Global Automotive Chip Packaging Market 2024 by Company, Regions, Type and Application, Forecast to 2030
Page: 143
Published Date: 17 Jan 2024
Category: Electronics & Semiconductor
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Description
Table of Contents
Table of Figures
Research Methodology
Companies Mentioned
Related Reports
Product Tags
Table of Contents
Table of Figures
Research Methodology
Companies Mentioned
Related Reports
Product Tags
Description
According to our (Global Info Research) latest study, the global Automotive Chip Packaging market size was valued at USD 8674 million in 2023 and is forecast to a readjusted size of USD 15150 million by 2030 with a CAGR of 8.3% during review period.
Automotive electronics encompasses a variety of products – from body electronics and access systems to engine, lighting and infotainment components. This report studies the Automotive Chip Packaging.
Currently the key players of Automotive OSAT are Amkor, ASE Group and UTAC, Others Automotive OSAT players are mainly located in China Taiwan, South Korea, China mainland, Southeast Asia (Singapore and Malaysia), including Chipbond Technology Corporation, ChipMOS TECHNOLOGIES, Powertech Technology Inc. (PTI), King Yuan Electronics Corp. (KYEC), OSE CORP., Sigurd Microelectronics, Natronix Semiconductor Technology, Nepes, SFA Semicon, Unisem Group, Carsem, Union Semiconductor（Hefei）Co., Ltd., Tongfu Microelectronics (TFME), Hefei Chipmore Technology Co.,Ltd., JCET Group and HT-tech, etc.
The Global Info Research report includes an overview of the development of the Automotive Chip Packaging industry chain, the market status of Automotive OSAT (Ceramic Substrate, WB BGA), Automotive IDM (Ceramic Substrate, WB BGA), and key enterprises in developed and developing market, and analysed the cutting-edge technology, patent, hot applications and market trends of Automotive Chip Packaging.
Regionally, the report analyzes the Automotive Chip Packaging markets in key regions. North America and Europe are experiencing steady growth, driven by government initiatives and increasing consumer awareness. Asia-Pacific, particularly China, leads the global Automotive Chip Packaging market, with robust domestic demand, supportive policies, and a strong manufacturing base.
Key Features:
The report presents comprehensive understanding of the Automotive Chip Packaging market. It provides a holistic view of the industry, as well as detailed insights into individual components and stakeholders. The report analysis market dynamics, trends, challenges, and opportunities within the Automotive Chip Packaging industry.
The report involves analyzing the market at a macro level:
Market Sizing and Segmentation: Report collect data on the overall market size, including the revenue generated, and market share of different by Type (e.g., Ceramic Substrate, WB BGA).
Industry Analysis: Report analyse the broader industry trends, such as government policies and regulations, technological advancements, consumer preferences, and market dynamics. This analysis helps in understanding the key drivers and challenges influencing the Automotive Chip Packaging market.
Regional Analysis: The report involves examining the Automotive Chip Packaging market at a regional or national level. Report analyses regional factors such as government incentives, infrastructure development, economic conditions, and consumer behaviour to identify variations and opportunities within different markets.
Market Projections: Report covers the gathered data and analysis to make future projections and forecasts for the Automotive Chip Packaging market. This may include estimating market growth rates, predicting market demand, and identifying emerging trends.
The report also involves a more granular approach to Automotive Chip Packaging:
Company Analysis: Report covers individual Automotive Chip Packaging players, suppliers, and other relevant industry players. This analysis includes studying their financial performance, market positioning, product portfolios, partnerships, and strategies.
Consumer Analysis: Report covers data on consumer behaviour, preferences, and attitudes towards Automotive Chip Packaging This may involve surveys, interviews, and analysis of consumer reviews and feedback from different by Application (Automotive OSAT, Automotive IDM).
Technology Analysis: Report covers specific technologies relevant to Automotive Chip Packaging. It assesses the current state, advancements, and potential future developments in Automotive Chip Packaging areas.
Competitive Landscape: By analyzing individual companies, suppliers, and consumers, the report present insights into the competitive landscape of the Automotive Chip Packaging market. This analysis helps understand market share, competitive advantages, and potential areas for differentiation among industry players.
Market Validation: The report involves validating findings and projections through primary research, such as surveys, interviews, and focus groups.
Market Segmentation
Automotive Chip Packaging market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of value.
Market segment by Type
Ceramic Substrate
WB BGA
Lead Frame
FC BGA
Power Module
Others
Market segment by Application
Automotive OSAT
Automotive IDM
Market segment by players, this report covers
NXP
Infineon (Cypress)
Renesas
Texas Instrument
STMicroelectronics
Bosch
onsemi
Mitsubishi Electric
Rapidus
Rohm
ADI
Microchip (Microsemi)
Amkor
ASE (SPIL)
UTAC
JCET (STATS ChipPAC)
Carsem
King Yuan Electronics Corp. (KYEC)
KINGPAK Technology Inc
Powertech Technology Inc. (PTI)
SFA Semicon
Unisem Group
Chipbond Technology Corporation
ChipMOS TECHNOLOGIES
OSE CORP.
Sigurd Microelectronics
Natronix Semiconductor Technology
Nepes
KESM Industries Berhad
Forehope Electronic (Ningbo) Co.,Ltd.
Union Semiconductor（Hefei）Co., Ltd.
Tongfu Microelectronics (TFME)
Hefei Chipmore Technology Co.,Ltd.
HT-tech
China Wafer Level CSP Co., Ltd
Ningbo ChipEx Semiconductor Co., Ltd
Guangdong Leadyo IC Testing
Unimos Microelectronics (Shanghai)
Sino Technology
Taiji Semiconductor (Suzhou)
Market segment by regions, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, UK, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, South Korea, India, Southeast Asia, Australia and Rest of Asia-Pacific)
South America (Brazil, Argentina and Rest of South America)
Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of Middle East & Africa)
The content of the study subjects, includes a total of 13 chapters:
Chapter 1, to describe Automotive Chip Packaging product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top players of Automotive Chip Packaging, with revenue, gross margin and global market share of Automotive Chip Packaging from 2019 to 2024.
Chapter 3, the Automotive Chip Packaging competitive situation, revenue and global market share of top players are analyzed emphatically by landscape contrast.
Chapter 4 and 5, to segment the market size by Type and application, with consumption value and growth rate by Type, application, from 2019 to 2030.
Chapter 6, 7, 8, 9, and 10, to break the market size data at the country level, with revenue and market share for key countries in the world, from 2019 to 2024.and Automotive Chip Packaging market forecast, by regions, type and application, with consumption value, from 2025 to 2030.
Chapter 11, market dynamics, drivers, restraints, trends and Porters Five Forces analysis.
Chapter 12, the key raw materials and key suppliers, and industry chain of Automotive Chip Packaging.
Chapter 13, to describe Automotive Chip Packaging research findings and conclusion.
