        1.3.3 Inorganic Substrate
        1.3.4 Composite Substrate
    1.4 Market Analysis by Application
        1.4.1 Overview: Global IC Packaging Substrate (SUB) Consumption Value by Application: 2018 Versus 2022 Versus 2029
        1.4.2 Smart Phones
        1.4.3 PC (Tablet, Laptop)
        1.4.4 Wearable Devices
        1.4.5 Others
    1.5 Global IC Packaging Substrate (SUB) Market Size & Forecast
        1.5.1 Global IC Packaging Substrate (SUB) Consumption Value (2018 & 2022 & 2029)
        1.5.2 Global IC Packaging Substrate (SUB) Sales Quantity (2018-2029)
        1.5.3 Global IC Packaging Substrate (SUB) Average Price (2018-2029)

2 Manufacturers Profiles
    2.1 Samsung Electro-Mechanics
        2.1.1 Samsung Electro-Mechanics Details
        2.1.2 Samsung Electro-Mechanics Major Business
        2.1.3 Samsung Electro-Mechanics IC Packaging Substrate (SUB) Product and Services
        2.1.4 Samsung Electro-Mechanics IC Packaging Substrate (SUB) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
        2.1.5 Samsung Electro-Mechanics Recent Developments/Updates
    2.2 MST
        2.2.1 MST Details
        2.2.2 MST Major Business
        2.2.3 MST IC Packaging Substrate (SUB) Product and Services
        2.2.4 MST IC Packaging Substrate (SUB) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
        2.2.5 MST Recent Developments/Updates
    2.3 NGK
        2.3.1 NGK Details
        2.3.2 NGK Major Business
        2.3.3 NGK IC Packaging Substrate (SUB) Product and Services
        2.3.4 NGK IC Packaging Substrate (SUB) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
        2.3.5 NGK Recent Developments/Updates
    2.4 KLA Corporation
        2.4.1 KLA Corporation Details
        2.4.2 KLA Corporation Major Business
        2.4.3 KLA Corporation IC Packaging Substrate (SUB) Product and Services
        2.4.4 KLA Corporation IC Packaging Substrate (SUB) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
        2.4.5 KLA Corporation Recent Developments/Updates
    2.5 Panasonic
        2.5.1 Panasonic Details
        2.5.2 Panasonic Major Business
        2.5.3 Panasonic IC Packaging Substrate (SUB) Product and Services
        2.5.4 Panasonic IC Packaging Substrate (SUB) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
        2.5.5 Panasonic Recent Developments/Updates
    2.6 Simmtech
        2.6.1 Simmtech Details
        2.6.2 Simmtech Major Business
        2.6.3 Simmtech IC Packaging Substrate (SUB) Product and Services
        2.6.4 Simmtech IC Packaging Substrate (SUB) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
        2.6.5 Simmtech Recent Developments/Updates
    2.7 Daeduck
        2.7.1 Daeduck Details
        2.7.2 Daeduck Major Business
        2.7.3 Daeduck IC Packaging Substrate (SUB) Product and Services
        2.7.4 Daeduck IC Packaging Substrate (SUB) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
        2.7.5 Daeduck Recent Developments/Updates
    2.8 ASE Material
        2.8.1 ASE Material Details
        2.8.2 ASE Material Major Business
        2.8.3 ASE Material IC Packaging Substrate (SUB) Product and Services
        2.8.4 ASE Material IC Packaging Substrate (SUB) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
        2.8.5 ASE Material Recent Developments/Updates
    2.9 Kyocera
        2.9.1 Kyocera Details
        2.9.2 Kyocera Major Business
        2.9.3 Kyocera IC Packaging Substrate (SUB) Product and Services
        2.9.4 Kyocera IC Packaging Substrate (SUB) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
        2.9.5 Kyocera Recent Developments/Updates
    2.10 Ibiden
        2.10.1 Ibiden Details
        2.10.2 Ibiden Major Business
        2.10.3 Ibiden IC Packaging Substrate (SUB) Product and Services
        2.10.4 Ibiden IC Packaging Substrate (SUB) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
        2.10.5 Ibiden Recent Developments/Updates
    2.11 Shinko Electric Industries
        2.11.1 Shinko Electric Industries Details
        2.11.2 Shinko Electric Industries Major Business
        2.11.3 Shinko Electric Industries IC Packaging Substrate (SUB) Product and Services
        2.11.4 Shinko Electric Industries IC Packaging Substrate (SUB) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
        2.11.5 Shinko Electric Industries Recent Developments/Updates
    2.12 AT&S
        2.12.1 AT&S Details
        2.12.2 AT&S Major Business
        2.12.3 AT&S IC Packaging Substrate (SUB) Product and Services
        2.12.4 AT&S IC Packaging Substrate (SUB) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
        2.12.5 AT&S Recent Developments/Updates
    2.13 LG InnoTek
        2.13.1 LG InnoTek Details
        2.13.2 LG InnoTek Major Business
        2.13.3 LG InnoTek IC Packaging Substrate (SUB) Product and Services
        2.13.4 LG InnoTek IC Packaging Substrate (SUB) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
        2.13.5 LG InnoTek Recent Developments/Updates
    2.14 Fastprint Circuit Tech
        2.14.1 Fastprint Circuit Tech Details
        2.14.2 Fastprint Circuit Tech Major Business
        2.14.3 Fastprint Circuit Tech IC Packaging Substrate (SUB) Product and Services
        2.14.4 Fastprint Circuit Tech IC Packaging Substrate (SUB) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
        2.14.5 Fastprint Circuit Tech Recent Developments/Updates
    2.15 ACCESS
        2.15.1 ACCESS Details
        2.15.2 ACCESS Major Business
        2.15.3 ACCESS IC Packaging Substrate (SUB) Product and Services
        2.15.4 ACCESS IC Packaging Substrate (SUB) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
        2.15.5 ACCESS Recent Developments/Updates
    2.16 Danbond Technology
        2.16.1 Danbond Technology Details
        2.16.2 Danbond Technology Major Business
        2.16.3 Danbond Technology IC Packaging Substrate (SUB) Product and Services
        2.16.4 Danbond Technology IC Packaging Substrate (SUB) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
        2.16.5 Danbond Technology Recent Developments/Updates
    2.17 TTM Technologies
        2.17.1 TTM Technologies Details
        2.17.2 TTM Technologies Major Business
        2.17.3 TTM Technologies IC Packaging Substrate (SUB) Product and Services
        2.17.4 TTM Technologies IC Packaging Substrate (SUB) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
        2.17.5 TTM Technologies Recent Developments/Updates
    2.18 Unimicron
        2.18.1 Unimicron Details
        2.18.2 Unimicron Major Business
        2.18.3 Unimicron IC Packaging Substrate (SUB) Product and Services
        2.18.4 Unimicron IC Packaging Substrate (SUB) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
        2.18.5 Unimicron Recent Developments/Updates
    2.19 Nan Ya PCB
        2.19.1 Nan Ya PCB Details
        2.19.2 Nan Ya PCB Major Business
        2.19.3 Nan Ya PCB IC Packaging Substrate (SUB) Product and Services
        2.19.4 Nan Ya PCB IC Packaging Substrate (SUB) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
        2.19.5 Nan Ya PCB Recent Developments/Updates
    2.20 Kinsus
        2.20.1 Kinsus Details
        2.20.2 Kinsus Major Business
        2.20.3 Kinsus IC Packaging Substrate (SUB) Product and Services
        2.20.4 Kinsus IC Packaging Substrate (SUB) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
        2.20.5 Kinsus Recent Developments/Updates
    2.21 SCC
        2.21.1 SCC Details
        2.21.2 SCC Major Business
        2.21.3 SCC IC Packaging Substrate (SUB) Product and Services
        2.21.4 SCC IC Packaging Substrate (SUB) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
        2.21.5 SCC Recent Developments/Updates

