Global BGA Solder Ball for IC Packaging Supply, Demand and Key Producers, 2024-2030

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Published Date: 12 Aug 2024

Category: Chemical & Material

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Description
Table of Contents
Table of Figures
Research Methodology
Companies Mentioned
Related Reports
Product Tags

Description

The global BGA Solder Ball for IC Packaging market size is expected to reach $ 2392 million by 2030, rising at a market growth of 6.3% CAGR during the forecast period (2024-2030).

This report studies the global BGA Solder Ball for IC Packaging production, demand, key manufacturers, and key regions.

This report is a detailed and comprehensive analysis of the world market for BGA Solder Ball for IC Packaging and provides market size (US$ million) and Year-over-Year (YoY) Growth, considering 2023 as the base year. This report explores demand trends and competition, as well as details the characteristics of BGA Solder Ball for IC Packaging that contribute to its increasing demand across many markets.

Highlights and key features of the study
Global BGA Solder Ball for IC Packaging total production and demand, 2019-2030, (Units)
Global BGA Solder Ball for IC Packaging total production value, 2019-2030, (USD Million)
Global BGA Solder Ball for IC Packaging production by region & country, production, value, CAGR, 2019-2030, (USD Million) & (Units), (based on production site)
Global BGA Solder Ball for IC Packaging consumption by region & country, CAGR, 2019-2030 & (Units)
U.S. VS China: BGA Solder Ball for IC Packaging domestic production, consumption, key domestic manufacturers and share
Global BGA Solder Ball for IC Packaging production by manufacturer, production, price, value and market share 2019-2024, (USD Million) & (Units)
Global BGA Solder Ball for IC Packaging production by Type, production, value, CAGR, 2019-2030, (USD Million) & (Units)
Global BGA Solder Ball for IC Packaging production by Application, production, value, CAGR, 2019-2030, (USD Million) & (Units)
This report profiles key players in the global BGA Solder Ball for IC Packaging market based on the following parameters - company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Senju Metal, Accurus Scientific., DS HiMetal, Nippon Micrometal Corporation, MK Electron, Yunnan Tin, PhiChem Corporation, Ishikawa Metal, Fukuda Metal Foil & Powder, MATSUDA SANGYO, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World BGA Solder Ball for IC Packaging market
Detailed Segmentation:
Each section contains quantitative market data including market by value (US$ Millions), volume (production, consumption) & (Units) and average price (US$/Unit) by manufacturer, by Type, and by Application. Data is given for the years 2019-2030 by year with 2023 as the base year, 2024 as the estimate year, and 2025-2030 as the forecast year.

Global BGA Solder Ball for IC Packaging Market, By Region:
    United States
    China
    Europe
    Japan
    South Korea
    ASEAN
    India
    Rest of World

Global BGA Solder Ball for IC Packaging Market, Segmentation by Type:
    Lead-Free Solder Ball
    Lead Solder Ball

Global BGA Solder Ball for IC Packaging Market, Segmentation by Application:
    PBGA
    FCBGA
    CBGA
    TBGA

Companies Profiled:
    Senju Metal
    Accurus Scientific.
    DS HiMetal
    Nippon Micrometal Corporation
    MK Electron
    Yunnan Tin
    PhiChem Corporation
    Ishikawa Metal
    Fukuda Metal Foil & Powder
    MATSUDA SANGYO
    SHEN MAO TECHNOLOGY
    Fonton Industrial

Key Questions Answered:
1. How big is the global BGA Solder Ball for IC Packaging market?
2. What is the demand of the global BGA Solder Ball for IC Packaging market?
3. What is the year over year growth of the global BGA Solder Ball for IC Packaging market?
4. What is the production and production value of the global BGA Solder Ball for IC Packaging market?
5. Who are the key producers in the global BGA Solder Ball for IC Packaging market?
6. What are the growth factors driving the market demand?

Table of Contents

1 Supply Summary
    1.1 BGA Solder Ball for IC Packaging Introduction
    1.2 World BGA Solder Ball for IC Packaging Supply & Forecast
        1.2.1 World BGA Solder Ball for IC Packaging Production Value (2019 & 2023 & 2030)
        1.2.2 World BGA Solder Ball for IC Packaging Production (2019-2030)
        1.2.3 World BGA Solder Ball for IC Packaging Pricing Trends (2019-2030)
    1.3 World BGA Solder Ball for IC Packaging Production by Region (Based on Production Site)
        1.3.1 World BGA Solder Ball for IC Packaging Production Value by Region (2019-2030)
        1.3.2 World BGA Solder Ball for IC Packaging Production by Region (2019-2030)
        1.3.3 World BGA Solder Ball for IC Packaging Average Price by Region (2019-2030)
        1.3.4 North America BGA Solder Ball for IC Packaging Production (2019-2030)
        1.3.5 Europe BGA Solder Ball for IC Packaging Production (2019-2030)
        1.3.6 China BGA Solder Ball for IC Packaging Production (2019-2030)
        1.3.7 Japan BGA Solder Ball for IC Packaging Production (2019-2030)
    1.4 Market Drivers, Restraints and Trends
        1.4.1 BGA Solder Ball for IC Packaging Market Drivers
        1.4.2 Factors Affecting Demand
        1.4.3 BGA Solder Ball for IC Packaging Major Market Trends

