Global Wafer Bonder and Debonder Supply, Demand and Key Producers, 2024-2030

Description

The global Wafer Bonder and Debonder market size is expected to reach $ 439 million by 2030, rising at a market growth of 4.9% CAGR during the forecast period (2024-2030).

A Wafer Bonder and Debonder is a specialized system used in semiconductor and microelectronics manufacturing that combines the processes of bonding wafers together and subsequently separating them when required. This equipment plays a crucial role in advanced packaging, MEMS fabrication, and 3D integration.

The Wafer Bonder and Debonder market represents a vital segment within semiconductor and electronics manufacturing equipment. It focuses on technologies enabling precise wafer bonding and subsequent debonding for applications in advanced packaging, 3D integration, MEMS, and other semiconductor fabrication processes. This market has seen steady growth driven by the rise of miniaturized and high-performance devices in industries like consumer electronics, automotive, telecommunications, and IoT.

Market Drivers
Demand for Advanced Packaging Solutions: Growth in fan-out wafer-level packaging (FOWLP) and 3D IC technologies increases the need for bonding and debonding equipment. Adoption of MEMS and IoT Devices: Applications in consumer electronics, automotive sensors, and smart devices drive market expansion. Wafer Thinning Trends: Handling and processing thin wafers require temporary bonding and debonding systems. Technological Advancements: Introduction of hybrid bonding and laser-assisted debonding techniques enables precision and efficiency.

Market Restraints
High Equipment Costs: The sophisticated technology involved results in significant initial investment. Process Complexity: Precise control over bonding and debonding processes requires skilled operators and advanced infrastructure.

Market Opportunities
Emerging Semiconductor Hubs: Expansion of manufacturing facilities in regions like Asia-Pacific opens new growth avenues. Applications in Flexible and Wearable Electronics: Development of ultra-thin and flexible devices presents opportunities for wafer bonders and debonders. Growth in Compound Semiconductor Applications: Increased use of materials like GaN and SiC in power electronics enhances market potential.

This report studies the global Wafer Bonder and Debonder production, demand, key manufacturers, and key regions.

This report is a detailed and comprehensive analysis of the world market for Wafer Bonder and Debonder and provides market size (US$ million) and Year-over-Year (YoY) Growth, considering 2023 as the base year. This report explores demand trends and competition, as well as details the characteristics of Wafer Bonder and Debonder that contribute to its increasing demand across many markets.

Highlights and key features of the study
Global Wafer Bonder and Debonder total production and demand, 2019-2030, (Units)
Global Wafer Bonder and Debonder total production value, 2019-2030, (USD Million)
Global Wafer Bonder and Debonder production by region & country, production, value, CAGR, 2019-2030, (USD Million) & (Units), (based on production site)
Global Wafer Bonder and Debonder consumption by region & country, CAGR, 2019-2030 & (Units)
U.S. VS China: Wafer Bonder and Debonder domestic production, consumption, key domestic manufacturers and share
Global Wafer Bonder and Debonder production by manufacturer, production, price, value and market share 2019-2024, (USD Million) & (Units)
Global Wafer Bonder and Debonder production by Type, production, value, CAGR, 2019-2030, (USD Million) & (Units)
Global Wafer Bonder and Debonder production by Application, production, value, CAGR, 2019-2030, (USD Million) & (Units)
This report profiles key players in the global Wafer Bonder and Debonder market based on the following parameters - company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include EV Group, SUSS MicroTec, Tokyo Electron, Applied Microengineering, Nidec Machine Tool, Ayumi Industry, Bondtech, Aimechatec, U-Precision Tech, TAZMO, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World Wafer Bonder and Debonder market
Detailed Segmentation:
Each section contains quantitative market data including market by value (US$ Millions), volume (production, consumption) & (Units) and average price (K US$/Unit) by manufacturer, by Type, and by Application. Data is given for the years 2019-2030 by year with 2023 as the base year, 2024 as the estimate year, and 2025-2030 as the forecast year.

