Global Flip Chip Bonder Supply, Demand and Key Producers, 2024-2030
Page: 100
Published Date: 09 Feb 2024
Category: Machinery & Equipment
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Description
Table of Contents
Table of Figures
Research Methodology
Companies Mentioned
Related Reports
Product Tags
Table of Contents
Table of Figures
Research Methodology
Companies Mentioned
Related Reports
Product Tags
Description
The global Flip Chip Bonder market size is expected to reach $ 323.2 million by 2030, rising at a market growth of 1.1% CAGR during the forecast period (2024-2030).
Global Flip Chip Bonder key players include Besi, ASM Pacific Technology, Shibaura, Kulicke & Soffa, etc. Global top four manufacturers hold a share nearly 70%.
China is the largest market, with a share about 25%, followed by United States, and Taiwan, both have a share about 30 percent.
In terms of product, Fully Automatic is the largest segment, with a share over 75%. And in terms of application, the largest application is IDMs, followed by OSAT.
Flip chip is a method used for components or devices that can be bonded directly onto a substrate, board or carrier face-down. The connection is made through conductive bumps placed on the surface of the die. The placing process amounts to the following:
1. Die is picked up and place on a "flipping device"
2. Die is "flipped" and moved to hover over the substrate (or board or carrier) where bumps reside - precisely positioned in their previously defined positions
3. The tool then places the die on the bump with a programmed amount of force
Flip chip bumping is a vital step to the process. The bump provides the necessary electrical connection between the die and the substrate, provides thermal conduction through the two materials, acts as a "spacer" to prevent electrical shorts and provides mechanical support.
Flip chips avoid wire bonding and therefore are able to be much smaller than their counterparts. Flip chip processes have been around for more than 40 years. Since then, thousands of applications have taken advantage of the size and cost benefits enabled by the flip chip assembly method.
This report studies the global Flip Chip Bonder production, demand, key manufacturers, and key regions.
This report is a detailed and comprehensive analysis of the world market for Flip Chip Bonder, and provides market size (US$ million) and Year-over-Year (YoY) Growth, considering 2023 as the base year. This report explores demand trends and competition, as well as details the characteristics of Flip Chip Bonder that contribute to its increasing demand across many markets.
Highlights and key features of the study
Global Flip Chip Bonder total production and demand, 2019-2030, (Units)
Global Flip Chip Bonder total production value, 2019-2030, (USD Million)
Global Flip Chip Bonder production by region & country, production, value, CAGR, 2019-2030, (USD Million) & (Units)
Global Flip Chip Bonder consumption by region & country, CAGR, 2019-2030 & (Units)
U.S. VS China: Flip Chip Bonder domestic production, consumption, key domestic manufacturers and share
Global Flip Chip Bonder production by manufacturer, production, price, value and market share 2019-2024, (USD Million) & (Units)
Global Flip Chip Bonder production by Type, production, value, CAGR, 2019-2030, (USD Million) & (Units)
Global Flip Chip Bonder production by Application production, value, CAGR, 2019-2030, (USD Million) & (Units).
This reports profiles key players in the global Flip Chip Bonder market based on the following parameters – company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include BESI, ASMPT, Shibaura, Muehlbauer, K&S, Hamni, AMICRA Microtechnologies, SET and Athlete FA, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World Flip Chip Bonder market.
Detailed Segmentation:
Each section contains quantitative market data including market by value (US$ Millions), volume (production, consumption) & (Units) and average price (K USD/Unit) by manufacturer, by Type, and by Application. Data is given for the years 2019-2030 by year with 2023 as the base year, 2024 as the estimate year, and 2025-2030 as the forecast year.
