Global FC-BGA Package Substrates Supply, Demand and Key Producers, 2024-2030

Global FC-BGA Package Substrates Supply, Demand and Key Producers, 2024-2030

Page: 109

Published Date: 04 Jun 2024

Category: Electronics & Semiconductor

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  • sp_icon1 sp_icon1_b Description
  • sp_icon2 sp_icon2_b Table of Contents
  • sp_icon3 sp_icon3_b Table of Figures
  • sp_icon4 sp_icon4_b Research Methodology
  • sp_icon1 sp_icon1_b Companies Mentioned
  • sp_icon1 sp_icon1_b Related Reports
  • sp_icon1 sp_icon1_b Product Tags
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Description

The global FC-BGA Package Substrates market size is expected to reach $ million by 2030, rising at a market growth of %CAGR during the forecast period (2024-2030).

This report studies the global FC-BGA Package Substrates production, demand, key manufacturers, and key regions.

This report is a detailed and comprehensive analysis of the world market for FC-BGA Package Substrates and provides market size (US$ million) and Year-over-Year (YoY) Growth, considering 2023 as the base year. This report explores demand trends and competition, as well as details the characteristics of FC-BGA Package Substrates that contribute to its increasing demand across many markets.

Highlights and key features of the study
Global FC-BGA Package Substrates total production and demand, 2019-2030, (K Sqm)
Global FC-BGA Package Substrates total production value, 2019-2030, (USD Million)
Global FC-BGA Package Substrates production by region & country, production, value, CAGR, 2019-2030, (USD Million) & (K Sqm), (based on production site)
Global FC-BGA Package Substrates consumption by region & country, CAGR, 2019-2030 & (K Sqm)
U.S. VS China: FC-BGA Package Substrates domestic production, consumption, key domestic manufacturers and share
Global FC-BGA Package Substrates production by manufacturer, production, price, value and market share 2019-2024, (USD Million) & (K Sqm)
Global FC-BGA Package Substrates production by Type, production, value, CAGR, 2019-2030, (USD Million) & (K Sqm)
Global FC-BGA Package Substrates production by Application, production, value, CAGR, 2019-2030, (USD Million) & (K Sqm)
This report profiles key players in the global FC-BGA Package Substrates market based on the following parameters - company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include IBIDEN, SHINKO, Samsung Electronics, Unimicron, Nan Ya PCB, Shennan Circuits, Fastprint Circuit Tech, Tianhe Defense Technology, Zhuhai ACCESS, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World FC-BGA Package Substrates market
Detailed Segmentation:
Each section contains quantitative market data including market by value (US$ Millions), volume (production, consumption) & (K Sqm) and average price (US$/Sq m) by manufacturer, by Type, and by Application. Data is given for the years 2019-2030 by year with 2023 as the base year, 2024 as the estimate year, and 2025-2030 as the forecast year.

Global FC-BGA Package Substrates Market, By Region:
United States
China
Europe
Japan
South Korea
ASEAN
India
Rest of World

Global FC-BGA Package Substrates Market, Segmentation by Type:
0.4mm
0.5mm
0.6mm
Others

Global FC-BGA Package Substrates Market, Segmentation by Application:
Microprocessors
Graphics Processors
Baseband Chips
Others

Companies Profiled:
IBIDEN
SHINKO
Samsung Electronics
Unimicron
Nan Ya PCB
Shennan Circuits
Fastprint Circuit Tech
Tianhe Defense Technology
Zhuhai ACCESS

Key Questions Answered:
1. How big is the global FC-BGA Package Substrates market?
2. What is the demand of the global FC-BGA Package Substrates market?
3. What is the year over year growth of the global FC-BGA Package Substrates market?
4. What is the production and production value of the global FC-BGA Package Substrates market?
5. Who are the key producers in the global FC-BGA Package Substrates market?
6. What are the growth factors driving the market demand?
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Table of Contents

1 Supply Summary
1.1 FC-BGA Package Substrates Introduction
1.2 World FC-BGA Package Substrates Supply & Forecast
1.2.1 World FC-BGA Package Substrates Production Value (2019 & 2023 & 2030)
1.2.2 World FC-BGA Package Substrates Production (2019-2030)
1.2.3 World FC-BGA Package Substrates Pricing Trends (2019-2030)
1.3 World FC-BGA Package Substrates Production by Region (Based on Production Site)
1.3.1 World FC-BGA Package Substrates Production Value by Region (2019-2030)
1.3.2 World FC-BGA Package Substrates Production by Region (2019-2030)
1.3.3 World FC-BGA Package Substrates Average Price by Region (2019-2030)
1.3.4 China FC-BGA Package Substrates Production (2019-2030)
1.3.5 Japan FC-BGA Package Substrates Production (2019-2030)
1.3.6 South Korea FC-BGA Package Substrates Production (2019-2030)
1.3.7 China Taiwan FC-BGA Package Substrates Production (2019-2030)
1.4 Market Drivers, Restraints and Trends
1.4.1 FC-BGA Package Substrates Market Drivers
1.4.2 Factors Affecting Demand
1.4.3 FC-BGA Package Substrates Major Market Trends

2 Demand Summary
2.1 World FC-BGA Package Substrates Demand (2019-2030)
2.2 World FC-BGA Package Substrates Consumption by Region
2.2.1 World FC-BGA Package Substrates Consumption by Region (2019-2024)
2.2.2 World FC-BGA Package Substrates Consumption Forecast by Region (2025-2030)
2.3 United States FC-BGA Package Substrates Consumption (2019-2030)
2.4 China FC-BGA Package Substrates Consumption (2019-2030)
2.5 Europe FC-BGA Package Substrates Consumption (2019-2030)
2.6 Japan FC-BGA Package Substrates Consumption (2019-2030)
2.7 South Korea FC-BGA Package Substrates Consumption (2019-2030)
2.8 ASEAN FC-BGA Package Substrates Consumption (2019-2030)
2.9 India FC-BGA Package Substrates Consumption (2019-2030)

3 World Manufacturers Competitive Analysis
3.1 World FC-BGA Package Substrates Production Value by Manufacturer (2019-2024)
3.2 World FC-BGA Package Substrates Production by Manufacturer (2019-2024)
3.3 World FC-BGA Package Substrates Average Price by Manufacturer (2019-2024)
3.4 FC-BGA Package Substrates Company Evaluation Quadrant
3.5 Industry Rank and Concentration Rate (CR)
3.5.1 Global FC-BGA Package Substrates Industry Rank of Major Manufacturers
3.5.2 Global Concentration Ratios (CR4) for FC-BGA Package Substrates in 2023
3.5.3 Global Concentration Ratios (CR8) for FC-BGA Package Substrates in 2023
3.6 FC-BGA Package Substrates Market: Overall Company Footprint Analysis
3.6.1 FC-BGA Package Substrates Market: Region Footprint
3.6.2 FC-BGA Package Substrates Market: Company Product Type Footprint
3.6.3 FC-BGA Package Substrates Market: Company Product Application Footprint
3.7 Competitive Environment
3.7.1 Historical Structure of the Industry
3.7.2 Barriers of Market Entry
3.7.3 Factors of Competition
3.8 New Entrant and Capacity Expansion Plans
3.9 Mergers, Acquisition, Agreements, and Collaborations