2 Demand Summary
    2.1 World BGA Solder Ball for IC Packaging Demand (2019-2030)
    2.2 World BGA Solder Ball for IC Packaging Consumption by Region
        2.2.1 World BGA Solder Ball for IC Packaging Consumption by Region (2019-2024)
        2.2.2 World BGA Solder Ball for IC Packaging Consumption Forecast by Region (2025-2030)
    2.3 United States BGA Solder Ball for IC Packaging Consumption (2019-2030)
    2.4 China BGA Solder Ball for IC Packaging Consumption (2019-2030)
    2.5 Europe BGA Solder Ball for IC Packaging Consumption (2019-2030)
    2.6 Japan BGA Solder Ball for IC Packaging Consumption (2019-2030)
    2.7 South Korea BGA Solder Ball for IC Packaging Consumption (2019-2030)
    2.8 ASEAN BGA Solder Ball for IC Packaging Consumption (2019-2030)
    2.9 India BGA Solder Ball for IC Packaging Consumption (2019-2030)

3 World Manufacturers Competitive Analysis
    3.1 World BGA Solder Ball for IC Packaging Production Value by Manufacturer (2019-2024)
    3.2 World BGA Solder Ball for IC Packaging Production by Manufacturer (2019-2024)
    3.3 World BGA Solder Ball for IC Packaging Average Price by Manufacturer (2019-2024)
    3.4 BGA Solder Ball for IC Packaging Company Evaluation Quadrant
    3.5 Industry Rank and Concentration Rate (CR)
        3.5.1 Global BGA Solder Ball for IC Packaging Industry Rank of Major Manufacturers
        3.5.2 Global Concentration Ratios (CR4) for BGA Solder Ball for IC Packaging in 2023
        3.5.3 Global Concentration Ratios (CR8) for BGA Solder Ball for IC Packaging in 2023
    3.6 BGA Solder Ball for IC Packaging Market: Overall Company Footprint Analysis
        3.6.1 BGA Solder Ball for IC Packaging Market: Region Footprint
        3.6.2 BGA Solder Ball for IC Packaging Market: Company Product Type Footprint
        3.6.3 BGA Solder Ball for IC Packaging Market: Company Product Application Footprint
    3.7 Competitive Environment
        3.7.1 Historical Structure of the Industry
        3.7.2 Barriers of Market Entry
        3.7.3 Factors of Competition
    3.8 New Entrant and Capacity Expansion Plans
    3.9 Mergers, Acquisition, Agreements, and Collaborations

4 United States VS China VS Rest of the World
    4.1 United States VS China: BGA Solder Ball for IC Packaging Production Value Comparison
        4.1.1 United States VS China: BGA Solder Ball for IC Packaging Production Value Comparison (2019 & 2023 & 2030)
        4.1.2 United States VS China: BGA Solder Ball for IC Packaging Production Value Market Share Comparison (2019 & 2023 & 2030)
    4.2 United States VS China: BGA Solder Ball for IC Packaging Production Comparison
        4.2.1 United States VS China: BGA Solder Ball for IC Packaging Production Comparison (2019 & 2023 & 2030)
        4.2.2 United States VS China: BGA Solder Ball for IC Packaging Production Market Share Comparison (2019 & 2023 & 2030)
    4.3 United States VS China: BGA Solder Ball for IC Packaging Consumption Comparison
        4.3.1 United States VS China: BGA Solder Ball for IC Packaging Consumption Comparison (2019 & 2023 & 2030)
        4.3.2 United States VS China: BGA Solder Ball for IC Packaging Consumption Market Share Comparison (2019 & 2023 & 2030)
    4.4 United States Based BGA Solder Ball for IC Packaging Manufacturers and Market Share, 2019-2024
        4.4.1 United States Based BGA Solder Ball for IC Packaging Manufacturers, Headquarters and Production Site (States, Country)
        4.4.2 United States Based Manufacturers BGA Solder Ball for IC Packaging Production Value (2019-2024)
        4.4.3 United States Based Manufacturers BGA Solder Ball for IC Packaging Production (2019-2024)
    4.5 China Based BGA Solder Ball for IC Packaging Manufacturers and Market Share
        4.5.1 China Based BGA Solder Ball for IC Packaging Manufacturers, Headquarters and Production Site (Province, Country)
        4.5.2 China Based Manufacturers BGA Solder Ball for IC Packaging Production Value (2019-2024)
        4.5.3 China Based Manufacturers BGA Solder Ball for IC Packaging Production (2019-2024)
    4.6 Rest of World Based BGA Solder Ball for IC Packaging Manufacturers and Market Share, 2019-2024
        4.6.1 Rest of World Based BGA Solder Ball for IC Packaging Manufacturers, Headquarters and Production Site (State, Country)
        4.6.2 Rest of World Based Manufacturers BGA Solder Ball for IC Packaging Production Value (2019-2024)
        4.6.3 Rest of World Based Manufacturers BGA Solder Ball for IC Packaging Production (2019-2024)