Global Flip Chip Bonder Market, By Region:
United States
China
Europe
Japan
South Korea
ASEAN
India
Rest of World
Global Flip Chip Bonder Market, Segmentation by Type
Fully Automatic
Semi-Automatic
Global Flip Chip Bonder Market, Segmentation by Application
IDMs
OSAT
Companies Profiled:
BESI
ASMPT
Shibaura
Muehlbauer
K&S
Hamni
AMICRA Microtechnologies
SET
Athlete FA
Key Questions Answered
1. How big is the global Flip Chip Bonder market?
2. What is the demand of the global Flip Chip Bonder market?
3. What is the year over year growth of the global Flip Chip Bonder market?
4. What is the production and production value of the global Flip Chip Bonder market?
5. Who are the key producers in the global Flip Chip Bonder market?
Table of Contents
1 Supply Summary
1.1 Flip Chip Bonder Introduction
1.2 World Flip Chip Bonder Supply & Forecast
1.2.1 World Flip Chip Bonder Production Value (2019 & 2023 & 2030)
1.2.2 World Flip Chip Bonder Production (2019-2030)
1.2.3 World Flip Chip Bonder Pricing Trends (2019-2030)
1.3 World Flip Chip Bonder Production by Region (Based on Production Site)
1.3.1 World Flip Chip Bonder Production Value by Region (2019-2030)
1.3.2 World Flip Chip Bonder Production by Region (2019-2030)
1.3.3 World Flip Chip Bonder Average Price by Region (2019-2030)
1.3.4 North America Flip Chip Bonder Production (2019-2030)
1.3.5 Europe Flip Chip Bonder Production (2019-2030)
1.3.6 China Flip Chip Bonder Production (2019-2030)
1.3.7 Japan Flip Chip Bonder Production (2019-2030)
1.3.8 South Korea Flip Chip Bonder Production (2019-2030)
1.3.9 Singapore Flip Chip Bonder Production (2019-2030)
1.4 Market Drivers, Restraints and Trends
1.4.1 Flip Chip Bonder Market Drivers
1.4.2 Factors Affecting Demand
1.4.3 Flip Chip Bonder Major Market Trends
2.1 World Flip Chip Bonder Demand (2019-2030)
2.2 World Flip Chip Bonder Consumption by Region
2.2.1 World Flip Chip Bonder Consumption by Region (2019-2024)
2.2.2 World Flip Chip Bonder Consumption Forecast by Region (2025-2030)
2.3 United States Flip Chip Bonder Consumption (2019-2030)
2.4 China Flip Chip Bonder Consumption (2019-2030)
2.5 Europe Flip Chip Bonder Consumption (2019-2030)
2.6 Japan Flip Chip Bonder Consumption (2019-2030)
2.7 South Korea Flip Chip Bonder Consumption (2019-2030)
2.8 ASEAN Flip Chip Bonder Consumption (2019-2030)
2.9 India Flip Chip Bonder Consumption (2019-2030)
3.1 World Flip Chip Bonder Production Value by Manufacturer (2019-2024)
3.2 World Flip Chip Bonder Production by Manufacturer (2019-2024)
3.3 World Flip Chip Bonder Average Price by Manufacturer (2019-2024)
3.4 Flip Chip Bonder Company Evaluation Quadrant
3.5 Industry Rank and Concentration Rate (CR)
3.5.1 Global Flip Chip Bonder Industry Rank of Major Manufacturers
3.5.2 Global Concentration Ratios (CR4) for Flip Chip Bonder in 2023
3.5.3 Global Concentration Ratios (CR8) for Flip Chip Bonder in 2023
3.6 Flip Chip Bonder Market: Overall Company Footprint Analysis
3.6.1 Flip Chip Bonder Market: Region Footprint
3.6.2 Flip Chip Bonder Market: Company Product Type Footprint
3.6.3 Flip Chip Bonder Market: Company Product Application Footprint
3.7 Competitive Environment
3.7.1 Historical Structure of the Industry
3.7.2 Barriers of Market Entry
3.7.3 Factors of Competition
3.8 New Entrant and Capacity Expansion Plans
3.9 Mergers, Acquisition, Agreements, and Collaborations
4.1 United States VS China: Flip Chip Bonder Production Value Comparison
4.1.1 United States VS China: Flip Chip Bonder Production Value Comparison (2019 & 2023 & 2030)
4.1.2 United States VS China: Flip Chip Bonder Production Value Market Share Comparison (2019 & 2023 & 2030)
