Global Solder Ball in Integrated Circuit Packaging Supply, Demand and Key Producers, 2024-2030
Page: 149
Published Date: 11 Feb 2024
Category: Chemical & Material
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Description
Table of Contents
Table of Figures
Research Methodology
Companies Mentioned
Related Reports
Product Tags
Table of Contents
Table of Figures
Research Methodology
Companies Mentioned
Related Reports
Product Tags
Description
The global Solder Ball in Integrated Circuit Packaging market size is expected to reach $ 423.9 million by 2030, rising at a market growth of 6.2% CAGR during the forecast period (2024-2030).
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
Solder ball refers to a small sphere or droplet of solder that is used in integrated circuit (IC) packaging. It plays a crucial role in connecting the IC's electrical contacts to the substrate or circuit board.In IC packaging, solder balls are typically made of an alloy with a low melting point, such as tin-lead (Sn-Pb) or lead-free alternatives like tin-silver-copper (SnAgCu) or tin-silver (SnAg). These alloys have good electrical conductivity and can form a reliable and durable connection.
This report studies the global Solder Ball in Integrated Circuit Packaging production, demand, key manufacturers, and key regions.
This report is a detailed and comprehensive analysis of the world market for Solder Ball in Integrated Circuit Packaging, and provides market size (US$ million) and Year-over-Year (YoY) Growth, considering 2023 as the base year. This report explores demand trends and competition, as well as details the characteristics of Solder Ball in Integrated Circuit Packaging that contribute to its increasing demand across many markets.
Highlights and key features of the study
Global Solder Ball in Integrated Circuit Packaging total production and demand, 2019-2030, (Tons)
Global Solder Ball in Integrated Circuit Packaging total production value, 2019-2030, (USD Million)
Global Solder Ball in Integrated Circuit Packaging production by region & country, production, value, CAGR, 2019-2030, (USD Million) & (Tons)
Global Solder Ball in Integrated Circuit Packaging consumption by region & country, CAGR, 2019-2030 & (Tons)
U.S. VS China: Solder Ball in Integrated Circuit Packaging domestic production, consumption, key domestic manufacturers and share
Global Solder Ball in Integrated Circuit Packaging production by manufacturer, production, price, value and market share 2019-2024, (USD Million) & (Tons)
Global Solder Ball in Integrated Circuit Packaging production by Type, production, value, CAGR, 2019-2030, (USD Million) & (Tons)
Global Solder Ball in Integrated Circuit Packaging production by Application production, value, CAGR, 2019-2030, (USD Million) & (Tons).
This reports profiles key players in the global Solder Ball in Integrated Circuit Packaging market based on the following parameters – company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include IPS, WEIDINGER, MacDermid Alpha Electronics, Senju Metal Industry Co. Ltd., Accurus, MKE, Nippon Micrometal, DS HiMetal and YUNNAN TIN COMPANY GROUP LIMITED, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World Solder Ball in Integrated Circuit Packaging market.
Detailed Segmentation:
Each section contains quantitative market data including market by value (US$ Millions), volume (production, consumption) & (Tons) and average price (US$/Ton) by manufacturer, by Type, and by Application. Data is given for the years 2019-2030 by year with 2023 as the base year, 2024 as the estimate year, and 2025-2030 as the forecast year.
Global Solder Ball in Integrated Circuit Packaging Market, By Region:
United States
China
Europe
Japan
South Korea
ASEAN
India
Rest of World
Global Solder Ball in Integrated Circuit Packaging Market, Segmentation by Type
Lead Solder Balls
Lead Free Solder Balls
Global Solder Ball in Integrated Circuit Packaging Market, Segmentation by Application
BGA
CSP & WLCSP
Others
Companies Profiled:
IPS
WEIDINGER
MacDermid Alpha Electronics
Senju Metal Industry Co. Ltd.
Accurus
MKE
Nippon Micrometal
DS HiMetal
YUNNAN TIN COMPANY GROUP LIMITED
Hitachi Metals Nanotech
Indium Corporation
Matsuo Handa Co. Ltd.