5 Market Analysis by Type
    5.1 World BGA Solder Ball for IC Packaging Market Size Overview by Type: 2019 VS 2023 VS 2030
    5.2 Segment Introduction by Type
        5.2.1 Lead-Free Solder Ball
        5.2.2 Lead Solder Ball
    5.3 Market Segment by Type
        5.3.1 World BGA Solder Ball for IC Packaging Production by Type (2019-2030)
        5.3.2 World BGA Solder Ball for IC Packaging Production Value by Type (2019-2030)
        5.3.3 World BGA Solder Ball for IC Packaging Average Price by Type (2019-2030)

6 Market Analysis by Application
    6.1 World BGA Solder Ball for IC Packaging Market Size Overview by Application: 2019 VS 2023 VS 2030
    6.2 Segment Introduction by Application
        6.2.1 PBGA
        6.2.2 FCBGA
        6.2.3 CBGA
        6.2.4 TBGA
    6.3 Market Segment by Application
        6.3.1 World BGA Solder Ball for IC Packaging Production by Application (2019-2030)
        6.3.2 World BGA Solder Ball for IC Packaging Production Value by Application (2019-2030)
        6.3.3 World BGA Solder Ball for IC Packaging Average Price by Application (2019-2030)

7 Company Profiles
    7.1 Senju Metal
        7.1.1 Senju Metal Details
        7.1.2 Senju Metal Major Business
        7.1.3 Senju Metal BGA Solder Ball for IC Packaging Product and Services
        7.1.4 Senju Metal BGA Solder Ball for IC Packaging Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.1.5 Senju Metal Recent Developments/Updates
        7.1.6 Senju Metal Competitive Strengths & Weaknesses
    7.2 Accurus Scientific.
        7.2.1 Accurus Scientific. Details
        7.2.2 Accurus Scientific. Major Business
        7.2.3 Accurus Scientific. BGA Solder Ball for IC Packaging Product and Services
        7.2.4 Accurus Scientific. BGA Solder Ball for IC Packaging Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.2.5 Accurus Scientific. Recent Developments/Updates
        7.2.6 Accurus Scientific. Competitive Strengths & Weaknesses
    7.3 DS HiMetal
        7.3.1 DS HiMetal Details
        7.3.2 DS HiMetal Major Business
        7.3.3 DS HiMetal BGA Solder Ball for IC Packaging Product and Services
        7.3.4 DS HiMetal BGA Solder Ball for IC Packaging Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.3.5 DS HiMetal Recent Developments/Updates
        7.3.6 DS HiMetal Competitive Strengths & Weaknesses
    7.4 Nippon Micrometal Corporation
        7.4.1 Nippon Micrometal Corporation Details
        7.4.2 Nippon Micrometal Corporation Major Business
        7.4.3 Nippon Micrometal Corporation BGA Solder Ball for IC Packaging Product and Services
        7.4.4 Nippon Micrometal Corporation BGA Solder Ball for IC Packaging Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.4.5 Nippon Micrometal Corporation Recent Developments/Updates
        7.4.6 Nippon Micrometal Corporation Competitive Strengths & Weaknesses
    7.5 MK Electron
        7.5.1 MK Electron Details
        7.5.2 MK Electron Major Business
        7.5.3 MK Electron BGA Solder Ball for IC Packaging Product and Services
        7.5.4 MK Electron BGA Solder Ball for IC Packaging Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.5.5 MK Electron Recent Developments/Updates
        7.5.6 MK Electron Competitive Strengths & Weaknesses
    7.6 Yunnan Tin
        7.6.1 Yunnan Tin Details
        7.6.2 Yunnan Tin Major Business
        7.6.3 Yunnan Tin BGA Solder Ball for IC Packaging Product and Services
        7.6.4 Yunnan Tin BGA Solder Ball for IC Packaging Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.6.5 Yunnan Tin Recent Developments/Updates
        7.6.6 Yunnan Tin Competitive Strengths & Weaknesses
    7.7 PhiChem Corporation
        7.7.1 PhiChem Corporation Details
        7.7.2 PhiChem Corporation Major Business
        7.7.3 PhiChem Corporation BGA Solder Ball for IC Packaging Product and Services
        7.7.4 PhiChem Corporation BGA Solder Ball for IC Packaging Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.7.5 PhiChem Corporation Recent Developments/Updates
        7.7.6 PhiChem Corporation Competitive Strengths & Weaknesses
    7.8 Ishikawa Metal
        7.8.1 Ishikawa Metal Details
        7.8.2 Ishikawa Metal Major Business
        7.8.3 Ishikawa Metal BGA Solder Ball for IC Packaging Product and Services
        7.8.4 Ishikawa Metal BGA Solder Ball for IC Packaging Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.8.5 Ishikawa Metal Recent Developments/Updates
        7.8.6 Ishikawa Metal Competitive Strengths & Weaknesses
    7.9 Fukuda Metal Foil & Powder
        7.9.1 Fukuda Metal Foil & Powder Details
        7.9.2 Fukuda Metal Foil & Powder Major Business
        7.9.3 Fukuda Metal Foil & Powder BGA Solder Ball for IC Packaging Product and Services
        7.9.4 Fukuda Metal Foil & Powder BGA Solder Ball for IC Packaging Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.9.5 Fukuda Metal Foil & Powder Recent Developments/Updates
        7.9.6 Fukuda Metal Foil & Powder Competitive Strengths & Weaknesses
    7.10 MATSUDA SANGYO
        7.10.1 MATSUDA SANGYO Details
        7.10.2 MATSUDA SANGYO Major Business
        7.10.3 MATSUDA SANGYO BGA Solder Ball for IC Packaging Product and Services
        7.10.4 MATSUDA SANGYO BGA Solder Ball for IC Packaging Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.10.5 MATSUDA SANGYO Recent Developments/Updates
        7.10.6 MATSUDA SANGYO Competitive Strengths & Weaknesses
    7.11 SHEN MAO TECHNOLOGY
        7.11.1 SHEN MAO TECHNOLOGY Details
        7.11.2 SHEN MAO TECHNOLOGY Major Business
        7.11.3 SHEN MAO TECHNOLOGY BGA Solder Ball for IC Packaging Product and Services
        7.11.4 SHEN MAO TECHNOLOGY BGA Solder Ball for IC Packaging Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.11.5 SHEN MAO TECHNOLOGY Recent Developments/Updates
        7.11.6 SHEN MAO TECHNOLOGY Competitive Strengths & Weaknesses
    7.12 Fonton Industrial
        7.12.1 Fonton Industrial Details
        7.12.2 Fonton Industrial Major Business
        7.12.3 Fonton Industrial BGA Solder Ball for IC Packaging Product and Services
        7.12.4 Fonton Industrial BGA Solder Ball for IC Packaging Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.12.5 Fonton Industrial Recent Developments/Updates
        7.12.6 Fonton Industrial Competitive Strengths & Weaknesses

