Global Chip Packaging COF Substrate Supply, Demand and Key Producers, 2023-2029

Page: 100

Published Date: 02 Jun 2023

Category: Electronics & Semiconductor

PDF Download

Get FREE Sample

Customize Request

Description
Table of Contents
Table of Figures
Research Methodology
Companies Mentioned
Related Reports
Product Tags

Description

The global Chip Packaging COF Substrate market size is expected to reach $ million by 2029, rising at a market growth of % CAGR during the forecast period (2023-2029).

The chip packaging COF substrate is the key to the current screen transformation. The main principle is to put the display driver IC chip into the flexible FPC cable, and then use the characteristics of the FPC itself to fold it to the bottom of the screen. Specifically, through thermocompression bonding, the gold bumps of the IC chip and the inner pins on the flexible substrate circuit will be combined. Since the space occupied by the IC chip is released, generally speaking, the width of the lower frame can be reduced by at least 1.5mm.

This report studies the global Chip Packaging COF Substrate production, demand, key manufacturers, and key regions.

This report is a detailed and comprehensive analysis of the world market for Chip Packaging COF Substrate, and provides market size (US$ million) and Year-over-Year (YoY) Growth, considering 2022 as the base year. This report explores demand trends and competition, as well as details the characteristics of Chip Packaging COF Substrate that contribute to its increasing demand across many markets.

Highlights and key features of the study
Global Chip Packaging COF Substrate total production and demand, 2018-2029, (K Units)
Global Chip Packaging COF Substrate total production value, 2018-2029, (USD Million)
Global Chip Packaging COF Substrate production by region & country, production, value, CAGR, 2018-2029, (USD Million) & (K Units)
Global Chip Packaging COF Substrate consumption by region & country, CAGR, 2018-2029 & (K Units)
U.S. VS China: Chip Packaging COF Substrate domestic production, consumption, key domestic manufacturers and share
Global Chip Packaging COF Substrate production by manufacturer, production, price, value and market share 2018-2023, (USD Million) & (K Units)
Global Chip Packaging COF Substrate production by Type, production, value, CAGR, 2018-2029, (USD Million) & (K Units)
Global Chip Packaging COF Substrate production by Application production, value, CAGR, 2018-2029, (USD Million) & (K Units)
This reports profiles key players in the global Chip Packaging COF Substrate market based on the following parameters – company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include STEMCO, JMCT, LGIT, FLEXCEED, Chipbond, Shenzhen Danbond Technology Co.Ltd, Leader-Tech Electronics (Shenzhen) Co.,Ltd and Suzhou Hengmairui Material Technology Co., Ltd, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals, COVID-19 and Russia-Ukraine War Influence.

Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World Chip Packaging COF Substrate market
Detailed Segmentation:
Each section contains quantitative market data including market by value (US$ Millions), volume (production, consumption) & (K Units) and average price (US$/Unit) by manufacturer, by Type, and by Application. Data is given for the years 2018-2029 by year with 2022 as the base year, 2023 as the estimate year, and 2024-2029 as the forecast year.

Global Chip Packaging COF Substrate Market, By Region:
    United States
    China
    Europe
    Japan
    South Korea
    ASEAN
    India
    Rest of World

Global Chip Packaging COF Substrate Market, Segmentation by Type
    Single Layer
    Double Layer

Global Chip Packaging COF Substrate Market, Segmentation by Application
    LCD TV
    Laptop
    Cell Phone
    MP3
    Others

Companies Profiled:
    STEMCO
    JMCT
    LGIT
    FLEXCEED
    Chipbond
    Shenzhen Danbond Technology Co.Ltd
    Leader-Tech Electronics (Shenzhen) Co.,Ltd
    Suzhou Hengmairui Material Technology Co., Ltd

Key Questions Answered
1. How big is the global Chip Packaging COF Substrate market?
2. What is the demand of the global Chip Packaging COF Substrate market?
3. What is the year over year growth of the global Chip Packaging COF Substrate market?
4. What is the production and production value of the global Chip Packaging COF Substrate market?
5. Who are the key producers in the global Chip Packaging COF Substrate market?
6. What are the growth factors driving the market demand?