Table of Contents
1 Market Overview
1.1 Product Overview and Scope of Automotive Chip Packaging
1.2 Market Estimation Caveats and Base Year
1.3 Classification of Automotive Chip Packaging by Type
1.3.1 Overview: Global Automotive Chip Packaging Market Size by Type: 2019 Versus 2023 Versus 2030
1.3.2 Global Automotive Chip Packaging Consumption Value Market Share by Type in 2023
1.3.3 Ceramic Substrate
1.3.4 WB BGA
1.3.5 Lead Frame
1.3.6 FC BGA
1.3.7 Power Module
1.3.8 Others
1.4 Global Automotive Chip Packaging Market by Application
1.4.1 Overview: Global Automotive Chip Packaging Market Size by Application: 2019 Versus 2023 Versus 2030
1.4.2 Automotive OSAT
1.4.3 Automotive IDM
1.5 Global Automotive Chip Packaging Market Size & Forecast
1.6 Global Automotive Chip Packaging Market Size and Forecast by Region
1.6.1 Global Automotive Chip Packaging Market Size by Region: 2019 VS 2023 VS 2030
1.6.2 Global Automotive Chip Packaging Market Size by Region, (2019-2030)
1.6.3 North America Automotive Chip Packaging Market Size and Prospect (2019-2030)
1.6.4 Europe Automotive Chip Packaging Market Size and Prospect (2019-2030)
1.6.5 Asia-Pacific Automotive Chip Packaging Market Size and Prospect (2019-2030)
1.6.6 South America Automotive Chip Packaging Market Size and Prospect (2019-2030)
1.6.7 Middle East and Africa Automotive Chip Packaging Market Size and Prospect (2019-2030)
2.1 NXP
2.1.1 NXP Details
2.1.2 NXP Major Business
2.1.3 NXP Automotive Chip Packaging Product and Solutions
2.1.4 NXP Automotive Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
2.1.5 NXP Recent Developments and Future Plans
2.2 Infineon (Cypress)
2.2.1 Infineon (Cypress) Details
2.2.2 Infineon (Cypress) Major Business
2.2.3 Infineon (Cypress) Automotive Chip Packaging Product and Solutions
2.2.4 Infineon (Cypress) Automotive Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
2.2.5 Infineon (Cypress) Recent Developments and Future Plans
2.3 Renesas
2.3.1 Renesas Details
2.3.2 Renesas Major Business
2.3.3 Renesas Automotive Chip Packaging Product and Solutions
2.3.4 Renesas Automotive Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
2.3.5 Renesas Recent Developments and Future Plans
2.4 Texas Instrument
2.4.1 Texas Instrument Details
2.4.2 Texas Instrument Major Business
2.4.3 Texas Instrument Automotive Chip Packaging Product and Solutions
2.4.4 Texas Instrument Automotive Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
2.4.5 Texas Instrument Recent Developments and Future Plans
2.5 STMicroelectronics
2.5.1 STMicroelectronics Details
2.5.2 STMicroelectronics Major Business
2.5.3 STMicroelectronics Automotive Chip Packaging Product and Solutions
2.5.4 STMicroelectronics Automotive Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
2.5.5 STMicroelectronics Recent Developments and Future Plans
2.6 Bosch
2.6.1 Bosch Details
2.6.2 Bosch Major Business
2.6.3 Bosch Automotive Chip Packaging Product and Solutions
2.6.4 Bosch Automotive Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
2.6.5 Bosch Recent Developments and Future Plans
2.7 onsemi
2.7.1 onsemi Details
2.7.2 onsemi Major Business
2.7.3 onsemi Automotive Chip Packaging Product and Solutions
2.7.4 onsemi Automotive Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
2.7.5 onsemi Recent Developments and Future Plans
2.8 Mitsubishi Electric
2.8.1 Mitsubishi Electric Details
2.8.2 Mitsubishi Electric Major Business
2.8.3 Mitsubishi Electric Automotive Chip Packaging Product and Solutions
2.8.4 Mitsubishi Electric Automotive Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
2.8.5 Mitsubishi Electric Recent Developments and Future Plans
2.9 Rapidus
2.9.1 Rapidus Details
2.9.2 Rapidus Major Business
2.9.3 Rapidus Automotive Chip Packaging Product and Solutions
2.9.4 Rapidus Automotive Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
2.9.5 Rapidus Recent Developments and Future Plans
2.10 Rohm
2.10.1 Rohm Details
2.10.2 Rohm Major Business
2.10.3 Rohm Automotive Chip Packaging Product and Solutions
2.10.4 Rohm Automotive Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
2.10.5 Rohm Recent Developments and Future Plans
2.11 ADI
2.11.1 ADI Details
2.11.2 ADI Major Business
2.11.3 ADI Automotive Chip Packaging Product and Solutions
2.11.4 ADI Automotive Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
2.11.5 ADI Recent Developments and Future Plans
2.12 Microchip (Microsemi)
2.12.1 Microchip (Microsemi) Details
2.12.2 Microchip (Microsemi) Major Business
2.12.3 Microchip (Microsemi) Automotive Chip Packaging Product and Solutions
2.12.4 Microchip (Microsemi) Automotive Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
2.12.5 Microchip (Microsemi) Recent Developments and Future Plans
2.13 Amkor
2.13.1 Amkor Details
2.13.2 Amkor Major Business
2.13.3 Amkor Automotive Chip Packaging Product and Solutions
2.13.4 Amkor Automotive Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
2.13.5 Amkor Recent Developments and Future Plans
2.14 ASE (SPIL)
2.14.1 ASE (SPIL) Details
2.14.2 ASE (SPIL) Major Business
2.14.3 ASE (SPIL) Automotive Chip Packaging Product and Solutions
2.14.4 ASE (SPIL) Automotive Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
2.14.5 ASE (SPIL) Recent Developments and Future Plans
2.15 UTAC
2.15.1 UTAC Details
2.15.2 UTAC Major Business
2.15.3 UTAC Automotive Chip Packaging Product and Solutions
2.15.4 UTAC Automotive Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
2.15.5 UTAC Recent Developments and Future Plans
2.16 JCET (STATS ChipPAC)
2.16.1 JCET (STATS ChipPAC) Details
2.16.2 JCET (STATS ChipPAC) Major Business
2.16.3 JCET (STATS ChipPAC) Automotive Chip Packaging Product and Solutions
2.16.4 JCET (STATS ChipPAC) Automotive Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
2.16.5 JCET (STATS ChipPAC) Recent Developments and Future Plans
2.17 Carsem
2.17.1 Carsem Details
2.17.2 Carsem Major Business
2.17.3 Carsem Automotive Chip Packaging Product and Solutions
2.17.4 Carsem Automotive Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
2.17.5 Carsem Recent Developments and Future Plans
2.18 King Yuan Electronics Corp. (KYEC)
2.18.1 King Yuan Electronics Corp. (KYEC) Details
2.18.2 King Yuan Electronics Corp. (KYEC) Major Business
2.18.3 King Yuan Electronics Corp. (KYEC) Automotive Chip Packaging Product and Solutions
2.18.4 King Yuan Electronics Corp. (KYEC) Automotive Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
2.18.5 King Yuan Electronics Corp. (KYEC) Recent Developments and Future Plans
2.19 KINGPAK Technology Inc
2.19.1 KINGPAK Technology Inc Details
2.19.2 KINGPAK Technology Inc Major Business
2.19.3 KINGPAK Technology Inc Automotive Chip Packaging Product and Solutions
2.19.4 KINGPAK Technology Inc Automotive Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
2.19.5 KINGPAK Technology Inc Recent Developments and Future Plans
2.20 Powertech Technology Inc. (PTI)
2.20.1 Powertech Technology Inc. (PTI) Details
2.20.2 Powertech Technology Inc. (PTI) Major Business
2.20.3 Powertech Technology Inc. (PTI) Automotive Chip Packaging Product and Solutions
2.20.4 Powertech Technology Inc. (PTI) Automotive Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