3 Competitive Environment: IC Packaging Substrate (SUB) by Manufacturer
    3.1 Global IC Packaging Substrate (SUB) Sales Quantity by Manufacturer (2018-2023)
    3.2 Global IC Packaging Substrate (SUB) Revenue by Manufacturer (2018-2023)
    3.3 Global IC Packaging Substrate (SUB) Average Price by Manufacturer (2018-2023)
    3.4 Market Share Analysis (2022)
        3.4.1 Producer Shipments of IC Packaging Substrate (SUB) by Manufacturer Revenue ($MM) and Market Share (%): 2022
        3.4.2 Top 3 IC Packaging Substrate (SUB) Manufacturer Market Share in 2022
        3.4.2 Top 6 IC Packaging Substrate (SUB) Manufacturer Market Share in 2022
    3.5 IC Packaging Substrate (SUB) Market: Overall Company Footprint Analysis
        3.5.1 IC Packaging Substrate (SUB) Market: Region Footprint
        3.5.2 IC Packaging Substrate (SUB) Market: Company Product Type Footprint
        3.5.3 IC Packaging Substrate (SUB) Market: Company Product Application Footprint
    3.6 New Market Entrants and Barriers to Market Entry
    3.7 Mergers, Acquisition, Agreements, and Collaborations

4 Consumption Analysis by Region
    4.1 Global IC Packaging Substrate (SUB) Market Size by Region
        4.1.1 Global IC Packaging Substrate (SUB) Sales Quantity by Region (2018-2029)
        4.1.2 Global IC Packaging Substrate (SUB) Consumption Value by Region (2018-2029)
        4.1.3 Global IC Packaging Substrate (SUB) Average Price by Region (2018-2029)
    4.2 North America IC Packaging Substrate (SUB) Consumption Value (2018-2029)
    4.3 Europe IC Packaging Substrate (SUB) Consumption Value (2018-2029)
    4.4 Asia-Pacific IC Packaging Substrate (SUB) Consumption Value (2018-2029)
    4.5 South America IC Packaging Substrate (SUB) Consumption Value (2018-2029)
    4.6 Middle East and Africa IC Packaging Substrate (SUB) Consumption Value (2018-2029)

5 Market Segment by Type
    5.1 Global IC Packaging Substrate (SUB) Sales Quantity by Type (2018-2029)
    5.2 Global IC Packaging Substrate (SUB) Consumption Value by Type (2018-2029)
    5.3 Global IC Packaging Substrate (SUB) Average Price by Type (2018-2029)

6 Market Segment by Application
    6.1 Global IC Packaging Substrate (SUB) Sales Quantity by Application (2018-2029)
    6.2 Global IC Packaging Substrate (SUB) Consumption Value by Application (2018-2029)
    6.3 Global IC Packaging Substrate (SUB) Average Price by Application (2018-2029)

7 North America
    7.1 North America IC Packaging Substrate (SUB) Sales Quantity by Type (2018-2029)
    7.2 North America IC Packaging Substrate (SUB) Sales Quantity by Application (2018-2029)
    7.3 North America IC Packaging Substrate (SUB) Market Size by Country
        7.3.1 North America IC Packaging Substrate (SUB) Sales Quantity by Country (2018-2029)
        7.3.2 North America IC Packaging Substrate (SUB) Consumption Value by Country (2018-2029)
        7.3.3 United States Market Size and Forecast (2018-2029)
        7.3.4 Canada Market Size and Forecast (2018-2029)
        7.3.5 Mexico Market Size and Forecast (2018-2029)