Table of Contents

1 Supply Summary
    1.1 Chip Packaging COF Substrate Introduction
    1.2 World Chip Packaging COF Substrate Supply & Forecast
        1.2.1 World Chip Packaging COF Substrate Production Value (2018 & 2022 & 2029)
        1.2.2 World Chip Packaging COF Substrate Production (2018-2029)
        1.2.3 World Chip Packaging COF Substrate Pricing Trends (2018-2029)
    1.3 World Chip Packaging COF Substrate Production by Region (Based on Production Site)
        1.3.1 World Chip Packaging COF Substrate Production Value by Region (2018-2029)
        1.3.2 World Chip Packaging COF Substrate Production by Region (2018-2029)
        1.3.3 World Chip Packaging COF Substrate Average Price by Region (2018-2029)
        1.3.4 North America Chip Packaging COF Substrate Production (2018-2029)
        1.3.5 Europe Chip Packaging COF Substrate Production (2018-2029)
        1.3.6 China Chip Packaging COF Substrate Production (2018-2029)
        1.3.7 Japan Chip Packaging COF Substrate Production (2018-2029)
        1.3.8 South Korea Chip Packaging COF Substrate Production (2018-2029)
    1.4 Market Drivers, Restraints and Trends
        1.4.1 Chip Packaging COF Substrate Market Drivers
        1.4.2 Factors Affecting Demand
        1.4.3 Chip Packaging COF Substrate Major Market Trends
    1.5 Influence of COVID-19 and Russia-Ukraine War
        1.5.1 Influence of COVID-19
        1.5.2 Influence of Russia-Ukraine War

2 Demand Summary
    2.1 World Chip Packaging COF Substrate Demand (2018-2029)
    2.2 World Chip Packaging COF Substrate Consumption by Region
        2.2.1 World Chip Packaging COF Substrate Consumption by Region (2018-2023)
        2.2.2 World Chip Packaging COF Substrate Consumption Forecast by Region (2024-2029)
    2.3 United States Chip Packaging COF Substrate Consumption (2018-2029)
    2.4 China Chip Packaging COF Substrate Consumption (2018-2029)
    2.5 Europe Chip Packaging COF Substrate Consumption (2018-2029)
    2.6 Japan Chip Packaging COF Substrate Consumption (2018-2029)
    2.7 South Korea Chip Packaging COF Substrate Consumption (2018-2029)
    2.8 ASEAN Chip Packaging COF Substrate Consumption (2018-2029)
    2.9 India Chip Packaging COF Substrate Consumption (2018-2029)

3 World Chip Packaging COF Substrate Manufacturers Competitive Analysis
    3.1 World Chip Packaging COF Substrate Production Value by Manufacturer (2018-2023)
    3.2 World Chip Packaging COF Substrate Production by Manufacturer (2018-2023)
    3.3 World Chip Packaging COF Substrate Average Price by Manufacturer (2018-2023)
    3.4 Chip Packaging COF Substrate Company Evaluation Quadrant
    3.5 Industry Rank and Concentration Rate (CR)
        3.5.1 Global Chip Packaging COF Substrate Industry Rank of Major Manufacturers
        3.5.2 Global Concentration Ratios (CR4) for Chip Packaging COF Substrate in 2022
        3.5.3 Global Concentration Ratios (CR8) for Chip Packaging COF Substrate in 2022
    3.6 Chip Packaging COF Substrate Market: Overall Company Footprint Analysis
        3.6.1 Chip Packaging COF Substrate Market: Region Footprint
        3.6.2 Chip Packaging COF Substrate Market: Company Product Type Footprint
        3.6.3 Chip Packaging COF Substrate Market: Company Product Application Footprint
    3.7 Competitive Environment
        3.7.1 Historical Structure of the Industry
        3.7.2 Barriers of Market Entry
        3.7.3 Factors of Competition
    3.8 New Entrant and Capacity Expansion Plans
    3.9 Mergers, Acquisition, Agreements, and Collaborations