2.20.5 Powertech Technology Inc. (PTI) Recent Developments and Future Plans
2.21 SFA Semicon
2.21.1 SFA Semicon Details
2.21.2 SFA Semicon Major Business
2.21.3 SFA Semicon Automotive Chip Packaging Product and Solutions
2.21.4 SFA Semicon Automotive Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
2.21.5 SFA Semicon Recent Developments and Future Plans
2.22 Unisem Group
2.22.1 Unisem Group Details
2.22.2 Unisem Group Major Business
2.22.3 Unisem Group Automotive Chip Packaging Product and Solutions
2.22.4 Unisem Group Automotive Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
2.22.5 Unisem Group Recent Developments and Future Plans
2.23 Chipbond Technology Corporation
2.23.1 Chipbond Technology Corporation Details
2.23.2 Chipbond Technology Corporation Major Business
2.23.3 Chipbond Technology Corporation Automotive Chip Packaging Product and Solutions
2.23.4 Chipbond Technology Corporation Automotive Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
2.23.5 Chipbond Technology Corporation Recent Developments and Future Plans
2.24 ChipMOS TECHNOLOGIES
2.24.1 ChipMOS TECHNOLOGIES Details
2.24.2 ChipMOS TECHNOLOGIES Major Business
2.24.3 ChipMOS TECHNOLOGIES Automotive Chip Packaging Product and Solutions
2.24.4 ChipMOS TECHNOLOGIES Automotive Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
2.24.5 ChipMOS TECHNOLOGIES Recent Developments and Future Plans
2.25 OSE CORP.
2.25.1 OSE CORP. Details
2.25.2 OSE CORP. Major Business
2.25.3 OSE CORP. Automotive Chip Packaging Product and Solutions
2.25.4 OSE CORP. Automotive Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
2.25.5 OSE CORP. Recent Developments and Future Plans
2.26 Sigurd Microelectronics
2.26.1 Sigurd Microelectronics Details
2.26.2 Sigurd Microelectronics Major Business
2.26.3 Sigurd Microelectronics Automotive Chip Packaging Product and Solutions
2.26.4 Sigurd Microelectronics Automotive Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
2.26.5 Sigurd Microelectronics Recent Developments and Future Plans
2.27 Natronix Semiconductor Technology
2.27.1 Natronix Semiconductor Technology Details
2.27.2 Natronix Semiconductor Technology Major Business
2.27.3 Natronix Semiconductor Technology Automotive Chip Packaging Product and Solutions
2.27.4 Natronix Semiconductor Technology Automotive Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
2.27.5 Natronix Semiconductor Technology Recent Developments and Future Plans
2.28 Nepes
2.28.1 Nepes Details
2.28.2 Nepes Major Business
2.28.3 Nepes Automotive Chip Packaging Product and Solutions
2.28.4 Nepes Automotive Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
2.28.5 Nepes Recent Developments and Future Plans
2.29 KESM Industries Berhad
2.29.1 KESM Industries Berhad Details
2.29.2 KESM Industries Berhad Major Business
2.29.3 KESM Industries Berhad Automotive Chip Packaging Product and Solutions
2.29.4 KESM Industries Berhad Automotive Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
2.29.5 KESM Industries Berhad Recent Developments and Future Plans
2.30 Forehope Electronic (Ningbo) Co.,Ltd.
2.30.1 Forehope Electronic (Ningbo) Co.,Ltd. Details
2.30.2 Forehope Electronic (Ningbo) Co.,Ltd. Major Business
2.30.3 Forehope Electronic (Ningbo) Co.,Ltd. Automotive Chip Packaging Product and Solutions
2.30.4 Forehope Electronic (Ningbo) Co.,Ltd. Automotive Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
2.30.5 Forehope Electronic (Ningbo) Co.,Ltd. Recent Developments and Future Plans
2.31 Union Semiconductor（Hefei）Co., Ltd.
2.31.1 Union Semiconductor（Hefei）Co., Ltd. Details
2.31.2 Union Semiconductor（Hefei）Co., Ltd. Major Business
2.31.3 Union Semiconductor（Hefei）Co., Ltd. Automotive Chip Packaging Product and Solutions
2.31.4 Union Semiconductor（Hefei）Co., Ltd. Automotive Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
2.31.5 Union Semiconductor（Hefei）Co., Ltd. Recent Developments and Future Plans
2.32 Tongfu Microelectronics (TFME)
2.32.1 Tongfu Microelectronics (TFME) Details
2.32.2 Tongfu Microelectronics (TFME) Major Business
2.32.3 Tongfu Microelectronics (TFME) Automotive Chip Packaging Product and Solutions
2.32.4 Tongfu Microelectronics (TFME) Automotive Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
2.32.5 Tongfu Microelectronics (TFME) Recent Developments and Future Plans
2.33 Hefei Chipmore Technology Co.,Ltd.
2.33.1 Hefei Chipmore Technology Co.,Ltd. Details
2.33.2 Hefei Chipmore Technology Co.,Ltd. Major Business
2.33.3 Hefei Chipmore Technology Co.,Ltd. Automotive Chip Packaging Product and Solutions
2.33.4 Hefei Chipmore Technology Co.,Ltd. Automotive Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
2.33.5 Hefei Chipmore Technology Co.,Ltd. Recent Developments and Future Plans
2.34 HT-tech
2.34.1 HT-tech Details
2.34.2 HT-tech Major Business
2.34.3 HT-tech Automotive Chip Packaging Product and Solutions
2.34.4 HT-tech Automotive Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
2.34.5 HT-tech Recent Developments and Future Plans
2.35 China Wafer Level CSP Co., Ltd
2.35.1 China Wafer Level CSP Co., Ltd Details
2.35.2 China Wafer Level CSP Co., Ltd Major Business
2.35.3 China Wafer Level CSP Co., Ltd Automotive Chip Packaging Product and Solutions
2.35.4 China Wafer Level CSP Co., Ltd Automotive Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
2.35.5 China Wafer Level CSP Co., Ltd Recent Developments and Future Plans
2.36 Ningbo ChipEx Semiconductor Co., Ltd
2.36.1 Ningbo ChipEx Semiconductor Co., Ltd Details
2.36.2 Ningbo ChipEx Semiconductor Co., Ltd Major Business
2.36.3 Ningbo ChipEx Semiconductor Co., Ltd Automotive Chip Packaging Product and Solutions
2.36.4 Ningbo ChipEx Semiconductor Co., Ltd Automotive Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
2.36.5 Ningbo ChipEx Semiconductor Co., Ltd Recent Developments and Future Plans
2.37 Guangdong Leadyo IC Testing
2.37.1 Guangdong Leadyo IC Testing Details
2.37.2 Guangdong Leadyo IC Testing Major Business
2.37.3 Guangdong Leadyo IC Testing Automotive Chip Packaging Product and Solutions
2.37.4 Guangdong Leadyo IC Testing Automotive Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
2.37.5 Guangdong Leadyo IC Testing Recent Developments and Future Plans
2.38 Unimos Microelectronics (Shanghai)
2.38.1 Unimos Microelectronics (Shanghai) Details
2.38.2 Unimos Microelectronics (Shanghai) Major Business
2.38.3 Unimos Microelectronics (Shanghai) Automotive Chip Packaging Product and Solutions
2.38.4 Unimos Microelectronics (Shanghai) Automotive Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
2.38.5 Unimos Microelectronics (Shanghai) Recent Developments and Future Plans
2.39 Sino Technology
2.39.1 Sino Technology Details
2.39.2 Sino Technology Major Business
2.39.3 Sino Technology Automotive Chip Packaging Product and Solutions
2.39.4 Sino Technology Automotive Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
2.39.5 Sino Technology Recent Developments and Future Plans
2.40 Taiji Semiconductor (Suzhou)
2.40.1 Taiji Semiconductor (Suzhou) Details
2.40.2 Taiji Semiconductor (Suzhou) Major Business
2.40.3 Taiji Semiconductor (Suzhou) Automotive Chip Packaging Product and Solutions
2.40.4 Taiji Semiconductor (Suzhou) Automotive Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