8 Industry Chain Analysis
    8.1 BGA Solder Ball for IC Packaging Industry Chain
    8.2 BGA Solder Ball for IC Packaging Upstream Analysis
        8.2.1 BGA Solder Ball for IC Packaging Core Raw Materials
        8.2.2 Main Manufacturers of BGA Solder Ball for IC Packaging Core Raw Materials
    8.3 Midstream Analysis
    8.4 Downstream Analysis
    8.5 BGA Solder Ball for IC Packaging Production Mode
    8.6 BGA Solder Ball for IC Packaging Procurement Model
    8.7 BGA Solder Ball for IC Packaging Industry Sales Model and Sales Channels
        8.7.1 BGA Solder Ball for IC Packaging Sales Model
        8.7.2 BGA Solder Ball for IC Packaging Typical Distributors

9 Research Findings and Conclusion

10 Appendix
    10.1 Methodology
    10.2 Research Process and Data Source
    10.3 Disclaimer

Table of Figures

List of Tables
 Table 1. World BGA Solder Ball for IC Packaging Production Value by Region (2019, 2023 and 2030) & (USD Million)
 Table 2. World BGA Solder Ball for IC Packaging Production Value by Region (2019-2024) & (USD Million)
 Table 3. World BGA Solder Ball for IC Packaging Production Value by Region (2025-2030) & (USD Million)
 Table 4. World BGA Solder Ball for IC Packaging Production Value Market Share by Region (2019-2024)
 Table 5. World BGA Solder Ball for IC Packaging Production Value Market Share by Region (2025-2030)
 Table 6. World BGA Solder Ball for IC Packaging Production by Region (2019-2024) & (Units)
 Table 7. World BGA Solder Ball for IC Packaging Production by Region (2025-2030) & (Units)
 Table 8. World BGA Solder Ball for IC Packaging Production Market Share by Region (2019-2024)
 Table 9. World BGA Solder Ball for IC Packaging Production Market Share by Region (2025-2030)
 Table 10. World BGA Solder Ball for IC Packaging Average Price by Region (2019-2024) & (US$/Unit)
 Table 11. World BGA Solder Ball for IC Packaging Average Price by Region (2025-2030) & (US$/Unit)
 Table 12. BGA Solder Ball for IC Packaging Major Market Trends
 Table 13. World BGA Solder Ball for IC Packaging Consumption Growth Rate Forecast by Region (2019 & 2023 & 2030) & (Units)
 Table 14. World BGA Solder Ball for IC Packaging Consumption by Region (2019-2024) & (Units)
 Table 15. World BGA Solder Ball for IC Packaging Consumption Forecast by Region (2025-2030) & (Units)
 Table 16. World BGA Solder Ball for IC Packaging Production Value by Manufacturer (2019-2024) & (USD Million)
 Table 17. Production Value Market Share of Key BGA Solder Ball for IC Packaging Producers in 2023
 Table 18. World BGA Solder Ball for IC Packaging Production by Manufacturer (2019-2024) & (Units)
 Table 19. Production Market Share of Key BGA Solder Ball for IC Packaging Producers in 2023
 Table 20. World BGA Solder Ball for IC Packaging Average Price by Manufacturer (2019-2024) & (US$/Unit)
 Table 21. Global BGA Solder Ball for IC Packaging Company Evaluation Quadrant
 Table 22. World BGA Solder Ball for IC Packaging Industry Rank of Major Manufacturers, Based on Production Value in 2023
 Table 23. Head Office and BGA Solder Ball for IC Packaging Production Site of Key Manufacturer
 Table 24. BGA Solder Ball for IC Packaging Market: Company Product Type Footprint
 Table 25. BGA Solder Ball for IC Packaging Market: Company Product Application Footprint
 Table 26. BGA Solder Ball for IC Packaging Competitive Factors
 Table 27. BGA Solder Ball for IC Packaging New Entrant and Capacity Expansion Plans
 Table 28. BGA Solder Ball for IC Packaging Mergers & Acquisitions Activity
 Table 29. United States VS China BGA Solder Ball for IC Packaging Production Value Comparison, (2019 & 2023 & 2030) & (USD Million)
 Table 30. United States VS China BGA Solder Ball for IC Packaging Production Comparison, (2019 & 2023 & 2030) & (Units)
 Table 31. United States VS China BGA Solder Ball for IC Packaging Consumption Comparison, (2019 & 2023 & 2030) & (Units)
 Table 32. United States Based BGA Solder Ball for IC Packaging Manufacturers, Headquarters and Production Site (States, Country)
 Table 33. United States Based Manufacturers BGA Solder Ball for IC Packaging Production Value, (2019-2024) & (USD Million)
 Table 34. United States Based Manufacturers BGA Solder Ball for IC Packaging Production Value Market Share (2019-2024)