PMTC
Shanghai hiking solder material
Shenmao Technology
Shenzhen Hua Maoxiang Electronics Co., Ltd
Accurus
NMC
YCTC
Key Questions Answered
1. How big is the global Solder Ball in Integrated Circuit Packaging market?
2. What is the demand of the global Solder Ball in Integrated Circuit Packaging market?
3. What is the year over year growth of the global Solder Ball in Integrated Circuit Packaging market?
4. What is the production and production value of the global Solder Ball in Integrated Circuit Packaging market?
5. Who are the key producers in the global Solder Ball in Integrated Circuit Packaging market?
Table of Contents
1 Supply Summary
1.1 Solder Ball in Integrated Circuit Packaging Introduction
1.2 World Solder Ball in Integrated Circuit Packaging Supply & Forecast
1.2.1 World Solder Ball in Integrated Circuit Packaging Production Value (2019 & 2023 & 2030)
1.2.2 World Solder Ball in Integrated Circuit Packaging Production (2019-2030)
1.2.3 World Solder Ball in Integrated Circuit Packaging Pricing Trends (2019-2030)
1.3 World Solder Ball in Integrated Circuit Packaging Production by Region (Based on Production Site)
1.3.1 World Solder Ball in Integrated Circuit Packaging Production Value by Region (2019-2030)
1.3.2 World Solder Ball in Integrated Circuit Packaging Production by Region (2019-2030)
1.3.3 World Solder Ball in Integrated Circuit Packaging Average Price by Region (2019-2030)
1.3.4 North America Solder Ball in Integrated Circuit Packaging Production (2019-2030)
1.3.5 Europe Solder Ball in Integrated Circuit Packaging Production (2019-2030)
1.3.6 China Solder Ball in Integrated Circuit Packaging Production (2019-2030)
1.3.7 Japan Solder Ball in Integrated Circuit Packaging Production (2019-2030)
1.4 Market Drivers, Restraints and Trends
1.4.1 Solder Ball in Integrated Circuit Packaging Market Drivers
1.4.2 Factors Affecting Demand
1.4.3 Solder Ball in Integrated Circuit Packaging Major Market Trends
2.1 World Solder Ball in Integrated Circuit Packaging Demand (2019-2030)
2.2 World Solder Ball in Integrated Circuit Packaging Consumption by Region
2.2.1 World Solder Ball in Integrated Circuit Packaging Consumption by Region (2019-2024)
2.2.2 World Solder Ball in Integrated Circuit Packaging Consumption Forecast by Region (2025-2030)
2.3 United States Solder Ball in Integrated Circuit Packaging Consumption (2019-2030)
2.4 China Solder Ball in Integrated Circuit Packaging Consumption (2019-2030)
2.5 Europe Solder Ball in Integrated Circuit Packaging Consumption (2019-2030)
2.6 Japan Solder Ball in Integrated Circuit Packaging Consumption (2019-2030)
2.7 South Korea Solder Ball in Integrated Circuit Packaging Consumption (2019-2030)
2.8 ASEAN Solder Ball in Integrated Circuit Packaging Consumption (2019-2030)
2.9 India Solder Ball in Integrated Circuit Packaging Consumption (2019-2030)
3.1 World Solder Ball in Integrated Circuit Packaging Production Value by Manufacturer (2019-2024)
3.2 World Solder Ball in Integrated Circuit Packaging Production by Manufacturer (2019-2024)
3.3 World Solder Ball in Integrated Circuit Packaging Average Price by Manufacturer (2019-2024)
3.4 Solder Ball in Integrated Circuit Packaging Company Evaluation Quadrant
3.5 Industry Rank and Concentration Rate (CR)
3.5.1 Global Solder Ball in Integrated Circuit Packaging Industry Rank of Major Manufacturers
3.5.2 Global Concentration Ratios (CR4) for Solder Ball in Integrated Circuit Packaging in 2023
3.5.3 Global Concentration Ratios (CR8) for Solder Ball in Integrated Circuit Packaging in 2023
3.6 Solder Ball in Integrated Circuit Packaging Market: Overall Company Footprint Analysis
3.6.1 Solder Ball in Integrated Circuit Packaging Market: Region Footprint
3.6.2 Solder Ball in Integrated Circuit Packaging Market: Company Product Type Footprint
3.6.3 Solder Ball in Integrated Circuit Packaging Market: Company Product Application Footprint
3.7 Competitive Environment
3.7.1 Historical Structure of the Industry
3.7.2 Barriers of Market Entry
3.7.3 Factors of Competition
3.8 New Entrant and Capacity Expansion Plans
3.9 Mergers, Acquisition, Agreements, and Collaborations
4.1 United States VS China: Solder Ball in Integrated Circuit Packaging Production Value Comparison
4.1.1 United States VS China: Solder Ball in Integrated Circuit Packaging Production Value Comparison (2019 & 2023 & 2030)
4.1.2 United States VS China: Solder Ball in Integrated Circuit Packaging Production Value Market Share Comparison (2019 & 2023 & 2030)
4.2 United States VS China: Solder Ball in Integrated Circuit Packaging Production Comparison
4.2.1 United States VS China: Solder Ball in Integrated Circuit Packaging Production Comparison (2019 & 2023 & 2030)
4.2.2 United States VS China: Solder Ball in Integrated Circuit Packaging Production Market Share Comparison (2019 & 2023 & 2030)
4.3 United States VS China: Solder Ball in Integrated Circuit Packaging Consumption Comparison
4.3.1 United States VS China: Solder Ball in Integrated Circuit Packaging Consumption Comparison (2019 & 2023 & 2030)
4.3.2 United States VS China: Solder Ball in Integrated Circuit Packaging Consumption Market Share Comparison (2019 & 2023 & 2030)
4.4 United States Based Solder Ball in Integrated Circuit Packaging Manufacturers and Market Share, 2019-2024
4.4.1 United States Based Solder Ball in Integrated Circuit Packaging Manufacturers, Headquarters and Production Site (States, Country)
4.4.2 United States Based Manufacturers Solder Ball in Integrated Circuit Packaging Production Value (2019-2024)
4.4.3 United States Based Manufacturers Solder Ball in Integrated Circuit Packaging Production (2019-2024)
4.5 China Based Solder Ball in Integrated Circuit Packaging Manufacturers and Market Share
4.5.1 China Based Solder Ball in Integrated Circuit Packaging Manufacturers, Headquarters and Production Site (Province, Country)
4.5.2 China Based Manufacturers Solder Ball in Integrated Circuit Packaging Production Value (2019-2024)