2.40.5 Taiji Semiconductor (Suzhou) Recent Developments and Future Plans
3.1 Global Automotive Chip Packaging Revenue and Share by Players (2019-2024)
3.2 Market Share Analysis (2023)
3.2.1 Market Share of Automotive Chip Packaging by Company Revenue
3.2.2 Top 3 Automotive Chip Packaging Players Market Share in 2023
3.2.3 Top 6 Automotive Chip Packaging Players Market Share in 2023
3.3 Automotive Chip Packaging Market: Overall Company Footprint Analysis
3.3.1 Automotive Chip Packaging Market: Region Footprint
3.3.2 Automotive Chip Packaging Market: Company Product Type Footprint
3.3.3 Automotive Chip Packaging Market: Company Product Application Footprint
3.4 New Market Entrants and Barriers to Market Entry
3.5 Mergers, Acquisition, Agreements, and Collaborations
4.1 Global Automotive Chip Packaging Consumption Value and Market Share by Type (2019-2024)
4.2 Global Automotive Chip Packaging Market Forecast by Type (2025-2030)
5.1 Global Automotive Chip Packaging Consumption Value Market Share by Application (2019-2024)
5.2 Global Automotive Chip Packaging Market Forecast by Application (2025-2030)
6.1 North America Automotive Chip Packaging Consumption Value by Type (2019-2030)
6.2 North America Automotive Chip Packaging Consumption Value by Application (2019-2030)
6.3 North America Automotive Chip Packaging Market Size by Country
6.3.1 North America Automotive Chip Packaging Consumption Value by Country (2019-2030)
6.3.2 United States Automotive Chip Packaging Market Size and Forecast (2019-2030)
6.3.3 Canada Automotive Chip Packaging Market Size and Forecast (2019-2030)
6.3.4 Mexico Automotive Chip Packaging Market Size and Forecast (2019-2030)
7.1 Europe Automotive Chip Packaging Consumption Value by Type (2019-2030)
7.2 Europe Automotive Chip Packaging Consumption Value by Application (2019-2030)
7.3 Europe Automotive Chip Packaging Market Size by Country
7.3.1 Europe Automotive Chip Packaging Consumption Value by Country (2019-2030)
7.3.2 Germany Automotive Chip Packaging Market Size and Forecast (2019-2030)
7.3.3 France Automotive Chip Packaging Market Size and Forecast (2019-2030)
7.3.4 United Kingdom Automotive Chip Packaging Market Size and Forecast (2019-2030)
7.3.5 Russia Automotive Chip Packaging Market Size and Forecast (2019-2030)
7.3.6 Italy Automotive Chip Packaging Market Size and Forecast (2019-2030)
8.1 Asia-Pacific Automotive Chip Packaging Consumption Value by Type (2019-2030)
8.2 Asia-Pacific Automotive Chip Packaging Consumption Value by Application (2019-2030)
8.3 Asia-Pacific Automotive Chip Packaging Market Size by Region
8.3.1 Asia-Pacific Automotive Chip Packaging Consumption Value by Region (2019-2030)
8.3.2 China Automotive Chip Packaging Market Size and Forecast (2019-2030)
8.3.3 Japan Automotive Chip Packaging Market Size and Forecast (2019-2030)
8.3.4 South Korea Automotive Chip Packaging Market Size and Forecast (2019-2030)
8.3.5 India Automotive Chip Packaging Market Size and Forecast (2019-2030)
8.3.6 Southeast Asia Automotive Chip Packaging Market Size and Forecast (2019-2030)
8.3.7 Australia Automotive Chip Packaging Market Size and Forecast (2019-2030)
9.1 South America Automotive Chip Packaging Consumption Value by Type (2019-2030)
9.2 South America Automotive Chip Packaging Consumption Value by Application (2019-2030)
9.3 South America Automotive Chip Packaging Market Size by Country
9.3.1 South America Automotive Chip Packaging Consumption Value by Country (2019-2030)
9.3.2 Brazil Automotive Chip Packaging Market Size and Forecast (2019-2030)
9.3.3 Argentina Automotive Chip Packaging Market Size and Forecast (2019-2030)
10.1 Middle East & Africa Automotive Chip Packaging Consumption Value by Type (2019-2030)
10.2 Middle East & Africa Automotive Chip Packaging Consumption Value by Application (2019-2030)
10.3 Middle East & Africa Automotive Chip Packaging Market Size by Country
10.3.1 Middle East & Africa Automotive Chip Packaging Consumption Value by Country (2019-2030)
10.3.2 Turkey Automotive Chip Packaging Market Size and Forecast (2019-2030)
10.3.3 Saudi Arabia Automotive Chip Packaging Market Size and Forecast (2019-2030)
10.3.4 UAE Automotive Chip Packaging Market Size and Forecast (2019-2030)
11.1 Automotive Chip Packaging Market Drivers
11.2 Automotive Chip Packaging Market Restraints
11.3 Automotive Chip Packaging Trends Analysis
11.4 Porters Five Forces Analysis
11.4.1 Threat of New Entrants
11.4.2 Bargaining Power of Suppliers
11.4.3 Bargaining Power of Buyers
11.4.4 Threat of Substitutes
11.4.5 Competitive Rivalry
12.1 Automotive Chip Packaging Industry Chain
12.2 Automotive Chip Packaging Upstream Analysis
12.3 Automotive Chip Packaging Midstream Analysis
12.4 Automotive Chip Packaging Downstream Analysis
14.1 Methodology
14.2 Research Process and Data Source
14.3 Disclaimer
Table of Figures
List of Tables
Table 1. Global Automotive Chip Packaging Consumption Value by Type, (USD Million), 2019 & 2023 & 2030
Table 2. Global Automotive Chip Packaging Consumption Value by Application, (USD Million), 2019 & 2023 & 2030
Table 3. Global Automotive Chip Packaging Consumption Value by Region (2019-2024) & (USD Million)
Table 4. Global Automotive Chip Packaging Consumption Value by Region (2025-2030) & (USD Million)
Table 5. NXP Company Information, Head Office, and Major Competitors
Table 6. NXP Major Business
Table 7. NXP Automotive Chip Packaging Product and Solutions
Table 8. NXP Automotive Chip Packaging Revenue (USD Million), Gross Margin and Market Share (2019-2024)
Table 9. NXP Recent Developments and Future Plans
Table 10. Infineon (Cypress) Company Information, Head Office, and Major Competitors
Table 11. Infineon (Cypress) Major Business
Table 12. Infineon (Cypress) Automotive Chip Packaging Product and Solutions
Table 13. Infineon (Cypress) Automotive Chip Packaging Revenue (USD Million), Gross Margin and Market Share (2019-2024)
Table 14. Infineon (Cypress) Recent Developments and Future Plans
Table 15. Renesas Company Information, Head Office, and Major Competitors
Table 16. Renesas Major Business
Table 17. Renesas Automotive Chip Packaging Product and Solutions
Table 18. Renesas Automotive Chip Packaging Revenue (USD Million), Gross Margin and Market Share (2019-2024)
Table 19. Renesas Recent Developments and Future Plans
Table 20. Texas Instrument Company Information, Head Office, and Major Competitors
Table 21. Texas Instrument Major Business
Table 22. Texas Instrument Automotive Chip Packaging Product and Solutions
Table 23. Texas Instrument Automotive Chip Packaging Revenue (USD Million), Gross Margin and Market Share (2019-2024)
Table 24. Texas Instrument Recent Developments and Future Plans
Table 25. STMicroelectronics Company Information, Head Office, and Major Competitors
Table 26. STMicroelectronics Major Business
Table 27. STMicroelectronics Automotive Chip Packaging Product and Solutions
Table 28. STMicroelectronics Automotive Chip Packaging Revenue (USD Million), Gross Margin and Market Share (2019-2024)
Table 29. STMicroelectronics Recent Developments and Future Plans
Table 30. Bosch Company Information, Head Office, and Major Competitors
Table 31. Bosch Major Business
Table 32. Bosch Automotive Chip Packaging Product and Solutions