4 United States VS China VS Rest of the World
    4.1 United States VS China: Chip Packaging COF Substrate Production Value Comparison
        4.1.1 United States VS China: Chip Packaging COF Substrate Production Value Comparison (2018 & 2022 & 2029)
        4.1.2 United States VS China: Chip Packaging COF Substrate Production Value Market Share Comparison (2018 & 2022 & 2029)
    4.2 United States VS China: Chip Packaging COF Substrate Production Comparison
        4.2.1 United States VS China: Chip Packaging COF Substrate Production Comparison (2018 & 2022 & 2029)
        4.2.2 United States VS China: Chip Packaging COF Substrate Production Market Share Comparison (2018 & 2022 & 2029)
    4.3 United States VS China: Chip Packaging COF Substrate Consumption Comparison
        4.3.1 United States VS China: Chip Packaging COF Substrate Consumption Comparison (2018 & 2022 & 2029)
        4.3.2 United States VS China: Chip Packaging COF Substrate Consumption Market Share Comparison (2018 & 2022 & 2029)
    4.4 United States Based Chip Packaging COF Substrate Manufacturers and Market Share, 2018-2023
        4.4.1 United States Based Chip Packaging COF Substrate Manufacturers, Headquarters and Production Site (States, Country)
        4.4.2 United States Based Manufacturers Chip Packaging COF Substrate Production Value (2018-2023)
        4.4.3 United States Based Manufacturers Chip Packaging COF Substrate Production (2018-2023)
    4.5 China Based Chip Packaging COF Substrate Manufacturers and Market Share
        4.5.1 China Based Chip Packaging COF Substrate Manufacturers, Headquarters and Production Site (Province, Country)
        4.5.2 China Based Manufacturers Chip Packaging COF Substrate Production Value (2018-2023)
        4.5.3 China Based Manufacturers Chip Packaging COF Substrate Production (2018-2023)
    4.6 Rest of World Based Chip Packaging COF Substrate Manufacturers and Market Share, 2018-2023
        4.6.1 Rest of World Based Chip Packaging COF Substrate Manufacturers, Headquarters and Production Site (State, Country)
        4.6.2 Rest of World Based Manufacturers Chip Packaging COF Substrate Production Value (2018-2023)
        4.6.3 Rest of World Based Manufacturers Chip Packaging COF Substrate Production (2018-2023)

5 Market Analysis by Type
    5.1 World Chip Packaging COF Substrate Market Size Overview by Type: 2018 VS 2022 VS 2029
    5.2 Segment Introduction by Type
        5.2.1 Single Layer
        5.2.2 Double Layer
    5.3 Market Segment by Type
        5.3.1 World Chip Packaging COF Substrate Production by Type (2018-2029)
        5.3.2 World Chip Packaging COF Substrate Production Value by Type (2018-2029)
        5.3.3 World Chip Packaging COF Substrate Average Price by Type (2018-2029)

6 Market Analysis by Application
    6.1 World Chip Packaging COF Substrate Market Size Overview by Application: 2018 VS 2022 VS 2029
    6.2 Segment Introduction by Application
        6.2.1 LCD TV
        6.2.2 Laptop
        6.2.3 Cell Phone
        6.2.4 MP3
        6.2.5 Others
    6.3 Market Segment by Application
        6.3.1 World Chip Packaging COF Substrate Production by Application (2018-2029)
        6.3.2 World Chip Packaging COF Substrate Production Value by Application (2018-2029)
        6.3.3 World Chip Packaging COF Substrate Average Price by Application (2018-2029)