4.5.3 China Based Manufacturers Solder Ball in Integrated Circuit Packaging Production (2019-2024)
4.6 Rest of World Based Solder Ball in Integrated Circuit Packaging Manufacturers and Market Share, 2019-2024
4.6.1 Rest of World Based Solder Ball in Integrated Circuit Packaging Manufacturers, Headquarters and Production Site (State, Country)
4.6.2 Rest of World Based Manufacturers Solder Ball in Integrated Circuit Packaging Production Value (2019-2024)
4.6.3 Rest of World Based Manufacturers Solder Ball in Integrated Circuit Packaging Production (2019-2024)
5.1 World Solder Ball in Integrated Circuit Packaging Market Size Overview by Type: 2019 VS 2023 VS 2030
5.2 Segment Introduction by Type
5.2.1 Lead Solder Balls
5.2.2 Lead Free Solder Balls
5.3 Market Segment by Type
5.3.1 World Solder Ball in Integrated Circuit Packaging Production by Type (2019-2030)
5.3.2 World Solder Ball in Integrated Circuit Packaging Production Value by Type (2019-2030)
5.3.3 World Solder Ball in Integrated Circuit Packaging Average Price by Type (2019-2030)
6.1 World Solder Ball in Integrated Circuit Packaging Market Size Overview by Application: 2019 VS 2023 VS 2030
6.2 Segment Introduction by Application
6.2.1 BGA
6.2.2 CSP & WLCSP
6.2.3 Others
6.3 Market Segment by Application
6.3.1 World Solder Ball in Integrated Circuit Packaging Production by Application (2019-2030)
6.3.2 World Solder Ball in Integrated Circuit Packaging Production Value by Application (2019-2030)
6.3.3 World Solder Ball in Integrated Circuit Packaging Average Price by Application (2019-2030)
7.1 IPS
7.1.1 IPS Details
7.1.2 IPS Major Business
7.1.3 IPS Solder Ball in Integrated Circuit Packaging Product and Services
7.1.4 IPS Solder Ball in Integrated Circuit Packaging Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.1.5 IPS Recent Developments/Updates
7.1.6 IPS Competitive Strengths & Weaknesses
7.2 WEIDINGER
7.2.1 WEIDINGER Details
7.2.2 WEIDINGER Major Business
7.2.3 WEIDINGER Solder Ball in Integrated Circuit Packaging Product and Services
7.2.4 WEIDINGER Solder Ball in Integrated Circuit Packaging Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.2.5 WEIDINGER Recent Developments/Updates
7.2.6 WEIDINGER Competitive Strengths & Weaknesses
7.3 MacDermid Alpha Electronics
7.3.1 MacDermid Alpha Electronics Details
7.3.2 MacDermid Alpha Electronics Major Business
7.3.3 MacDermid Alpha Electronics Solder Ball in Integrated Circuit Packaging Product and Services
7.3.4 MacDermid Alpha Electronics Solder Ball in Integrated Circuit Packaging Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.3.5 MacDermid Alpha Electronics Recent Developments/Updates
7.3.6 MacDermid Alpha Electronics Competitive Strengths & Weaknesses
7.4 Senju Metal Industry Co. Ltd.
7.4.1 Senju Metal Industry Co. Ltd. Details
7.4.2 Senju Metal Industry Co. Ltd. Major Business
7.4.3 Senju Metal Industry Co. Ltd. Solder Ball in Integrated Circuit Packaging Product and Services
7.4.4 Senju Metal Industry Co. Ltd. Solder Ball in Integrated Circuit Packaging Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.4.5 Senju Metal Industry Co. Ltd. Recent Developments/Updates
7.4.6 Senju Metal Industry Co. Ltd. Competitive Strengths & Weaknesses
7.5 Accurus
7.5.1 Accurus Details
7.5.2 Accurus Major Business
7.5.3 Accurus Solder Ball in Integrated Circuit Packaging Product and Services
7.5.4 Accurus Solder Ball in Integrated Circuit Packaging Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.5.5 Accurus Recent Developments/Updates
7.5.6 Accurus Competitive Strengths & Weaknesses
7.6 MKE
7.6.1 MKE Details
7.6.2 MKE Major Business
7.6.3 MKE Solder Ball in Integrated Circuit Packaging Product and Services
7.6.4 MKE Solder Ball in Integrated Circuit Packaging Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.6.5 MKE Recent Developments/Updates
7.6.6 MKE Competitive Strengths & Weaknesses
7.7 Nippon Micrometal
7.7.1 Nippon Micrometal Details
7.7.2 Nippon Micrometal Major Business
7.7.3 Nippon Micrometal Solder Ball in Integrated Circuit Packaging Product and Services
7.7.4 Nippon Micrometal Solder Ball in Integrated Circuit Packaging Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.7.5 Nippon Micrometal Recent Developments/Updates
7.7.6 Nippon Micrometal Competitive Strengths & Weaknesses
7.8 DS HiMetal
7.8.1 DS HiMetal Details
7.8.2 DS HiMetal Major Business
7.8.3 DS HiMetal Solder Ball in Integrated Circuit Packaging Product and Services
7.8.4 DS HiMetal Solder Ball in Integrated Circuit Packaging Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.8.5 DS HiMetal Recent Developments/Updates
7.8.6 DS HiMetal Competitive Strengths & Weaknesses
7.9 YUNNAN TIN COMPANY GROUP LIMITED
7.9.1 YUNNAN TIN COMPANY GROUP LIMITED Details
7.9.2 YUNNAN TIN COMPANY GROUP LIMITED Major Business
7.9.3 YUNNAN TIN COMPANY GROUP LIMITED Solder Ball in Integrated Circuit Packaging Product and Services
7.9.4 YUNNAN TIN COMPANY GROUP LIMITED Solder Ball in Integrated Circuit Packaging Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.9.5 YUNNAN TIN COMPANY GROUP LIMITED Recent Developments/Updates
7.9.6 YUNNAN TIN COMPANY GROUP LIMITED Competitive Strengths & Weaknesses
7.10 Hitachi Metals Nanotech
7.10.1 Hitachi Metals Nanotech Details
7.10.2 Hitachi Metals Nanotech Major Business
7.10.3 Hitachi Metals Nanotech Solder Ball in Integrated Circuit Packaging Product and Services
7.10.4 Hitachi Metals Nanotech Solder Ball in Integrated Circuit Packaging Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.10.5 Hitachi Metals Nanotech Recent Developments/Updates
7.10.6 Hitachi Metals Nanotech Competitive Strengths & Weaknesses
7.11 Indium Corporation
7.11.1 Indium Corporation Details
7.11.2 Indium Corporation Major Business
7.11.3 Indium Corporation Solder Ball in Integrated Circuit Packaging Product and Services
7.11.4 Indium Corporation Solder Ball in Integrated Circuit Packaging Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.11.5 Indium Corporation Recent Developments/Updates