8 Europe
    8.1 Europe IC Packaging Substrate (SUB) Sales Quantity by Type (2018-2029)
    8.2 Europe IC Packaging Substrate (SUB) Sales Quantity by Application (2018-2029)
    8.3 Europe IC Packaging Substrate (SUB) Market Size by Country
        8.3.1 Europe IC Packaging Substrate (SUB) Sales Quantity by Country (2018-2029)
        8.3.2 Europe IC Packaging Substrate (SUB) Consumption Value by Country (2018-2029)
        8.3.3 Germany Market Size and Forecast (2018-2029)
        8.3.4 France Market Size and Forecast (2018-2029)
        8.3.5 United Kingdom Market Size and Forecast (2018-2029)
        8.3.6 Russia Market Size and Forecast (2018-2029)
        8.3.7 Italy Market Size and Forecast (2018-2029)

9 Asia-Pacific
    9.1 Asia-Pacific IC Packaging Substrate (SUB) Sales Quantity by Type (2018-2029)
    9.2 Asia-Pacific IC Packaging Substrate (SUB) Sales Quantity by Application (2018-2029)
    9.3 Asia-Pacific IC Packaging Substrate (SUB) Market Size by Region
        9.3.1 Asia-Pacific IC Packaging Substrate (SUB) Sales Quantity by Region (2018-2029)
        9.3.2 Asia-Pacific IC Packaging Substrate (SUB) Consumption Value by Region (2018-2029)
        9.3.3 China Market Size and Forecast (2018-2029)
        9.3.4 Japan Market Size and Forecast (2018-2029)
        9.3.5 Korea Market Size and Forecast (2018-2029)
        9.3.6 India Market Size and Forecast (2018-2029)
        9.3.7 Southeast Asia Market Size and Forecast (2018-2029)
        9.3.8 Australia Market Size and Forecast (2018-2029)

10 South America
    10.1 South America IC Packaging Substrate (SUB) Sales Quantity by Type (2018-2029)
    10.2 South America IC Packaging Substrate (SUB) Sales Quantity by Application (2018-2029)
    10.3 South America IC Packaging Substrate (SUB) Market Size by Country
        10.3.1 South America IC Packaging Substrate (SUB) Sales Quantity by Country (2018-2029)
        10.3.2 South America IC Packaging Substrate (SUB) Consumption Value by Country (2018-2029)
        10.3.3 Brazil Market Size and Forecast (2018-2029)
        10.3.4 Argentina Market Size and Forecast (2018-2029)

11 Middle East & Africa
    11.1 Middle East & Africa IC Packaging Substrate (SUB) Sales Quantity by Type (2018-2029)
    11.2 Middle East & Africa IC Packaging Substrate (SUB) Sales Quantity by Application (2018-2029)
    11.3 Middle East & Africa IC Packaging Substrate (SUB) Market Size by Country
        11.3.1 Middle East & Africa IC Packaging Substrate (SUB) Sales Quantity by Country (2018-2029)
        11.3.2 Middle East & Africa IC Packaging Substrate (SUB) Consumption Value by Country (2018-2029)
        11.3.3 Turkey Market Size and Forecast (2018-2029)
        11.3.4 Egypt Market Size and Forecast (2018-2029)
        11.3.5 Saudi Arabia Market Size and Forecast (2018-2029)
        11.3.6 South Africa Market Size and Forecast (2018-2029)

12 Market Dynamics
    12.1 IC Packaging Substrate (SUB) Market Drivers
    12.2 IC Packaging Substrate (SUB) Market Restraints
    12.3 IC Packaging Substrate (SUB) Trends Analysis
    12.4 Porters Five Forces Analysis
        12.4.1 Threat of New Entrants
        12.4.2 Bargaining Power of Suppliers
        12.4.3 Bargaining Power of Buyers
        12.4.4 Threat of Substitutes
        12.4.5 Competitive Rivalry
    12.5 Influence of COVID-19 and Russia-Ukraine War
        12.5.1 Influence of COVID-19
        12.5.2 Influence of Russia-Ukraine War

13 Raw Material and Industry Chain
    13.1 Raw Material of IC Packaging Substrate (SUB) and Key Manufacturers
    13.2 Manufacturing Costs Percentage of IC Packaging Substrate (SUB)
    13.3 IC Packaging Substrate (SUB) Production Process
    13.4 IC Packaging Substrate (SUB) Industrial Chain

14 Shipments by Distribution Channel
    14.1 Sales Channel
        14.1.1 Direct to End-User
        14.1.2 Distributors
    14.2 IC Packaging Substrate (SUB) Typical Distributors
    14.3 IC Packaging Substrate (SUB) Typical Customers