Global Wafer Bonder and Debonder Market, By Region:
    United States
    China
    Europe
    Japan
    South Korea
    ASEAN
    India
    Rest of World

Global Wafer Bonder and Debonder Market, Segmentation by Type:
    Fully Automatic
    Semi Automatic

Global Wafer Bonder and Debonder Market, Segmentation by Application:
    MEMS
    Advanced Packaging
    CIS
    Others

Companies Profiled:
    EV Group
    SUSS MicroTec
    Tokyo Electron
    Applied Microengineering
    Nidec Machine Tool
    Ayumi Industry
    Bondtech
    Aimechatec
    U-Precision Tech
    TAZMO
    Hutem
    Shanghai Micro Electronics
    Canon

Key Questions Answered:
1. How big is the global Wafer Bonder and Debonder market?
2. What is the demand of the global Wafer Bonder and Debonder market?
3. What is the year over year growth of the global Wafer Bonder and Debonder market?
4. What is the production and production value of the global Wafer Bonder and Debonder market?
5. Who are the key producers in the global Wafer Bonder and Debonder market?
6. What are the growth factors driving the market demand?

Table of Contents

1 Supply Summary
    1.1 Wafer Bonder and Debonder Introduction
    1.2 World Wafer Bonder and Debonder Supply & Forecast
        1.2.1 World Wafer Bonder and Debonder Production Value (2019 & 2023 & 2030)
        1.2.2 World Wafer Bonder and Debonder Production (2019-2030)
        1.2.3 World Wafer Bonder and Debonder Pricing Trends (2019-2030)
    1.3 World Wafer Bonder and Debonder Production by Region (Based on Production Site)
        1.3.1 World Wafer Bonder and Debonder Production Value by Region (2019-2030)
        1.3.2 World Wafer Bonder and Debonder Production by Region (2019-2030)
        1.3.3 World Wafer Bonder and Debonder Average Price by Region (2019-2030)
        1.3.4 Europe Wafer Bonder and Debonder Production (2019-2030)
        1.3.5 China Wafer Bonder and Debonder Production (2019-2030)
        1.3.6 Japan Wafer Bonder and Debonder Production (2019-2030)
    1.4 Market Drivers, Restraints and Trends
        1.4.1 Wafer Bonder and Debonder Market Drivers
        1.4.2 Factors Affecting Demand
        1.4.3 Wafer Bonder and Debonder Major Market Trends

2 Demand Summary
    2.1 World Wafer Bonder and Debonder Demand (2019-2030)
    2.2 World Wafer Bonder and Debonder Consumption by Region
        2.2.1 World Wafer Bonder and Debonder Consumption by Region (2019-2024)
        2.2.2 World Wafer Bonder and Debonder Consumption Forecast by Region (2025-2030)
    2.3 United States Wafer Bonder and Debonder Consumption (2019-2030)
    2.4 China Wafer Bonder and Debonder Consumption (2019-2030)
    2.5 Europe Wafer Bonder and Debonder Consumption (2019-2030)
    2.6 Japan Wafer Bonder and Debonder Consumption (2019-2030)
    2.7 South Korea Wafer Bonder and Debonder Consumption (2019-2030)
    2.8 ASEAN Wafer Bonder and Debonder Consumption (2019-2030)
    2.9 India Wafer Bonder and Debonder Consumption (2019-2030)

3 World Manufacturers Competitive Analysis
    3.1 World Wafer Bonder and Debonder Production Value by Manufacturer (2019-2024)
    3.2 World Wafer Bonder and Debonder Production by Manufacturer (2019-2024)
    3.3 World Wafer Bonder and Debonder Average Price by Manufacturer (2019-2024)
    3.4 Wafer Bonder and Debonder Company Evaluation Quadrant
    3.5 Industry Rank and Concentration Rate (CR)
        3.5.1 Global Wafer Bonder and Debonder Industry Rank of Major Manufacturers
        3.5.2 Global Concentration Ratios (CR4) for Wafer Bonder and Debonder in 2023
        3.5.3 Global Concentration Ratios (CR8) for Wafer Bonder and Debonder in 2023
    3.6 Wafer Bonder and Debonder Market: Overall Company Footprint Analysis
        3.6.1 Wafer Bonder and Debonder Market: Region Footprint
        3.6.2 Wafer Bonder and Debonder Market: Company Product Type Footprint
        3.6.3 Wafer Bonder and Debonder Market: Company Product Application Footprint
    3.7 Competitive Environment
        3.7.1 Historical Structure of the Industry
        3.7.2 Barriers of Market Entry
        3.7.3 Factors of Competition
    3.8 New Entrant and Capacity Expansion Plans
    3.9 Mergers, Acquisition, Agreements, and Collaborations