7.11.6 Indium Corporation Competitive Strengths & Weaknesses
7.12 Matsuo Handa Co. Ltd.
7.12.1 Matsuo Handa Co. Ltd. Details
7.12.2 Matsuo Handa Co. Ltd. Major Business
7.12.3 Matsuo Handa Co. Ltd. Solder Ball in Integrated Circuit Packaging Product and Services
7.12.4 Matsuo Handa Co. Ltd. Solder Ball in Integrated Circuit Packaging Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.12.5 Matsuo Handa Co. Ltd. Recent Developments/Updates
7.12.6 Matsuo Handa Co. Ltd. Competitive Strengths & Weaknesses
7.13 PMTC
7.13.1 PMTC Details
7.13.2 PMTC Major Business
7.13.3 PMTC Solder Ball in Integrated Circuit Packaging Product and Services
7.13.4 PMTC Solder Ball in Integrated Circuit Packaging Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.13.5 PMTC Recent Developments/Updates
7.13.6 PMTC Competitive Strengths & Weaknesses
7.14 Shanghai hiking solder material
7.14.1 Shanghai hiking solder material Details
7.14.2 Shanghai hiking solder material Major Business
7.14.3 Shanghai hiking solder material Solder Ball in Integrated Circuit Packaging Product and Services
7.14.4 Shanghai hiking solder material Solder Ball in Integrated Circuit Packaging Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.14.5 Shanghai hiking solder material Recent Developments/Updates
7.14.6 Shanghai hiking solder material Competitive Strengths & Weaknesses
7.15 Shenmao Technology
7.15.1 Shenmao Technology Details
7.15.2 Shenmao Technology Major Business
7.15.3 Shenmao Technology Solder Ball in Integrated Circuit Packaging Product and Services
7.15.4 Shenmao Technology Solder Ball in Integrated Circuit Packaging Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.15.5 Shenmao Technology Recent Developments/Updates
7.15.6 Shenmao Technology Competitive Strengths & Weaknesses
7.16 Shenzhen Hua Maoxiang Electronics Co., Ltd
7.16.1 Shenzhen Hua Maoxiang Electronics Co., Ltd Details
7.16.2 Shenzhen Hua Maoxiang Electronics Co., Ltd Major Business
7.16.3 Shenzhen Hua Maoxiang Electronics Co., Ltd Solder Ball in Integrated Circuit Packaging Product and Services
7.16.4 Shenzhen Hua Maoxiang Electronics Co., Ltd Solder Ball in Integrated Circuit Packaging Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.16.5 Shenzhen Hua Maoxiang Electronics Co., Ltd Recent Developments/Updates
7.16.6 Shenzhen Hua Maoxiang Electronics Co., Ltd Competitive Strengths & Weaknesses
7.17 Accurus
7.17.1 Accurus Details
7.17.2 Accurus Major Business
7.17.3 Accurus Solder Ball in Integrated Circuit Packaging Product and Services
7.17.4 Accurus Solder Ball in Integrated Circuit Packaging Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.17.5 Accurus Recent Developments/Updates
7.17.6 Accurus Competitive Strengths & Weaknesses
7.18 NMC
7.18.1 NMC Details
7.18.2 NMC Major Business
7.18.3 NMC Solder Ball in Integrated Circuit Packaging Product and Services
7.18.4 NMC Solder Ball in Integrated Circuit Packaging Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.18.5 NMC Recent Developments/Updates
7.18.6 NMC Competitive Strengths & Weaknesses
7.19 YCTC
7.19.1 YCTC Details
7.19.2 YCTC Major Business
7.19.3 YCTC Solder Ball in Integrated Circuit Packaging Product and Services
7.19.4 YCTC Solder Ball in Integrated Circuit Packaging Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.19.5 YCTC Recent Developments/Updates
7.19.6 YCTC Competitive Strengths & Weaknesses
8.1 Solder Ball in Integrated Circuit Packaging Industry Chain
8.2 Solder Ball in Integrated Circuit Packaging Upstream Analysis
8.2.1 Solder Ball in Integrated Circuit Packaging Core Raw Materials
8.2.2 Main Manufacturers of Solder Ball in Integrated Circuit Packaging Core Raw Materials
8.3 Midstream Analysis
8.4 Downstream Analysis
8.5 Solder Ball in Integrated Circuit Packaging Production Mode
8.6 Solder Ball in Integrated Circuit Packaging Procurement Model
8.7 Solder Ball in Integrated Circuit Packaging Industry Sales Model and Sales Channels
8.7.1 Solder Ball in Integrated Circuit Packaging Sales Model
8.7.2 Solder Ball in Integrated Circuit Packaging Typical Customers
10.1 Methodology
10.2 Research Process and Data Source
10.3 Disclaimer
Table of Figures
List of Tables
Table 1. World Solder Ball in Integrated Circuit Packaging Production Value by Region (2019, 2023 and 2030) & (USD Million)
Table 2. World Solder Ball in Integrated Circuit Packaging Production Value by Region (2019-2024) & (USD Million)
Table 3. World Solder Ball in Integrated Circuit Packaging Production Value by Region (2025-2030) & (USD Million)
Table 4. World Solder Ball in Integrated Circuit Packaging Production Value Market Share by Region (2019-2024)
Table 5. World Solder Ball in Integrated Circuit Packaging Production Value Market Share by Region (2025-2030)
Table 6. World Solder Ball in Integrated Circuit Packaging Production by Region (2019-2024) & (Tons)
Table 7. World Solder Ball in Integrated Circuit Packaging Production by Region (2025-2030) & (Tons)
Table 8. World Solder Ball in Integrated Circuit Packaging Production Market Share by Region (2019-2024)
Table 9. World Solder Ball in Integrated Circuit Packaging Production Market Share by Region (2025-2030)
Table 10. World Solder Ball in Integrated Circuit Packaging Average Price by Region (2019-2024) & (US$/Ton)
Table 11. World Solder Ball in Integrated Circuit Packaging Average Price by Region (2025-2030) & (US$/Ton)
Table 12. Solder Ball in Integrated Circuit Packaging Major Market Trends
Table 13. World Solder Ball in Integrated Circuit Packaging Consumption Growth Rate Forecast by Region (2019 & 2023 & 2030) & (Tons)
Table 14. World Solder Ball in Integrated Circuit Packaging Consumption by Region (2019-2024) & (Tons)
Table 15. World Solder Ball in Integrated Circuit Packaging Consumption Forecast by Region (2025-2030) & (Tons)