 Table 35. United States Based Manufacturers BGA Solder Ball for IC Packaging Production (2019-2024) & (Units)
 Table 36. United States Based Manufacturers BGA Solder Ball for IC Packaging Production Market Share (2019-2024)
 Table 37. China Based BGA Solder Ball for IC Packaging Manufacturers, Headquarters and Production Site (Province, Country)
 Table 38. China Based Manufacturers BGA Solder Ball for IC Packaging Production Value, (2019-2024) & (USD Million)
 Table 39. China Based Manufacturers BGA Solder Ball for IC Packaging Production Value Market Share (2019-2024)
 Table 40. China Based Manufacturers BGA Solder Ball for IC Packaging Production, (2019-2024) & (Units)
 Table 41. China Based Manufacturers BGA Solder Ball for IC Packaging Production Market Share (2019-2024)
 Table 42. Rest of World Based BGA Solder Ball for IC Packaging Manufacturers, Headquarters and Production Site (State, Country)
 Table 43. Rest of World Based Manufacturers BGA Solder Ball for IC Packaging Production Value, (2019-2024) & (USD Million)
 Table 44. Rest of World Based Manufacturers BGA Solder Ball for IC Packaging Production Value Market Share (2019-2024)
 Table 45. Rest of World Based Manufacturers BGA Solder Ball for IC Packaging Production, (2019-2024) & (Units)
 Table 46. Rest of World Based Manufacturers BGA Solder Ball for IC Packaging Production Market Share (2019-2024)
 Table 47. World BGA Solder Ball for IC Packaging Production Value by Type, (USD Million), 2019 & 2023 & 2030
 Table 48. World BGA Solder Ball for IC Packaging Production by Type (2019-2024) & (Units)
 Table 49. World BGA Solder Ball for IC Packaging Production by Type (2025-2030) & (Units)
 Table 50. World BGA Solder Ball for IC Packaging Production Value by Type (2019-2024) & (USD Million)
 Table 51. World BGA Solder Ball for IC Packaging Production Value by Type (2025-2030) & (USD Million)
 Table 52. World BGA Solder Ball for IC Packaging Average Price by Type (2019-2024) & (US$/Unit)
 Table 53. World BGA Solder Ball for IC Packaging Average Price by Type (2025-2030) & (US$/Unit)
 Table 54. World BGA Solder Ball for IC Packaging Production Value by Application, (USD Million), 2019 & 2023 & 2030
 Table 55. World BGA Solder Ball for IC Packaging Production by Application (2019-2024) & (Units)
 Table 56. World BGA Solder Ball for IC Packaging Production by Application (2025-2030) & (Units)
 Table 57. World BGA Solder Ball for IC Packaging Production Value by Application (2019-2024) & (USD Million)
 Table 58. World BGA Solder Ball for IC Packaging Production Value by Application (2025-2030) & (USD Million)
 Table 59. World BGA Solder Ball for IC Packaging Average Price by Application (2019-2024) & (US$/Unit)
 Table 60. World BGA Solder Ball for IC Packaging Average Price by Application (2025-2030) & (US$/Unit)
 Table 61. Senju Metal Basic Information, Manufacturing Base and Competitors
 Table 62. Senju Metal Major Business
 Table 63. Senju Metal BGA Solder Ball for IC Packaging Product and Services
 Table 64. Senju Metal BGA Solder Ball for IC Packaging Production (Units), Price (US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 65. Senju Metal Recent Developments/Updates
 Table 66. Senju Metal Competitive Strengths & Weaknesses
 Table 67. Accurus Scientific. Basic Information, Manufacturing Base and Competitors
 Table 68. Accurus Scientific. Major Business
 Table 69. Accurus Scientific. BGA Solder Ball for IC Packaging Product and Services
 Table 70. Accurus Scientific. BGA Solder Ball for IC Packaging Production (Units), Price (US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 71. Accurus Scientific. Recent Developments/Updates
 Table 72. Accurus Scientific. Competitive Strengths & Weaknesses
 Table 73. DS HiMetal Basic Information, Manufacturing Base and Competitors
 Table 74. DS HiMetal Major Business
 Table 75. DS HiMetal BGA Solder Ball for IC Packaging Product and Services
 Table 76. DS HiMetal BGA Solder Ball for IC Packaging Production (Units), Price (US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 77. DS HiMetal Recent Developments/Updates
 Table 78. DS HiMetal Competitive Strengths & Weaknesses
 Table 79. Nippon Micrometal Corporation Basic Information, Manufacturing Base and Competitors
 Table 80. Nippon Micrometal Corporation Major Business
 Table 81. Nippon Micrometal Corporation BGA Solder Ball for IC Packaging Product and Services