4 United States VS China VS Rest of the World
4.1 United States VS China: FC-BGA Package Substrates Production Value Comparison
4.1.1 United States VS China: FC-BGA Package Substrates Production Value Comparison (2019 & 2023 & 2030)
4.1.2 United States VS China: FC-BGA Package Substrates Production Value Market Share Comparison (2019 & 2023 & 2030)
4.2 United States VS China: FC-BGA Package Substrates Production Comparison
4.2.1 United States VS China: FC-BGA Package Substrates Production Comparison (2019 & 2023 & 2030)
4.2.2 United States VS China: FC-BGA Package Substrates Production Market Share Comparison (2019 & 2023 & 2030)
4.3 United States VS China: FC-BGA Package Substrates Consumption Comparison
4.3.1 United States VS China: FC-BGA Package Substrates Consumption Comparison (2019 & 2023 & 2030)
4.3.2 United States VS China: FC-BGA Package Substrates Consumption Market Share Comparison (2019 & 2023 & 2030)
4.4 United States Based FC-BGA Package Substrates Manufacturers and Market Share, 2019-2024
4.4.1 United States Based FC-BGA Package Substrates Manufacturers, Headquarters and Production Site (States, Country)
4.4.2 United States Based Manufacturers FC-BGA Package Substrates Production Value (2019-2024)
4.4.3 United States Based Manufacturers FC-BGA Package Substrates Production (2019-2024)
4.5 China Based FC-BGA Package Substrates Manufacturers and Market Share
4.5.1 China Based FC-BGA Package Substrates Manufacturers, Headquarters and Production Site (Province, Country)
4.5.2 China Based Manufacturers FC-BGA Package Substrates Production Value (2019-2024)
4.5.3 China Based Manufacturers FC-BGA Package Substrates Production (2019-2024)
4.6 Rest of World Based FC-BGA Package Substrates Manufacturers and Market Share, 2019-2024
4.6.1 Rest of World Based FC-BGA Package Substrates Manufacturers, Headquarters and Production Site (State, Country)
4.6.2 Rest of World Based Manufacturers FC-BGA Package Substrates Production Value (2019-2024)
4.6.3 Rest of World Based Manufacturers FC-BGA Package Substrates Production (2019-2024)

5 Market Analysis by Type
5.1 World FC-BGA Package Substrates Market Size Overview by Type: 2019 VS 2023 VS 2030
5.2 Segment Introduction by Type
5.2.1 0.4mm
5.2.2 0.5mm
5.2.3 0.6mm
5.2.4 Others
5.3 Market Segment by Type
5.3.1 World FC-BGA Package Substrates Production by Type (2019-2030)
5.3.2 World FC-BGA Package Substrates Production Value by Type (2019-2030)
5.3.3 World FC-BGA Package Substrates Average Price by Type (2019-2030)

6 Market Analysis by Application
6.1 World FC-BGA Package Substrates Market Size Overview by Application: 2019 VS 2023 VS 2030
6.2 Segment Introduction by Application
6.2.1 Microprocessors
6.2.2 Graphics Processors
6.2.3 Baseband Chips
6.2.4 Others
6.3 Market Segment by Application
6.3.1 World FC-BGA Package Substrates Production by Application (2019-2030)
6.3.2 World FC-BGA Package Substrates Production Value by Application (2019-2030)
6.3.3 World FC-BGA Package Substrates Average Price by Application (2019-2030)

7 Company Profiles
7.1 IBIDEN
7.1.1 IBIDEN Details
7.1.2 IBIDEN Major Business
7.1.3 IBIDEN FC-BGA Package Substrates Product and Services
7.1.4 IBIDEN FC-BGA Package Substrates Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.1.5 IBIDEN Recent Developments/Updates
7.1.6 IBIDEN Competitive Strengths & Weaknesses
7.2 SHINKO
7.2.1 SHINKO Details
7.2.2 SHINKO Major Business
7.2.3 SHINKO FC-BGA Package Substrates Product and Services
7.2.4 SHINKO FC-BGA Package Substrates Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.2.5 SHINKO Recent Developments/Updates
7.2.6 SHINKO Competitive Strengths & Weaknesses
7.3 Samsung Electronics
7.3.1 Samsung Electronics Details
7.3.2 Samsung Electronics Major Business
7.3.3 Samsung Electronics FC-BGA Package Substrates Product and Services
7.3.4 Samsung Electronics FC-BGA Package Substrates Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.3.5 Samsung Electronics Recent Developments/Updates
7.3.6 Samsung Electronics Competitive Strengths & Weaknesses
7.4 Unimicron
7.4.1 Unimicron Details
7.4.2 Unimicron Major Business
7.4.3 Unimicron FC-BGA Package Substrates Product and Services
7.4.4 Unimicron FC-BGA Package Substrates Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.4.5 Unimicron Recent Developments/Updates
7.4.6 Unimicron Competitive Strengths & Weaknesses
7.5 Nan Ya PCB
7.5.1 Nan Ya PCB Details
7.5.2 Nan Ya PCB Major Business
7.5.3 Nan Ya PCB FC-BGA Package Substrates Product and Services
7.5.4 Nan Ya PCB FC-BGA Package Substrates Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.5.5 Nan Ya PCB Recent Developments/Updates
7.5.6 Nan Ya PCB Competitive Strengths & Weaknesses
7.6 Shennan Circuits
7.6.1 Shennan Circuits Details
7.6.2 Shennan Circuits Major Business
7.6.3 Shennan Circuits FC-BGA Package Substrates Product and Services
7.6.4 Shennan Circuits FC-BGA Package Substrates Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.6.5 Shennan Circuits Recent Developments/Updates
7.6.6 Shennan Circuits Competitive Strengths & Weaknesses
7.7 Fastprint Circuit Tech
7.7.1 Fastprint Circuit Tech Details
7.7.2 Fastprint Circuit Tech Major Business
7.7.3 Fastprint Circuit Tech FC-BGA Package Substrates Product and Services
7.7.4 Fastprint Circuit Tech FC-BGA Package Substrates Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.7.5 Fastprint Circuit Tech Recent Developments/Updates
7.7.6 Fastprint Circuit Tech Competitive Strengths & Weaknesses
7.8 Tianhe Defense Technology
7.8.1 Tianhe Defense Technology Details
7.8.2 Tianhe Defense Technology Major Business
7.8.3 Tianhe Defense Technology FC-BGA Package Substrates Product and Services
7.8.4 Tianhe Defense Technology FC-BGA Package Substrates Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.8.5 Tianhe Defense Technology Recent Developments/Updates
7.8.6 Tianhe Defense Technology Competitive Strengths & Weaknesses
7.9 Zhuhai ACCESS
7.9.1 Zhuhai ACCESS Details
7.9.2 Zhuhai ACCESS Major Business
7.9.3 Zhuhai ACCESS FC-BGA Package Substrates Product and Services
7.9.4 Zhuhai ACCESS FC-BGA Package Substrates Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.9.5 Zhuhai ACCESS Recent Developments/Updates
7.9.6 Zhuhai ACCESS Competitive Strengths & Weaknesses

8 Industry Chain Analysis
8.1 FC-BGA Package Substrates Industry Chain
8.2 FC-BGA Package Substrates Upstream Analysis
8.2.1 FC-BGA Package Substrates Core Raw Materials
8.2.2 Main Manufacturers of FC-BGA Package Substrates Core Raw Materials
8.3 Midstream Analysis
8.4 Downstream Analysis
8.5 FC-BGA Package Substrates Production Mode
8.6 FC-BGA Package Substrates Procurement Model
8.7 FC-BGA Package Substrates Industry Sales Model and Sales Channels
8.7.1 FC-BGA Package Substrates Sales Model
8.7.2 FC-BGA Package Substrates Typical Distributors

9 Research Findings and Conclusion

10 Appendix
10.1 Methodology
10.2 Research Process and Data Source
10.3 Disclaimer
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Table of Figures