Table 16. World Solder Ball in Integrated Circuit Packaging Production Value by Manufacturer (2019-2024) & (USD Million)
Table 17. Production Value Market Share of Key Solder Ball in Integrated Circuit Packaging Producers in 2023
Table 18. World Solder Ball in Integrated Circuit Packaging Production by Manufacturer (2019-2024) & (Tons)
Table 19. Production Market Share of Key Solder Ball in Integrated Circuit Packaging Producers in 2023
Table 20. World Solder Ball in Integrated Circuit Packaging Average Price by Manufacturer (2019-2024) & (US$/Ton)
Table 21. Global Solder Ball in Integrated Circuit Packaging Company Evaluation Quadrant
Table 22. World Solder Ball in Integrated Circuit Packaging Industry Rank of Major Manufacturers, Based on Production Value in 2023
Table 23. Head Office and Solder Ball in Integrated Circuit Packaging Production Site of Key Manufacturer
Table 24. Solder Ball in Integrated Circuit Packaging Market: Company Product Type Footprint
Table 25. Solder Ball in Integrated Circuit Packaging Market: Company Product Application Footprint
Table 26. Solder Ball in Integrated Circuit Packaging Competitive Factors
Table 27. Solder Ball in Integrated Circuit Packaging New Entrant and Capacity Expansion Plans
Table 28. Solder Ball in Integrated Circuit Packaging Mergers & Acquisitions Activity
Table 29. United States VS China Solder Ball in Integrated Circuit Packaging Production Value Comparison, (2019 & 2023 & 2030) & (USD Million)
Table 30. United States VS China Solder Ball in Integrated Circuit Packaging Production Comparison, (2019 & 2023 & 2030) & (Tons)
Table 31. United States VS China Solder Ball in Integrated Circuit Packaging Consumption Comparison, (2019 & 2023 & 2030) & (Tons)
Table 32. United States Based Solder Ball in Integrated Circuit Packaging Manufacturers, Headquarters and Production Site (States, Country)
Table 33. United States Based Manufacturers Solder Ball in Integrated Circuit Packaging Production Value, (2019-2024) & (USD Million)
Table 34. United States Based Manufacturers Solder Ball in Integrated Circuit Packaging Production Value Market Share (2019-2024)
Table 35. United States Based Manufacturers Solder Ball in Integrated Circuit Packaging Production (2019-2024) & (Tons)
Table 36. United States Based Manufacturers Solder Ball in Integrated Circuit Packaging Production Market Share (2019-2024)
Table 37. China Based Solder Ball in Integrated Circuit Packaging Manufacturers, Headquarters and Production Site (Province, Country)
Table 38. China Based Manufacturers Solder Ball in Integrated Circuit Packaging Production Value, (2019-2024) & (USD Million)
Table 39. China Based Manufacturers Solder Ball in Integrated Circuit Packaging Production Value Market Share (2019-2024)
Table 40. China Based Manufacturers Solder Ball in Integrated Circuit Packaging Production (2019-2024) & (Tons)
Table 41. China Based Manufacturers Solder Ball in Integrated Circuit Packaging Production Market Share (2019-2024)
Table 42. Rest of World Based Solder Ball in Integrated Circuit Packaging Manufacturers, Headquarters and Production Site (States, Country)
Table 43. Rest of World Based Manufacturers Solder Ball in Integrated Circuit Packaging Production Value, (2019-2024) & (USD Million)
Table 44. Rest of World Based Manufacturers Solder Ball in Integrated Circuit Packaging Production Value Market Share (2019-2024)
Table 45. Rest of World Based Manufacturers Solder Ball in Integrated Circuit Packaging Production (2019-2024) & (Tons)
Table 46. Rest of World Based Manufacturers Solder Ball in Integrated Circuit Packaging Production Market Share (2019-2024)
Table 47. World Solder Ball in Integrated Circuit Packaging Production Value by Type, (USD Million), 2019 & 2023 & 2030
Table 48. World Solder Ball in Integrated Circuit Packaging Production by Type (2019-2024) & (Tons)
Table 49. World Solder Ball in Integrated Circuit Packaging Production by Type (2025-2030) & (Tons)
Table 50. World Solder Ball in Integrated Circuit Packaging Production Value by Type (2019-2024) & (USD Million)
Table 51. World Solder Ball in Integrated Circuit Packaging Production Value by Type (2025-2030) & (USD Million)
Table 52. World Solder Ball in Integrated Circuit Packaging Average Price by Type (2019-2024) & (US$/Ton)
Table 53. World Solder Ball in Integrated Circuit Packaging Average Price by Type (2025-2030) & (US$/Ton)
Table 54. World Solder Ball in Integrated Circuit Packaging Production Value by Application, (USD Million), 2019 & 2023 & 2030
Table 55. World Solder Ball in Integrated Circuit Packaging Production by Application (2019-2024) & (Tons)
Table 56. World Solder Ball in Integrated Circuit Packaging Production by Application (2025-2030) & (Tons)
Table 57. World Solder Ball in Integrated Circuit Packaging Production Value by Application (2019-2024) & (USD Million)
Table 58. World Solder Ball in Integrated Circuit Packaging Production Value by Application (2025-2030) & (USD Million)
Table 59. World Solder Ball in Integrated Circuit Packaging Average Price by Application (2019-2024) & (US$/Ton)
Table 60. World Solder Ball in Integrated Circuit Packaging Average Price by Application (2025-2030) & (US$/Ton)
Table 61. IPS Basic Information, Manufacturing Base and Competitors
Table 62. IPS Major Business
Table 63. IPS Solder Ball in Integrated Circuit Packaging Product and Services
Table 64. IPS Solder Ball in Integrated Circuit Packaging Production (Tons), Price (US$/Ton), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 65. IPS Recent Developments/Updates
Table 66. IPS Competitive Strengths & Weaknesses
Table 67. WEIDINGER Basic Information, Manufacturing Base and Competitors
Table 68. WEIDINGER Major Business
Table 69. WEIDINGER Solder Ball in Integrated Circuit Packaging Product and Services