 Table 82. Nippon Micrometal Corporation BGA Solder Ball for IC Packaging Production (Units), Price (US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 83. Nippon Micrometal Corporation Recent Developments/Updates
 Table 84. Nippon Micrometal Corporation Competitive Strengths & Weaknesses
 Table 85. MK Electron Basic Information, Manufacturing Base and Competitors
 Table 86. MK Electron Major Business
 Table 87. MK Electron BGA Solder Ball for IC Packaging Product and Services
 Table 88. MK Electron BGA Solder Ball for IC Packaging Production (Units), Price (US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 89. MK Electron Recent Developments/Updates
 Table 90. MK Electron Competitive Strengths & Weaknesses
 Table 91. Yunnan Tin Basic Information, Manufacturing Base and Competitors
 Table 92. Yunnan Tin Major Business
 Table 93. Yunnan Tin BGA Solder Ball for IC Packaging Product and Services
 Table 94. Yunnan Tin BGA Solder Ball for IC Packaging Production (Units), Price (US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 95. Yunnan Tin Recent Developments/Updates
 Table 96. Yunnan Tin Competitive Strengths & Weaknesses
 Table 97. PhiChem Corporation Basic Information, Manufacturing Base and Competitors
 Table 98. PhiChem Corporation Major Business
 Table 99. PhiChem Corporation BGA Solder Ball for IC Packaging Product and Services
 Table 100. PhiChem Corporation BGA Solder Ball for IC Packaging Production (Units), Price (US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 101. PhiChem Corporation Recent Developments/Updates
 Table 102. PhiChem Corporation Competitive Strengths & Weaknesses
 Table 103. Ishikawa Metal Basic Information, Manufacturing Base and Competitors
 Table 104. Ishikawa Metal Major Business
 Table 105. Ishikawa Metal BGA Solder Ball for IC Packaging Product and Services
 Table 106. Ishikawa Metal BGA Solder Ball for IC Packaging Production (Units), Price (US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 107. Ishikawa Metal Recent Developments/Updates
 Table 108. Ishikawa Metal Competitive Strengths & Weaknesses
 Table 109. Fukuda Metal Foil & Powder Basic Information, Manufacturing Base and Competitors
 Table 110. Fukuda Metal Foil & Powder Major Business
 Table 111. Fukuda Metal Foil & Powder BGA Solder Ball for IC Packaging Product and Services
 Table 112. Fukuda Metal Foil & Powder BGA Solder Ball for IC Packaging Production (Units), Price (US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 113. Fukuda Metal Foil & Powder Recent Developments/Updates
 Table 114. Fukuda Metal Foil & Powder Competitive Strengths & Weaknesses
 Table 115. MATSUDA SANGYO Basic Information, Manufacturing Base and Competitors
 Table 116. MATSUDA SANGYO Major Business
 Table 117. MATSUDA SANGYO BGA Solder Ball for IC Packaging Product and Services
 Table 118. MATSUDA SANGYO BGA Solder Ball for IC Packaging Production (Units), Price (US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 119. MATSUDA SANGYO Recent Developments/Updates
 Table 120. MATSUDA SANGYO Competitive Strengths & Weaknesses
 Table 121. SHEN MAO TECHNOLOGY Basic Information, Manufacturing Base and Competitors
 Table 122. SHEN MAO TECHNOLOGY Major Business
 Table 123. SHEN MAO TECHNOLOGY BGA Solder Ball for IC Packaging Product and Services
 Table 124. SHEN MAO TECHNOLOGY BGA Solder Ball for IC Packaging Production (Units), Price (US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 125. SHEN MAO TECHNOLOGY Recent Developments/Updates
 Table 126. SHEN MAO TECHNOLOGY Competitive Strengths & Weaknesses
 Table 127. Fonton Industrial Basic Information, Manufacturing Base and Competitors
 Table 128. Fonton Industrial Major Business
 Table 129. Fonton Industrial BGA Solder Ball for IC Packaging Product and Services
 Table 130. Fonton Industrial BGA Solder Ball for IC Packaging Production (Units), Price (US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 131. Fonton Industrial Recent Developments/Updates
 Table 132. Fonton Industrial Competitive Strengths & Weaknesses
 Table 133. Global Key Players of BGA Solder Ball for IC Packaging Upstream (Raw Materials)
 Table 134. Global BGA Solder Ball for IC Packaging Typical Customers
 Table 135. BGA Solder Ball for IC Packaging Typical Distributors