15 Research Findings and Conclusion

16 Appendix
    16.1 Methodology
    16.2 Research Process and Data Source
    16.3 Disclaimer

Table of Figures

List of Tables
    Table 1. Global IC Packaging Substrate (SUB) Consumption Value by Type, (USD Million), 2018 & 2022 & 2029
    Table 2. Global IC Packaging Substrate (SUB) Consumption Value by Application, (USD Million), 2018 & 2022 & 2029
    Table 3. Samsung Electro-Mechanics Basic Information, Manufacturing Base and Competitors
    Table 4. Samsung Electro-Mechanics Major Business
    Table 5. Samsung Electro-Mechanics IC Packaging Substrate (SUB) Product and Services
    Table 6. Samsung Electro-Mechanics IC Packaging Substrate (SUB) Sales Quantity (M Pcs), Average Price (US$/Pc), Revenue (USD Million), Gross Margin and Market Share (2018-2023)
    Table 7. Samsung Electro-Mechanics Recent Developments/Updates
    Table 8. MST Basic Information, Manufacturing Base and Competitors
    Table 9. MST Major Business
    Table 10. MST IC Packaging Substrate (SUB) Product and Services
    Table 11. MST IC Packaging Substrate (SUB) Sales Quantity (M Pcs), Average Price (US$/Pc), Revenue (USD Million), Gross Margin and Market Share (2018-2023)
    Table 12. MST Recent Developments/Updates
    Table 13. NGK Basic Information, Manufacturing Base and Competitors
    Table 14. NGK Major Business
    Table 15. NGK IC Packaging Substrate (SUB) Product and Services
    Table 16. NGK IC Packaging Substrate (SUB) Sales Quantity (M Pcs), Average Price (US$/Pc), Revenue (USD Million), Gross Margin and Market Share (2018-2023)
    Table 17. NGK Recent Developments/Updates
    Table 18. KLA Corporation Basic Information, Manufacturing Base and Competitors
    Table 19. KLA Corporation Major Business
    Table 20. KLA Corporation IC Packaging Substrate (SUB) Product and Services
    Table 21. KLA Corporation IC Packaging Substrate (SUB) Sales Quantity (M Pcs), Average Price (US$/Pc), Revenue (USD Million), Gross Margin and Market Share (2018-2023)
    Table 22. KLA Corporation Recent Developments/Updates
    Table 23. Panasonic Basic Information, Manufacturing Base and Competitors
    Table 24. Panasonic Major Business
    Table 25. Panasonic IC Packaging Substrate (SUB) Product and Services
    Table 26. Panasonic IC Packaging Substrate (SUB) Sales Quantity (M Pcs), Average Price (US$/Pc), Revenue (USD Million), Gross Margin and Market Share (2018-2023)
    Table 27. Panasonic Recent Developments/Updates
    Table 28. Simmtech Basic Information, Manufacturing Base and Competitors
    Table 29. Simmtech Major Business
    Table 30. Simmtech IC Packaging Substrate (SUB) Product and Services
    Table 31. Simmtech IC Packaging Substrate (SUB) Sales Quantity (M Pcs), Average Price (US$/Pc), Revenue (USD Million), Gross Margin and Market Share (2018-2023)
    Table 32. Simmtech Recent Developments/Updates
    Table 33. Daeduck Basic Information, Manufacturing Base and Competitors
    Table 34. Daeduck Major Business
    Table 35. Daeduck IC Packaging Substrate (SUB) Product and Services
    Table 36. Daeduck IC Packaging Substrate (SUB) Sales Quantity (M Pcs), Average Price (US$/Pc), Revenue (USD Million), Gross Margin and Market Share (2018-2023)
    Table 37. Daeduck Recent Developments/Updates
    Table 38. ASE Material Basic Information, Manufacturing Base and Competitors
    Table 39. ASE Material Major Business
    Table 40. ASE Material IC Packaging Substrate (SUB) Product and Services
    Table 41. ASE Material IC Packaging Substrate (SUB) Sales Quantity (M Pcs), Average Price (US$/Pc), Revenue (USD Million), Gross Margin and Market Share (2018-2023)
    Table 42. ASE Material Recent Developments/Updates
    Table 43. Kyocera Basic Information, Manufacturing Base and Competitors
    Table 44. Kyocera Major Business
    Table 45. Kyocera IC Packaging Substrate (SUB) Product and Services
    Table 46. Kyocera IC Packaging Substrate (SUB) Sales Quantity (M Pcs), Average Price (US$/Pc), Revenue (USD Million), Gross Margin and Market Share (2018-2023)
    Table 47. Kyocera Recent Developments/Updates
    Table 48. Ibiden Basic Information, Manufacturing Base and Competitors
    Table 49. Ibiden Major Business
    Table 50. Ibiden IC Packaging Substrate (SUB) Product and Services
    Table 51. Ibiden IC Packaging Substrate (SUB) Sales Quantity (M Pcs), Average Price (US$/Pc), Revenue (USD Million), Gross Margin and Market Share (2018-2023)
    Table 52. Ibiden Recent Developments/Updates
    Table 53. Shinko Electric Industries Basic Information, Manufacturing Base and Competitors
    Table 54. Shinko Electric Industries Major Business
    Table 55. Shinko Electric Industries IC Packaging Substrate (SUB) Product and Services
    Table 56. Shinko Electric Industries IC Packaging Substrate (SUB) Sales Quantity (M Pcs), Average Price (US$/Pc), Revenue (USD Million), Gross Margin and Market Share (2018-2023)
    Table 57. Shinko Electric Industries Recent Developments/Updates
    Table 58. AT&S Basic Information, Manufacturing Base and Competitors
    Table 59. AT&S Major Business
    Table 60. AT&S IC Packaging Substrate (SUB) Product and Services
    Table 61. AT&S IC Packaging Substrate (SUB) Sales Quantity (M Pcs), Average Price (US$/Pc), Revenue (USD Million), Gross Margin and Market Share (2018-2023)
    Table 62. AT&S Recent Developments/Updates
    Table 63. LG InnoTek Basic Information, Manufacturing Base and Competitors
    Table 64. LG InnoTek Major Business
    Table 65. LG InnoTek IC Packaging Substrate (SUB) Product and Services
    Table 66. LG InnoTek IC Packaging Substrate (SUB) Sales Quantity (M Pcs), Average Price (US$/Pc), Revenue (USD Million), Gross Margin and Market Share (2018-2023)
    Table 67. LG InnoTek Recent Developments/Updates
    Table 68. Fastprint Circuit Tech Basic Information, Manufacturing Base and Competitors
    Table 69. Fastprint Circuit Tech Major Business
    Table 70. Fastprint Circuit Tech IC Packaging Substrate (SUB) Product and Services
    Table 71. Fastprint Circuit Tech IC Packaging Substrate (SUB) Sales Quantity (M Pcs), Average Price (US$/Pc), Revenue (USD Million), Gross Margin and Market Share (2018-2023)