4.2 United States VS China: Flip Chip Bonder Production Comparison
4.2.1 United States VS China: Flip Chip Bonder Production Comparison (2019 & 2023 & 2030)
4.2.2 United States VS China: Flip Chip Bonder Production Market Share Comparison (2019 & 2023 & 2030)
4.3 United States VS China: Flip Chip Bonder Consumption Comparison
4.3.1 United States VS China: Flip Chip Bonder Consumption Comparison (2019 & 2023 & 2030)
4.3.2 United States VS China: Flip Chip Bonder Consumption Market Share Comparison (2019 & 2023 & 2030)
4.4 United States Based Flip Chip Bonder Manufacturers and Market Share, 2019-2024
4.4.1 United States Based Flip Chip Bonder Manufacturers, Headquarters and Production Site (States, Country)
4.4.2 United States Based Manufacturers Flip Chip Bonder Production Value (2019-2024)
4.4.3 United States Based Manufacturers Flip Chip Bonder Production (2019-2024)
4.5 China Based Flip Chip Bonder Manufacturers and Market Share
4.5.1 China Based Flip Chip Bonder Manufacturers, Headquarters and Production Site (Province, Country)
4.5.2 China Based Manufacturers Flip Chip Bonder Production Value (2019-2024)
4.5.3 China Based Manufacturers Flip Chip Bonder Production (2019-2024)
4.6 Rest of World Based Flip Chip Bonder Manufacturers and Market Share, 2019-2024
4.6.1 Rest of World Based Flip Chip Bonder Manufacturers, Headquarters and Production Site (State, Country)
4.6.2 Rest of World Based Manufacturers Flip Chip Bonder Production Value (2019-2024)
4.6.3 Rest of World Based Manufacturers Flip Chip Bonder Production (2019-2024)
5.1 World Flip Chip Bonder Market Size Overview by Type: 2019 VS 2023 VS 2030
5.2 Segment Introduction by Type
5.2.1 Fully Automatic
5.2.2 Semi-Automatic
5.3 Market Segment by Type
5.3.1 World Flip Chip Bonder Production by Type (2019-2030)
5.3.2 World Flip Chip Bonder Production Value by Type (2019-2030)
5.3.3 World Flip Chip Bonder Average Price by Type (2019-2030)
6.1 World Flip Chip Bonder Market Size Overview by Application: 2019 VS 2023 VS 2030
6.2 Segment Introduction by Application
6.2.1 IDMs
6.2.2 OSAT
6.3 Market Segment by Application
6.3.1 World Flip Chip Bonder Production by Application (2019-2030)
6.3.2 World Flip Chip Bonder Production Value by Application (2019-2030)
6.3.3 World Flip Chip Bonder Average Price by Application (2019-2030)
7.1 BESI
7.1.1 BESI Details
7.1.2 BESI Major Business
7.1.3 BESI Flip Chip Bonder Product and Services
7.1.4 BESI Flip Chip Bonder Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.1.5 BESI Recent Developments/Updates
7.1.6 BESI Competitive Strengths & Weaknesses
7.2 ASMPT
7.2.1 ASMPT Details
7.2.2 ASMPT Major Business
7.2.3 ASMPT Flip Chip Bonder Product and Services
7.2.4 ASMPT Flip Chip Bonder Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.2.5 ASMPT Recent Developments/Updates
7.2.6 ASMPT Competitive Strengths & Weaknesses
7.3 Shibaura
7.3.1 Shibaura Details
7.3.2 Shibaura Major Business
7.3.3 Shibaura Flip Chip Bonder Product and Services
7.3.4 Shibaura Flip Chip Bonder Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.3.5 Shibaura Recent Developments/Updates
7.3.6 Shibaura Competitive Strengths & Weaknesses
7.4 Muehlbauer
7.4.1 Muehlbauer Details
7.4.2 Muehlbauer Major Business
7.4.3 Muehlbauer Flip Chip Bonder Product and Services
7.4.4 Muehlbauer Flip Chip Bonder Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.4.5 Muehlbauer Recent Developments/Updates
7.4.6 Muehlbauer Competitive Strengths & Weaknesses
7.5 K&S
7.5.1 K&S Details
7.5.2 K&S Major Business