List of Tables
Table 1. World FC-BGA Package Substrates Production Value by Region (2019, 2023 and 2030) & (USD Million)
Table 2. World FC-BGA Package Substrates Production Value by Region (2019-2024) & (USD Million)
Table 3. World FC-BGA Package Substrates Production Value by Region (2025-2030) & (USD Million)
Table 4. World FC-BGA Package Substrates Production Value Market Share by Region (2019-2024)
Table 5. World FC-BGA Package Substrates Production Value Market Share by Region (2025-2030)
Table 6. World FC-BGA Package Substrates Production by Region (2019-2024) & (K Sqm)
Table 7. World FC-BGA Package Substrates Production by Region (2025-2030) & (K Sqm)
Table 8. World FC-BGA Package Substrates Production Market Share by Region (2019-2024)
Table 9. World FC-BGA Package Substrates Production Market Share by Region (2025-2030)
Table 10. World FC-BGA Package Substrates Average Price by Region (2019-2024) & (US$/Sq m)
Table 11. World FC-BGA Package Substrates Average Price by Region (2025-2030) & (US$/Sq m)
Table 12. FC-BGA Package Substrates Major Market Trends
Table 13. World FC-BGA Package Substrates Consumption Growth Rate Forecast by Region (2019 & 2023 & 2030) & (K Sqm)
Table 14. World FC-BGA Package Substrates Consumption by Region (2019-2024) & (K Sqm)
Table 15. World FC-BGA Package Substrates Consumption Forecast by Region (2025-2030) & (K Sqm)
Table 16. World FC-BGA Package Substrates Production Value by Manufacturer (2019-2024) & (USD Million)
Table 17. Production Value Market Share of Key FC-BGA Package Substrates Producers in 2023
Table 18. World FC-BGA Package Substrates Production by Manufacturer (2019-2024) & (K Sqm)
Table 19. Production Market Share of Key FC-BGA Package Substrates Producers in 2023
Table 20. World FC-BGA Package Substrates Average Price by Manufacturer (2019-2024) & (US$/Sq m)
Table 21. Global FC-BGA Package Substrates Company Evaluation Quadrant
Table 22. World FC-BGA Package Substrates Industry Rank of Major Manufacturers, Based on Production Value in 2023
Table 23. Head Office and FC-BGA Package Substrates Production Site of Key Manufacturer
Table 24. FC-BGA Package Substrates Market: Company Product Type Footprint
Table 25. FC-BGA Package Substrates Market: Company Product Application Footprint
Table 26. FC-BGA Package Substrates Competitive Factors
Table 27. FC-BGA Package Substrates New Entrant and Capacity Expansion Plans
Table 28. FC-BGA Package Substrates Mergers & Acquisitions Activity
Table 29. United States VS China FC-BGA Package Substrates Production Value Comparison, (2019 & 2023 & 2030) & (USD Million)
Table 30. United States VS China FC-BGA Package Substrates Production Comparison, (2019 & 2023 & 2030) & (K Sqm)
Table 31. United States VS China FC-BGA Package Substrates Consumption Comparison, (2019 & 2023 & 2030) & (K Sqm)
Table 32. United States Based FC-BGA Package Substrates Manufacturers, Headquarters and Production Site (States, Country)
Table 33. United States Based Manufacturers FC-BGA Package Substrates Production Value, (2019-2024) & (USD Million)
Table 34. United States Based Manufacturers FC-BGA Package Substrates Production Value Market Share (2019-2024)
Table 35. United States Based Manufacturers FC-BGA Package Substrates Production (2019-2024) & (K Sqm)
Table 36. United States Based Manufacturers FC-BGA Package Substrates Production Market Share (2019-2024)
Table 37. China Based FC-BGA Package Substrates Manufacturers, Headquarters and Production Site (Province, Country)
Table 38. China Based Manufacturers FC-BGA Package Substrates Production Value, (2019-2024) & (USD Million)
Table 39. China Based Manufacturers FC-BGA Package Substrates Production Value Market Share (2019-2024)
Table 40. China Based Manufacturers FC-BGA Package Substrates Production, (2019-2024) & (K Sqm)
Table 41. China Based Manufacturers FC-BGA Package Substrates Production Market Share (2019-2024)
Table 42. Rest of World Based FC-BGA Package Substrates Manufacturers, Headquarters and Production Site (State, Country)
Table 43. Rest of World Based Manufacturers FC-BGA Package Substrates Production Value, (2019-2024) & (USD Million)
Table 44. Rest of World Based Manufacturers FC-BGA Package Substrates Production Value Market Share (2019-2024)
Table 45. Rest of World Based Manufacturers FC-BGA Package Substrates Production, (2019-2024) & (K Sqm)
Table 46. Rest of World Based Manufacturers FC-BGA Package Substrates Production Market Share (2019-2024)
Table 47. World FC-BGA Package Substrates Production Value by Type, (USD Million), 2019 & 2023 & 2030
Table 48. World FC-BGA Package Substrates Production by Type (2019-2024) & (K Sqm)
Table 49. World FC-BGA Package Substrates Production by Type (2025-2030) & (K Sqm)
Table 50. World FC-BGA Package Substrates Production Value by Type (2019-2024) & (USD Million)
Table 51. World FC-BGA Package Substrates Production Value by Type (2025-2030) & (USD Million)
Table 52. World FC-BGA Package Substrates Average Price by Type (2019-2024) & (US$/Sq m)
Table 53. World FC-BGA Package Substrates Average Price by Type (2025-2030) & (US$/Sq m)
Table 54. World FC-BGA Package Substrates Production Value by Application, (USD Million), 2019 & 2023 & 2030
Table 55. World FC-BGA Package Substrates Production by Application (2019-2024) & (K Sqm)
Table 56. World FC-BGA Package Substrates Production by Application (2025-2030) & (K Sqm)
Table 57. World FC-BGA Package Substrates Production Value by Application (2019-2024) & (USD Million)
Table 58. World FC-BGA Package Substrates Production Value by Application (2025-2030) & (USD Million)
Table 59. World FC-BGA Package Substrates Average Price by Application (2019-2024) & (US$/Sq m)
Table 60. World FC-BGA Package Substrates Average Price by Application (2025-2030) & (US$/Sq m)
Table 61. IBIDEN Basic Information, Manufacturing Base and Competitors
Table 62. IBIDEN Major Business
Table 63. IBIDEN FC-BGA Package Substrates Product and Services
Table 64. IBIDEN FC-BGA Package Substrates Production (K Sqm), Price (US$/Sq m), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 65. IBIDEN Recent Developments/Updates
Table 66. IBIDEN Competitive Strengths & Weaknesses
Table 67. SHINKO Basic Information, Manufacturing Base and Competitors
Table 68. SHINKO Major Business
Table 69. SHINKO FC-BGA Package Substrates Product and Services
Table 70. SHINKO FC-BGA Package Substrates Production (K Sqm), Price (US$/Sq m), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 71. SHINKO Recent Developments/Updates
Table 72. SHINKO Competitive Strengths & Weaknesses
Table 73. Samsung Electronics Basic Information, Manufacturing Base and Competitors
Table 74. Samsung Electronics Major Business
Table 75. Samsung Electronics FC-BGA Package Substrates Product and Services
Table 76. Samsung Electronics FC-BGA Package Substrates Production (K Sqm), Price (US$/Sq m), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 77. Samsung Electronics Recent Developments/Updates
Table 78. Samsung Electronics Competitive Strengths & Weaknesses
Table 79. Unimicron Basic Information, Manufacturing Base and Competitors
Table 80. Unimicron Major Business
Table 81. Unimicron FC-BGA Package Substrates Product and Services
Table 82. Unimicron FC-BGA Package Substrates Production (K Sqm), Price (US$/Sq m), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 83. Unimicron Recent Developments/Updates
Table 84. Unimicron Competitive Strengths & Weaknesses
Table 85. Nan Ya PCB Basic Information, Manufacturing Base and Competitors
Table 86. Nan Ya PCB Major Business
Table 87. Nan Ya PCB FC-BGA Package Substrates Product and Services
Table 88. Nan Ya PCB FC-BGA Package Substrates Production (K Sqm), Price (US$/Sq m), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 89. Nan Ya PCB Recent Developments/Updates
Table 90. Nan Ya PCB Competitive Strengths & Weaknesses
Table 91. Shennan Circuits Basic Information, Manufacturing Base and Competitors
Table 92. Shennan Circuits Major Business
Table 93. Shennan Circuits FC-BGA Package Substrates Product and Services
Table 94. Shennan Circuits FC-BGA Package Substrates Production (K Sqm), Price (US$/Sq m), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 95. Shennan Circuits Recent Developments/Updates
Table 96. Shennan Circuits Competitive Strengths & Weaknesses
Table 97. Fastprint Circuit Tech Basic Information, Manufacturing Base and Competitors
Table 98. Fastprint Circuit Tech Major Business
Table 99. Fastprint Circuit Tech FC-BGA Package Substrates Product and Services
Table 100. Fastprint Circuit Tech FC-BGA Package Substrates Production (K Sqm), Price (US$/Sq m), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 101. Fastprint Circuit Tech Recent Developments/Updates
Table 102. Fastprint Circuit Tech Competitive Strengths & Weaknesses
Table 103. Tianhe Defense Technology Basic Information, Manufacturing Base and Competitors
Table 104. Tianhe Defense Technology Major Business
Table 105. Tianhe Defense Technology FC-BGA Package Substrates Product and Services
Table 106. Tianhe Defense Technology FC-BGA Package Substrates Production (K Sqm), Price (US$/Sq m), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 107. Tianhe Defense Technology Recent Developments/Updates
Table 108. Tianhe Defense Technology Competitive Strengths & Weaknesses
Table 109. Zhuhai ACCESS Basic Information, Manufacturing Base and Competitors
Table 110. Zhuhai ACCESS Major Business
Table 111. Zhuhai ACCESS FC-BGA Package Substrates Product and Services
Table 112. Zhuhai ACCESS FC-BGA Package Substrates Production (K Sqm), Price (US$/Sq m), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 113. Zhuhai ACCESS Recent Developments/Updates
Table 114. Zhuhai ACCESS Competitive Strengths & Weaknesses
Table 115. Global Key Players of FC-BGA Package Substrates Upstream (Raw Materials)
Table 116. Global FC-BGA Package Substrates Typical Customers
Table 117. FC-BGA Package Substrates Typical Distributors