4 United States VS China VS Rest of the World
    4.1 United States VS China: Wafer Bonder and Debonder Production Value Comparison
        4.1.1 United States VS China: Wafer Bonder and Debonder Production Value Comparison (2019 & 2023 & 2030)
        4.1.2 United States VS China: Wafer Bonder and Debonder Production Value Market Share Comparison (2019 & 2023 & 2030)
    4.2 United States VS China: Wafer Bonder and Debonder Production Comparison
        4.2.1 United States VS China: Wafer Bonder and Debonder Production Comparison (2019 & 2023 & 2030)
        4.2.2 United States VS China: Wafer Bonder and Debonder Production Market Share Comparison (2019 & 2023 & 2030)
    4.3 United States VS China: Wafer Bonder and Debonder Consumption Comparison
        4.3.1 United States VS China: Wafer Bonder and Debonder Consumption Comparison (2019 & 2023 & 2030)
        4.3.2 United States VS China: Wafer Bonder and Debonder Consumption Market Share Comparison (2019 & 2023 & 2030)
    4.4 United States Based Wafer Bonder and Debonder Manufacturers and Market Share, 2019-2024
        4.4.1 United States Based Wafer Bonder and Debonder Manufacturers, Headquarters and Production Site (States, Country)
        4.4.2 United States Based Manufacturers Wafer Bonder and Debonder Production Value (2019-2024)
        4.4.3 United States Based Manufacturers Wafer Bonder and Debonder Production (2019-2024)
    4.5 China Based Wafer Bonder and Debonder Manufacturers and Market Share
        4.5.1 China Based Wafer Bonder and Debonder Manufacturers, Headquarters and Production Site (Province, Country)
        4.5.2 China Based Manufacturers Wafer Bonder and Debonder Production Value (2019-2024)
        4.5.3 China Based Manufacturers Wafer Bonder and Debonder Production (2019-2024)
    4.6 Rest of World Based Wafer Bonder and Debonder Manufacturers and Market Share, 2019-2024
        4.6.1 Rest of World Based Wafer Bonder and Debonder Manufacturers, Headquarters and Production Site (State, Country)
        4.6.2 Rest of World Based Manufacturers Wafer Bonder and Debonder Production Value (2019-2024)
        4.6.3 Rest of World Based Manufacturers Wafer Bonder and Debonder Production (2019-2024)

5 Market Analysis by Type
    5.1 World Wafer Bonder and Debonder Market Size Overview by Type: 2019 VS 2023 VS 2030
    5.2 Segment Introduction by Type
        5.2.1 Fully Automatic
        5.2.2 Semi Automatic
    5.3 Market Segment by Type
        5.3.1 World Wafer Bonder and Debonder Production by Type (2019-2030)
        5.3.2 World Wafer Bonder and Debonder Production Value by Type (2019-2030)
        5.3.3 World Wafer Bonder and Debonder Average Price by Type (2019-2030)

6 Market Analysis by Application
    6.1 World Wafer Bonder and Debonder Market Size Overview by Application: 2019 VS 2023 VS 2030
    6.2 Segment Introduction by Application
        6.2.1 MEMS
        6.2.2 Advanced Packaging
        6.2.3 CIS
        6.2.4 Others
    6.3 Market Segment by Application
        6.3.1 World Wafer Bonder and Debonder Production by Application (2019-2030)
        6.3.2 World Wafer Bonder and Debonder Production Value by Application (2019-2030)
        6.3.3 World Wafer Bonder and Debonder Average Price by Application (2019-2030)