7 Company Profiles
    7.1 STEMCO
        7.1.1 STEMCO Details
        7.1.2 STEMCO Major Business
        7.1.3 STEMCO Chip Packaging COF Substrate Product and Services
        7.1.4 STEMCO Chip Packaging COF Substrate Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.1.5 STEMCO Recent Developments/Updates
        7.1.6 STEMCO Competitive Strengths & Weaknesses
    7.2 JMCT
        7.2.1 JMCT Details
        7.2.2 JMCT Major Business
        7.2.3 JMCT Chip Packaging COF Substrate Product and Services
        7.2.4 JMCT Chip Packaging COF Substrate Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.2.5 JMCT Recent Developments/Updates
        7.2.6 JMCT Competitive Strengths & Weaknesses
    7.3 LGIT
        7.3.1 LGIT Details
        7.3.2 LGIT Major Business
        7.3.3 LGIT Chip Packaging COF Substrate Product and Services
        7.3.4 LGIT Chip Packaging COF Substrate Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.3.5 LGIT Recent Developments/Updates
        7.3.6 LGIT Competitive Strengths & Weaknesses
    7.4 FLEXCEED
        7.4.1 FLEXCEED Details
        7.4.2 FLEXCEED Major Business
        7.4.3 FLEXCEED Chip Packaging COF Substrate Product and Services
        7.4.4 FLEXCEED Chip Packaging COF Substrate Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.4.5 FLEXCEED Recent Developments/Updates
        7.4.6 FLEXCEED Competitive Strengths & Weaknesses
    7.5 Chipbond
        7.5.1 Chipbond Details
        7.5.2 Chipbond Major Business
        7.5.3 Chipbond Chip Packaging COF Substrate Product and Services
        7.5.4 Chipbond Chip Packaging COF Substrate Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.5.5 Chipbond Recent Developments/Updates
        7.5.6 Chipbond Competitive Strengths & Weaknesses
    7.6 Shenzhen Danbond Technology Co.Ltd
        7.6.1 Shenzhen Danbond Technology Co.Ltd Details
        7.6.2 Shenzhen Danbond Technology Co.Ltd Major Business
        7.6.3 Shenzhen Danbond Technology Co.Ltd Chip Packaging COF Substrate Product and Services
        7.6.4 Shenzhen Danbond Technology Co.Ltd Chip Packaging COF Substrate Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.6.5 Shenzhen Danbond Technology Co.Ltd Recent Developments/Updates
        7.6.6 Shenzhen Danbond Technology Co.Ltd Competitive Strengths & Weaknesses
    7.7 Leader-Tech Electronics (Shenzhen) Co.,Ltd
        7.7.1 Leader-Tech Electronics (Shenzhen) Co.,Ltd Details
        7.7.2 Leader-Tech Electronics (Shenzhen) Co.,Ltd Major Business
        7.7.3 Leader-Tech Electronics (Shenzhen) Co.,Ltd Chip Packaging COF Substrate Product and Services
        7.7.4 Leader-Tech Electronics (Shenzhen) Co.,Ltd Chip Packaging COF Substrate Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.7.5 Leader-Tech Electronics (Shenzhen) Co.,Ltd Recent Developments/Updates
        7.7.6 Leader-Tech Electronics (Shenzhen) Co.,Ltd Competitive Strengths & Weaknesses
    7.8 Suzhou Hengmairui Material Technology Co., Ltd
        7.8.1 Suzhou Hengmairui Material Technology Co., Ltd Details
        7.8.2 Suzhou Hengmairui Material Technology Co., Ltd Major Business
        7.8.3 Suzhou Hengmairui Material Technology Co., Ltd Chip Packaging COF Substrate Product and Services
        7.8.4 Suzhou Hengmairui Material Technology Co., Ltd Chip Packaging COF Substrate Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.8.5 Suzhou Hengmairui Material Technology Co., Ltd Recent Developments/Updates
        7.8.6 Suzhou Hengmairui Material Technology Co., Ltd Competitive Strengths & Weaknesses

8 Industry Chain Analysis
    8.1 Chip Packaging COF Substrate Industry Chain
    8.2 Chip Packaging COF Substrate Upstream Analysis
        8.2.1 Chip Packaging COF Substrate Core Raw Materials
        8.2.2 Main Manufacturers of Chip Packaging COF Substrate Core Raw Materials
    8.3 Midstream Analysis
    8.4 Downstream Analysis
    8.5 Chip Packaging COF Substrate Production Mode
    8.6 Chip Packaging COF Substrate Procurement Model
    8.7 Chip Packaging COF Substrate Industry Sales Model and Sales Channels
        8.7.1 Chip Packaging COF Substrate Sales Model
        8.7.2 Chip Packaging COF Substrate Typical Customers