Table 70. WEIDINGER Solder Ball in Integrated Circuit Packaging Production (Tons), Price (US$/Ton), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 71. WEIDINGER Recent Developments/Updates
Table 72. WEIDINGER Competitive Strengths & Weaknesses
Table 73. MacDermid Alpha Electronics Basic Information, Manufacturing Base and Competitors
Table 74. MacDermid Alpha Electronics Major Business
Table 75. MacDermid Alpha Electronics Solder Ball in Integrated Circuit Packaging Product and Services
Table 76. MacDermid Alpha Electronics Solder Ball in Integrated Circuit Packaging Production (Tons), Price (US$/Ton), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 77. MacDermid Alpha Electronics Recent Developments/Updates
Table 78. MacDermid Alpha Electronics Competitive Strengths & Weaknesses
Table 79. Senju Metal Industry Co. Ltd. Basic Information, Manufacturing Base and Competitors
Table 80. Senju Metal Industry Co. Ltd. Major Business
Table 81. Senju Metal Industry Co. Ltd. Solder Ball in Integrated Circuit Packaging Product and Services
Table 82. Senju Metal Industry Co. Ltd. Solder Ball in Integrated Circuit Packaging Production (Tons), Price (US$/Ton), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 83. Senju Metal Industry Co. Ltd. Recent Developments/Updates
Table 84. Senju Metal Industry Co. Ltd. Competitive Strengths & Weaknesses
Table 85. Accurus Basic Information, Manufacturing Base and Competitors
Table 86. Accurus Major Business
Table 87. Accurus Solder Ball in Integrated Circuit Packaging Product and Services
Table 88. Accurus Solder Ball in Integrated Circuit Packaging Production (Tons), Price (US$/Ton), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 89. Accurus Recent Developments/Updates
Table 90. Accurus Competitive Strengths & Weaknesses
Table 91. MKE Basic Information, Manufacturing Base and Competitors
Table 92. MKE Major Business
Table 93. MKE Solder Ball in Integrated Circuit Packaging Product and Services
Table 94. MKE Solder Ball in Integrated Circuit Packaging Production (Tons), Price (US$/Ton), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 95. MKE Recent Developments/Updates
Table 96. MKE Competitive Strengths & Weaknesses
Table 97. Nippon Micrometal Basic Information, Manufacturing Base and Competitors
Table 98. Nippon Micrometal Major Business
Table 99. Nippon Micrometal Solder Ball in Integrated Circuit Packaging Product and Services
Table 100. Nippon Micrometal Solder Ball in Integrated Circuit Packaging Production (Tons), Price (US$/Ton), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 101. Nippon Micrometal Recent Developments/Updates
Table 102. Nippon Micrometal Competitive Strengths & Weaknesses
Table 103. DS HiMetal Basic Information, Manufacturing Base and Competitors
Table 104. DS HiMetal Major Business
Table 105. DS HiMetal Solder Ball in Integrated Circuit Packaging Product and Services
Table 106. DS HiMetal Solder Ball in Integrated Circuit Packaging Production (Tons), Price (US$/Ton), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 107. DS HiMetal Recent Developments/Updates
Table 108. DS HiMetal Competitive Strengths & Weaknesses
Table 109. YUNNAN TIN COMPANY GROUP LIMITED Basic Information, Manufacturing Base and Competitors
Table 110. YUNNAN TIN COMPANY GROUP LIMITED Major Business
Table 111. YUNNAN TIN COMPANY GROUP LIMITED Solder Ball in Integrated Circuit Packaging Product and Services
Table 112. YUNNAN TIN COMPANY GROUP LIMITED Solder Ball in Integrated Circuit Packaging Production (Tons), Price (US$/Ton), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 113. YUNNAN TIN COMPANY GROUP LIMITED Recent Developments/Updates
Table 114. YUNNAN TIN COMPANY GROUP LIMITED Competitive Strengths & Weaknesses
Table 115. Hitachi Metals Nanotech Basic Information, Manufacturing Base and Competitors
Table 116. Hitachi Metals Nanotech Major Business
Table 117. Hitachi Metals Nanotech Solder Ball in Integrated Circuit Packaging Product and Services
Table 118. Hitachi Metals Nanotech Solder Ball in Integrated Circuit Packaging Production (Tons), Price (US$/Ton), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 119. Hitachi Metals Nanotech Recent Developments/Updates
Table 120. Hitachi Metals Nanotech Competitive Strengths & Weaknesses
Table 121. Indium Corporation Basic Information, Manufacturing Base and Competitors
Table 122. Indium Corporation Major Business
Table 123. Indium Corporation Solder Ball in Integrated Circuit Packaging Product and Services
Table 124. Indium Corporation Solder Ball in Integrated Circuit Packaging Production (Tons), Price (US$/Ton), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 125. Indium Corporation Recent Developments/Updates
Table 126. Indium Corporation Competitive Strengths & Weaknesses
Table 127. Matsuo Handa Co. Ltd. Basic Information, Manufacturing Base and Competitors
Table 128. Matsuo Handa Co. Ltd. Major Business
Table 129. Matsuo Handa Co. Ltd. Solder Ball in Integrated Circuit Packaging Product and Services
Table 130. Matsuo Handa Co. Ltd. Solder Ball in Integrated Circuit Packaging Production (Tons), Price (US$/Ton), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 131. Matsuo Handa Co. Ltd. Recent Developments/Updates
Table 132. Matsuo Handa Co. Ltd. Competitive Strengths & Weaknesses
Table 133. PMTC Basic Information, Manufacturing Base and Competitors
Table 134. PMTC Major Business
Table 135. PMTC Solder Ball in Integrated Circuit Packaging Product and Services
Table 136. PMTC Solder Ball in Integrated Circuit Packaging Production (Tons), Price (US$/Ton), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 137. PMTC Recent Developments/Updates
Table 138. PMTC Competitive Strengths & Weaknesses
Table 139. Shanghai hiking solder material Basic Information, Manufacturing Base and Competitors