    Table 72. Fastprint Circuit Tech Recent Developments/Updates
    Table 73. ACCESS Basic Information, Manufacturing Base and Competitors
    Table 74. ACCESS Major Business
    Table 75. ACCESS IC Packaging Substrate (SUB) Product and Services
    Table 76. ACCESS IC Packaging Substrate (SUB) Sales Quantity (M Pcs), Average Price (US$/Pc), Revenue (USD Million), Gross Margin and Market Share (2018-2023)
    Table 77. ACCESS Recent Developments/Updates
    Table 78. Danbond Technology Basic Information, Manufacturing Base and Competitors
    Table 79. Danbond Technology Major Business
    Table 80. Danbond Technology IC Packaging Substrate (SUB) Product and Services
    Table 81. Danbond Technology IC Packaging Substrate (SUB) Sales Quantity (M Pcs), Average Price (US$/Pc), Revenue (USD Million), Gross Margin and Market Share (2018-2023)
    Table 82. Danbond Technology Recent Developments/Updates
    Table 83. TTM Technologies Basic Information, Manufacturing Base and Competitors
    Table 84. TTM Technologies Major Business
    Table 85. TTM Technologies IC Packaging Substrate (SUB) Product and Services
    Table 86. TTM Technologies IC Packaging Substrate (SUB) Sales Quantity (M Pcs), Average Price (US$/Pc), Revenue (USD Million), Gross Margin and Market Share (2018-2023)
    Table 87. TTM Technologies Recent Developments/Updates
    Table 88. Unimicron Basic Information, Manufacturing Base and Competitors
    Table 89. Unimicron Major Business
    Table 90. Unimicron IC Packaging Substrate (SUB) Product and Services
    Table 91. Unimicron IC Packaging Substrate (SUB) Sales Quantity (M Pcs), Average Price (US$/Pc), Revenue (USD Million), Gross Margin and Market Share (2018-2023)
    Table 92. Unimicron Recent Developments/Updates
    Table 93. Nan Ya PCB Basic Information, Manufacturing Base and Competitors
    Table 94. Nan Ya PCB Major Business
    Table 95. Nan Ya PCB IC Packaging Substrate (SUB) Product and Services
    Table 96. Nan Ya PCB IC Packaging Substrate (SUB) Sales Quantity (M Pcs), Average Price (US$/Pc), Revenue (USD Million), Gross Margin and Market Share (2018-2023)
    Table 97. Nan Ya PCB Recent Developments/Updates
    Table 98. Kinsus Basic Information, Manufacturing Base and Competitors
    Table 99. Kinsus Major Business
    Table 100. Kinsus IC Packaging Substrate (SUB) Product and Services
    Table 101. Kinsus IC Packaging Substrate (SUB) Sales Quantity (M Pcs), Average Price (US$/Pc), Revenue (USD Million), Gross Margin and Market Share (2018-2023)
    Table 102. Kinsus Recent Developments/Updates
    Table 103. SCC Basic Information, Manufacturing Base and Competitors
    Table 104. SCC Major Business
    Table 105. SCC IC Packaging Substrate (SUB) Product and Services
    Table 106. SCC IC Packaging Substrate (SUB) Sales Quantity (M Pcs), Average Price (US$/Pc), Revenue (USD Million), Gross Margin and Market Share (2018-2023)
    Table 107. SCC Recent Developments/Updates
    Table 108. Global IC Packaging Substrate (SUB) Sales Quantity by Manufacturer (2018-2023) & (M Pcs)
    Table 109. Global IC Packaging Substrate (SUB) Revenue by Manufacturer (2018-2023) & (USD Million)
    Table 110. Global IC Packaging Substrate (SUB) Average Price by Manufacturer (2018-2023) & (US$/Pc)
    Table 111. Market Position of Manufacturers in IC Packaging Substrate (SUB), (Tier 1, Tier 2, and Tier 3), Based on Consumption Value in 2022
    Table 112. Head Office and IC Packaging Substrate (SUB) Production Site of Key Manufacturer
    Table 113. IC Packaging Substrate (SUB) Market: Company Product Type Footprint
    Table 114. IC Packaging Substrate (SUB) Market: Company Product Application Footprint
    Table 115. IC Packaging Substrate (SUB) New Market Entrants and Barriers to Market Entry
    Table 116. IC Packaging Substrate (SUB) Mergers, Acquisition, Agreements, and Collaborations
    Table 117. Global IC Packaging Substrate (SUB) Sales Quantity by Region (2018-2023) & (M Pcs)
    Table 118. Global IC Packaging Substrate (SUB) Sales Quantity by Region (2024-2029) & (M Pcs)
    Table 119. Global IC Packaging Substrate (SUB) Consumption Value by Region (2018-2023) & (USD Million)
    Table 120. Global IC Packaging Substrate (SUB) Consumption Value by Region (2024-2029) & (USD Million)
    Table 121. Global IC Packaging Substrate (SUB) Average Price by Region (2018-2023) & (US$/Pc)
    Table 122. Global IC Packaging Substrate (SUB) Average Price by Region (2024-2029) & (US$/Pc)
    Table 123. Global IC Packaging Substrate (SUB) Sales Quantity by Type (2018-2023) & (M Pcs)
    Table 124. Global IC Packaging Substrate (SUB) Sales Quantity by Type (2024-2029) & (M Pcs)
    Table 125. Global IC Packaging Substrate (SUB) Consumption Value by Type (2018-2023) & (USD Million)
    Table 126. Global IC Packaging Substrate (SUB) Consumption Value by Type (2024-2029) & (USD Million)
    Table 127. Global IC Packaging Substrate (SUB) Average Price by Type (2018-2023) & (US$/Pc)
    Table 128. Global IC Packaging Substrate (SUB) Average Price by Type (2024-2029) & (US$/Pc)
    Table 129. Global IC Packaging Substrate (SUB) Sales Quantity by Application (2018-2023) & (M Pcs)
    Table 130. Global IC Packaging Substrate (SUB) Sales Quantity by Application (2024-2029) & (M Pcs)
    Table 131. Global IC Packaging Substrate (SUB) Consumption Value by Application (2018-2023) & (USD Million)
    Table 132. Global IC Packaging Substrate (SUB) Consumption Value by Application (2024-2029) & (USD Million)
    Table 133. Global IC Packaging Substrate (SUB) Average Price by Application (2018-2023) & (US$/Pc)
    Table 134. Global IC Packaging Substrate (SUB) Average Price by Application (2024-2029) & (US$/Pc)
    Table 135. North America IC Packaging Substrate (SUB) Sales Quantity by Type (2018-2023) & (M Pcs)
    Table 136. North America IC Packaging Substrate (SUB) Sales Quantity by Type (2024-2029) & (M Pcs)
    Table 137. North America IC Packaging Substrate (SUB) Sales Quantity by Application (2018-2023) & (M Pcs)
    Table 138. North America IC Packaging Substrate (SUB) Sales Quantity by Application (2024-2029) & (M Pcs)