7.5.3 K&S Flip Chip Bonder Product and Services
7.5.4 K&S Flip Chip Bonder Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.5.5 K&S Recent Developments/Updates
7.5.6 K&S Competitive Strengths & Weaknesses
7.6 Hamni
7.6.1 Hamni Details
7.6.2 Hamni Major Business
7.6.3 Hamni Flip Chip Bonder Product and Services
7.6.4 Hamni Flip Chip Bonder Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.6.5 Hamni Recent Developments/Updates
7.6.6 Hamni Competitive Strengths & Weaknesses
7.7 AMICRA Microtechnologies
7.7.1 AMICRA Microtechnologies Details
7.7.2 AMICRA Microtechnologies Major Business
7.7.3 AMICRA Microtechnologies Flip Chip Bonder Product and Services
7.7.4 AMICRA Microtechnologies Flip Chip Bonder Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.7.5 AMICRA Microtechnologies Recent Developments/Updates
7.7.6 AMICRA Microtechnologies Competitive Strengths & Weaknesses
7.8 SET
7.8.1 SET Details
7.8.2 SET Major Business
7.8.3 SET Flip Chip Bonder Product and Services
7.8.4 SET Flip Chip Bonder Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.8.5 SET Recent Developments/Updates
7.8.6 SET Competitive Strengths & Weaknesses
7.9 Athlete FA
7.9.1 Athlete FA Details
7.9.2 Athlete FA Major Business
7.9.3 Athlete FA Flip Chip Bonder Product and Services
7.9.4 Athlete FA Flip Chip Bonder Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.9.5 Athlete FA Recent Developments/Updates
7.9.6 Athlete FA Competitive Strengths & Weaknesses
8.1 Flip Chip Bonder Industry Chain
8.2 Flip Chip Bonder Upstream Analysis
8.2.1 Flip Chip Bonder Core Raw Materials
8.2.2 Main Manufacturers of Flip Chip Bonder Core Raw Materials
8.3 Midstream Analysis
8.4 Downstream Analysis
8.5 Flip Chip Bonder Production Mode
8.6 Flip Chip Bonder Procurement Model
8.7 Flip Chip Bonder Industry Sales Model and Sales Channels
8.7.1 Flip Chip Bonder Sales Model
8.7.2 Flip Chip Bonder Typical Customers
10.1 Methodology
10.2 Research Process and Data Source
10.3 Disclaimer
Table of Figures
List of Tables
Table 1. World Flip Chip Bonder Production Value by Region (2019, 2023 and 2030) & (USD Million)
Table 2. World Flip Chip Bonder Production Value by Region (2019-2024) & (USD Million)
Table 3. World Flip Chip Bonder Production Value by Region (2025-2030) & (USD Million)
Table 4. World Flip Chip Bonder Production Value Market Share by Region (2019-2024)
Table 5. World Flip Chip Bonder Production Value Market Share by Region (2025-2030)
Table 6. World Flip Chip Bonder Production by Region (2019-2024) & (Units)
Table 7. World Flip Chip Bonder Production by Region (2025-2030) & (Units)
Table 8. World Flip Chip Bonder Production Market Share by Region (2019-2024)
Table 9. World Flip Chip Bonder Production Market Share by Region (2025-2030)
Table 10. World Flip Chip Bonder Average Price by Region (2019-2024) & (K USD/Unit)
Table 11. World Flip Chip Bonder Average Price by Region (2025-2030) & (K USD/Unit)
Table 12. Flip Chip Bonder Major Market Trends
Table 13. World Flip Chip Bonder Consumption Growth Rate Forecast by Region (2019 & 2023 & 2030) & (Units)
Table 14. World Flip Chip Bonder Consumption by Region (2019-2024) & (Units)
Table 15. World Flip Chip Bonder Consumption Forecast by Region (2025-2030) & (Units)
Table 16. World Flip Chip Bonder Production Value by Manufacturer (2019-2024) & (USD Million)
Table 17. Production Value Market Share of Key Flip Chip Bonder Producers in 2023
Table 18. World Flip Chip Bonder Production by Manufacturer (2019-2024) & (Units)
Table 19. Production Market Share of Key Flip Chip Bonder Producers in 2023
