Global Semiconductor IC Design, Manufacturing, Packaging and Testing Supply, Demand and Key Producers, 2024-2030

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Published Date: 15 Aug 2024

Category: Electronics & Semiconductor

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Description
Table of Contents
Table of Figures
Research Methodology
Companies Mentioned
Related Reports
Product Tags

Description

The semiconductor supply chain involves a complex network of companies, organizations, and individuals involved in the design, manufacturing, Semiconductor Test and Packaging, Semiconductor Equipment and Materials.

This report studies the semiconductor IC Design (IDM and fabless), IC Manufacturing (foundries and IDM), IC Packaging and IC Testing (OSAT and IDM).

Key IC design companies include NVIDIA, Qualcomm, Broadcom, Advanced Micro Devices, Inc. (AMD), MediaTek, Marvell Technology Group, Novatek Microelectronics Corp., Tsinghua Unigroup, Realtek Semiconductor Corporation and OmniVision Technology, Inc.

Key IC manufacturing/wafer fabrication companies are TSMC, Samsung Foundry, GlobalFoundries, United Microelectronics Corporation (UMC), SMIC, Tower Semiconductor, PSMC, VIS (Vanguard International Semiconductor), and Hua Hong Semiconductor, etc.

Key IDMs include Samsung, Intel, SK Hynix, Micron Technology, Texas Instruments (TI), STMicroelectronics, Kioxia, Sony Semiconductor Solutions Corporation (SSS), Infineon, NXP, Analog Devices, Inc. (ADI), Renesas Electronics, Microchip Technology and Onsemi, etc.

Key Assembly, Test, and Packaging (OSAT) companies include ASE (SPIL), Amkor, JCET (STATS ChipPAC), Tongfu Microelectronics (TFME), Powertech Technology Inc. (PTI), HT-tech, King Yuan Electronics Corp. (KYEC), ChipMOS TECHNOLOGIES and Chipbond Technology, etc.

The global Semiconductor IC Design, Manufacturing, Packaging and Testing market size is expected to reach $ 1169010 million by 2030, rising at a market growth of 5.3% CAGR during the forecast period (2024-2030).

This report studies the global Semiconductor IC Design, Manufacturing, Packaging and Testing demand, key companies, and key regions.

This report is a detailed and comprehensive analysis of the world market for Semiconductor IC Design, Manufacturing, Packaging and Testing, and provides market size (US$ million) and Year-over-Year (YoY) growth, considering 2023 as the base year. This report explores demand trends and competition, as well as details the characteristics of Semiconductor IC Design, Manufacturing, Packaging and Testing that contribute to its increasing demand across many markets.

Highlights and key features of the study
Global Semiconductor IC Design, Manufacturing, Packaging and Testing total market, 2019-2030, (USD Million)
Global Semiconductor IC Design, Manufacturing, Packaging and Testing total market by region & country, CAGR, 2019-2030, (USD Million)
U.S. VS China: Semiconductor IC Design, Manufacturing, Packaging and Testing total market, key domestic companies, and share, (USD Million)
Global Semiconductor IC Design, Manufacturing, Packaging and Testing revenue by player, revenue and market share 2019-2024, (USD Million)
Global Semiconductor IC Design, Manufacturing, Packaging and Testing total market by Type, CAGR, 2019-2030, (USD Million)
Global Semiconductor IC Design, Manufacturing, Packaging and Testing total market by Application, CAGR, 2019-2030, (USD Million)
This report profiles major players in the global Semiconductor IC Design, Manufacturing, Packaging and Testing market based on the following parameters - company overview, revenue, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Samsung-Memory, Intel, SK Hynix, Micron Technology, Texas Instruments (TI), STMicroelectronics, Kioxia, Sony Semiconductor Solutions Corporation (SSS), Infineon, NXP, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the world Semiconductor IC Design, Manufacturing, Packaging and Testing market
Detailed Segmentation:
Each section contains quantitative market data including market by value (US$ Millions), by player, by regions, by Type, and by Application. Data is given for the years 2019-2030 by year with 2023 as the base year, 2024 as the estimate year, and 2025-2030 as the forecast year.