List of Figures
Figure 1. FC-BGA Package Substrates Picture
Figure 2. World FC-BGA Package Substrates Production Value: 2019 & 2023 & 2030, (USD Million)
Figure 3. World FC-BGA Package Substrates Production Value and Forecast (2019-2030) & (USD Million)
Figure 4. World FC-BGA Package Substrates Production (2019-2030) & (K Sqm)
Figure 5. World FC-BGA Package Substrates Average Price (2019-2030) & (US$/Sq m)
Figure 6. World FC-BGA Package Substrates Production Value Market Share by Region (2019-2030)
Figure 7. World FC-BGA Package Substrates Production Market Share by Region (2019-2030)
Figure 8. China FC-BGA Package Substrates Production (2019-2030) & (K Sqm)
Figure 9. Japan FC-BGA Package Substrates Production (2019-2030) & (K Sqm)
Figure 10. South Korea FC-BGA Package Substrates Production (2019-2030) & (K Sqm)
Figure 11. China Taiwan FC-BGA Package Substrates Production (2019-2030) & (K Sqm)
Figure 12. FC-BGA Package Substrates Market Drivers
Figure 13. Factors Affecting Demand
Figure 14. World FC-BGA Package Substrates Consumption (2019-2030) & (K Sqm)
Figure 15. World FC-BGA Package Substrates Consumption Market Share by Region (2019-2030)
Figure 16. United States FC-BGA Package Substrates Consumption (2019-2030) & (K Sqm)
Figure 17. China FC-BGA Package Substrates Consumption (2019-2030) & (K Sqm)
Figure 18. Europe FC-BGA Package Substrates Consumption (2019-2030) & (K Sqm)
Figure 19. Japan FC-BGA Package Substrates Consumption (2019-2030) & (K Sqm)
Figure 20. South Korea FC-BGA Package Substrates Consumption (2019-2030) & (K Sqm)
Figure 21. ASEAN FC-BGA Package Substrates Consumption (2019-2030) & (K Sqm)
Figure 22. India FC-BGA Package Substrates Consumption (2019-2030) & (K Sqm)
Figure 23. Producer Shipments of FC-BGA Package Substrates by Manufacturer Revenue ($MM) and Market Share (%): 2023
Figure 24. Global Four-firm Concentration Ratios (CR4) for FC-BGA Package Substrates Markets in 2023
Figure 25. Global Four-firm Concentration Ratios (CR8) for FC-BGA Package Substrates Markets in 2023
Figure 26. United States VS China: FC-BGA Package Substrates Production Value Market Share Comparison (2019 & 2023 & 2030)
Figure 27. United States VS China: FC-BGA Package Substrates Production Market Share Comparison (2019 & 2023 & 2030)
Figure 28. United States VS China: FC-BGA Package Substrates Consumption Market Share Comparison (2019 & 2023 & 2030)
Figure 29. United States Based Manufacturers FC-BGA Package Substrates Production Market Share 2023
Figure 30. China Based Manufacturers FC-BGA Package Substrates Production Market Share 2023
Figure 31. Rest of World Based Manufacturers FC-BGA Package Substrates Production Market Share 2023
Figure 32. World FC-BGA Package Substrates Production Value by Type, (USD Million), 2019 & 2023 & 2030
Figure 33. World FC-BGA Package Substrates Production Value Market Share by Type in 2023
Figure 34. 0.4mm
Figure 35. 0.5mm
Figure 36. 0.6mm
Figure 37. Others
Figure 38. World FC-BGA Package Substrates Production Market Share by Type (2019-2030)
Figure 39. World FC-BGA Package Substrates Production Value Market Share by Type (2019-2030)
Figure 40. World FC-BGA Package Substrates Average Price by Type (2019-2030) & (US$/Sq m)
Figure 41. World FC-BGA Package Substrates Production Value by Application, (USD Million), 2019 & 2023 & 2030
Figure 42. World FC-BGA Package Substrates Production Value Market Share by Application in 2023
Figure 43. Microprocessors
Figure 44. Graphics Processors
Figure 45. Baseband Chips
Figure 46. Others
Figure 47. World FC-BGA Package Substrates Production Market Share by Application (2019-2030)
Figure 48. World FC-BGA Package Substrates Production Value Market Share by Application (2019-2030)
Figure 49. World FC-BGA Package Substrates Average Price by Application (2019-2030) & (US$/Sq m)
Figure 50. FC-BGA Package Substrates Industry Chain
Figure 51. FC-BGA Package Substrates Procurement Model
Figure 52. FC-BGA Package Substrates Sales Model
Figure 53. FC-BGA Package Substrates Sales Channels, Direct Sales, and Distribution
Figure 54. Methodology
Figure 55. Research Process and Data Source
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Research Methodology

Client Requirements

yuan2

Review and analyze client requirements

yuan2

Discussion of all the project requirements and queries

Flexibility Check

yuan2

Project Feasibility Analysis

yuan2

Finalizing tentative research programme

yuan2

Structuring project proposal with scope, timeline, and costs

Analyzing Market Dynamics

yuan2

Determination of key drivers, restraints, challenge, and opportunity

yuan2

Identifies market needs and trends

Market Size Estimation & Forecast

yuan2

Estimation of historical data based on secondary and primary data

yuan2

Anticipating market recast by assigning weightage to market forces (drivers, restraints, opportunities)

yuan2

Freezing historical and forecast market size estimations based on evolution, trends, outlook, and strategies

yuan2

Consideration of geography, region-specific product/service demand for region segments

yuan2

Consideration of product utilization rates, product demand outlook for segments by application or end-user.

tuBiao1

Data Source

yuan2

Secondary Source
Data collections from annual reports, presentations,associations, journals, analyst reports, paid database, press releases, blogs, newsletters,and GIR repositories.

yuan2

Primary Source
Research discussion with manufacturers, distributors, suppliers, end user, industry experts to verify insights.

Validation and
triangulation of
secondary and primary source.

yuan2

Collection of data

yuan2

Cumulating and collating the essential qualitative and quantitative data

yuan2

Generation of report in client requested format by research analysts

yuan2

Reviews by expert analysts

yuan2

Final quality check

yuan2

Clarifying queries

yuan2

Receiving feedback

yuan2

Ensuring satisfaction

  • yuan01
    liuCheng01

    01 Identification of data

    This step involves identification of several primary and secondary data research sources, including Global Info Research's internal data sources. The primary sources consist of in-depth discussions and interviews with policy makers, industry experts, and data evaluators, whereas secondary sources include a thorough study of market journals, press releases, annual reports, and government and non-government agencies websites.

  • yuan01
    liuCheng01

    02 Evaluation of Market Dynamic

    This phase includes a detailed evaluation of several factors that are likely to affect the market dynamics. It involves a comprehensive assessment of major market pain points, drivers, and trends. It also comprises a detailed study of research plans and methodology.

  • yuan01
    liuCheng01

    03 Collection of Data

    This process consists of gathering data, accessing proprietary databases, and reaching out to key industry participants that operate in the market across the value chain. It also involves studying several patterns in the historical data and comparing it with the current scenario.

  • yuan01
    liuCheng01

    04 Collaboration of Data

    This stage involves the validation of data and arrival at actual statistics, and evolution of the market over the years. It entails the study and analyzes various segments and verticals of the market. An impact analysis is also performed to observe which factors will affect the market in the next few years.

  • yuan01
    liuCheng01

    05 Verification and Analysis

    This is the final stage, which involves both quantity and quality checks. Although the process of data verification is an integral part of the research process, all data points and statistics and figures are re-checked to uphold their authenticity and validity.