    Table 139. North America IC Packaging Substrate (SUB) Sales Quantity by Country (2018-2023) & (M Pcs)
    Table 140. North America IC Packaging Substrate (SUB) Sales Quantity by Country (2024-2029) & (M Pcs)
    Table 141. North America IC Packaging Substrate (SUB) Consumption Value by Country (2018-2023) & (USD Million)
    Table 142. North America IC Packaging Substrate (SUB) Consumption Value by Country (2024-2029) & (USD Million)
    Table 143. Europe IC Packaging Substrate (SUB) Sales Quantity by Type (2018-2023) & (M Pcs)
    Table 144. Europe IC Packaging Substrate (SUB) Sales Quantity by Type (2024-2029) & (M Pcs)
    Table 145. Europe IC Packaging Substrate (SUB) Sales Quantity by Application (2018-2023) & (M Pcs)
    Table 146. Europe IC Packaging Substrate (SUB) Sales Quantity by Application (2024-2029) & (M Pcs)
    Table 147. Europe IC Packaging Substrate (SUB) Sales Quantity by Country (2018-2023) & (M Pcs)
    Table 148. Europe IC Packaging Substrate (SUB) Sales Quantity by Country (2024-2029) & (M Pcs)
    Table 149. Europe IC Packaging Substrate (SUB) Consumption Value by Country (2018-2023) & (USD Million)
    Table 150. Europe IC Packaging Substrate (SUB) Consumption Value by Country (2024-2029) & (USD Million)
    Table 151. Asia-Pacific IC Packaging Substrate (SUB) Sales Quantity by Type (2018-2023) & (M Pcs)
    Table 152. Asia-Pacific IC Packaging Substrate (SUB) Sales Quantity by Type (2024-2029) & (M Pcs)
    Table 153. Asia-Pacific IC Packaging Substrate (SUB) Sales Quantity by Application (2018-2023) & (M Pcs)
    Table 154. Asia-Pacific IC Packaging Substrate (SUB) Sales Quantity by Application (2024-2029) & (M Pcs)
    Table 155. Asia-Pacific IC Packaging Substrate (SUB) Sales Quantity by Region (2018-2023) & (M Pcs)
    Table 156. Asia-Pacific IC Packaging Substrate (SUB) Sales Quantity by Region (2024-2029) & (M Pcs)
    Table 157. Asia-Pacific IC Packaging Substrate (SUB) Consumption Value by Region (2018-2023) & (USD Million)
    Table 158. Asia-Pacific IC Packaging Substrate (SUB) Consumption Value by Region (2024-2029) & (USD Million)
    Table 159. South America IC Packaging Substrate (SUB) Sales Quantity by Type (2018-2023) & (M Pcs)
    Table 160. South America IC Packaging Substrate (SUB) Sales Quantity by Type (2024-2029) & (M Pcs)
    Table 161. South America IC Packaging Substrate (SUB) Sales Quantity by Application (2018-2023) & (M Pcs)
    Table 162. South America IC Packaging Substrate (SUB) Sales Quantity by Application (2024-2029) & (M Pcs)
    Table 163. South America IC Packaging Substrate (SUB) Sales Quantity by Country (2018-2023) & (M Pcs)
    Table 164. South America IC Packaging Substrate (SUB) Sales Quantity by Country (2024-2029) & (M Pcs)
    Table 165. South America IC Packaging Substrate (SUB) Consumption Value by Country (2018-2023) & (USD Million)
    Table 166. South America IC Packaging Substrate (SUB) Consumption Value by Country (2024-2029) & (USD Million)
    Table 167. Middle East & Africa IC Packaging Substrate (SUB) Sales Quantity by Type (2018-2023) & (M Pcs)
    Table 168. Middle East & Africa IC Packaging Substrate (SUB) Sales Quantity by Type (2024-2029) & (M Pcs)
    Table 169. Middle East & Africa IC Packaging Substrate (SUB) Sales Quantity by Application (2018-2023) & (M Pcs)
    Table 170. Middle East & Africa IC Packaging Substrate (SUB) Sales Quantity by Application (2024-2029) & (M Pcs)
    Table 171. Middle East & Africa IC Packaging Substrate (SUB) Sales Quantity by Region (2018-2023) & (M Pcs)
    Table 172. Middle East & Africa IC Packaging Substrate (SUB) Sales Quantity by Region (2024-2029) & (M Pcs)
    Table 173. Middle East & Africa IC Packaging Substrate (SUB) Consumption Value by Region (2018-2023) & (USD Million)
    Table 174. Middle East & Africa IC Packaging Substrate (SUB) Consumption Value by Region (2024-2029) & (USD Million)
    Table 175. IC Packaging Substrate (SUB) Raw Material
    Table 176. Key Manufacturers of IC Packaging Substrate (SUB) Raw Materials
    Table 177. IC Packaging Substrate (SUB) Typical Distributors
    Table 178. IC Packaging Substrate (SUB) Typical Customers
List of Figures
    Figure 1. IC Packaging Substrate (SUB) Picture
    Figure 2. Global IC Packaging Substrate (SUB) Consumption Value by Type, (USD Million), 2018 & 2022 & 2029
    Figure 3. Global IC Packaging Substrate (SUB) Consumption Value Market Share by Type in 2022
    Figure 4. Organic Substrate Examples
    Figure 5. Inorganic Substrate Examples
    Figure 6. Composite Substrate Examples
    Figure 7. Global IC Packaging Substrate (SUB) Consumption Value by Application, (USD Million), 2018 & 2022 & 2029
    Figure 8. Global IC Packaging Substrate (SUB) Consumption Value Market Share by Application in 2022
    Figure 9. Smart Phones Examples
    Figure 10. PC (Tablet, Laptop) Examples
    Figure 11. Wearable Devices Examples
    Figure 12. Others Examples
    Figure 13. Global IC Packaging Substrate (SUB) Consumption Value, (USD Million): 2018 & 2022 & 2029
    Figure 14. Global IC Packaging Substrate (SUB) Consumption Value and Forecast (2018-2029) & (USD Million)
    Figure 15. Global IC Packaging Substrate (SUB) Sales Quantity (2018-2029) & (M Pcs)
    Figure 16. Global IC Packaging Substrate (SUB) Average Price (2018-2029) & (US$/Pc)
    Figure 17. Global IC Packaging Substrate (SUB) Sales Quantity Market Share by Manufacturer in 2022
    Figure 18. Global IC Packaging Substrate (SUB) Consumption Value Market Share by Manufacturer in 2022
    Figure 19. Producer Shipments of IC Packaging Substrate (SUB) by Manufacturer Sales Quantity ($MM) and Market Share (%): 2021
    Figure 20. Top 3 IC Packaging Substrate (SUB) Manufacturer (Consumption Value) Market Share in 2022
    Figure 21. Top 6 IC Packaging Substrate (SUB) Manufacturer (Consumption Value) Market Share in 2022
    Figure 22. Global IC Packaging Substrate (SUB) Sales Quantity Market Share by Region (2018-2029)
    Figure 23. Global IC Packaging Substrate (SUB) Consumption Value Market Share by Region (2018-2029)
    Figure 24. North America IC Packaging Substrate (SUB) Consumption Value (2018-2029) & (USD Million)