7 Company Profiles
    7.1 EV Group
        7.1.1 EV Group Details
        7.1.2 EV Group Major Business
        7.1.3 EV Group Wafer Bonder and Debonder Product and Services
        7.1.4 EV Group Wafer Bonder and Debonder Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.1.5 EV Group Recent Developments/Updates
        7.1.6 EV Group Competitive Strengths & Weaknesses
    7.2 SUSS MicroTec
        7.2.1 SUSS MicroTec Details
        7.2.2 SUSS MicroTec Major Business
        7.2.3 SUSS MicroTec Wafer Bonder and Debonder Product and Services
        7.2.4 SUSS MicroTec Wafer Bonder and Debonder Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.2.5 SUSS MicroTec Recent Developments/Updates
        7.2.6 SUSS MicroTec Competitive Strengths & Weaknesses
    7.3 Tokyo Electron
        7.3.1 Tokyo Electron Details
        7.3.2 Tokyo Electron Major Business
        7.3.3 Tokyo Electron Wafer Bonder and Debonder Product and Services
        7.3.4 Tokyo Electron Wafer Bonder and Debonder Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.3.5 Tokyo Electron Recent Developments/Updates
        7.3.6 Tokyo Electron Competitive Strengths & Weaknesses
    7.4 Applied Microengineering
        7.4.1 Applied Microengineering Details
        7.4.2 Applied Microengineering Major Business
        7.4.3 Applied Microengineering Wafer Bonder and Debonder Product and Services
        7.4.4 Applied Microengineering Wafer Bonder and Debonder Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.4.5 Applied Microengineering Recent Developments/Updates
        7.4.6 Applied Microengineering Competitive Strengths & Weaknesses
    7.5 Nidec Machine Tool
        7.5.1 Nidec Machine Tool Details
        7.5.2 Nidec Machine Tool Major Business
        7.5.3 Nidec Machine Tool Wafer Bonder and Debonder Product and Services
        7.5.4 Nidec Machine Tool Wafer Bonder and Debonder Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.5.5 Nidec Machine Tool Recent Developments/Updates
        7.5.6 Nidec Machine Tool Competitive Strengths & Weaknesses
    7.6 Ayumi Industry
        7.6.1 Ayumi Industry Details
        7.6.2 Ayumi Industry Major Business
        7.6.3 Ayumi Industry Wafer Bonder and Debonder Product and Services
        7.6.4 Ayumi Industry Wafer Bonder and Debonder Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.6.5 Ayumi Industry Recent Developments/Updates
        7.6.6 Ayumi Industry Competitive Strengths & Weaknesses
    7.7 Bondtech
        7.7.1 Bondtech Details
        7.7.2 Bondtech Major Business
        7.7.3 Bondtech Wafer Bonder and Debonder Product and Services
        7.7.4 Bondtech Wafer Bonder and Debonder Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.7.5 Bondtech Recent Developments/Updates
        7.7.6 Bondtech Competitive Strengths & Weaknesses
    7.8 Aimechatec
        7.8.1 Aimechatec Details
        7.8.2 Aimechatec Major Business
        7.8.3 Aimechatec Wafer Bonder and Debonder Product and Services
        7.8.4 Aimechatec Wafer Bonder and Debonder Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.8.5 Aimechatec Recent Developments/Updates
        7.8.6 Aimechatec Competitive Strengths & Weaknesses
    7.9 U-Precision Tech
        7.9.1 U-Precision Tech Details
        7.9.2 U-Precision Tech Major Business
        7.9.3 U-Precision Tech Wafer Bonder and Debonder Product and Services
        7.9.4 U-Precision Tech Wafer Bonder and Debonder Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.9.5 U-Precision Tech Recent Developments/Updates
        7.9.6 U-Precision Tech Competitive Strengths & Weaknesses
    7.10 TAZMO
        7.10.1 TAZMO Details
        7.10.2 TAZMO Major Business
        7.10.3 TAZMO Wafer Bonder and Debonder Product and Services
        7.10.4 TAZMO Wafer Bonder and Debonder Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.10.5 TAZMO Recent Developments/Updates
        7.10.6 TAZMO Competitive Strengths & Weaknesses
    7.11 Hutem
        7.11.1 Hutem Details
        7.11.2 Hutem Major Business
        7.11.3 Hutem Wafer Bonder and Debonder Product and Services
        7.11.4 Hutem Wafer Bonder and Debonder Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.11.5 Hutem Recent Developments/Updates
        7.11.6 Hutem Competitive Strengths & Weaknesses
    7.12 Shanghai Micro Electronics
        7.12.1 Shanghai Micro Electronics Details
        7.12.2 Shanghai Micro Electronics Major Business
        7.12.3 Shanghai Micro Electronics Wafer Bonder and Debonder Product and Services
        7.12.4 Shanghai Micro Electronics Wafer Bonder and Debonder Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.12.5 Shanghai Micro Electronics Recent Developments/Updates
        7.12.6 Shanghai Micro Electronics Competitive Strengths & Weaknesses
    7.13 Canon
        7.13.1 Canon Details
        7.13.2 Canon Major Business
        7.13.3 Canon Wafer Bonder and Debonder Product and Services
        7.13.4 Canon Wafer Bonder and Debonder Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.13.5 Canon Recent Developments/Updates
        7.13.6 Canon Competitive Strengths & Weaknesses