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Companies Mentioned

IBIDEN
SHINKO
Samsung Electronics
Unimicron
Nan Ya PCB
Shennan Circuits
Fastprint Circuit Tech
Tianhe Defense Technology
Zhuhai ACCESS
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Global FC-BGA Package Substrates Supply, Demand and Key Producers, 2024-2030

Global FC-BGA Package Substrates Supply, Demand and Key Producers, 2024-2030

Page: 109

Published Date: 04 Jun 2024

Category: Electronics & Semiconductor

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Description

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Description

The global FC-BGA Package Substrates market size is expected to reach $ million by 2030, rising at a market growth of %CAGR during the forecast period (2024-2030).

This report studies the global FC-BGA Package Substrates production, demand, key manufacturers, and key regions.

This report is a detailed and comprehensive analysis of the world market for FC-BGA Package Substrates and provides market size (US$ million) and Year-over-Year (YoY) Growth, considering 2023 as the base year. This report explores demand trends and competition, as well as details the characteristics of FC-BGA Package Substrates that contribute to its increasing demand across many markets.

Highlights and key features of the study
Global FC-BGA Package Substrates total production and demand, 2019-2030, (K Sqm)
Global FC-BGA Package Substrates total production value, 2019-2030, (USD Million)
Global FC-BGA Package Substrates production by region & country, production, value, CAGR, 2019-2030, (USD Million) & (K Sqm), (based on production site)
Global FC-BGA Package Substrates consumption by region & country, CAGR, 2019-2030 & (K Sqm)
U.S. VS China: FC-BGA Package Substrates domestic production, consumption, key domestic manufacturers and share
Global FC-BGA Package Substrates production by manufacturer, production, price, value and market share 2019-2024, (USD Million) & (K Sqm)
Global FC-BGA Package Substrates production by Type, production, value, CAGR, 2019-2030, (USD Million) & (K Sqm)
Global FC-BGA Package Substrates production by Application, production, value, CAGR, 2019-2030, (USD Million) & (K Sqm)
This report profiles key players in the global FC-BGA Package Substrates market based on the following parameters - company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include IBIDEN, SHINKO, Samsung Electronics, Unimicron, Nan Ya PCB, Shennan Circuits, Fastprint Circuit Tech, Tianhe Defense Technology, Zhuhai ACCESS, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World FC-BGA Package Substrates market
Detailed Segmentation:
Each section contains quantitative market data including market by value (US$ Millions), volume (production, consumption) & (K Sqm) and average price (US$/Sq m) by manufacturer, by Type, and by Application. Data is given for the years 2019-2030 by year with 2023 as the base year, 2024 as the estimate year, and 2025-2030 as the forecast year.

Global FC-BGA Package Substrates Market, By Region:
United States
China
Europe
Japan
South Korea
ASEAN
India
Rest of World

Global FC-BGA Package Substrates Market, Segmentation by Type:
0.4mm
0.5mm
0.6mm
Others

Global FC-BGA Package Substrates Market, Segmentation by Application:
Microprocessors
Graphics Processors
Baseband Chips
Others

Companies Profiled:
IBIDEN
SHINKO
Samsung Electronics
Unimicron
Nan Ya PCB
Shennan Circuits
Fastprint Circuit Tech
Tianhe Defense Technology
Zhuhai ACCESS

Key Questions Answered:
1. How big is the global FC-BGA Package Substrates market?
2. What is the demand of the global FC-BGA Package Substrates market?
3. What is the year over year growth of the global FC-BGA Package Substrates market?
4. What is the production and production value of the global FC-BGA Package Substrates market?
5. Who are the key producers in the global FC-BGA Package Substrates market?
6. What are the growth factors driving the market demand?
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Table of Contents

1 Supply Summary
1.1 FC-BGA Package Substrates Introduction
1.2 World FC-BGA Package Substrates Supply & Forecast
1.2.1 World FC-BGA Package Substrates Production Value (2019 & 2023 & 2030)
1.2.2 World FC-BGA Package Substrates Production (2019-2030)
1.2.3 World FC-BGA Package Substrates Pricing Trends (2019-2030)
1.3 World FC-BGA Package Substrates Production by Region (Based on Production Site)
1.3.1 World FC-BGA Package Substrates Production Value by Region (2019-2030)
1.3.2 World FC-BGA Package Substrates Production by Region (2019-2030)
1.3.3 World FC-BGA Package Substrates Average Price by Region (2019-2030)
1.3.4 China FC-BGA Package Substrates Production (2019-2030)
1.3.5 Japan FC-BGA Package Substrates Production (2019-2030)
1.3.6 South Korea FC-BGA Package Substrates Production (2019-2030)
1.3.7 China Taiwan FC-BGA Package Substrates Production (2019-2030)
1.4 Market Drivers, Restraints and Trends
1.4.1 FC-BGA Package Substrates Market Drivers
1.4.2 Factors Affecting Demand
1.4.3 FC-BGA Package Substrates Major Market Trends

2 Demand Summary
2.1 World FC-BGA Package Substrates Demand (2019-2030)
2.2 World FC-BGA Package Substrates Consumption by Region
2.2.1 World FC-BGA Package Substrates Consumption by Region (2019-2024)
2.2.2 World FC-BGA Package Substrates Consumption Forecast by Region (2025-2030)
2.3 United States FC-BGA Package Substrates Consumption (2019-2030)
2.4 China FC-BGA Package Substrates Consumption (2019-2030)
2.5 Europe FC-BGA Package Substrates Consumption (2019-2030)
2.6 Japan FC-BGA Package Substrates Consumption (2019-2030)
2.7 South Korea FC-BGA Package Substrates Consumption (2019-2030)
2.8 ASEAN FC-BGA Package Substrates Consumption (2019-2030)
2.9 India FC-BGA Package Substrates Consumption (2019-2030)

3 World Manufacturers Competitive Analysis
3.1 World FC-BGA Package Substrates Production Value by Manufacturer (2019-2024)
3.2 World FC-BGA Package Substrates Production by Manufacturer (2019-2024)
3.3 World FC-BGA Package Substrates Average Price by Manufacturer (2019-2024)
3.4 FC-BGA Package Substrates Company Evaluation Quadrant
3.5 Industry Rank and Concentration Rate (CR)
3.5.1 Global FC-BGA Package Substrates Industry Rank of Major Manufacturers
3.5.2 Global Concentration Ratios (CR4) for FC-BGA Package Substrates in 2023
3.5.3 Global Concentration Ratios (CR8) for FC-BGA Package Substrates in 2023
3.6 FC-BGA Package Substrates Market: Overall Company Footprint Analysis
3.6.1 FC-BGA Package Substrates Market: Region Footprint
3.6.2 FC-BGA Package Substrates Market: Company Product Type Footprint
3.6.3 FC-BGA Package Substrates Market: Company Product Application Footprint
3.7 Competitive Environment
3.7.1 Historical Structure of the Industry
3.7.2 Barriers of Market Entry
3.7.3 Factors of Competition
3.8 New Entrant and Capacity Expansion Plans
3.9 Mergers, Acquisition, Agreements, and Collaborations

4 United States VS China VS Rest of the World
4.1 United States VS China: FC-BGA Package Substrates Production Value Comparison
4.1.1 United States VS China: FC-BGA Package Substrates Production Value Comparison (2019 & 2023 & 2030)
4.1.2 United States VS China: FC-BGA Package Substrates Production Value Market Share Comparison (2019 & 2023 & 2030)
4.2 United States VS China: FC-BGA Package Substrates Production Comparison
4.2.1 United States VS China: FC-BGA Package Substrates Production Comparison (2019 & 2023 & 2030)
4.2.2 United States VS China: FC-BGA Package Substrates Production Market Share Comparison (2019 & 2023 & 2030)
4.3 United States VS China: FC-BGA Package Substrates Consumption Comparison
4.3.1 United States VS China: FC-BGA Package Substrates Consumption Comparison (2019 & 2023 & 2030)
4.3.2 United States VS China: FC-BGA Package Substrates Consumption Market Share Comparison (2019 & 2023 & 2030)
4.4 United States Based FC-BGA Package Substrates Manufacturers and Market Share, 2019-2024
4.4.1 United States Based FC-BGA Package Substrates Manufacturers, Headquarters and Production Site (States, Country)
4.4.2 United States Based Manufacturers FC-BGA Package Substrates Production Value (2019-2024)
4.4.3 United States Based Manufacturers FC-BGA Package Substrates Production (2019-2024)
4.5 China Based FC-BGA Package Substrates Manufacturers and Market Share
4.5.1 China Based FC-BGA Package Substrates Manufacturers, Headquarters and Production Site (Province, Country)
4.5.2 China Based Manufacturers FC-BGA Package Substrates Production Value (2019-2024)
4.5.3 China Based Manufacturers FC-BGA Package Substrates Production (2019-2024)
4.6 Rest of World Based FC-BGA Package Substrates Manufacturers and Market Share, 2019-2024
4.6.1 Rest of World Based FC-BGA Package Substrates Manufacturers, Headquarters and Production Site (State, Country)
4.6.2 Rest of World Based Manufacturers FC-BGA Package Substrates Production Value (2019-2024)
4.6.3 Rest of World Based Manufacturers FC-BGA Package Substrates Production (2019-2024)