    Figure 25. Europe IC Packaging Substrate (SUB) Consumption Value (2018-2029) & (USD Million)
    Figure 26. Asia-Pacific IC Packaging Substrate (SUB) Consumption Value (2018-2029) & (USD Million)
    Figure 27. South America IC Packaging Substrate (SUB) Consumption Value (2018-2029) & (USD Million)
    Figure 28. Middle East & Africa IC Packaging Substrate (SUB) Consumption Value (2018-2029) & (USD Million)
    Figure 29. Global IC Packaging Substrate (SUB) Sales Quantity Market Share by Type (2018-2029)
    Figure 30. Global IC Packaging Substrate (SUB) Consumption Value Market Share by Type (2018-2029)
    Figure 31. Global IC Packaging Substrate (SUB) Average Price by Type (2018-2029) & (US$/Pc)
    Figure 32. Global IC Packaging Substrate (SUB) Sales Quantity Market Share by Application (2018-2029)
    Figure 33. Global IC Packaging Substrate (SUB) Consumption Value Market Share by Application (2018-2029)
    Figure 34. Global IC Packaging Substrate (SUB) Average Price by Application (2018-2029) & (US$/Pc)
    Figure 35. North America IC Packaging Substrate (SUB) Sales Quantity Market Share by Type (2018-2029)
    Figure 36. North America IC Packaging Substrate (SUB) Sales Quantity Market Share by Application (2018-2029)
    Figure 37. North America IC Packaging Substrate (SUB) Sales Quantity Market Share by Country (2018-2029)
    Figure 38. North America IC Packaging Substrate (SUB) Consumption Value Market Share by Country (2018-2029)
    Figure 39. United States IC Packaging Substrate (SUB) Consumption Value and Growth Rate (2018-2029) & (USD Million)
    Figure 40. Canada IC Packaging Substrate (SUB) Consumption Value and Growth Rate (2018-2029) & (USD Million)
    Figure 41. Mexico IC Packaging Substrate (SUB) Consumption Value and Growth Rate (2018-2029) & (USD Million)
    Figure 42. Europe IC Packaging Substrate (SUB) Sales Quantity Market Share by Type (2018-2029)
    Figure 43. Europe IC Packaging Substrate (SUB) Sales Quantity Market Share by Application (2018-2029)
    Figure 44. Europe IC Packaging Substrate (SUB) Sales Quantity Market Share by Country (2018-2029)
    Figure 45. Europe IC Packaging Substrate (SUB) Consumption Value Market Share by Country (2018-2029)
    Figure 46. Germany IC Packaging Substrate (SUB) Consumption Value and Growth Rate (2018-2029) & (USD Million)
    Figure 47. France IC Packaging Substrate (SUB) Consumption Value and Growth Rate (2018-2029) & (USD Million)
    Figure 48. United Kingdom IC Packaging Substrate (SUB) Consumption Value and Growth Rate (2018-2029) & (USD Million)
    Figure 49. Russia IC Packaging Substrate (SUB) Consumption Value and Growth Rate (2018-2029) & (USD Million)
    Figure 50. Italy IC Packaging Substrate (SUB) Consumption Value and Growth Rate (2018-2029) & (USD Million)
    Figure 51. Asia-Pacific IC Packaging Substrate (SUB) Sales Quantity Market Share by Type (2018-2029)
    Figure 52. Asia-Pacific IC Packaging Substrate (SUB) Sales Quantity Market Share by Application (2018-2029)
    Figure 53. Asia-Pacific IC Packaging Substrate (SUB) Sales Quantity Market Share by Region (2018-2029)
    Figure 54. Asia-Pacific IC Packaging Substrate (SUB) Consumption Value Market Share by Region (2018-2029)
    Figure 55. China IC Packaging Substrate (SUB) Consumption Value and Growth Rate (2018-2029) & (USD Million)
    Figure 56. Japan IC Packaging Substrate (SUB) Consumption Value and Growth Rate (2018-2029) & (USD Million)
    Figure 57. Korea IC Packaging Substrate (SUB) Consumption Value and Growth Rate (2018-2029) & (USD Million)
    Figure 58. India IC Packaging Substrate (SUB) Consumption Value and Growth Rate (2018-2029) & (USD Million)
    Figure 59. Southeast Asia IC Packaging Substrate (SUB) Consumption Value and Growth Rate (2018-2029) & (USD Million)
    Figure 60. Australia IC Packaging Substrate (SUB) Consumption Value and Growth Rate (2018-2029) & (USD Million)
    Figure 61. South America IC Packaging Substrate (SUB) Sales Quantity Market Share by Type (2018-2029)
    Figure 62. South America IC Packaging Substrate (SUB) Sales Quantity Market Share by Application (2018-2029)
    Figure 63. South America IC Packaging Substrate (SUB) Sales Quantity Market Share by Country (2018-2029)
    Figure 64. South America IC Packaging Substrate (SUB) Consumption Value Market Share by Country (2018-2029)
    Figure 65. Brazil IC Packaging Substrate (SUB) Consumption Value and Growth Rate (2018-2029) & (USD Million)
    Figure 66. Argentina IC Packaging Substrate (SUB) Consumption Value and Growth Rate (2018-2029) & (USD Million)
    Figure 67. Middle East & Africa IC Packaging Substrate (SUB) Sales Quantity Market Share by Type (2018-2029)
    Figure 68. Middle East & Africa IC Packaging Substrate (SUB) Sales Quantity Market Share by Application (2018-2029)
    Figure 69. Middle East & Africa IC Packaging Substrate (SUB) Sales Quantity Market Share by Region (2018-2029)
    Figure 70. Middle East & Africa IC Packaging Substrate (SUB) Consumption Value Market Share by Region (2018-2029)
    Figure 71. Turkey IC Packaging Substrate (SUB) Consumption Value and Growth Rate (2018-2029) & (USD Million)
    Figure 72. Egypt IC Packaging Substrate (SUB) Consumption Value and Growth Rate (2018-2029) & (USD Million)
    Figure 73. Saudi Arabia IC Packaging Substrate (SUB) Consumption Value and Growth Rate (2018-2029) & (USD Million)
    Figure 74. South Africa IC Packaging Substrate (SUB) Consumption Value and Growth Rate (2018-2029) & (USD Million)
    Figure 75. IC Packaging Substrate (SUB) Market Drivers
    Figure 76. IC Packaging Substrate (SUB) Market Restraints
    Figure 77. IC Packaging Substrate (SUB) Market Trends
    Figure 78. Porters Five Forces Analysis
    Figure 79. Manufacturing Cost Structure Analysis of IC Packaging Substrate (SUB) in 2022
    Figure 80. Manufacturing Process Analysis of IC Packaging Substrate (SUB)
    Figure 81. IC Packaging Substrate (SUB) Industrial Chain
    Figure 82. Sales Quantity Channel: Direct to End-User vs Distributors
    Figure 83. Direct Channel Pros & Cons
    Figure 84. Indirect Channel Pros & Cons
    Figure 85. Methodology
    Figure 86. Research Process and Data Source