Table 33. Bosch Automotive Chip Packaging Revenue (USD Million), Gross Margin and Market Share (2019-2024)
Table 34. Bosch Recent Developments and Future Plans
Table 35. onsemi Company Information, Head Office, and Major Competitors
Table 36. onsemi Major Business
Table 37. onsemi Automotive Chip Packaging Product and Solutions
Table 38. onsemi Automotive Chip Packaging Revenue (USD Million), Gross Margin and Market Share (2019-2024)
Table 39. onsemi Recent Developments and Future Plans
Table 40. Mitsubishi Electric Company Information, Head Office, and Major Competitors
Table 41. Mitsubishi Electric Major Business
Table 42. Mitsubishi Electric Automotive Chip Packaging Product and Solutions
Table 43. Mitsubishi Electric Automotive Chip Packaging Revenue (USD Million), Gross Margin and Market Share (2019-2024)
Table 44. Mitsubishi Electric Recent Developments and Future Plans
Table 45. Rapidus Company Information, Head Office, and Major Competitors
Table 46. Rapidus Major Business
Table 47. Rapidus Automotive Chip Packaging Product and Solutions
Table 48. Rapidus Automotive Chip Packaging Revenue (USD Million), Gross Margin and Market Share (2019-2024)
Table 49. Rapidus Recent Developments and Future Plans
Table 50. Rohm Company Information, Head Office, and Major Competitors
Table 51. Rohm Major Business
Table 52. Rohm Automotive Chip Packaging Product and Solutions
Table 53. Rohm Automotive Chip Packaging Revenue (USD Million), Gross Margin and Market Share (2019-2024)
Table 54. Rohm Recent Developments and Future Plans
Table 55. ADI Company Information, Head Office, and Major Competitors
Table 56. ADI Major Business
Table 57. ADI Automotive Chip Packaging Product and Solutions
Table 58. ADI Automotive Chip Packaging Revenue (USD Million), Gross Margin and Market Share (2019-2024)
Table 59. ADI Recent Developments and Future Plans
Table 60. Microchip (Microsemi) Company Information, Head Office, and Major Competitors
Table 61. Microchip (Microsemi) Major Business
Table 62. Microchip (Microsemi) Automotive Chip Packaging Product and Solutions
Table 63. Microchip (Microsemi) Automotive Chip Packaging Revenue (USD Million), Gross Margin and Market Share (2019-2024)
Table 64. Microchip (Microsemi) Recent Developments and Future Plans
Table 65. Amkor Company Information, Head Office, and Major Competitors
Table 66. Amkor Major Business
Table 67. Amkor Automotive Chip Packaging Product and Solutions
Table 68. Amkor Automotive Chip Packaging Revenue (USD Million), Gross Margin and Market Share (2019-2024)
Table 69. Amkor Recent Developments and Future Plans
Table 70. ASE (SPIL) Company Information, Head Office, and Major Competitors
Table 71. ASE (SPIL) Major Business
Table 72. ASE (SPIL) Automotive Chip Packaging Product and Solutions
Table 73. ASE (SPIL) Automotive Chip Packaging Revenue (USD Million), Gross Margin and Market Share (2019-2024)
Table 74. ASE (SPIL) Recent Developments and Future Plans
Table 75. UTAC Company Information, Head Office, and Major Competitors
Table 76. UTAC Major Business
Table 77. UTAC Automotive Chip Packaging Product and Solutions
Table 78. UTAC Automotive Chip Packaging Revenue (USD Million), Gross Margin and Market Share (2019-2024)
Table 79. UTAC Recent Developments and Future Plans
Table 80. JCET (STATS ChipPAC) Company Information, Head Office, and Major Competitors
Table 81. JCET (STATS ChipPAC) Major Business
Table 82. JCET (STATS ChipPAC) Automotive Chip Packaging Product and Solutions
Table 83. JCET (STATS ChipPAC) Automotive Chip Packaging Revenue (USD Million), Gross Margin and Market Share (2019-2024)
Table 84. JCET (STATS ChipPAC) Recent Developments and Future Plans
Table 85. Carsem Company Information, Head Office, and Major Competitors
Table 86. Carsem Major Business
Table 87. Carsem Automotive Chip Packaging Product and Solutions
Table 88. Carsem Automotive Chip Packaging Revenue (USD Million), Gross Margin and Market Share (2019-2024)
Table 89. Carsem Recent Developments and Future Plans
Table 90. King Yuan Electronics Corp. (KYEC) Company Information, Head Office, and Major Competitors
Table 91. King Yuan Electronics Corp. (KYEC) Major Business
Table 92. King Yuan Electronics Corp. (KYEC) Automotive Chip Packaging Product and Solutions
Table 93. King Yuan Electronics Corp. (KYEC) Automotive Chip Packaging Revenue (USD Million), Gross Margin and Market Share (2019-2024)
Table 94. King Yuan Electronics Corp. (KYEC) Recent Developments and Future Plans
Table 95. KINGPAK Technology Inc Company Information, Head Office, and Major Competitors
Table 96. KINGPAK Technology Inc Major Business
Table 97. KINGPAK Technology Inc Automotive Chip Packaging Product and Solutions
Table 98. KINGPAK Technology Inc Automotive Chip Packaging Revenue (USD Million), Gross Margin and Market Share (2019-2024)
Table 99. KINGPAK Technology Inc Recent Developments and Future Plans
Table 100. Powertech Technology Inc. (PTI) Company Information, Head Office, and Major Competitors
Table 101. Powertech Technology Inc. (PTI) Major Business
Table 102. Powertech Technology Inc. (PTI) Automotive Chip Packaging Product and Solutions
Table 103. Powertech Technology Inc. (PTI) Automotive Chip Packaging Revenue (USD Million), Gross Margin and Market Share (2019-2024)
Table 104. Powertech Technology Inc. (PTI) Recent Developments and Future Plans
Table 105. SFA Semicon Company Information, Head Office, and Major Competitors
Table 106. SFA Semicon Major Business
Table 107. SFA Semicon Automotive Chip Packaging Product and Solutions
Table 108. SFA Semicon Automotive Chip Packaging Revenue (USD Million), Gross Margin and Market Share (2019-2024)
Table 109. SFA Semicon Recent Developments and Future Plans
Table 110. Unisem Group Company Information, Head Office, and Major Competitors
Table 111. Unisem Group Major Business
Table 112. Unisem Group Automotive Chip Packaging Product and Solutions
Table 113. Unisem Group Automotive Chip Packaging Revenue (USD Million), Gross Margin and Market Share (2019-2024)
Table 114. Unisem Group Recent Developments and Future Plans
Table 115. Chipbond Technology Corporation Company Information, Head Office, and Major Competitors
Table 116. Chipbond Technology Corporation Major Business
Table 117. Chipbond Technology Corporation Automotive Chip Packaging Product and Solutions
Table 118. Chipbond Technology Corporation Automotive Chip Packaging Revenue (USD Million), Gross Margin and Market Share (2019-2024)
Table 119. Chipbond Technology Corporation Recent Developments and Future Plans
Table 120. ChipMOS TECHNOLOGIES Company Information, Head Office, and Major Competitors
Table 121. ChipMOS TECHNOLOGIES Major Business
Table 122. ChipMOS TECHNOLOGIES Automotive Chip Packaging Product and Solutions
Table 123. ChipMOS TECHNOLOGIES Automotive Chip Packaging Revenue (USD Million), Gross Margin and Market Share (2019-2024)
Table 124. ChipMOS TECHNOLOGIES Recent Developments and Future Plans
Table 125. OSE CORP. Company Information, Head Office, and Major Competitors
Table 126. OSE CORP. Major Business
Table 127. OSE CORP. Automotive Chip Packaging Product and Solutions
Table 128. OSE CORP. Automotive Chip Packaging Revenue (USD Million), Gross Margin and Market Share (2019-2024)