5 Market Analysis by Type
5.1 World FC-BGA Package Substrates Market Size Overview by Type: 2019 VS 2023 VS 2030
5.2 Segment Introduction by Type
5.2.1 0.4mm
5.2.2 0.5mm
5.2.3 0.6mm
5.2.4 Others
5.3 Market Segment by Type
5.3.1 World FC-BGA Package Substrates Production by Type (2019-2030)
5.3.2 World FC-BGA Package Substrates Production Value by Type (2019-2030)
5.3.3 World FC-BGA Package Substrates Average Price by Type (2019-2030)

6 Market Analysis by Application
6.1 World FC-BGA Package Substrates Market Size Overview by Application: 2019 VS 2023 VS 2030
6.2 Segment Introduction by Application
6.2.1 Microprocessors
6.2.2 Graphics Processors
6.2.3 Baseband Chips
6.2.4 Others
6.3 Market Segment by Application
6.3.1 World FC-BGA Package Substrates Production by Application (2019-2030)
6.3.2 World FC-BGA Package Substrates Production Value by Application (2019-2030)
6.3.3 World FC-BGA Package Substrates Average Price by Application (2019-2030)

7 Company Profiles
7.1 IBIDEN
7.1.1 IBIDEN Details
7.1.2 IBIDEN Major Business
7.1.3 IBIDEN FC-BGA Package Substrates Product and Services
7.1.4 IBIDEN FC-BGA Package Substrates Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.1.5 IBIDEN Recent Developments/Updates
7.1.6 IBIDEN Competitive Strengths & Weaknesses
7.2 SHINKO
7.2.1 SHINKO Details
7.2.2 SHINKO Major Business
7.2.3 SHINKO FC-BGA Package Substrates Product and Services
7.2.4 SHINKO FC-BGA Package Substrates Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.2.5 SHINKO Recent Developments/Updates
7.2.6 SHINKO Competitive Strengths & Weaknesses
7.3 Samsung Electronics
7.3.1 Samsung Electronics Details
7.3.2 Samsung Electronics Major Business
7.3.3 Samsung Electronics FC-BGA Package Substrates Product and Services
7.3.4 Samsung Electronics FC-BGA Package Substrates Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.3.5 Samsung Electronics Recent Developments/Updates
7.3.6 Samsung Electronics Competitive Strengths & Weaknesses
7.4 Unimicron
7.4.1 Unimicron Details
7.4.2 Unimicron Major Business
7.4.3 Unimicron FC-BGA Package Substrates Product and Services
7.4.4 Unimicron FC-BGA Package Substrates Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.4.5 Unimicron Recent Developments/Updates
7.4.6 Unimicron Competitive Strengths & Weaknesses
7.5 Nan Ya PCB
7.5.1 Nan Ya PCB Details
7.5.2 Nan Ya PCB Major Business
7.5.3 Nan Ya PCB FC-BGA Package Substrates Product and Services
7.5.4 Nan Ya PCB FC-BGA Package Substrates Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.5.5 Nan Ya PCB Recent Developments/Updates
7.5.6 Nan Ya PCB Competitive Strengths & Weaknesses
7.6 Shennan Circuits
7.6.1 Shennan Circuits Details
7.6.2 Shennan Circuits Major Business
7.6.3 Shennan Circuits FC-BGA Package Substrates Product and Services
7.6.4 Shennan Circuits FC-BGA Package Substrates Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.6.5 Shennan Circuits Recent Developments/Updates
7.6.6 Shennan Circuits Competitive Strengths & Weaknesses
7.7 Fastprint Circuit Tech
7.7.1 Fastprint Circuit Tech Details
7.7.2 Fastprint Circuit Tech Major Business
7.7.3 Fastprint Circuit Tech FC-BGA Package Substrates Product and Services
7.7.4 Fastprint Circuit Tech FC-BGA Package Substrates Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.7.5 Fastprint Circuit Tech Recent Developments/Updates
7.7.6 Fastprint Circuit Tech Competitive Strengths & Weaknesses
7.8 Tianhe Defense Technology
7.8.1 Tianhe Defense Technology Details
7.8.2 Tianhe Defense Technology Major Business
7.8.3 Tianhe Defense Technology FC-BGA Package Substrates Product and Services
7.8.4 Tianhe Defense Technology FC-BGA Package Substrates Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.8.5 Tianhe Defense Technology Recent Developments/Updates
7.8.6 Tianhe Defense Technology Competitive Strengths & Weaknesses
7.9 Zhuhai ACCESS
7.9.1 Zhuhai ACCESS Details
7.9.2 Zhuhai ACCESS Major Business
7.9.3 Zhuhai ACCESS FC-BGA Package Substrates Product and Services
7.9.4 Zhuhai ACCESS FC-BGA Package Substrates Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.9.5 Zhuhai ACCESS Recent Developments/Updates
7.9.6 Zhuhai ACCESS Competitive Strengths & Weaknesses

8 Industry Chain Analysis
8.1 FC-BGA Package Substrates Industry Chain
8.2 FC-BGA Package Substrates Upstream Analysis
8.2.1 FC-BGA Package Substrates Core Raw Materials
8.2.2 Main Manufacturers of FC-BGA Package Substrates Core Raw Materials
8.3 Midstream Analysis
8.4 Downstream Analysis
8.5 FC-BGA Package Substrates Production Mode
8.6 FC-BGA Package Substrates Procurement Model
8.7 FC-BGA Package Substrates Industry Sales Model and Sales Channels
8.7.1 FC-BGA Package Substrates Sales Model
8.7.2 FC-BGA Package Substrates Typical Distributors

9 Research Findings and Conclusion

10 Appendix
10.1 Methodology
10.2 Research Process and Data Source
10.3 Disclaimer
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Table of Figures