8 Industry Chain Analysis
    8.1 Wafer Bonder and Debonder Industry Chain
    8.2 Wafer Bonder and Debonder Upstream Analysis
        8.2.1 Wafer Bonder and Debonder Core Raw Materials
        8.2.2 Main Manufacturers of Wafer Bonder and Debonder Core Raw Materials
    8.3 Midstream Analysis
    8.4 Downstream Analysis
    8.5 Wafer Bonder and Debonder Production Mode
    8.6 Wafer Bonder and Debonder Procurement Model
    8.7 Wafer Bonder and Debonder Industry Sales Model and Sales Channels
        8.7.1 Wafer Bonder and Debonder Sales Model
        8.7.2 Wafer Bonder and Debonder Typical Distributors

9 Research Findings and Conclusion

10 Appendix
    10.1 Methodology
    10.2 Research Process and Data Source
    10.3 Disclaimer

Table of Figures

List of Tables
 Table 1. World Wafer Bonder and Debonder Production Value by Region (2019, 2023 and 2030) & (USD Million)
 Table 2. World Wafer Bonder and Debonder Production Value by Region (2019-2024) & (USD Million)
 Table 3. World Wafer Bonder and Debonder Production Value by Region (2025-2030) & (USD Million)
 Table 4. World Wafer Bonder and Debonder Production Value Market Share by Region (2019-2024)
 Table 5. World Wafer Bonder and Debonder Production Value Market Share by Region (2025-2030)
 Table 6. World Wafer Bonder and Debonder Production by Region (2019-2024) & (Units)
 Table 7. World Wafer Bonder and Debonder Production by Region (2025-2030) & (Units)
 Table 8. World Wafer Bonder and Debonder Production Market Share by Region (2019-2024)
 Table 9. World Wafer Bonder and Debonder Production Market Share by Region (2025-2030)
 Table 10. World Wafer Bonder and Debonder Average Price by Region (2019-2024) & (K US$/Unit)
 Table 11. World Wafer Bonder and Debonder Average Price by Region (2025-2030) & (K US$/Unit)
 Table 12. Wafer Bonder and Debonder Major Market Trends
 Table 13. World Wafer Bonder and Debonder Consumption Growth Rate Forecast by Region (2019 & 2023 & 2030) & (Units)
 Table 14. World Wafer Bonder and Debonder Consumption by Region (2019-2024) & (Units)
 Table 15. World Wafer Bonder and Debonder Consumption Forecast by Region (2025-2030) & (Units)
 Table 16. World Wafer Bonder and Debonder Production Value by Manufacturer (2019-2024) & (USD Million)
 Table 17. Production Value Market Share of Key Wafer Bonder and Debonder Producers in 2023
 Table 18. World Wafer Bonder and Debonder Production by Manufacturer (2019-2024) & (Units)
 Table 19. Production Market Share of Key Wafer Bonder and Debonder Producers in 2023
 Table 20. World Wafer Bonder and Debonder Average Price by Manufacturer (2019-2024) & (K US$/Unit)
 Table 21. Global Wafer Bonder and Debonder Company Evaluation Quadrant
 Table 22. World Wafer Bonder and Debonder Industry Rank of Major Manufacturers, Based on Production Value in 2023
 Table 23. Head Office and Wafer Bonder and Debonder Production Site of Key Manufacturer
 Table 24. Wafer Bonder and Debonder Market: Company Product Type Footprint
 Table 25. Wafer Bonder and Debonder Market: Company Product Application Footprint
 Table 26. Wafer Bonder and Debonder Competitive Factors
 Table 27. Wafer Bonder and Debonder New Entrant and Capacity Expansion Plans
 Table 28. Wafer Bonder and Debonder Mergers & Acquisitions Activity
 Table 29. United States VS China Wafer Bonder and Debonder Production Value Comparison, (2019 & 2023 & 2030) & (USD Million)
 Table 30. United States VS China Wafer Bonder and Debonder Production Comparison, (2019 & 2023 & 2030) & (Units)
 Table 31. United States VS China Wafer Bonder and Debonder Consumption Comparison, (2019 & 2023 & 2030) & (Units)
 Table 32. United States Based Wafer Bonder and Debonder Manufacturers, Headquarters and Production Site (States, Country)
 Table 33. United States Based Manufacturers Wafer Bonder and Debonder Production Value, (2019-2024) & (USD Million)
 Table 34. United States Based Manufacturers Wafer Bonder and Debonder Production Value Market Share (2019-2024)
 Table 35. United States Based Manufacturers Wafer Bonder and Debonder Production (2019-2024) & (Units)
 Table 36. United States Based Manufacturers Wafer Bonder and Debonder Production Market Share (2019-2024)