Research Methodology

Client Requirements

Review and analyze client requirements

Discussion of all the project requirements and queries

Flexibility Check

Project Feasibility Analysis

Finalizing tentative research programme

Structuring project proposal with scope, timeline, and costs

Analyzing Market Dynamics

Determination of key drivers, restraints, challenge, and opportunity

Identifies market needs and trends

Market Size Estimation & Forecast

Estimation of historical data based on secondary and primary data

Anticipating market recast by assigning weightage to market forces (drivers, restraints, opportunities)

Freezing historical and forecast market size estimations based on evolution, trends, outlook, and strategies

Consideration of geography, region-specific product/service demand for region segments

Consideration of product utilization rates, product demand outlook for segments by application or end-user.

Data Source

Secondary Source
Data collections from annual reports, presentations,associations, journals, analyst reports, paid database, press releases, blogs, newsletters,and GIR repositories.

Primary Source
Research discussion with manufacturers, distributors, suppliers, end user, industry experts to verify insights.

Validation and
triangulation of
secondary and primary source.

Collection of data

Cumulating and collating the essential qualitative and quantitative data

Generation of report in client requested format by research analysts

Reviews by expert analysts

Final quality check

Clarifying queries

Receiving feedback

Ensuring satisfaction

01 Identification of data

This step involves identification of several primary and secondary data research sources, including Global Info Research's internal data sources. The primary sources consist of in-depth discussions and interviews with policy makers, industry experts, and data evaluators, whereas secondary sources include a thorough study of market journals, press releases, annual reports, and government and non-government agencies websites.
02 Evaluation of Market Dynamic

This phase includes a detailed evaluation of several factors that are likely to affect the market dynamics. It involves a comprehensive assessment of major market pain points, drivers, and trends. It also comprises a detailed study of research plans and methodology.
03 Collection of Data

This process consists of gathering data, accessing proprietary databases, and reaching out to key industry participants that operate in the market across the value chain. It also involves studying several patterns in the historical data and comparing it with the current scenario.
04 Collaboration of Data

This stage involves the validation of data and arrival at actual statistics, and evolution of the market over the years. It entails the study and analyzes various segments and verticals of the market. An impact analysis is also performed to observe which factors will affect the market in the next few years.
05 Verification and Analysis

This is the final stage, which involves both quantity and quality checks. Although the process of data verification is an integral part of the research process, all data points and statistics and figures are re-checked to uphold their authenticity and validity.

Companies Mentioned

Samsung Electro-Mechanics
MST
NGK
KLA Corporation
Panasonic
Simmtech
Daeduck
ASE Material
Kyocera
Ibiden
Shinko Electric Industries
AT&S
LG InnoTek
Fastprint Circuit Tech
ACCESS
Danbond Technology
TTM Technologies
Unimicron
Nan Ya PCB
Kinsus
SCC

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