List of Tables
Table 1. World FC-BGA Package Substrates Production Value by Region (2019, 2023 and 2030) & (USD Million)
Table 2. World FC-BGA Package Substrates Production Value by Region (2019-2024) & (USD Million)
Table 3. World FC-BGA Package Substrates Production Value by Region (2025-2030) & (USD Million)
Table 4. World FC-BGA Package Substrates Production Value Market Share by Region (2019-2024)
Table 5. World FC-BGA Package Substrates Production Value Market Share by Region (2025-2030)
Table 6. World FC-BGA Package Substrates Production by Region (2019-2024) & (K Sqm)
Table 7. World FC-BGA Package Substrates Production by Region (2025-2030) & (K Sqm)
Table 8. World FC-BGA Package Substrates Production Market Share by Region (2019-2024)
Table 9. World FC-BGA Package Substrates Production Market Share by Region (2025-2030)
Table 10. World FC-BGA Package Substrates Average Price by Region (2019-2024) & (US$/Sq m)
Table 11. World FC-BGA Package Substrates Average Price by Region (2025-2030) & (US$/Sq m)
Table 12. FC-BGA Package Substrates Major Market Trends
Table 13. World FC-BGA Package Substrates Consumption Growth Rate Forecast by Region (2019 & 2023 & 2030) & (K Sqm)
Table 14. World FC-BGA Package Substrates Consumption by Region (2019-2024) & (K Sqm)
Table 15. World FC-BGA Package Substrates Consumption Forecast by Region (2025-2030) & (K Sqm)
Table 16. World FC-BGA Package Substrates Production Value by Manufacturer (2019-2024) & (USD Million)
Table 17. Production Value Market Share of Key FC-BGA Package Substrates Producers in 2023
Table 18. World FC-BGA Package Substrates Production by Manufacturer (2019-2024) & (K Sqm)
Table 19. Production Market Share of Key FC-BGA Package Substrates Producers in 2023
Table 20. World FC-BGA Package Substrates Average Price by Manufacturer (2019-2024) & (US$/Sq m)
Table 21. Global FC-BGA Package Substrates Company Evaluation Quadrant
Table 22. World FC-BGA Package Substrates Industry Rank of Major Manufacturers, Based on Production Value in 2023
Table 23. Head Office and FC-BGA Package Substrates Production Site of Key Manufacturer
Table 24. FC-BGA Package Substrates Market: Company Product Type Footprint
Table 25. FC-BGA Package Substrates Market: Company Product Application Footprint
Table 26. FC-BGA Package Substrates Competitive Factors
Table 27. FC-BGA Package Substrates New Entrant and Capacity Expansion Plans
Table 28. FC-BGA Package Substrates Mergers & Acquisitions Activity
Table 29. United States VS China FC-BGA Package Substrates Production Value Comparison, (2019 & 2023 & 2030) & (USD Million)
Table 30. United States VS China FC-BGA Package Substrates Production Comparison, (2019 & 2023 & 2030) & (K Sqm)
Table 31. United States VS China FC-BGA Package Substrates Consumption Comparison, (2019 & 2023 & 2030) & (K Sqm)
Table 32. United States Based FC-BGA Package Substrates Manufacturers, Headquarters and Production Site (States, Country)
Table 33. United States Based Manufacturers FC-BGA Package Substrates Production Value, (2019-2024) & (USD Million)
Table 34. United States Based Manufacturers FC-BGA Package Substrates Production Value Market Share (2019-2024)
Table 35. United States Based Manufacturers FC-BGA Package Substrates Production (2019-2024) & (K Sqm)
Table 36. United States Based Manufacturers FC-BGA Package Substrates Production Market Share (2019-2024)
Table 37. China Based FC-BGA Package Substrates Manufacturers, Headquarters and Production Site (Province, Country)
Table 38. China Based Manufacturers FC-BGA Package Substrates Production Value, (2019-2024) & (USD Million)
Table 39. China Based Manufacturers FC-BGA Package Substrates Production Value Market Share (2019-2024)
Table 40. China Based Manufacturers FC-BGA Package Substrates Production, (2019-2024) & (K Sqm)
Table 41. China Based Manufacturers FC-BGA Package Substrates Production Market Share (2019-2024)
Table 42. Rest of World Based FC-BGA Package Substrates Manufacturers, Headquarters and Production Site (State, Country)
Table 43. Rest of World Based Manufacturers FC-BGA Package Substrates Production Value, (2019-2024) & (USD Million)
Table 44. Rest of World Based Manufacturers FC-BGA Package Substrates Production Value Market Share (2019-2024)
Table 45. Rest of World Based Manufacturers FC-BGA Package Substrates Production, (2019-2024) & (K Sqm)
Table 46. Rest of World Based Manufacturers FC-BGA Package Substrates Production Market Share (2019-2024)
Table 47. World FC-BGA Package Substrates Production Value by Type, (USD Million), 2019 & 2023 & 2030
Table 48. World FC-BGA Package Substrates Production by Type (2019-2024) & (K Sqm)
Table 49. World FC-BGA Package Substrates Production by Type (2025-2030) & (K Sqm)
Table 50. World FC-BGA Package Substrates Production Value by Type (2019-2024) & (USD Million)
Table 51. World FC-BGA Package Substrates Production Value by Type (2025-2030) & (USD Million)
Table 52. World FC-BGA Package Substrates Average Price by Type (2019-2024) & (US$/Sq m)
Table 53. World FC-BGA Package Substrates Average Price by Type (2025-2030) & (US$/Sq m)
Table 54. World FC-BGA Package Substrates Production Value by Application, (USD Million), 2019 & 2023 & 2030
Table 55. World FC-BGA Package Substrates Production by Application (2019-2024) & (K Sqm)
Table 56. World FC-BGA Package Substrates Production by Application (2025-2030) & (K Sqm)
Table 57. World FC-BGA Package Substrates Production Value by Application (2019-2024) & (USD Million)
Table 58. World FC-BGA Package Substrates Production Value by Application (2025-2030) & (USD Million)
Table 59. World FC-BGA Package Substrates Average Price by Application (2019-2024) & (US$/Sq m)
Table 60. World FC-BGA Package Substrates Average Price by Application (2025-2030) & (US$/Sq m)
Table 61. IBIDEN Basic Information, Manufacturing Base and Competitors
Table 62. IBIDEN Major Business
Table 63. IBIDEN FC-BGA Package Substrates Product and Services
Table 64. IBIDEN FC-BGA Package Substrates Production (K Sqm), Price (US$/Sq m), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 65. IBIDEN Recent Developments/Updates
Table 66. IBIDEN Competitive Strengths & Weaknesses
Table 67. SHINKO Basic Information, Manufacturing Base and Competitors
Table 68. SHINKO Major Business
Table 69. SHINKO FC-BGA Package Substrates Product and Services
Table 70. SHINKO FC-BGA Package Substrates Production (K Sqm), Price (US$/Sq m), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 71. SHINKO Recent Developments/Updates
Table 72. SHINKO Competitive Strengths & Weaknesses
Table 73. Samsung Electronics Basic Information, Manufacturing Base and Competitors
Table 74. Samsung Electronics Major Business
Table 75. Samsung Electronics FC-BGA Package Substrates Product and Services
Table 76. Samsung Electronics FC-BGA Package Substrates Production (K Sqm), Price (US$/Sq m), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 77. Samsung Electronics Recent Developments/Updates
Table 78. Samsung Electronics Competitive Strengths & Weaknesses
Table 79. Unimicron Basic Information, Manufacturing Base and Competitors
Table 80. Unimicron Major Business
Table 81. Unimicron FC-BGA Package Substrates Product and Services
Table 82. Unimicron FC-BGA Package Substrates Production (K Sqm), Price (US$/Sq m), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 83. Unimicron Recent Developments/Updates
Table 84. Unimicron Competitive Strengths & Weaknesses
Table 85. Nan Ya PCB Basic Information, Manufacturing Base and Competitors
Table 86. Nan Ya PCB Major Business
Table 87. Nan Ya PCB FC-BGA Package Substrates Product and Services
Table 88. Nan Ya PCB FC-BGA Package Substrates Production (K Sqm), Price (US$/Sq m), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 89. Nan Ya PCB Recent Developments/Updates
Table 90. Nan Ya PCB Competitive Strengths & Weaknesses
Table 91. Shennan Circuits Basic Information, Manufacturing Base and Competitors
Table 92. Shennan Circuits Major Business
Table 93. Shennan Circuits FC-BGA Package Substrates Product and Services
Table 94. Shennan Circuits FC-BGA Package Substrates Production (K Sqm), Price (US$/Sq m), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 95. Shennan Circuits Recent Developments/Updates
Table 96. Shennan Circuits Competitive Strengths & Weaknesses
Table 97. Fastprint Circuit Tech Basic Information, Manufacturing Base and Competitors
Table 98. Fastprint Circuit Tech Major Business
Table 99. Fastprint Circuit Tech FC-BGA Package Substrates Product and Services
Table 100. Fastprint Circuit Tech FC-BGA Package Substrates Production (K Sqm), Price (US$/Sq m), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 101. Fastprint Circuit Tech Recent Developments/Updates
Table 102. Fastprint Circuit Tech Competitive Strengths & Weaknesses
Table 103. Tianhe Defense Technology Basic Information, Manufacturing Base and Competitors
Table 104. Tianhe Defense Technology Major Business
Table 105. Tianhe Defense Technology FC-BGA Package Substrates Product and Services
Table 106. Tianhe Defense Technology FC-BGA Package Substrates Production (K Sqm), Price (US$/Sq m), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 107. Tianhe Defense Technology Recent Developments/Updates
Table 108. Tianhe Defense Technology Competitive Strengths & Weaknesses
Table 109. Zhuhai ACCESS Basic Information, Manufacturing Base and Competitors
Table 110. Zhuhai ACCESS Major Business
Table 111. Zhuhai ACCESS FC-BGA Package Substrates Product and Services
Table 112. Zhuhai ACCESS FC-BGA Package Substrates Production (K Sqm), Price (US$/Sq m), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 113. Zhuhai ACCESS Recent Developments/Updates
Table 114. Zhuhai ACCESS Competitive Strengths & Weaknesses
Table 115. Global Key Players of FC-BGA Package Substrates Upstream (Raw Materials)
Table 116. Global FC-BGA Package Substrates Typical Customers
Table 117. FC-BGA Package Substrates Typical Distributors