Table 20. World Flip Chip Bonder Average Price by Manufacturer (2019-2024) & (K USD/Unit)
Table 21. Global Flip Chip Bonder Company Evaluation Quadrant
Table 22. World Flip Chip Bonder Industry Rank of Major Manufacturers, Based on Production Value in 2023
Table 23. Head Office and Flip Chip Bonder Production Site of Key Manufacturer
Table 24. Flip Chip Bonder Market: Company Product Type Footprint
Table 25. Flip Chip Bonder Market: Company Product Application Footprint
Table 26. Flip Chip Bonder Competitive Factors
Table 27. Flip Chip Bonder New Entrant and Capacity Expansion Plans
Table 28. Flip Chip Bonder Mergers & Acquisitions Activity
Table 29. United States VS China Flip Chip Bonder Production Value Comparison, (2019 & 2023 & 2030) & (USD Million)
Table 30. United States VS China Flip Chip Bonder Production Comparison, (2019 & 2023 & 2030) & (Units)
Table 31. United States VS China Flip Chip Bonder Consumption Comparison, (2019 & 2023 & 2030) & (Units)
Table 32. United States Based Flip Chip Bonder Manufacturers, Headquarters and Production Site (States, Country)
Table 33. United States Based Manufacturers Flip Chip Bonder Production Value, (2019-2024) & (USD Million)
Table 34. United States Based Manufacturers Flip Chip Bonder Production Value Market Share (2019-2024)
Table 35. United States Based Manufacturers Flip Chip Bonder Production (2019-2024) & (Units)
Table 36. United States Based Manufacturers Flip Chip Bonder Production Market Share (2019-2024)
Table 37. China Based Flip Chip Bonder Manufacturers, Headquarters and Production Site (Province, Country)
Table 38. China Based Manufacturers Flip Chip Bonder Production Value, (2019-2024) & (USD Million)
Table 39. China Based Manufacturers Flip Chip Bonder Production Value Market Share (2019-2024)
Table 40. China Based Manufacturers Flip Chip Bonder Production (2019-2024) & (Units)
Table 41. China Based Manufacturers Flip Chip Bonder Production Market Share (2019-2024)
Table 42. Rest of World Based Flip Chip Bonder Manufacturers, Headquarters and Production Site (States, Country)
Table 43. Rest of World Based Manufacturers Flip Chip Bonder Production Value, (2019-2024) & (USD Million)
Table 44. Rest of World Based Manufacturers Flip Chip Bonder Production Value Market Share (2019-2024)
Table 45. Rest of World Based Manufacturers Flip Chip Bonder Production (2019-2024) & (Units)
Table 46. Rest of World Based Manufacturers Flip Chip Bonder Production Market Share (2019-2024)
Table 47. World Flip Chip Bonder Production Value by Type, (USD Million), 2019 & 2023 & 2030
Table 48. World Flip Chip Bonder Production by Type (2019-2024) & (Units)
Table 49. World Flip Chip Bonder Production by Type (2025-2030) & (Units)
Table 50. World Flip Chip Bonder Production Value by Type (2019-2024) & (USD Million)
Table 51. World Flip Chip Bonder Production Value by Type (2025-2030) & (USD Million)
Table 52. World Flip Chip Bonder Average Price by Type (2019-2024) & (K USD/Unit)
Table 53. World Flip Chip Bonder Average Price by Type (2025-2030) & (K USD/Unit)
Table 54. World Flip Chip Bonder Production Value by Application, (USD Million), 2019 & 2023 & 2030
Table 55. World Flip Chip Bonder Production by Application (2019-2024) & (Units)
Table 56. World Flip Chip Bonder Production by Application (2025-2030) & (Units)
Table 57. World Flip Chip Bonder Production Value by Application (2019-2024) & (USD Million)
Table 58. World Flip Chip Bonder Production Value by Application (2025-2030) & (USD Million)
Table 59. World Flip Chip Bonder Average Price by Application (2019-2024) & (K USD/Unit)