 Table 37. China Based Wafer Bonder and Debonder Manufacturers, Headquarters and Production Site (Province, Country)
 Table 38. China Based Manufacturers Wafer Bonder and Debonder Production Value, (2019-2024) & (USD Million)
 Table 39. China Based Manufacturers Wafer Bonder and Debonder Production Value Market Share (2019-2024)
 Table 40. China Based Manufacturers Wafer Bonder and Debonder Production, (2019-2024) & (Units)
 Table 41. China Based Manufacturers Wafer Bonder and Debonder Production Market Share (2019-2024)
 Table 42. Rest of World Based Wafer Bonder and Debonder Manufacturers, Headquarters and Production Site (State, Country)
 Table 43. Rest of World Based Manufacturers Wafer Bonder and Debonder Production Value, (2019-2024) & (USD Million)
 Table 44. Rest of World Based Manufacturers Wafer Bonder and Debonder Production Value Market Share (2019-2024)
 Table 45. Rest of World Based Manufacturers Wafer Bonder and Debonder Production, (2019-2024) & (Units)
 Table 46. Rest of World Based Manufacturers Wafer Bonder and Debonder Production Market Share (2019-2024)
 Table 47. World Wafer Bonder and Debonder Production Value by Type, (USD Million), 2019 & 2023 & 2030
 Table 48. World Wafer Bonder and Debonder Production by Type (2019-2024) & (Units)
 Table 49. World Wafer Bonder and Debonder Production by Type (2025-2030) & (Units)
 Table 50. World Wafer Bonder and Debonder Production Value by Type (2019-2024) & (USD Million)
 Table 51. World Wafer Bonder and Debonder Production Value by Type (2025-2030) & (USD Million)
 Table 52. World Wafer Bonder and Debonder Average Price by Type (2019-2024) & (K US$/Unit)
 Table 53. World Wafer Bonder and Debonder Average Price by Type (2025-2030) & (K US$/Unit)
 Table 54. World Wafer Bonder and Debonder Production Value by Application, (USD Million), 2019 & 2023 & 2030
 Table 55. World Wafer Bonder and Debonder Production by Application (2019-2024) & (Units)
 Table 56. World Wafer Bonder and Debonder Production by Application (2025-2030) & (Units)
 Table 57. World Wafer Bonder and Debonder Production Value by Application (2019-2024) & (USD Million)
 Table 58. World Wafer Bonder and Debonder Production Value by Application (2025-2030) & (USD Million)
 Table 59. World Wafer Bonder and Debonder Average Price by Application (2019-2024) & (K US$/Unit)
 Table 60. World Wafer Bonder and Debonder Average Price by Application (2025-2030) & (K US$/Unit)
 Table 61. EV Group Basic Information, Manufacturing Base and Competitors
 Table 62. EV Group Major Business
 Table 63. EV Group Wafer Bonder and Debonder Product and Services
 Table 64. EV Group Wafer Bonder and Debonder Production (Units), Price (K US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 65. EV Group Recent Developments/Updates
 Table 66. EV Group Competitive Strengths & Weaknesses
 Table 67. SUSS MicroTec Basic Information, Manufacturing Base and Competitors
 Table 68. SUSS MicroTec Major Business
 Table 69. SUSS MicroTec Wafer Bonder and Debonder Product and Services
 Table 70. SUSS MicroTec Wafer Bonder and Debonder Production (Units), Price (K US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 71. SUSS MicroTec Recent Developments/Updates
 Table 72. SUSS MicroTec Competitive Strengths & Weaknesses
 Table 73. Tokyo Electron Basic Information, Manufacturing Base and Competitors
 Table 74. Tokyo Electron Major Business
 Table 75. Tokyo Electron Wafer Bonder and Debonder Product and Services
 Table 76. Tokyo Electron Wafer Bonder and Debonder Production (Units), Price (K US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 77. Tokyo Electron Recent Developments/Updates
 Table 78. Tokyo Electron Competitive Strengths & Weaknesses
 Table 79. Applied Microengineering Basic Information, Manufacturing Base and Competitors
 Table 80. Applied Microengineering Major Business
 Table 81. Applied Microengineering Wafer Bonder and Debonder Product and Services
 Table 82. Applied Microengineering Wafer Bonder and Debonder Production (Units), Price (K US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 83. Applied Microengineering Recent Developments/Updates