Table 129. OSE CORP. Recent Developments and Future Plans
Table 130. Sigurd Microelectronics Company Information, Head Office, and Major Competitors
Table 131. Sigurd Microelectronics Major Business
Table 132. Sigurd Microelectronics Automotive Chip Packaging Product and Solutions
Table 133. Sigurd Microelectronics Automotive Chip Packaging Revenue (USD Million), Gross Margin and Market Share (2019-2024)
Table 134. Sigurd Microelectronics Recent Developments and Future Plans
Table 135. Natronix Semiconductor Technology Company Information, Head Office, and Major Competitors
Table 136. Natronix Semiconductor Technology Major Business
Table 137. Natronix Semiconductor Technology Automotive Chip Packaging Product and Solutions
Table 138. Natronix Semiconductor Technology Automotive Chip Packaging Revenue (USD Million), Gross Margin and Market Share (2019-2024)
Table 139. Natronix Semiconductor Technology Recent Developments and Future Plans
Table 140. Nepes Company Information, Head Office, and Major Competitors
Table 141. Nepes Major Business
Table 142. Nepes Automotive Chip Packaging Product and Solutions
Table 143. Nepes Automotive Chip Packaging Revenue (USD Million), Gross Margin and Market Share (2019-2024)
Table 144. Nepes Recent Developments and Future Plans
Table 145. KESM Industries Berhad Company Information, Head Office, and Major Competitors
Table 146. KESM Industries Berhad Major Business
Table 147. KESM Industries Berhad Automotive Chip Packaging Product and Solutions
Table 148. KESM Industries Berhad Automotive Chip Packaging Revenue (USD Million), Gross Margin and Market Share (2019-2024)
Table 149. KESM Industries Berhad Recent Developments and Future Plans
Table 150. Forehope Electronic (Ningbo) Co.,Ltd. Company Information, Head Office, and Major Competitors
Table 151. Forehope Electronic (Ningbo) Co.,Ltd. Major Business
Table 152. Forehope Electronic (Ningbo) Co.,Ltd. Automotive Chip Packaging Product and Solutions
Table 153. Forehope Electronic (Ningbo) Co.,Ltd. Automotive Chip Packaging Revenue (USD Million), Gross Margin and Market Share (2019-2024)
Table 154. Forehope Electronic (Ningbo) Co.,Ltd. Recent Developments and Future Plans
Table 155. Union Semiconductor（Hefei）Co., Ltd. Company Information, Head Office, and Major Competitors
Table 156. Union Semiconductor（Hefei）Co., Ltd. Major Business
Table 157. Union Semiconductor（Hefei）Co., Ltd. Automotive Chip Packaging Product and Solutions
Table 158. Union Semiconductor（Hefei）Co., Ltd. Automotive Chip Packaging Revenue (USD Million), Gross Margin and Market Share (2019-2024)
Table 159. Union Semiconductor（Hefei）Co., Ltd. Recent Developments and Future Plans
Table 160. Tongfu Microelectronics (TFME) Company Information, Head Office, and Major Competitors
Table 161. Tongfu Microelectronics (TFME) Major Business
Table 162. Tongfu Microelectronics (TFME) Automotive Chip Packaging Product and Solutions
Table 163. Tongfu Microelectronics (TFME) Automotive Chip Packaging Revenue (USD Million), Gross Margin and Market Share (2019-2024)
Table 164. Tongfu Microelectronics (TFME) Recent Developments and Future Plans
Table 165. Hefei Chipmore Technology Co.,Ltd. Company Information, Head Office, and Major Competitors
Table 166. Hefei Chipmore Technology Co.,Ltd. Major Business
Table 167. Hefei Chipmore Technology Co.,Ltd. Automotive Chip Packaging Product and Solutions
Table 168. Hefei Chipmore Technology Co.,Ltd. Automotive Chip Packaging Revenue (USD Million), Gross Margin and Market Share (2019-2024)
Table 169. Hefei Chipmore Technology Co.,Ltd. Recent Developments and Future Plans
Table 170. HT-tech Company Information, Head Office, and Major Competitors
Table 171. HT-tech Major Business
Table 172. HT-tech Automotive Chip Packaging Product and Solutions
Table 173. HT-tech Automotive Chip Packaging Revenue (USD Million), Gross Margin and Market Share (2019-2024)
Table 174. HT-tech Recent Developments and Future Plans
Table 175. China Wafer Level CSP Co., Ltd Company Information, Head Office, and Major Competitors
Table 176. China Wafer Level CSP Co., Ltd Major Business
Table 177. China Wafer Level CSP Co., Ltd Automotive Chip Packaging Product and Solutions
Table 178. China Wafer Level CSP Co., Ltd Automotive Chip Packaging Revenue (USD Million), Gross Margin and Market Share (2019-2024)
Table 179. China Wafer Level CSP Co., Ltd Recent Developments and Future Plans
Table 180. Ningbo ChipEx Semiconductor Co., Ltd Company Information, Head Office, and Major Competitors
Table 181. Ningbo ChipEx Semiconductor Co., Ltd Major Business
Table 182. Ningbo ChipEx Semiconductor Co., Ltd Automotive Chip Packaging Product and Solutions
Table 183. Ningbo ChipEx Semiconductor Co., Ltd Automotive Chip Packaging Revenue (USD Million), Gross Margin and Market Share (2019-2024)
Table 184. Ningbo ChipEx Semiconductor Co., Ltd Recent Developments and Future Plans
Table 185. Guangdong Leadyo IC Testing Company Information, Head Office, and Major Competitors
Table 186. Guangdong Leadyo IC Testing Major Business
Table 187. Guangdong Leadyo IC Testing Automotive Chip Packaging Product and Solutions
Table 188. Guangdong Leadyo IC Testing Automotive Chip Packaging Revenue (USD Million), Gross Margin and Market Share (2019-2024)
Table 189. Guangdong Leadyo IC Testing Recent Developments and Future Plans
Table 190. Unimos Microelectronics (Shanghai) Company Information, Head Office, and Major Competitors
Table 191. Unimos Microelectronics (Shanghai) Major Business
Table 192. Unimos Microelectronics (Shanghai) Automotive Chip Packaging Product and Solutions
Table 193. Unimos Microelectronics (Shanghai) Automotive Chip Packaging Revenue (USD Million), Gross Margin and Market Share (2019-2024)
Table 194. Unimos Microelectronics (Shanghai) Recent Developments and Future Plans
Table 195. Sino Technology Company Information, Head Office, and Major Competitors
Table 196. Sino Technology Major Business
Table 197. Sino Technology Automotive Chip Packaging Product and Solutions
Table 198. Sino Technology Automotive Chip Packaging Revenue (USD Million), Gross Margin and Market Share (2019-2024)
Table 199. Sino Technology Recent Developments and Future Plans
Table 200. Taiji Semiconductor (Suzhou) Company Information, Head Office, and Major Competitors
Table 201. Taiji Semiconductor (Suzhou) Major Business
Table 202. Taiji Semiconductor (Suzhou) Automotive Chip Packaging Product and Solutions
Table 203. Taiji Semiconductor (Suzhou) Automotive Chip Packaging Revenue (USD Million), Gross Margin and Market Share (2019-2024)
Table 204. Taiji Semiconductor (Suzhou) Recent Developments and Future Plans
Table 205. Global Automotive Chip Packaging Revenue (USD Million) by Players (2019-2024)
Table 206. Global Automotive Chip Packaging Revenue Share by Players (2019-2024)
Table 207. Breakdown of Automotive Chip Packaging by Company Type (Tier 1, Tier 2, and Tier 3)
Table 208. Market Position of Players in Automotive Chip Packaging, (Tier 1, Tier 2, and Tier 3), Based on Revenue in 2023
Table 209. Head Office of Key Automotive Chip Packaging Players
Table 210. Automotive Chip Packaging Market: Company Product Type Footprint