9 Research Findings and Conclusion

10 Appendix
    10.1 Methodology
    10.2 Research Process and Data Source
    10.3 Disclaimer

Table of Figures

List of Tables
    Table 1. World Chip Packaging COF Substrate Production Value by Region (2018, 2022 and 2029) & (USD Million)
    Table 2. World Chip Packaging COF Substrate Production Value by Region (2018-2023) & (USD Million)
    Table 3. World Chip Packaging COF Substrate Production Value by Region (2024-2029) & (USD Million)
    Table 4. World Chip Packaging COF Substrate Production Value Market Share by Region (2018-2023)
    Table 5. World Chip Packaging COF Substrate Production Value Market Share by Region (2024-2029)
    Table 6. World Chip Packaging COF Substrate Production by Region (2018-2023) & (K Units)
    Table 7. World Chip Packaging COF Substrate Production by Region (2024-2029) & (K Units)
    Table 8. World Chip Packaging COF Substrate Production Market Share by Region (2018-2023)
    Table 9. World Chip Packaging COF Substrate Production Market Share by Region (2024-2029)
    Table 10. World Chip Packaging COF Substrate Average Price by Region (2018-2023) & (US$/Unit)
    Table 11. World Chip Packaging COF Substrate Average Price by Region (2024-2029) & (US$/Unit)
    Table 12. Chip Packaging COF Substrate Major Market Trends
    Table 13. World Chip Packaging COF Substrate Consumption Growth Rate Forecast by Region (2018 & 2022 & 2029) & (K Units)
    Table 14. World Chip Packaging COF Substrate Consumption by Region (2018-2023) & (K Units)
    Table 15. World Chip Packaging COF Substrate Consumption Forecast by Region (2024-2029) & (K Units)
    Table 16. World Chip Packaging COF Substrate Production Value by Manufacturer (2018-2023) & (USD Million)
    Table 17. Production Value Market Share of Key Chip Packaging COF Substrate Producers in 2022
    Table 18. World Chip Packaging COF Substrate Production by Manufacturer (2018-2023) & (K Units)
    Table 19. Production Market Share of Key Chip Packaging COF Substrate Producers in 2022
    Table 20. World Chip Packaging COF Substrate Average Price by Manufacturer (2018-2023) & (US$/Unit)
    Table 21. Global Chip Packaging COF Substrate Company Evaluation Quadrant
    Table 22. World Chip Packaging COF Substrate Industry Rank of Major Manufacturers, Based on Production Value in 2022
    Table 23. Head Office and Chip Packaging COF Substrate Production Site of Key Manufacturer
    Table 24. Chip Packaging COF Substrate Market: Company Product Type Footprint
    Table 25. Chip Packaging COF Substrate Market: Company Product Application Footprint
    Table 26. Chip Packaging COF Substrate Competitive Factors
    Table 27. Chip Packaging COF Substrate New Entrant and Capacity Expansion Plans
    Table 28. Chip Packaging COF Substrate Mergers & Acquisitions Activity
    Table 29. United States VS China Chip Packaging COF Substrate Production Value Comparison, (2018 & 2022 & 2029) & (USD Million)
    Table 30. United States VS China Chip Packaging COF Substrate Production Comparison, (2018 & 2022 & 2029) & (K Units)
    Table 31. United States VS China Chip Packaging COF Substrate Consumption Comparison, (2018 & 2022 & 2029) & (K Units)
    Table 32. United States Based Chip Packaging COF Substrate Manufacturers, Headquarters and Production Site (States, Country)
    Table 33. United States Based Manufacturers Chip Packaging COF Substrate Production Value, (2018-2023) & (USD Million)
    Table 34. United States Based Manufacturers Chip Packaging COF Substrate Production Value Market Share (2018-2023)
    Table 35. United States Based Manufacturers Chip Packaging COF Substrate Production (2018-2023) & (K Units)
    Table 36. United States Based Manufacturers Chip Packaging COF Substrate Production Market Share (2018-2023)
    Table 37. China Based Chip Packaging COF Substrate Manufacturers, Headquarters and Production Site (Province, Country)
    Table 38. China Based Manufacturers Chip Packaging COF Substrate Production Value, (2018-2023) & (USD Million)
    Table 39. China Based Manufacturers Chip Packaging COF Substrate Production Value Market Share (2018-2023)
    Table 40. China Based Manufacturers Chip Packaging COF Substrate Production (2018-2023) & (K Units)
    Table 41. China Based Manufacturers Chip Packaging COF Substrate Production Market Share (2018-2023)
    Table 42. Rest of World Based Chip Packaging COF Substrate Manufacturers, Headquarters and Production Site (States, Country)
    Table 43. Rest of World Based Manufacturers Chip Packaging COF Substrate Production Value, (2018-2023) & (USD Million)
    Table 44. Rest of World Based Manufacturers Chip Packaging COF Substrate Production Value Market Share (2018-2023)
    Table 45. Rest of World Based Manufacturers Chip Packaging COF Substrate Production (2018-2023) & (K Units)
    Table 46. Rest of World Based Manufacturers Chip Packaging COF Substrate Production Market Share (2018-2023)