Global Semiconductor IC Design, Manufacturing, Packaging and Testing Market, By Region:
United States
China
Europe
Japan
South Korea
ASEAN
India
Rest of World

Global Semiconductor IC Design, Manufacturing, Packaging and Testing Market, Segmentation by Type
IC Design
IC Manufacturing
IC Packaging & Testing

Global Semiconductor IC Design, Manufacturing, Packaging and Testing Market, Segmentation by Application:
Communication
Computer/PC
Consumer
Automotive
Industrial
Others

Companies Profiled:
Samsung-Memory
Intel
SK Hynix
Micron Technology
Texas Instruments (TI)
STMicroelectronics
Kioxia
Sony Semiconductor Solutions Corporation (SSS)
Infineon
NXP
Analog Devices, Inc. (ADI)
Renesas Electronics
Microchip Technology
Onsemi
NVIDIA
Qualcomm
Broadcom
Advanced Micro Devices, Inc. (AMD)
MediaTek
Marvell Technology Group
Novatek Microelectronics Corp.
Tsinghua Unigroup
Realtek Semiconductor Corporation
OmniVision Technology, Inc
Monolithic Power Systems, Inc. (MPS)
Cirrus Logic, Inc.
Socionext Inc.
LX Semicon
HiSilicon Technologies
TSMC
Samsung Foundry
GlobalFoundries
United Microelectronics Corporation (UMC)
SMIC
Tower Semiconductor
PSMC
VIS (Vanguard International Semiconductor)
Hua Hong Semiconductor
HLMC
ASE (SPIL)
Amkor
JCET (STATS ChipPAC)
Tongfu Microelectronics (TFME)
Powertech Technology Inc. (PTI)
HT-tech
King Yuan Electronics Corp. (KYEC)
ChipMOS TECHNOLOGIES
SFA Semicon
Chipbond Technology Corporation
UTAC
ASML
TEL (Tokyo Electron Ltd.)
Lam Research
KLA
Nikon
Carsem
SFA Semicon
Forehope Electronic (Ningbo) Co.,Ltd.
Unisem Group
OSE CORP.

Key Questions Answered
1. How big is the global Semiconductor IC Design, Manufacturing, Packaging and Testing market?
2. What is the demand of the global Semiconductor IC Design, Manufacturing, Packaging and Testing market?
3. What is the year over year growth of the global Semiconductor IC Design, Manufacturing, Packaging and Testing market?
4. What is the total value of the global Semiconductor IC Design, Manufacturing, Packaging and Testing market?
5. Who are the Major Players in the global Semiconductor IC Design, Manufacturing, Packaging and Testing market?
6. What are the growth factors driving the market demand?

Table of Contents

1 Supply Summary
    1.1 Semiconductor IC Design, Manufacturing, Packaging and Testing Introduction
    1.2 World Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size & Forecast (2019 & 2023 & 2030)
    1.3 World Semiconductor IC Design, Manufacturing, Packaging and Testing Total Market by Region (by Headquarter Location)
        1.3.1 World Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size by Region (2019-2030), (by Headquarter Location)
        1.3.2 United States Based Company Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue (2019-2030)
        1.3.3 China Based Company Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue (2019-2030)
        1.3.4 Europe Based Company Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue (2019-2030)
        1.3.5 Japan Based Company Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue (2019-2030)
        1.3.6 South Korea Based Company Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue (2019-2030)
        1.3.7 ASEAN Based Company Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue (2019-2030)
        1.3.8 India Based Company Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue (2019-2030)
    1.4 Market Drivers, Restraints and Trends
        1.4.1 Semiconductor IC Design, Manufacturing, Packaging and Testing Market Drivers
        1.4.2 Factors Affecting Demand
        1.4.3 Major Market Trends

2 Demand Summary
    2.1 World Semiconductor IC Design, Manufacturing, Packaging and Testing Consumption Value (2019-2030)
    2.2 World Semiconductor IC Design, Manufacturing, Packaging and Testing Consumption Value by Region
        2.2.1 World Semiconductor IC Design, Manufacturing, Packaging and Testing Consumption Value by Region (2019-2024)
        2.2.2 World Semiconductor IC Design, Manufacturing, Packaging and Testing Consumption Value Forecast by Region (2025-2030)
    2.3 United States Semiconductor IC Design, Manufacturing, Packaging and Testing Consumption Value (2019-2030)
    2.4 China Semiconductor IC Design, Manufacturing, Packaging and Testing Consumption Value (2019-2030)
    2.5 Europe Semiconductor IC Design, Manufacturing, Packaging and Testing Consumption Value (2019-2030)
    2.6 Japan Semiconductor IC Design, Manufacturing, Packaging and Testing Consumption Value (2019-2030)
    2.7 South Korea Semiconductor IC Design, Manufacturing, Packaging and Testing Consumption Value (2019-2030)
    2.8 ASEAN Semiconductor IC Design, Manufacturing, Packaging and Testing Consumption Value (2019-2030)
    2.9 India Semiconductor IC Design, Manufacturing, Packaging and Testing Consumption Value (2019-2030)