Table 60. World Flip Chip Bonder Average Price by Application (2025-2030) & (K USD/Unit)
Table 61. BESI Basic Information, Manufacturing Base and Competitors
Table 62. BESI Major Business
Table 63. BESI Flip Chip Bonder Product and Services
Table 64. BESI Flip Chip Bonder Production (Units), Price (K USD/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 65. BESI Recent Developments/Updates
Table 66. BESI Competitive Strengths & Weaknesses
Table 67. ASMPT Basic Information, Manufacturing Base and Competitors
Table 68. ASMPT Major Business
Table 69. ASMPT Flip Chip Bonder Product and Services
Table 70. ASMPT Flip Chip Bonder Production (Units), Price (K USD/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 71. ASMPT Recent Developments/Updates
Table 72. ASMPT Competitive Strengths & Weaknesses
Table 73. Shibaura Basic Information, Manufacturing Base and Competitors
Table 74. Shibaura Major Business
Table 75. Shibaura Flip Chip Bonder Product and Services
Table 76. Shibaura Flip Chip Bonder Production (Units), Price (K USD/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 77. Shibaura Recent Developments/Updates
Table 78. Shibaura Competitive Strengths & Weaknesses
Table 79. Muehlbauer Basic Information, Manufacturing Base and Competitors
Table 80. Muehlbauer Major Business
Table 81. Muehlbauer Flip Chip Bonder Product and Services
Table 82. Muehlbauer Flip Chip Bonder Production (Units), Price (K USD/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 83. Muehlbauer Recent Developments/Updates
Table 84. Muehlbauer Competitive Strengths & Weaknesses
Table 85. K&S Basic Information, Manufacturing Base and Competitors
Table 86. K&S Major Business
Table 87. K&S Flip Chip Bonder Product and Services
Table 88. K&S Flip Chip Bonder Production (Units), Price (K USD/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 89. K&S Recent Developments/Updates
Table 90. K&S Competitive Strengths & Weaknesses
Table 91. Hamni Basic Information, Manufacturing Base and Competitors
Table 92. Hamni Major Business
Table 93. Hamni Flip Chip Bonder Product and Services
Table 94. Hamni Flip Chip Bonder Production (Units), Price (K USD/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 95. Hamni Recent Developments/Updates
Table 96. Hamni Competitive Strengths & Weaknesses
Table 97. AMICRA Microtechnologies Basic Information, Manufacturing Base and Competitors
Table 98. AMICRA Microtechnologies Major Business
Table 99. AMICRA Microtechnologies Flip Chip Bonder Product and Services
Table 100. AMICRA Microtechnologies Flip Chip Bonder Production (Units), Price (K USD/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 101. AMICRA Microtechnologies Recent Developments/Updates
Table 102. AMICRA Microtechnologies Competitive Strengths & Weaknesses
Table 103. SET Basic Information, Manufacturing Base and Competitors
Table 104. SET Major Business
Table 105. SET Flip Chip Bonder Product and Services
Table 106. SET Flip Chip Bonder Production (Units), Price (K USD/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 107. SET Recent Developments/Updates
Table 108. Athlete FA Basic Information, Manufacturing Base and Competitors
Table 109. Athlete FA Major Business
Table 110. Athlete FA Flip Chip Bonder Product and Services
Table 111. Athlete FA Flip Chip Bonder Production (Units), Price (K USD/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 112. Global Key Players of Flip Chip Bonder Upstream (Raw Materials)
Table 113. Flip Chip Bonder Typical Customers
Table 114. Flip Chip Bonder Typical Distributors
List of Figure
Figure 1. Flip Chip Bonder Picture