Table 140. Shanghai hiking solder material Major Business
Table 141. Shanghai hiking solder material Solder Ball in Integrated Circuit Packaging Product and Services
Table 142. Shanghai hiking solder material Solder Ball in Integrated Circuit Packaging Production (Tons), Price (US$/Ton), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 143. Shanghai hiking solder material Recent Developments/Updates
Table 144. Shanghai hiking solder material Competitive Strengths & Weaknesses
Table 145. Shenmao Technology Basic Information, Manufacturing Base and Competitors
Table 146. Shenmao Technology Major Business
Table 147. Shenmao Technology Solder Ball in Integrated Circuit Packaging Product and Services
Table 148. Shenmao Technology Solder Ball in Integrated Circuit Packaging Production (Tons), Price (US$/Ton), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 149. Shenmao Technology Recent Developments/Updates
Table 150. Shenmao Technology Competitive Strengths & Weaknesses
Table 151. Shenzhen Hua Maoxiang Electronics Co., Ltd Basic Information, Manufacturing Base and Competitors
Table 152. Shenzhen Hua Maoxiang Electronics Co., Ltd Major Business
Table 153. Shenzhen Hua Maoxiang Electronics Co., Ltd Solder Ball in Integrated Circuit Packaging Product and Services
Table 154. Shenzhen Hua Maoxiang Electronics Co., Ltd Solder Ball in Integrated Circuit Packaging Production (Tons), Price (US$/Ton), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 155. Shenzhen Hua Maoxiang Electronics Co., Ltd Recent Developments/Updates
Table 156. Shenzhen Hua Maoxiang Electronics Co., Ltd Competitive Strengths & Weaknesses
Table 157. Accurus Basic Information, Manufacturing Base and Competitors
Table 158. Accurus Major Business
Table 159. Accurus Solder Ball in Integrated Circuit Packaging Product and Services
Table 160. Accurus Solder Ball in Integrated Circuit Packaging Production (Tons), Price (US$/Ton), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 161. Accurus Recent Developments/Updates
Table 162. Accurus Competitive Strengths & Weaknesses
Table 163. NMC Basic Information, Manufacturing Base and Competitors
Table 164. NMC Major Business
Table 165. NMC Solder Ball in Integrated Circuit Packaging Product and Services
Table 166. NMC Solder Ball in Integrated Circuit Packaging Production (Tons), Price (US$/Ton), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 167. NMC Recent Developments/Updates
Table 168. YCTC Basic Information, Manufacturing Base and Competitors
Table 169. YCTC Major Business
Table 170. YCTC Solder Ball in Integrated Circuit Packaging Product and Services
Table 171. YCTC Solder Ball in Integrated Circuit Packaging Production (Tons), Price (US$/Ton), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 172. Global Key Players of Solder Ball in Integrated Circuit Packaging Upstream (Raw Materials)
Table 173. Solder Ball in Integrated Circuit Packaging Typical Customers
Table 174. Solder Ball in Integrated Circuit Packaging Typical Distributors
List of Figure
Figure 1. Solder Ball in Integrated Circuit Packaging Picture
Figure 2. World Solder Ball in Integrated Circuit Packaging Production Value: 2019 & 2023 & 2030, (USD Million)
Figure 3. World Solder Ball in Integrated Circuit Packaging Production Value and Forecast (2019-2030) & (USD Million)
Figure 4. World Solder Ball in Integrated Circuit Packaging Production (2019-2030) & (Tons)
Figure 5. World Solder Ball in Integrated Circuit Packaging Average Price (2019-2030) & (US$/Ton)
Figure 6. World Solder Ball in Integrated Circuit Packaging Production Value Market Share by Region (2019-2030)
Figure 7. World Solder Ball in Integrated Circuit Packaging Production Market Share by Region (2019-2030)
Figure 8. North America Solder Ball in Integrated Circuit Packaging Production (2019-2030) & (Tons)
Figure 9. Europe Solder Ball in Integrated Circuit Packaging Production (2019-2030) & (Tons)
Figure 10. China Solder Ball in Integrated Circuit Packaging Production (2019-2030) & (Tons)
Figure 11. Japan Solder Ball in Integrated Circuit Packaging Production (2019-2030) & (Tons)
Figure 12. Solder Ball in Integrated Circuit Packaging Market Drivers
Figure 13. Factors Affecting Demand
Figure 14. World Solder Ball in Integrated Circuit Packaging Consumption (2019-2030) & (Tons)
Figure 15. World Solder Ball in Integrated Circuit Packaging Consumption Market Share by Region (2019-2030)
Figure 16. United States Solder Ball in Integrated Circuit Packaging Consumption (2019-2030) & (Tons)
Figure 17. China Solder Ball in Integrated Circuit Packaging Consumption (2019-2030) & (Tons)
Figure 18. Europe Solder Ball in Integrated Circuit Packaging Consumption (2019-2030) & (Tons)
Figure 19. Japan Solder Ball in Integrated Circuit Packaging Consumption (2019-2030) & (Tons)
Figure 20. South Korea Solder Ball in Integrated Circuit Packaging Consumption (2019-2030) & (Tons)
Figure 21. ASEAN Solder Ball in Integrated Circuit Packaging Consumption (2019-2030) & (Tons)
Figure 22. India Solder Ball in Integrated Circuit Packaging Consumption (2019-2030) & (Tons)
Figure 23. Producer Shipments of Solder Ball in Integrated Circuit Packaging by Manufacturer Revenue ($MM) and Market Share (%): 2023
Figure 24. Global Four-firm Concentration Ratios (CR4) for Solder Ball in Integrated Circuit Packaging Markets in 2023
Figure 25. Global Four-firm Concentration Ratios (CR8) for Solder Ball in Integrated Circuit Packaging Markets in 2023
Figure 26. United States VS China: Solder Ball in Integrated Circuit Packaging Production Value Market Share Comparison (2019 & 2023 & 2030)
Figure 27. United States VS China: Solder Ball in Integrated Circuit Packaging Production Market Share Comparison (2019 & 2023 & 2030)