3 World Semiconductor IC Design, Manufacturing, Packaging and Testing Companies Competitive Analysis
    3.1 World Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue by Player (2019-2024)
    3.2 Industry Rank and Concentration Rate (CR)
        3.2.1 Global Semiconductor IC Design, Manufacturing, Packaging and Testing Industry Rank of Major Players
        3.2.2 Global Concentration Ratios (CR4) for Semiconductor IC Design, Manufacturing, Packaging and Testing in 2023
        3.2.3 Global Concentration Ratios (CR8) for Semiconductor IC Design, Manufacturing, Packaging and Testing in 2023
    3.3 Semiconductor IC Design, Manufacturing, Packaging and Testing Company Evaluation Quadrant
    3.4 Semiconductor IC Design, Manufacturing, Packaging and Testing Market: Overall Company Footprint Analysis
        3.4.1 Semiconductor IC Design, Manufacturing, Packaging and Testing Market: Region Footprint
        3.4.2 Semiconductor IC Design, Manufacturing, Packaging and Testing Market: Company Product Type Footprint
        3.4.3 Semiconductor IC Design, Manufacturing, Packaging and Testing Market: Company Product Application Footprint
    3.5 Competitive Environment
        3.5.1 Historical Structure of the Industry
        3.5.2 Barriers of Market Entry
        3.5.3 Factors of Competition
    3.6 Mergers & Acquisitions Activity

4 United States VS China VS Rest of World (by Headquarter Location)
    4.1 United States VS China: Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue Comparison (by Headquarter Location)
        4.1.1 United States VS China: Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue Comparison (2019 & 2023 & 2030) (by Headquarter Location)
        4.1.2 United States VS China: Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue Market Share Comparison (2019 & 2023 & 2030)
    4.2 United States Based Companies VS China Based Companies: Semiconductor IC Design, Manufacturing, Packaging and Testing Consumption Value Comparison
        4.2.1 United States VS China: Semiconductor IC Design, Manufacturing, Packaging and Testing Consumption Value Comparison (2019 & 2023 & 2030)
        4.2.2 United States VS China: Semiconductor IC Design, Manufacturing, Packaging and Testing Consumption Value Market Share Comparison (2019 & 2023 & 2030)
    4.3 United States Based Semiconductor IC Design, Manufacturing, Packaging and Testing Companies and Market Share, 2019-2024
        4.3.1 United States Based Semiconductor IC Design, Manufacturing, Packaging and Testing Companies, Headquarters (States, Country)
        4.3.2 United States Based Companies Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, (2019-2024)
    4.4 China Based Companies Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue and Market Share, 2019-2024
        4.4.1 China Based Semiconductor IC Design, Manufacturing, Packaging and Testing Companies, Company Headquarters (Province, Country)
        4.4.2 China Based Companies Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, (2019-2024)
    4.5 Rest of World Based Semiconductor IC Design, Manufacturing, Packaging and Testing Companies and Market Share, 2019-2024
        4.5.1 Rest of World Based Semiconductor IC Design, Manufacturing, Packaging and Testing Companies, Headquarters (Province, Country)
        4.5.2 Rest of World Based Companies Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue (2019-2024)

5 Market Analysis by Type
    5.1 World Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size Overview by Type: 2019 VS 2023 VS 2030
    5.2 Segment Introduction by Type
        5.2.1 IC Design
        5.2.2 IC Manufacturing
        5.2.3 IC Packaging & Testing
    5.3 Market Segment by Type
        5.3.1 World Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size by Type (2019-2024)
        5.3.2 World Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size by Type (2025-2030)
        5.3.3 World Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size Market Share by Type (2025-2030)

6 Market Analysis by Application
    6.1 World Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size Overview by Application: 2019 VS 2023 VS 2030
    6.2 Segment Introduction by Application
        6.2.1 Communication
        6.2.2 Computer/PC
        6.2.3 Consumer
        6.2.4 Automotive
        6.2.5 Industrial
        6.2.6 Others
    6.3 Market Segment by Application
        6.3.1 World Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size by Application (2019-2024)
        6.3.2 World Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size by Application (2025-2030)
        6.3.3 World Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size Market Share by Application (2019-2030)