    Table 47. World Chip Packaging COF Substrate Production Value by Type, (USD Million), 2018 & 2022 & 2029
    Table 48. World Chip Packaging COF Substrate Production by Type (2018-2023) & (K Units)
    Table 49. World Chip Packaging COF Substrate Production by Type (2024-2029) & (K Units)
    Table 50. World Chip Packaging COF Substrate Production Value by Type (2018-2023) & (USD Million)
    Table 51. World Chip Packaging COF Substrate Production Value by Type (2024-2029) & (USD Million)
    Table 52. World Chip Packaging COF Substrate Average Price by Type (2018-2023) & (US$/Unit)
    Table 53. World Chip Packaging COF Substrate Average Price by Type (2024-2029) & (US$/Unit)
    Table 54. World Chip Packaging COF Substrate Production Value by Application, (USD Million), 2018 & 2022 & 2029
    Table 55. World Chip Packaging COF Substrate Production by Application (2018-2023) & (K Units)
    Table 56. World Chip Packaging COF Substrate Production by Application (2024-2029) & (K Units)
    Table 57. World Chip Packaging COF Substrate Production Value by Application (2018-2023) & (USD Million)
    Table 58. World Chip Packaging COF Substrate Production Value by Application (2024-2029) & (USD Million)
    Table 59. World Chip Packaging COF Substrate Average Price by Application (2018-2023) & (US$/Unit)
    Table 60. World Chip Packaging COF Substrate Average Price by Application (2024-2029) & (US$/Unit)
    Table 61. STEMCO Basic Information, Manufacturing Base and Competitors
    Table 62. STEMCO Major Business
    Table 63. STEMCO Chip Packaging COF Substrate Product and Services
    Table 64. STEMCO Chip Packaging COF Substrate Production (K Units), Price (US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 65. STEMCO Recent Developments/Updates
    Table 66. STEMCO Competitive Strengths & Weaknesses
    Table 67. JMCT Basic Information, Manufacturing Base and Competitors
    Table 68. JMCT Major Business
    Table 69. JMCT Chip Packaging COF Substrate Product and Services
    Table 70. JMCT Chip Packaging COF Substrate Production (K Units), Price (US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 71. JMCT Recent Developments/Updates
    Table 72. JMCT Competitive Strengths & Weaknesses
    Table 73. LGIT Basic Information, Manufacturing Base and Competitors
    Table 74. LGIT Major Business
    Table 75. LGIT Chip Packaging COF Substrate Product and Services
    Table 76. LGIT Chip Packaging COF Substrate Production (K Units), Price (US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 77. LGIT Recent Developments/Updates
    Table 78. LGIT Competitive Strengths & Weaknesses
    Table 79. FLEXCEED Basic Information, Manufacturing Base and Competitors
    Table 80. FLEXCEED Major Business
    Table 81. FLEXCEED Chip Packaging COF Substrate Product and Services
    Table 82. FLEXCEED Chip Packaging COF Substrate Production (K Units), Price (US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 83. FLEXCEED Recent Developments/Updates
    Table 84. FLEXCEED Competitive Strengths & Weaknesses
    Table 85. Chipbond Basic Information, Manufacturing Base and Competitors
    Table 86. Chipbond Major Business
    Table 87. Chipbond Chip Packaging COF Substrate Product and Services
    Table 88. Chipbond Chip Packaging COF Substrate Production (K Units), Price (US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 89. Chipbond Recent Developments/Updates
    Table 90. Chipbond Competitive Strengths & Weaknesses
    Table 91. Shenzhen Danbond Technology Co.Ltd Basic Information, Manufacturing Base and Competitors
    Table 92. Shenzhen Danbond Technology Co.Ltd Major Business
    Table 93. Shenzhen Danbond Technology Co.Ltd Chip Packaging COF Substrate Product and Services
    Table 94. Shenzhen Danbond Technology Co.Ltd Chip Packaging COF Substrate Production (K Units), Price (US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 95. Shenzhen Danbond Technology Co.Ltd Recent Developments/Updates
    Table 96. Shenzhen Danbond Technology Co.Ltd Competitive Strengths & Weaknesses
    Table 97. Leader-Tech Electronics (Shenzhen) Co.,Ltd Basic Information, Manufacturing Base and Competitors
    Table 98. Leader-Tech Electronics (Shenzhen) Co.,Ltd Major Business
    Table 99. Leader-Tech Electronics (Shenzhen) Co.,Ltd Chip Packaging COF Substrate Product and Services
    Table 100. Leader-Tech Electronics (Shenzhen) Co.,Ltd Chip Packaging COF Substrate Production (K Units), Price (US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 101. Leader-Tech Electronics (Shenzhen) Co.,Ltd Recent Developments/Updates
    Table 102. Suzhou Hengmairui Material Technology Co., Ltd Basic Information, Manufacturing Base and Competitors
    Table 103. Suzhou Hengmairui Material Technology Co., Ltd Major Business
    Table 104. Suzhou Hengmairui Material Technology Co., Ltd Chip Packaging COF Substrate Product and Services