Figure 2. World Flip Chip Bonder Production Value: 2019 & 2023 & 2030, (USD Million)
Figure 3. World Flip Chip Bonder Production Value and Forecast (2019-2030) & (USD Million)
Figure 4. World Flip Chip Bonder Production (2019-2030) & (Units)
Figure 5. World Flip Chip Bonder Average Price (2019-2030) & (K USD/Unit)
Figure 6. World Flip Chip Bonder Production Value Market Share by Region (2019-2030)
Figure 7. World Flip Chip Bonder Production Market Share by Region (2019-2030)
Figure 8. North America Flip Chip Bonder Production (2019-2030) & (Units)
Figure 9. Europe Flip Chip Bonder Production (2019-2030) & (Units)
Figure 10. China Flip Chip Bonder Production (2019-2030) & (Units)
Figure 11. Japan Flip Chip Bonder Production (2019-2030) & (Units)
Figure 12. South Korea Flip Chip Bonder Production (2019-2030) & (Units)
Figure 13. Singapore Flip Chip Bonder Production (2019-2030) & (Units)
Figure 14. Flip Chip Bonder Market Drivers
Figure 15. Factors Affecting Demand
Figure 16. World Flip Chip Bonder Consumption (2019-2030) & (Units)
Figure 17. World Flip Chip Bonder Consumption Market Share by Region (2019-2030)
Figure 18. United States Flip Chip Bonder Consumption (2019-2030) & (Units)
Figure 19. China Flip Chip Bonder Consumption (2019-2030) & (Units)
Figure 20. Europe Flip Chip Bonder Consumption (2019-2030) & (Units)
Figure 21. Japan Flip Chip Bonder Consumption (2019-2030) & (Units)
Figure 22. South Korea Flip Chip Bonder Consumption (2019-2030) & (Units)
Figure 23. ASEAN Flip Chip Bonder Consumption (2019-2030) & (Units)
Figure 24. India Flip Chip Bonder Consumption (2019-2030) & (Units)
Figure 25. Producer Shipments of Flip Chip Bonder by Manufacturer Revenue ($MM) and Market Share (%): 2023
Figure 26. Global Four-firm Concentration Ratios (CR4) for Flip Chip Bonder Markets in 2023
Figure 27. Global Four-firm Concentration Ratios (CR8) for Flip Chip Bonder Markets in 2023
Figure 28. United States VS China: Flip Chip Bonder Production Value Market Share Comparison (2019 & 2023 & 2030)
Figure 29. United States VS China: Flip Chip Bonder Production Market Share Comparison (2019 & 2023 & 2030)
Figure 30. United States VS China: Flip Chip Bonder Consumption Market Share Comparison (2019 & 2023 & 2030)
Figure 31. United States Based Manufacturers Flip Chip Bonder Production Market Share 2023
Figure 32. China Based Manufacturers Flip Chip Bonder Production Market Share 2023
Figure 33. Rest of World Based Manufacturers Flip Chip Bonder Production Market Share 2023
Figure 34. World Flip Chip Bonder Production Value by Type, (USD Million), 2019 & 2023 & 2030
Figure 35. World Flip Chip Bonder Production Value Market Share by Type in 2023
Figure 36. Fully Automatic
Figure 37. Semi-Automatic
Figure 38. World Flip Chip Bonder Production Market Share by Type (2019-2030)
Figure 39. World Flip Chip Bonder Production Value Market Share by Type (2019-2030)
Figure 40. World Flip Chip Bonder Average Price by Type (2019-2030) & (K USD/Unit)
Figure 41. World Flip Chip Bonder Production Value by Application, (USD Million), 2019 & 2023 & 2030
Figure 42. World Flip Chip Bonder Production Value Market Share by Application in 2023
Figure 43. IDMs
Figure 44. OSAT
Figure 45. World Flip Chip Bonder Production Market Share by Application (2019-2030)
Figure 46. World Flip Chip Bonder Production Value Market Share by Application (2019-2030)
Figure 47. World Flip Chip Bonder Average Price by Application (2019-2030) & (K USD/Unit)
Figure 48. Flip Chip Bonder Industry Chain
Figure 49. Flip Chip Bonder Procurement Model
Figure 50. Flip Chip Bonder Sales Model