Table 211. Automotive Chip Packaging Market: Company Product Application Footprint
Table 212. Automotive Chip Packaging New Market Entrants and Barriers to Market Entry
Table 213. Automotive Chip Packaging Mergers, Acquisition, Agreements, and Collaborations
Table 214. Global Automotive Chip Packaging Consumption Value (USD Million) by Type (2019-2024)
Table 215. Global Automotive Chip Packaging Consumption Value Share by Type (2019-2024)
Table 216. Global Automotive Chip Packaging Consumption Value Forecast by Type (2025-2030)
Table 217. Global Automotive Chip Packaging Consumption Value by Application (2019-2024)
Table 218. Global Automotive Chip Packaging Consumption Value Forecast by Application (2025-2030)
Table 219. North America Automotive Chip Packaging Consumption Value by Type (2019-2024) & (USD Million)
Table 220. North America Automotive Chip Packaging Consumption Value by Type (2025-2030) & (USD Million)
Table 221. North America Automotive Chip Packaging Consumption Value by Application (2019-2024) & (USD Million)
Table 222. North America Automotive Chip Packaging Consumption Value by Application (2025-2030) & (USD Million)
Table 223. North America Automotive Chip Packaging Consumption Value by Country (2019-2024) & (USD Million)
Table 224. North America Automotive Chip Packaging Consumption Value by Country (2025-2030) & (USD Million)
Table 225. Europe Automotive Chip Packaging Consumption Value by Type (2019-2024) & (USD Million)
Table 226. Europe Automotive Chip Packaging Consumption Value by Type (2025-2030) & (USD Million)
Table 227. Europe Automotive Chip Packaging Consumption Value by Application (2019-2024) & (USD Million)
Table 228. Europe Automotive Chip Packaging Consumption Value by Application (2025-2030) & (USD Million)
Table 229. Europe Automotive Chip Packaging Consumption Value by Country (2019-2024) & (USD Million)
Table 230. Europe Automotive Chip Packaging Consumption Value by Country (2025-2030) & (USD Million)
Table 231. Asia-Pacific Automotive Chip Packaging Consumption Value by Type (2019-2024) & (USD Million)
Table 232. Asia-Pacific Automotive Chip Packaging Consumption Value by Type (2025-2030) & (USD Million)
Table 233. Asia-Pacific Automotive Chip Packaging Consumption Value by Application (2019-2024) & (USD Million)
Table 234. Asia-Pacific Automotive Chip Packaging Consumption Value by Application (2025-2030) & (USD Million)
Table 235. Asia-Pacific Automotive Chip Packaging Consumption Value by Region (2019-2024) & (USD Million)
Table 236. Asia-Pacific Automotive Chip Packaging Consumption Value by Region (2025-2030) & (USD Million)
Table 237. South America Automotive Chip Packaging Consumption Value by Type (2019-2024) & (USD Million)
Table 238. South America Automotive Chip Packaging Consumption Value by Type (2025-2030) & (USD Million)
Table 239. South America Automotive Chip Packaging Consumption Value by Application (2019-2024) & (USD Million)
Table 240. South America Automotive Chip Packaging Consumption Value by Application (2025-2030) & (USD Million)
Table 241. South America Automotive Chip Packaging Consumption Value by Country (2019-2024) & (USD Million)
Table 242. South America Automotive Chip Packaging Consumption Value by Country (2025-2030) & (USD Million)
Table 243. Middle East & Africa Automotive Chip Packaging Consumption Value by Type (2019-2024) & (USD Million)
Table 244. Middle East & Africa Automotive Chip Packaging Consumption Value by Type (2025-2030) & (USD Million)
Table 245. Middle East & Africa Automotive Chip Packaging Consumption Value by Application (2019-2024) & (USD Million)
Table 246. Middle East & Africa Automotive Chip Packaging Consumption Value by Application (2025-2030) & (USD Million)
Table 247. Middle East & Africa Automotive Chip Packaging Consumption Value by Country (2019-2024) & (USD Million)
Table 248. Middle East & Africa Automotive Chip Packaging Consumption Value by Country (2025-2030) & (USD Million)
Table 249. Automotive Chip Packaging Raw Material
Table 250. Key Suppliers of Automotive Chip Packaging Raw Materials
List of Figures
Figure 1. Automotive Chip Packaging Picture
Figure 2. Global Automotive Chip Packaging Consumption Value by Type, (USD Million), 2019 & 2023 & 2030
Figure 3. Global Automotive Chip Packaging Consumption Value Market Share by Type in 2023
Figure 4. Ceramic Substrate
Figure 5. WB BGA
Figure 6. Lead Frame
Figure 7. FC BGA
Figure 8. Power Module
Figure 9. Others
Figure 10. Global Automotive Chip Packaging Consumption Value by Type, (USD Million), 2019 & 2023 & 2030
Figure 11. Automotive Chip Packaging Consumption Value Market Share by Application in 2023
Figure 12. Automotive OSAT Picture
Figure 13. Automotive IDM Picture
Figure 14. Global Automotive Chip Packaging Consumption Value, (USD Million): 2019 & 2023 & 2030
Figure 15. Global Automotive Chip Packaging Consumption Value and Forecast (2019-2030) & (USD Million)
Figure 16. Global Market Automotive Chip Packaging Consumption Value (USD Million) Comparison by Region (2019 & 2023 & 2030)
Figure 17. Global Automotive Chip Packaging Consumption Value Market Share by Region (2019-2030)
Figure 18. Global Automotive Chip Packaging Consumption Value Market Share by Region in 2023
Figure 19. North America Automotive Chip Packaging Consumption Value (2019-2030) & (USD Million)
Figure 20. Europe Automotive Chip Packaging Consumption Value (2019-2030) & (USD Million)
Figure 21. Asia-Pacific Automotive Chip Packaging Consumption Value (2019-2030) & (USD Million)
Figure 22. South America Automotive Chip Packaging Consumption Value (2019-2030) & (USD Million)
Figure 23. Middle East and Africa Automotive Chip Packaging Consumption Value (2019-2030) & (USD Million)
Figure 24. Global Automotive Chip Packaging Revenue Share by Players in 2023
Figure 25. Automotive Chip Packaging Market Share by Company Type (Tier 1, Tier 2 and Tier 3) in 2023
Figure 26. Global Top 3 Players Automotive Chip Packaging Market Share in 2023
Figure 27. Global Top 6 Players Automotive Chip Packaging Market Share in 2023
Figure 28. Global Automotive Chip Packaging Consumption Value Share by Type (2019-2024)
Figure 29. Global Automotive Chip Packaging Market Share Forecast by Type (2025-2030)
Figure 30. Global Automotive Chip Packaging Consumption Value Share by Application (2019-2024)
Figure 31. Global Automotive Chip Packaging Market Share Forecast by Application (2025-2030)
Figure 32. North America Automotive Chip Packaging Consumption Value Market Share by Type (2019-2030)
Figure 33. North America Automotive Chip Packaging Consumption Value Market Share by Application (2019-2030)
Figure 34. North America Automotive Chip Packaging Consumption Value Market Share by Country (2019-2030)
Figure 35. United States Automotive Chip Packaging Consumption Value (2019-2030) & (USD Million)
Figure 36. Canada Automotive Chip Packaging Consumption Value (2019-2030) & (USD Million)
Figure 37. Mexico Automotive Chip Packaging Consumption Value (2019-2030) & (USD Million)
Figure 38. Europe Automotive Chip Packaging Consumption Value Market Share by Type (2019-2030)
Figure 39. Europe Automotive Chip Packaging Consumption Value Market Share by Application (2019-2030)