List of Figures
Figure 1. FC-BGA Package Substrates Picture
Figure 2. World FC-BGA Package Substrates Production Value: 2019 & 2023 & 2030, (USD Million)
Figure 3. World FC-BGA Package Substrates Production Value and Forecast (2019-2030) & (USD Million)
Figure 4. World FC-BGA Package Substrates Production (2019-2030) & (K Sqm)
Figure 5. World FC-BGA Package Substrates Average Price (2019-2030) & (US$/Sq m)
Figure 6. World FC-BGA Package Substrates Production Value Market Share by Region (2019-2030)
Figure 7. World FC-BGA Package Substrates Production Market Share by Region (2019-2030)
Figure 8. China FC-BGA Package Substrates Production (2019-2030) & (K Sqm)
Figure 9. Japan FC-BGA Package Substrates Production (2019-2030) & (K Sqm)
Figure 10. South Korea FC-BGA Package Substrates Production (2019-2030) & (K Sqm)
Figure 11. China Taiwan FC-BGA Package Substrates Production (2019-2030) & (K Sqm)
Figure 12. FC-BGA Package Substrates Market Drivers
Figure 13. Factors Affecting Demand
Figure 14. World FC-BGA Package Substrates Consumption (2019-2030) & (K Sqm)
Figure 15. World FC-BGA Package Substrates Consumption Market Share by Region (2019-2030)
Figure 16. United States FC-BGA Package Substrates Consumption (2019-2030) & (K Sqm)
Figure 17. China FC-BGA Package Substrates Consumption (2019-2030) & (K Sqm)
Figure 18. Europe FC-BGA Package Substrates Consumption (2019-2030) & (K Sqm)
Figure 19. Japan FC-BGA Package Substrates Consumption (2019-2030) & (K Sqm)
Figure 20. South Korea FC-BGA Package Substrates Consumption (2019-2030) & (K Sqm)
Figure 21. ASEAN FC-BGA Package Substrates Consumption (2019-2030) & (K Sqm)
Figure 22. India FC-BGA Package Substrates Consumption (2019-2030) & (K Sqm)
Figure 23. Producer Shipments of FC-BGA Package Substrates by Manufacturer Revenue ($MM) and Market Share (%): 2023
Figure 24. Global Four-firm Concentration Ratios (CR4) for FC-BGA Package Substrates Markets in 2023
Figure 25. Global Four-firm Concentration Ratios (CR8) for FC-BGA Package Substrates Markets in 2023
Figure 26. United States VS China: FC-BGA Package Substrates Production Value Market Share Comparison (2019 & 2023 & 2030)
Figure 27. United States VS China: FC-BGA Package Substrates Production Market Share Comparison (2019 & 2023 & 2030)
Figure 28. United States VS China: FC-BGA Package Substrates Consumption Market Share Comparison (2019 & 2023 & 2030)
Figure 29. United States Based Manufacturers FC-BGA Package Substrates Production Market Share 2023
Figure 30. China Based Manufacturers FC-BGA Package Substrates Production Market Share 2023
Figure 31. Rest of World Based Manufacturers FC-BGA Package Substrates Production Market Share 2023
Figure 32. World FC-BGA Package Substrates Production Value by Type, (USD Million), 2019 & 2023 & 2030
Figure 33. World FC-BGA Package Substrates Production Value Market Share by Type in 2023
Figure 34. 0.4mm
Figure 35. 0.5mm
Figure 36. 0.6mm
Figure 37. Others
Figure 38. World FC-BGA Package Substrates Production Market Share by Type (2019-2030)
Figure 39. World FC-BGA Package Substrates Production Value Market Share by Type (2019-2030)
Figure 40. World FC-BGA Package Substrates Average Price by Type (2019-2030) & (US$/Sq m)
Figure 41. World FC-BGA Package Substrates Production Value by Application, (USD Million), 2019 & 2023 & 2030
Figure 42. World FC-BGA Package Substrates Production Value Market Share by Application in 2023
Figure 43. Microprocessors
Figure 44. Graphics Processors
Figure 45. Baseband Chips
Figure 46. Others
Figure 47. World FC-BGA Package Substrates Production Market Share by Application (2019-2030)
Figure 48. World FC-BGA Package Substrates Production Value Market Share by Application (2019-2030)
Figure 49. World FC-BGA Package Substrates Average Price by Application (2019-2030) & (US$/Sq m)
Figure 50. FC-BGA Package Substrates Industry Chain
Figure 51. FC-BGA Package Substrates Procurement Model
Figure 52. FC-BGA Package Substrates Sales Model
Figure 53. FC-BGA Package Substrates Sales Channels, Direct Sales, and Distribution
Figure 54. Methodology
Figure 55. Research Process and Data Source
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Research Methodology

Client Requirements

yuan2

Review and analyze client requirements

yuan2

Discussion of all the project requirements and queries

Flexibility Check

yuan2

Project Feasibility Analysis

yuan2

Finalizing tentative research programme

yuan2

Structuring project proposal with scope, timeline, and costs

Analyzing Market Dynamics

yuan2

Determination of key drivers, restraints, challenge, and opportunity

yuan2

Identifies market needs and trends

Market Size Estimation & Forecast

yuan2

Estimation of historical data based on secondary and primary data

yuan2

Anticipating market recast by assigning weightage to market forces (drivers, restraints, opportunities)

yuan2

Freezing historical and forecast market size estimations based on evolution, trends, outlook, and strategies

yuan2

Consideration of geography, region-specific product/service demand for region segments

yuan2

Consideration of product utilization rates, product demand outlook for segments by application or end-user.

tuBiao1

Data Source

yuan2

Secondary Source
Data collections from annual reports, presentations,associations, journals, analyst reports, paid database, press releases, blogs, newsletters,and GIR repositories.

yuan2

Discussion of all the project requirements and queries

Validation and triangulation of secondary and primary source.

yuan2

Collection of data

yuan2

Cumulating and collating the essential qualitative and quantitative data

yuan2

Generation of report in client requested format by research analysts

yuan2

Reviews by expert analysts

yuan2

Final quality check

yuan2

Clarifying queries

yuan2

Receiving feedback

yuan2

Ensuring satisfaction

  • yuan01
    liuCheng01

    01 Identification of data

    This step involves identification of several primary and secondary data research sources, including Global Info Research's internal data sources. The primary sources consist of in-depth discussions and interviews with policy makers, industry experts, and data evaluators, whereas secondary sources include a thorough study of market journals, press releases, annual reports, and government and non-government agencies websites.

  • yuan01
    liuCheng01

    02 Evaluation of Market Dynamic

    This phase includes a detailed evaluation of several factors that are likely to affect the market dynamics. It involves a comprehensive assessment of major market pain points, drivers, and trends. It also comprises a detailed study of research plans and methodology.

  • yuan01
    liuCheng01

    03 Collection of Data

    This process consists of gathering data, accessing proprietary databases, and reaching out to key industry participants that operate in the market across the value chain. It also involves studying several patterns in the historical data and comparing it with the current scenario.

  • yuan01
    liuCheng01

    04 Collaboration of Data

    This stage involves the validation of data and arrival at actual statistics, and evolution of the market over the years. It entails the study and analyzes various segments and verticals of the market. An impact analysis is also performed to observe which factors will affect the market in the next few years.

  • yuan01
    liuCheng01

    05 Verification and Analysis

    This is the final stage, which involves both quantity and quality checks. Although the process of data verification is an integral part of the research process, all data points and statistics and figures are re-checked to uphold their authenticity and validity.

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Companies Mentioned

IBIDEN
SHINKO
Samsung Electronics
Unimicron
Nan Ya PCB
Shennan Circuits
Fastprint Circuit Tech
Tianhe Defense Technology
Zhuhai ACCESS
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