Figure 51. Flip Chip Bonder Sales Channels, Direct Sales, and Distribution
Figure 52. Methodology
Figure 53. Research Process and Data Source
Research Methodology
Client Requirements
Review and analyze client requirements
Discussion of all the project requirements and queries
Flexibility Check
Project Feasibility Analysis
Finalizing tentative research programme
Structuring project proposal with scope, timeline, and costs
Analyzing Market Dynamics
Determination of key drivers, restraints, challenge, and opportunity
Identifies market needs and trends
Market Size Estimation & Forecast
Estimation of historical data based on secondary and primary data
Anticipating market recast by assigning weightage to market forces (drivers, restraints, opportunities)
Freezing historical and forecast market size estimations based on evolution, trends, outlook, and strategies
Consideration of geography, region-specific product/service demand for region segments
Consideration of product utilization rates, product demand outlook for segments by application or end-user.
Data Source
Secondary Source
Data collections from annual reports, presentations,associations, journals, analyst reports,
paid database, press releases, blogs, newsletters,and GIR repositories.
Primary Source
Research discussion with manufacturers, distributors, suppliers, end user, industry experts
to verify insights.
Validation
and
triangulation of
secondary and primary source.
Collection of data
Cumulating and collating the essential qualitative and quantitative data
Generation of report in client requested format by research analysts
Reviews by expert analysts
Final quality check
Clarifying queries
Receiving feedback
Ensuring satisfaction
01 Identification of data
This step involves identification of several primary and secondary data research sources, including Global Info Research's internal data sources. The primary sources consist of in-depth discussions and interviews with policy makers, industry experts, and data evaluators, whereas secondary sources include a thorough study of market journals, press releases, annual reports, and government and non-government agencies websites.
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02 Evaluation of Market Dynamic
This phase includes a detailed evaluation of several factors that are likely to affect the market dynamics. It involves a comprehensive assessment of major market pain points, drivers, and trends. It also comprises a detailed study of research plans and methodology.
-
03 Collection of Data
This process consists of gathering data, accessing proprietary databases, and reaching out to key industry participants that operate in the market across the value chain. It also involves studying several patterns in the historical data and comparing it with the current scenario.
-
04 Collaboration of Data
This stage involves the validation of data and arrival at actual statistics, and evolution of the market over the years. It entails the study and analyzes various segments and verticals of the market. An impact analysis is also performed to observe which factors will affect the market in the next few years.
05 Verification and Analysis
This is the final stage, which involves both quantity and quality checks. Although the process of data verification is an integral part of the research process, all data points and statistics and figures are re-checked to uphold their authenticity and validity.
Companies Mentioned
BESI ASMPT Shibaura Muehlbauer K&S Hamni AMICRA Microtechnologies SET Athlete FA
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