    Table 105. Suzhou Hengmairui Material Technology Co., Ltd Chip Packaging COF Substrate Production (K Units), Price (US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 106. Global Key Players of Chip Packaging COF Substrate Upstream (Raw Materials)
    Table 107. Chip Packaging COF Substrate Typical Customers
    Table 108. Chip Packaging COF Substrate Typical Distributors
List of Figure
    Figure 1. Chip Packaging COF Substrate Picture
    Figure 2. World Chip Packaging COF Substrate Production Value: 2018 & 2022 & 2029, (USD Million)
    Figure 3. World Chip Packaging COF Substrate Production Value and Forecast (2018-2029) & (USD Million)
    Figure 4. World Chip Packaging COF Substrate Production (2018-2029) & (K Units)
    Figure 5. World Chip Packaging COF Substrate Average Price (2018-2029) & (US$/Unit)
    Figure 6. World Chip Packaging COF Substrate Production Value Market Share by Region (2018-2029)
    Figure 7. World Chip Packaging COF Substrate Production Market Share by Region (2018-2029)
    Figure 8. North America Chip Packaging COF Substrate Production (2018-2029) & (K Units)
    Figure 9. Europe Chip Packaging COF Substrate Production (2018-2029) & (K Units)
    Figure 10. China Chip Packaging COF Substrate Production (2018-2029) & (K Units)
    Figure 11. Japan Chip Packaging COF Substrate Production (2018-2029) & (K Units)
    Figure 12. South Korea Chip Packaging COF Substrate Production (2018-2029) & (K Units)
    Figure 13. Chip Packaging COF Substrate Market Drivers
    Figure 14. Factors Affecting Demand
    Figure 15. World Chip Packaging COF Substrate Consumption (2018-2029) & (K Units)
    Figure 16. World Chip Packaging COF Substrate Consumption Market Share by Region (2018-2029)
    Figure 17. United States Chip Packaging COF Substrate Consumption (2018-2029) & (K Units)
    Figure 18. China Chip Packaging COF Substrate Consumption (2018-2029) & (K Units)
    Figure 19. Europe Chip Packaging COF Substrate Consumption (2018-2029) & (K Units)
    Figure 20. Japan Chip Packaging COF Substrate Consumption (2018-2029) & (K Units)
    Figure 21. South Korea Chip Packaging COF Substrate Consumption (2018-2029) & (K Units)
    Figure 22. ASEAN Chip Packaging COF Substrate Consumption (2018-2029) & (K Units)
    Figure 23. India Chip Packaging COF Substrate Consumption (2018-2029) & (K Units)
    Figure 24. Producer Shipments of Chip Packaging COF Substrate by Manufacturer Revenue ($MM) and Market Share (%): 2022
    Figure 25. Global Four-firm Concentration Ratios (CR4) for Chip Packaging COF Substrate Markets in 2022
    Figure 26. Global Four-firm Concentration Ratios (CR8) for Chip Packaging COF Substrate Markets in 2022
    Figure 27. United States VS China: Chip Packaging COF Substrate Production Value Market Share Comparison (2018 & 2022 & 2029)
    Figure 28. United States VS China: Chip Packaging COF Substrate Production Market Share Comparison (2018 & 2022 & 2029)
    Figure 29. United States VS China: Chip Packaging COF Substrate Consumption Market Share Comparison (2018 & 2022 & 2029)
    Figure 30. United States Based Manufacturers Chip Packaging COF Substrate Production Market Share 2022
    Figure 31. China Based Manufacturers Chip Packaging COF Substrate Production Market Share 2022
    Figure 32. Rest of World Based Manufacturers Chip Packaging COF Substrate Production Market Share 2022
    Figure 33. World Chip Packaging COF Substrate Production Value by Type, (USD Million), 2018 & 2022 & 2029
    Figure 34. World Chip Packaging COF Substrate Production Value Market Share by Type in 2022
    Figure 35. Single Layer
    Figure 36. Double Layer
    Figure 37. World Chip Packaging COF Substrate Production Market Share by Type (2018-2029)
    Figure 38. World Chip Packaging COF Substrate Production Value Market Share by Type (2018-2029)
    Figure 39. World Chip Packaging COF Substrate Average Price by Type (2018-2029) & (US$/Unit)
    Figure 40. World Chip Packaging COF Substrate Production Value by Application, (USD Million), 2018 & 2022 & 2029
    Figure 41. World Chip Packaging COF Substrate Production Value Market Share by Application in 2022
    Figure 42. LCD TV
    Figure 43. Laptop
    Figure 44. Cell Phone
    Figure 45. MP3
    Figure 46. Others
    Figure 47. World Chip Packaging COF Substrate Production Market Share by Application (2018-2029)
    Figure 48. World Chip Packaging COF Substrate Production Value Market Share by Application (2018-2029)
    Figure 49. World Chip Packaging COF Substrate Average Price by Application (2018-2029) & (US$/Unit)
    Figure 50. Chip Packaging COF Substrate Industry Chain
    Figure 51. Chip Packaging COF Substrate Procurement Model
    Figure 52. Chip Packaging COF Substrate Sales Model
    Figure 53. Chip Packaging COF Substrate Sales Channels, Direct Sales, and Distribution
    Figure 54. Methodology
    Figure 55. Research Process and Data Source