List of Figures
 Figure 1. BGA Solder Ball for IC Packaging Picture
 Figure 2. World BGA Solder Ball for IC Packaging Production Value: 2019 & 2023 & 2030, (USD Million)
 Figure 3. World BGA Solder Ball for IC Packaging Production Value and Forecast (2019-2030) & (USD Million)
 Figure 4. World BGA Solder Ball for IC Packaging Production (2019-2030) & (Units)
 Figure 5. World BGA Solder Ball for IC Packaging Average Price (2019-2030) & (US$/Unit)
 Figure 6. World BGA Solder Ball for IC Packaging Production Value Market Share by Region (2019-2030)
 Figure 7. World BGA Solder Ball for IC Packaging Production Market Share by Region (2019-2030)
 Figure 8. North America BGA Solder Ball for IC Packaging Production (2019-2030) & (Units)
 Figure 9. Europe BGA Solder Ball for IC Packaging Production (2019-2030) & (Units)
 Figure 10. China BGA Solder Ball for IC Packaging Production (2019-2030) & (Units)
 Figure 11. Japan BGA Solder Ball for IC Packaging Production (2019-2030) & (Units)
 Figure 12. BGA Solder Ball for IC Packaging Market Drivers
 Figure 13. Factors Affecting Demand
 Figure 14. World BGA Solder Ball for IC Packaging Consumption (2019-2030) & (Units)
 Figure 15. World BGA Solder Ball for IC Packaging Consumption Market Share by Region (2019-2030)
 Figure 16. United States BGA Solder Ball for IC Packaging Consumption (2019-2030) & (Units)
 Figure 17. China BGA Solder Ball for IC Packaging Consumption (2019-2030) & (Units)
 Figure 18. Europe BGA Solder Ball for IC Packaging Consumption (2019-2030) & (Units)
 Figure 19. Japan BGA Solder Ball for IC Packaging Consumption (2019-2030) & (Units)
 Figure 20. South Korea BGA Solder Ball for IC Packaging Consumption (2019-2030) & (Units)
 Figure 21. ASEAN BGA Solder Ball for IC Packaging Consumption (2019-2030) & (Units)
 Figure 22. India BGA Solder Ball for IC Packaging Consumption (2019-2030) & (Units)
 Figure 23. Producer Shipments of BGA Solder Ball for IC Packaging by Manufacturer Revenue ($MM) and Market Share (%): 2023
 Figure 24. Global Four-firm Concentration Ratios (CR4) for BGA Solder Ball for IC Packaging Markets in 2023
 Figure 25. Global Four-firm Concentration Ratios (CR8) for BGA Solder Ball for IC Packaging Markets in 2023
 Figure 26. United States VS China: BGA Solder Ball for IC Packaging Production Value Market Share Comparison (2019 & 2023 & 2030)
 Figure 27. United States VS China: BGA Solder Ball for IC Packaging Production Market Share Comparison (2019 & 2023 & 2030)
 Figure 28. United States VS China: BGA Solder Ball for IC Packaging Consumption Market Share Comparison (2019 & 2023 & 2030)
 Figure 29. United States Based Manufacturers BGA Solder Ball for IC Packaging Production Market Share 2023
 Figure 30. China Based Manufacturers BGA Solder Ball for IC Packaging Production Market Share 2023
 Figure 31. Rest of World Based Manufacturers BGA Solder Ball for IC Packaging Production Market Share 2023
 Figure 32. World BGA Solder Ball for IC Packaging Production Value by Type, (USD Million), 2019 & 2023 & 2030
 Figure 33. World BGA Solder Ball for IC Packaging Production Value Market Share by Type in 2023
 Figure 34. Lead-Free Solder Ball
 Figure 35. Lead Solder Ball
 Figure 36. World BGA Solder Ball for IC Packaging Production Market Share by Type (2019-2030)
 Figure 37. World BGA Solder Ball for IC Packaging Production Value Market Share by Type (2019-2030)
 Figure 38. World BGA Solder Ball for IC Packaging Average Price by Type (2019-2030) & (US$/Unit)
 Figure 39. World BGA Solder Ball for IC Packaging Production Value by Application, (USD Million), 2019 & 2023 & 2030
 Figure 40. World BGA Solder Ball for IC Packaging Production Value Market Share by Application in 2023
 Figure 41. PBGA
 Figure 42. FCBGA
 Figure 43. CBGA
 Figure 44. TBGA
 Figure 45. World BGA Solder Ball for IC Packaging Production Market Share by Application (2019-2030)
 Figure 46. World BGA Solder Ball for IC Packaging Production Value Market Share by Application (2019-2030)
 Figure 47. World BGA Solder Ball for IC Packaging Average Price by Application (2019-2030) & (US$/Unit)
 Figure 48. BGA Solder Ball for IC Packaging Industry Chain
 Figure 49. BGA Solder Ball for IC Packaging Procurement Model
 Figure 50. BGA Solder Ball for IC Packaging Sales Model
 Figure 51. BGA Solder Ball for IC Packaging Sales Channels, Direct Sales, and Distribution
 Figure 52. Methodology
 Figure 53. Research Process and Data Source