 Table 84. Applied Microengineering Competitive Strengths & Weaknesses
 Table 85. Nidec Machine Tool Basic Information, Manufacturing Base and Competitors
 Table 86. Nidec Machine Tool Major Business
 Table 87. Nidec Machine Tool Wafer Bonder and Debonder Product and Services
 Table 88. Nidec Machine Tool Wafer Bonder and Debonder Production (Units), Price (K US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 89. Nidec Machine Tool Recent Developments/Updates
 Table 90. Nidec Machine Tool Competitive Strengths & Weaknesses
 Table 91. Ayumi Industry Basic Information, Manufacturing Base and Competitors
 Table 92. Ayumi Industry Major Business
 Table 93. Ayumi Industry Wafer Bonder and Debonder Product and Services
 Table 94. Ayumi Industry Wafer Bonder and Debonder Production (Units), Price (K US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 95. Ayumi Industry Recent Developments/Updates
 Table 96. Ayumi Industry Competitive Strengths & Weaknesses
 Table 97. Bondtech Basic Information, Manufacturing Base and Competitors
 Table 98. Bondtech Major Business
 Table 99. Bondtech Wafer Bonder and Debonder Product and Services
 Table 100. Bondtech Wafer Bonder and Debonder Production (Units), Price (K US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 101. Bondtech Recent Developments/Updates
 Table 102. Bondtech Competitive Strengths & Weaknesses
 Table 103. Aimechatec Basic Information, Manufacturing Base and Competitors
 Table 104. Aimechatec Major Business
 Table 105. Aimechatec Wafer Bonder and Debonder Product and Services
 Table 106. Aimechatec Wafer Bonder and Debonder Production (Units), Price (K US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 107. Aimechatec Recent Developments/Updates
 Table 108. Aimechatec Competitive Strengths & Weaknesses
 Table 109. U-Precision Tech Basic Information, Manufacturing Base and Competitors
 Table 110. U-Precision Tech Major Business
 Table 111. U-Precision Tech Wafer Bonder and Debonder Product and Services
 Table 112. U-Precision Tech Wafer Bonder and Debonder Production (Units), Price (K US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 113. U-Precision Tech Recent Developments/Updates
 Table 114. U-Precision Tech Competitive Strengths & Weaknesses
 Table 115. TAZMO Basic Information, Manufacturing Base and Competitors
 Table 116. TAZMO Major Business
 Table 117. TAZMO Wafer Bonder and Debonder Product and Services
 Table 118. TAZMO Wafer Bonder and Debonder Production (Units), Price (K US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 119. TAZMO Recent Developments/Updates
 Table 120. TAZMO Competitive Strengths & Weaknesses
 Table 121. Hutem Basic Information, Manufacturing Base and Competitors
 Table 122. Hutem Major Business
 Table 123. Hutem Wafer Bonder and Debonder Product and Services
 Table 124. Hutem Wafer Bonder and Debonder Production (Units), Price (K US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 125. Hutem Recent Developments/Updates
 Table 126. Hutem Competitive Strengths & Weaknesses
 Table 127. Shanghai Micro Electronics Basic Information, Manufacturing Base and Competitors
 Table 128. Shanghai Micro Electronics Major Business
 Table 129. Shanghai Micro Electronics Wafer Bonder and Debonder Product and Services
 Table 130. Shanghai Micro Electronics Wafer Bonder and Debonder Production (Units), Price (K US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 131. Shanghai Micro Electronics Recent Developments/Updates
 Table 132. Shanghai Micro Electronics Competitive Strengths & Weaknesses
 Table 133. Canon Basic Information, Manufacturing Base and Competitors
 Table 134. Canon Major Business
 Table 135. Canon Wafer Bonder and Debonder Product and Services
 Table 136. Canon Wafer Bonder and Debonder Production (Units), Price (K US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 137. Canon Recent Developments/Updates
 Table 138. Canon Competitive Strengths & Weaknesses
 Table 139. Global Key Players of Wafer Bonder and Debonder Upstream (Raw Materials)
 Table 140. Global Wafer Bonder and Debonder Typical Customers
 Table 141. Wafer Bonder and Debonder Typical Distributors