Figure 28. United States VS China: Solder Ball in Integrated Circuit Packaging Consumption Market Share Comparison (2019 & 2023 & 2030)
Figure 29. United States Based Manufacturers Solder Ball in Integrated Circuit Packaging Production Market Share 2023
Figure 30. China Based Manufacturers Solder Ball in Integrated Circuit Packaging Production Market Share 2023
Figure 31. Rest of World Based Manufacturers Solder Ball in Integrated Circuit Packaging Production Market Share 2023
Figure 32. World Solder Ball in Integrated Circuit Packaging Production Value by Type, (USD Million), 2019 & 2023 & 2030
Figure 33. World Solder Ball in Integrated Circuit Packaging Production Value Market Share by Type in 2023
Figure 34. Lead Solder Balls
Figure 35. Lead Free Solder Balls
Figure 36. World Solder Ball in Integrated Circuit Packaging Production Market Share by Type (2019-2030)
Figure 37. World Solder Ball in Integrated Circuit Packaging Production Value Market Share by Type (2019-2030)
Figure 38. World Solder Ball in Integrated Circuit Packaging Average Price by Type (2019-2030) & (US$/Ton)
Figure 39. World Solder Ball in Integrated Circuit Packaging Production Value by Application, (USD Million), 2019 & 2023 & 2030
Figure 40. World Solder Ball in Integrated Circuit Packaging Production Value Market Share by Application in 2023
Figure 41. BGA
Figure 42. CSP & WLCSP
Figure 43. Others
Figure 44. World Solder Ball in Integrated Circuit Packaging Production Market Share by Application (2019-2030)
Figure 45. World Solder Ball in Integrated Circuit Packaging Production Value Market Share by Application (2019-2030)
Figure 46. World Solder Ball in Integrated Circuit Packaging Average Price by Application (2019-2030) & (US$/Ton)
Figure 47. Solder Ball in Integrated Circuit Packaging Industry Chain
Figure 48. Solder Ball in Integrated Circuit Packaging Procurement Model
Figure 49. Solder Ball in Integrated Circuit Packaging Sales Model
Figure 50. Solder Ball in Integrated Circuit Packaging Sales Channels, Direct Sales, and Distribution
Figure 51. Methodology
Figure 52. Research Process and Data Source
Research Methodology
Client Requirements
Review and analyze client requirements
Discussion of all the project requirements and queries
Flexibility Check
Project Feasibility Analysis
Finalizing tentative research programme
Structuring project proposal with scope, timeline, and costs
Analyzing Market Dynamics
Determination of key drivers, restraints, challenge, and opportunity
Identifies market needs and trends
Market Size Estimation & Forecast
Estimation of historical data based on secondary and primary data
Anticipating market recast by assigning weightage to market forces (drivers, restraints, opportunities)
Freezing historical and forecast market size estimations based on evolution, trends, outlook, and strategies
Consideration of geography, region-specific product/service demand for region segments
Consideration of product utilization rates, product demand outlook for segments by application or end-user.
Data Source
Secondary Source
Data collections from annual reports, presentations,associations, journals, analyst reports,
paid database, press releases, blogs, newsletters,and GIR repositories.
Primary Source
Research discussion with manufacturers, distributors, suppliers, end user, industry experts
to verify insights.
Validation
and
triangulation of
secondary and primary source.
Collection of data
Cumulating and collating the essential qualitative and quantitative data
Generation of report in client requested format by research analysts
Reviews by expert analysts
Final quality check
Clarifying queries
Receiving feedback
Ensuring satisfaction
01 Identification of data
This step involves identification of several primary and secondary data research sources, including Global Info Research's internal data sources. The primary sources consist of in-depth discussions and interviews with policy makers, industry experts, and data evaluators, whereas secondary sources include a thorough study of market journals, press releases, annual reports, and government and non-government agencies websites.
-
02 Evaluation of Market Dynamic
This phase includes a detailed evaluation of several factors that are likely to affect the market dynamics. It involves a comprehensive assessment of major market pain points, drivers, and trends. It also comprises a detailed study of research plans and methodology.
-
03 Collection of Data
This process consists of gathering data, accessing proprietary databases, and reaching out to key industry participants that operate in the market across the value chain. It also involves studying several patterns in the historical data and comparing it with the current scenario.
-
04 Collaboration of Data
This stage involves the validation of data and arrival at actual statistics, and evolution of the market over the years. It entails the study and analyzes various segments and verticals of the market. An impact analysis is also performed to observe which factors will affect the market in the next few years.
05 Verification and Analysis
This is the final stage, which involves both quantity and quality checks. Although the process of data verification is an integral part of the research process, all data points and statistics and figures are re-checked to uphold their authenticity and validity.
Companies Mentioned
IPS WEIDINGER MacDermid Alpha Electronics Senju Metal Industry Co. Ltd. Accurus MKE Nippon Micrometal DS HiMetal YUNNAN TIN COMPANY GROUP LIMITED Hitachi Metals Nanotech Indium Corporation Matsuo Handa Co. Ltd. PMTC Shanghai hiking solder material Shenmao Technology Shenzhen Hua Maoxiang Electronics Co., Ltd Accurus NMC YCTC
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06 Feb 2023
Chemical & Material
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