Figure 40. Europe Automotive Chip Packaging Consumption Value Market Share by Country (2019-2030)
Figure 41. Germany Automotive Chip Packaging Consumption Value (2019-2030) & (USD Million)
Figure 42. France Automotive Chip Packaging Consumption Value (2019-2030) & (USD Million)
Figure 43. United Kingdom Automotive Chip Packaging Consumption Value (2019-2030) & (USD Million)
Figure 44. Russia Automotive Chip Packaging Consumption Value (2019-2030) & (USD Million)
Figure 45. Italy Automotive Chip Packaging Consumption Value (2019-2030) & (USD Million)
Figure 46. Asia-Pacific Automotive Chip Packaging Consumption Value Market Share by Type (2019-2030)
Figure 47. Asia-Pacific Automotive Chip Packaging Consumption Value Market Share by Application (2019-2030)
Figure 48. Asia-Pacific Automotive Chip Packaging Consumption Value Market Share by Region (2019-2030)
Figure 49. China Automotive Chip Packaging Consumption Value (2019-2030) & (USD Million)
Figure 50. Japan Automotive Chip Packaging Consumption Value (2019-2030) & (USD Million)
Figure 51. South Korea Automotive Chip Packaging Consumption Value (2019-2030) & (USD Million)
Figure 52. India Automotive Chip Packaging Consumption Value (2019-2030) & (USD Million)
Figure 53. Southeast Asia Automotive Chip Packaging Consumption Value (2019-2030) & (USD Million)
Figure 54. Australia Automotive Chip Packaging Consumption Value (2019-2030) & (USD Million)
Figure 55. South America Automotive Chip Packaging Consumption Value Market Share by Type (2019-2030)
Figure 56. South America Automotive Chip Packaging Consumption Value Market Share by Application (2019-2030)
Figure 57. South America Automotive Chip Packaging Consumption Value Market Share by Country (2019-2030)
Figure 58. Brazil Automotive Chip Packaging Consumption Value (2019-2030) & (USD Million)
Figure 59. Argentina Automotive Chip Packaging Consumption Value (2019-2030) & (USD Million)
Figure 60. Middle East and Africa Automotive Chip Packaging Consumption Value Market Share by Type (2019-2030)
Figure 61. Middle East and Africa Automotive Chip Packaging Consumption Value Market Share by Application (2019-2030)
Figure 62. Middle East and Africa Automotive Chip Packaging Consumption Value Market Share by Country (2019-2030)
Figure 63. Turkey Automotive Chip Packaging Consumption Value (2019-2030) & (USD Million)
Figure 64. Saudi Arabia Automotive Chip Packaging Consumption Value (2019-2030) & (USD Million)
Figure 65. UAE Automotive Chip Packaging Consumption Value (2019-2030) & (USD Million)
Figure 66. Automotive Chip Packaging Market Drivers
Figure 67. Automotive Chip Packaging Market Restraints
Figure 68. Automotive Chip Packaging Market Trends
Figure 69. Porters Five Forces Analysis
Figure 70. Manufacturing Cost Structure Analysis of Automotive Chip Packaging in 2023
Figure 71. Manufacturing Process Analysis of Automotive Chip Packaging
Figure 72. Automotive Chip Packaging Industrial Chain
Figure 73. Methodology
Figure 74. Research Process and Data Source
Research Methodology
Client Requirements
Review and analyze client requirements
Discussion of all the project requirements and queries
Flexibility Check
Project Feasibility Analysis
Finalizing tentative research programme
Structuring project proposal with scope, timeline, and costs
Analyzing Market Dynamics
Determination of key drivers, restraints, challenge, and opportunity
Identifies market needs and trends
Market Size Estimation & Forecast
Estimation of historical data based on secondary and primary data
Anticipating market recast by assigning weightage to market forces (drivers, restraints, opportunities)
Freezing historical and forecast market size estimations based on evolution, trends, outlook, and strategies
Consideration of geography, region-specific product/service demand for region segments
Consideration of product utilization rates, product demand outlook for segments by application or end-user.
Data Source
Secondary Source
Data collections from annual reports, presentations,associations, journals, analyst reports,
paid database, press releases, blogs, newsletters,and GIR repositories.
Primary Source
Research discussion with manufacturers, distributors, suppliers, end user, industry experts
to verify insights.
Validation
and
triangulation of
secondary and primary source.
Collection of data
Cumulating and collating the essential qualitative and quantitative data
Generation of report in client requested format by research analysts
Reviews by expert analysts
Final quality check
Clarifying queries
Receiving feedback
Ensuring satisfaction
01 Identification of data
This step involves identification of several primary and secondary data research sources, including Global Info Research's internal data sources. The primary sources consist of in-depth discussions and interviews with policy makers, industry experts, and data evaluators, whereas secondary sources include a thorough study of market journals, press releases, annual reports, and government and non-government agencies websites.
-
02 Evaluation of Market Dynamic
This phase includes a detailed evaluation of several factors that are likely to affect the market dynamics. It involves a comprehensive assessment of major market pain points, drivers, and trends. It also comprises a detailed study of research plans and methodology.
-
03 Collection of Data
This process consists of gathering data, accessing proprietary databases, and reaching out to key industry participants that operate in the market across the value chain. It also involves studying several patterns in the historical data and comparing it with the current scenario.
-
04 Collaboration of Data
This stage involves the validation of data and arrival at actual statistics, and evolution of the market over the years. It entails the study and analyzes various segments and verticals of the market. An impact analysis is also performed to observe which factors will affect the market in the next few years.
05 Verification and Analysis
This is the final stage, which involves both quantity and quality checks. Although the process of data verification is an integral part of the research process, all data points and statistics and figures are re-checked to uphold their authenticity and validity.
Companies Mentioned
NXP Infineon (Cypress) Renesas Texas Instrument STMicroelectronics Bosch onsemi Mitsubishi Electric Rapidus Rohm ADI Microchip (Microsemi) Amkor ASE (SPIL) UTAC JCET (STATS ChipPAC) Carsem King Yuan Electronics Corp. (KYEC) KINGPAK Technology Inc Powertech Technology Inc. (PTI) SFA Semicon Unisem Group Chipbond Technology Corporation ChipMOS TECHNOLOGIES OSE CORP. Sigurd Microelectronics Natronix Semiconductor Technology Nepes KESM Industries Berhad Forehope Electronic (Ningbo) Co.,Ltd. Union Semiconductor（Hefei）Co., Ltd. Tongfu Microelectronics (TFME) Hefei Chipmore Technology Co.,Ltd. HT-tech China Wafer Level CSP Co., Ltd Ningbo ChipEx Semiconductor Co., Ltd Guangdong Leadyo IC Testing Unimos Microelectronics (Shanghai) Sino Technology Taiji Semiconductor (Suzhou)
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17 Oct 2023
Electronics & Semiconductor
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