Research Methodology

Client Requirements

Review and analyze client requirements

Discussion of all the project requirements and queries

Flexibility Check

Project Feasibility Analysis

Finalizing tentative research programme

Structuring project proposal with scope, timeline, and costs

Analyzing Market Dynamics

Determination of key drivers, restraints, challenge, and opportunity

Identifies market needs and trends

Market Size Estimation & Forecast

Estimation of historical data based on secondary and primary data

Anticipating market recast by assigning weightage to market forces (drivers, restraints, opportunities)

Freezing historical and forecast market size estimations based on evolution, trends, outlook, and strategies

Consideration of geography, region-specific product/service demand for region segments

Consideration of product utilization rates, product demand outlook for segments by application or end-user.

Data Source

Secondary Source
Data collections from annual reports, presentations,associations, journals, analyst reports, paid database, press releases, blogs, newsletters,and GIR repositories.

Primary Source
Research discussion with manufacturers, distributors, suppliers, end user, industry experts to verify insights.

Validation and
triangulation of
secondary and primary source.

Collection of data

Cumulating and collating the essential qualitative and quantitative data

Generation of report in client requested format by research analysts

Reviews by expert analysts

Final quality check

Clarifying queries

Receiving feedback

Ensuring satisfaction

01 Identification of data

This step involves identification of several primary and secondary data research sources, including Global Info Research's internal data sources. The primary sources consist of in-depth discussions and interviews with policy makers, industry experts, and data evaluators, whereas secondary sources include a thorough study of market journals, press releases, annual reports, and government and non-government agencies websites.
02 Evaluation of Market Dynamic

This phase includes a detailed evaluation of several factors that are likely to affect the market dynamics. It involves a comprehensive assessment of major market pain points, drivers, and trends. It also comprises a detailed study of research plans and methodology.
03 Collection of Data

This process consists of gathering data, accessing proprietary databases, and reaching out to key industry participants that operate in the market across the value chain. It also involves studying several patterns in the historical data and comparing it with the current scenario.
04 Collaboration of Data

This stage involves the validation of data and arrival at actual statistics, and evolution of the market over the years. It entails the study and analyzes various segments and verticals of the market. An impact analysis is also performed to observe which factors will affect the market in the next few years.
05 Verification and Analysis

This is the final stage, which involves both quantity and quality checks. Although the process of data verification is an integral part of the research process, all data points and statistics and figures are re-checked to uphold their authenticity and validity.

Companies Mentioned

STEMCO
JMCT
LGIT
FLEXCEED
Chipbond
Shenzhen Danbond Technology Co.Ltd
Leader-Tech Electronics (Shenzhen) Co.,Ltd
Suzhou Hengmairui Material Technology Co., Ltd

Related Reports

Global Chip Packaging COF Substrate Market 2023 by Manufacturers, Regions, Type and Application, Forecast to 2029

Global Chip Packaging COF Substrate Market 2023 by Manufacturers, Regions, Type and Application, Forecast to 2029

date 02 Jun 2023

date Electronics & Semiconductor

According to our (Global Info Research) latest study, the global Chip Packaging COF Substrate market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029 with a CAGR of % during review period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.

Global Chip Packaging COF Substrate Supply, Demand and Key Producers, 2024-2030

Global Chip Packaging COF Substrate Supply, Demand and Key Producers, 2024-2030

date 27 Feb 2024

date Electronics & Semiconductor

The global Chip Packaging COF Substrate market size is expected to reach $ million by 2030, rising at a market growth of % CAGR during the forecast period (2024-2030).

Product Tags

Chip Packaging COF Substrate

Fault Line Indicator Supply

Low Response Time Display Supply

Hi-Fi Stereo Power Amplifiers

Purchase Options

Single User License

USD4480.00

Multi User License

USD6720.00

Corporate Users License

USD8960.00

Add To Cart

Buy Now

Popular Product Keywords

AI
semiconductor
electron
5G
artificial intelligence
Battery
new energy
We Provide Professional, Accurate Market Analysis to Help You Stay Ahead of Your Competition.

Speak to our analyst >>
Our Clients
What We Can Provide?

With better results and higher quality products,Our professional reports can achieve four things:
- Insight into the industry market information
- Analyze market development needs
- Prospects for future development
- Develop industry investment strategy
Digging deeper into global industry information and providing market strategies.

Contact Us >>