Research Methodology

Client Requirements

Review and analyze client requirements

Discussion of all the project requirements and queries

Flexibility Check

Project Feasibility Analysis

Finalizing tentative research programme

Structuring project proposal with scope, timeline, and costs

Analyzing Market Dynamics

Determination of key drivers, restraints, challenge, and opportunity

Identifies market needs and trends

Market Size Estimation & Forecast

Estimation of historical data based on secondary and primary data

Anticipating market recast by assigning weightage to market forces (drivers, restraints, opportunities)

Freezing historical and forecast market size estimations based on evolution, trends, outlook, and strategies

Consideration of geography, region-specific product/service demand for region segments

Consideration of product utilization rates, product demand outlook for segments by application or end-user.

Data Source

Secondary Source
Data collections from annual reports, presentations,associations, journals, analyst reports, paid database, press releases, blogs, newsletters,and GIR repositories.

Primary Source
Research discussion with manufacturers, distributors, suppliers, end user, industry experts to verify insights.

Validation and
triangulation of
secondary and primary source.

Collection of data

Cumulating and collating the essential qualitative and quantitative data

Generation of report in client requested format by research analysts

Reviews by expert analysts

Final quality check

Clarifying queries

Receiving feedback

Ensuring satisfaction

01 Identification of data

This step involves identification of several primary and secondary data research sources, including Global Info Research's internal data sources. The primary sources consist of in-depth discussions and interviews with policy makers, industry experts, and data evaluators, whereas secondary sources include a thorough study of market journals, press releases, annual reports, and government and non-government agencies websites.
02 Evaluation of Market Dynamic

This phase includes a detailed evaluation of several factors that are likely to affect the market dynamics. It involves a comprehensive assessment of major market pain points, drivers, and trends. It also comprises a detailed study of research plans and methodology.
03 Collection of Data

This process consists of gathering data, accessing proprietary databases, and reaching out to key industry participants that operate in the market across the value chain. It also involves studying several patterns in the historical data and comparing it with the current scenario.
04 Collaboration of Data

This stage involves the validation of data and arrival at actual statistics, and evolution of the market over the years. It entails the study and analyzes various segments and verticals of the market. An impact analysis is also performed to observe which factors will affect the market in the next few years.
05 Verification and Analysis

This is the final stage, which involves both quantity and quality checks. Although the process of data verification is an integral part of the research process, all data points and statistics and figures are re-checked to uphold their authenticity and validity.

Companies Mentioned

Senju Metal
Accurus Scientific.
DS HiMetal
Nippon Micrometal Corporation
MK Electron
Yunnan Tin
PhiChem Corporation
Ishikawa Metal
Fukuda Metal Foil & Powder
MATSUDA SANGYO
SHEN MAO TECHNOLOGY
Fonton Industrial

Related Reports

Global BGA Solder Ball for IC Packaging Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

Global BGA Solder Ball for IC Packaging Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

date 12 Aug 2024

date Chemical & Material

According to our (Global Info Research) latest study, the global BGA Solder Ball for IC Packaging market size was valued at US$ 1556 million in 2023 and is forecast to a readjusted size of USD 2392 million by 2030 with a CAGR of 6.3% during review period.

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