List of Figures
 Figure 1. Wafer Bonder and Debonder Picture
 Figure 2. World Wafer Bonder and Debonder Production Value: 2019 & 2023 & 2030, (USD Million)
 Figure 3. World Wafer Bonder and Debonder Production Value and Forecast (2019-2030) & (USD Million)
 Figure 4. World Wafer Bonder and Debonder Production (2019-2030) & (Units)
 Figure 5. World Wafer Bonder and Debonder Average Price (2019-2030) & (K US$/Unit)
 Figure 6. World Wafer Bonder and Debonder Production Value Market Share by Region (2019-2030)
 Figure 7. World Wafer Bonder and Debonder Production Market Share by Region (2019-2030)
 Figure 8. Europe Wafer Bonder and Debonder Production (2019-2030) & (Units)
 Figure 9. China Wafer Bonder and Debonder Production (2019-2030) & (Units)
 Figure 10. Japan Wafer Bonder and Debonder Production (2019-2030) & (Units)
 Figure 11. Wafer Bonder and Debonder Market Drivers
 Figure 12. Factors Affecting Demand
 Figure 13. World Wafer Bonder and Debonder Consumption (2019-2030) & (Units)
 Figure 14. World Wafer Bonder and Debonder Consumption Market Share by Region (2019-2030)
 Figure 15. United States Wafer Bonder and Debonder Consumption (2019-2030) & (Units)
 Figure 16. China Wafer Bonder and Debonder Consumption (2019-2030) & (Units)
 Figure 17. Europe Wafer Bonder and Debonder Consumption (2019-2030) & (Units)
 Figure 18. Japan Wafer Bonder and Debonder Consumption (2019-2030) & (Units)
 Figure 19. South Korea Wafer Bonder and Debonder Consumption (2019-2030) & (Units)
 Figure 20. ASEAN Wafer Bonder and Debonder Consumption (2019-2030) & (Units)
 Figure 21. India Wafer Bonder and Debonder Consumption (2019-2030) & (Units)
 Figure 22. Producer Shipments of Wafer Bonder and Debonder by Manufacturer Revenue ($MM) and Market Share (%): 2023
 Figure 23. Global Four-firm Concentration Ratios (CR4) for Wafer Bonder and Debonder Markets in 2023
 Figure 24. Global Four-firm Concentration Ratios (CR8) for Wafer Bonder and Debonder Markets in 2023
 Figure 25. United States VS China: Wafer Bonder and Debonder Production Value Market Share Comparison (2019 & 2023 & 2030)
 Figure 26. United States VS China: Wafer Bonder and Debonder Production Market Share Comparison (2019 & 2023 & 2030)
 Figure 27. United States VS China: Wafer Bonder and Debonder Consumption Market Share Comparison (2019 & 2023 & 2030)
 Figure 28. United States Based Manufacturers Wafer Bonder and Debonder Production Market Share 2023
 Figure 29. China Based Manufacturers Wafer Bonder and Debonder Production Market Share 2023
 Figure 30. Rest of World Based Manufacturers Wafer Bonder and Debonder Production Market Share 2023
 Figure 31. World Wafer Bonder and Debonder Production Value by Type, (USD Million), 2019 & 2023 & 2030
 Figure 32. World Wafer Bonder and Debonder Production Value Market Share by Type in 2023
 Figure 33. Fully Automatic
 Figure 34. Semi Automatic
 Figure 35. World Wafer Bonder and Debonder Production Market Share by Type (2019-2030)
 Figure 36. World Wafer Bonder and Debonder Production Value Market Share by Type (2019-2030)
 Figure 37. World Wafer Bonder and Debonder Average Price by Type (2019-2030) & (K US$/Unit)
 Figure 38. World Wafer Bonder and Debonder Production Value by Application, (USD Million), 2019 & 2023 & 2030
 Figure 39. World Wafer Bonder and Debonder Production Value Market Share by Application in 2023
 Figure 40. MEMS
 Figure 41. Advanced Packaging
 Figure 42. CIS
 Figure 43. Others
 Figure 44. World Wafer Bonder and Debonder Production Market Share by Application (2019-2030)
 Figure 45. World Wafer Bonder and Debonder Production Value Market Share by Application (2019-2030)
 Figure 46. World Wafer Bonder and Debonder Average Price by Application (2019-2030) & (K US$/Unit)
 Figure 47. Wafer Bonder and Debonder Industry Chain
 Figure 48. Wafer Bonder and Debonder Procurement Model
 Figure 49. Wafer Bonder and Debonder Sales Model
 Figure 50. Wafer Bonder and Debonder Sales Channels, Direct Sales, and Distribution
 Figure 51. Methodology
 Figure 52. Research Process and Data Source

Companies Mentioned

EV Group
SUSS MicroTec
Tokyo Electron
Applied Microengineering
Nidec Machine Tool
Ayumi Industry
Bondtech
Aimechatec
U-Precision Tech
TAZMO
Hutem
Shanghai Micro Electronics
Canon