7 Company Profiles
    7.1 Samsung-Memory
        7.1.1 Samsung-Memory Details
        7.1.2 Samsung-Memory Major Business
        7.1.3 Samsung-Memory Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
        7.1.4 Samsung-Memory Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024)
        7.1.5 Samsung-Memory Recent Developments/Updates
        7.1.6 Samsung-Memory Competitive Strengths & Weaknesses
    7.2 Intel
        7.2.1 Intel Details
        7.2.2 Intel Major Business
        7.2.3 Intel Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
        7.2.4 Intel Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024)
        7.2.5 Intel Recent Developments/Updates
        7.2.6 Intel Competitive Strengths & Weaknesses
    7.3 SK Hynix
        7.3.1 SK Hynix Details
        7.3.2 SK Hynix Major Business
        7.3.3 SK Hynix Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
        7.3.4 SK Hynix Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024)
        7.3.5 SK Hynix Recent Developments/Updates
        7.3.6 SK Hynix Competitive Strengths & Weaknesses
    7.4 Micron Technology
        7.4.1 Micron Technology Details
        7.4.2 Micron Technology Major Business
        7.4.3 Micron Technology Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
        7.4.4 Micron Technology Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024)
        7.4.5 Micron Technology Recent Developments/Updates
        7.4.6 Micron Technology Competitive Strengths & Weaknesses
    7.5 Texas Instruments (TI)
        7.5.1 Texas Instruments (TI) Details
        7.5.2 Texas Instruments (TI) Major Business
        7.5.3 Texas Instruments (TI) Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
        7.5.4 Texas Instruments (TI) Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024)
        7.5.5 Texas Instruments (TI) Recent Developments/Updates
        7.5.6 Texas Instruments (TI) Competitive Strengths & Weaknesses
    7.6 STMicroelectronics
        7.6.1 STMicroelectronics Details
        7.6.2 STMicroelectronics Major Business
        7.6.3 STMicroelectronics Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
        7.6.4 STMicroelectronics Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024)
        7.6.5 STMicroelectronics Recent Developments/Updates
        7.6.6 STMicroelectronics Competitive Strengths & Weaknesses
    7.7 Kioxia
        7.7.1 Kioxia Details
        7.7.2 Kioxia Major Business
        7.7.3 Kioxia Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
        7.7.4 Kioxia Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024)
        7.7.5 Kioxia Recent Developments/Updates
        7.7.6 Kioxia Competitive Strengths & Weaknesses
    7.8 Sony Semiconductor Solutions Corporation (SSS)
        7.8.1 Sony Semiconductor Solutions Corporation (SSS) Details
        7.8.2 Sony Semiconductor Solutions Corporation (SSS) Major Business
        7.8.3 Sony Semiconductor Solutions Corporation (SSS) Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
        7.8.4 Sony Semiconductor Solutions Corporation (SSS) Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024)
        7.8.5 Sony Semiconductor Solutions Corporation (SSS) Recent Developments/Updates
        7.8.6 Sony Semiconductor Solutions Corporation (SSS) Competitive Strengths & Weaknesses
    7.9 Infineon
        7.9.1 Infineon Details
        7.9.2 Infineon Major Business
        7.9.3 Infineon Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
        7.9.4 Infineon Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024)
        7.9.5 Infineon Recent Developments/Updates
        7.9.6 Infineon Competitive Strengths & Weaknesses
    7.10 NXP
        7.10.1 NXP Details
        7.10.2 NXP Major Business
        7.10.3 NXP Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
        7.10.4 NXP Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024)
        7.10.5 NXP Recent Developments/Updates
        7.10.6 NXP Competitive Strengths & Weaknesses
    7.11 Analog Devices, Inc. (ADI)
        7.11.1 Analog Devices, Inc. (ADI) Details
        7.11.2 Analog Devices, Inc. (ADI) Major Business
        7.11.3 Analog Devices, Inc. (ADI) Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
        7.11.4 Analog Devices, Inc. (ADI) Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024)
        7.11.5 Analog Devices, Inc. (ADI) Recent Developments/Updates
        7.11.6 Analog Devices, Inc. (ADI) Competitive Strengths & Weaknesses
    7.12 Renesas Electronics
        7.12.1 Renesas Electronics Details
        7.12.2 Renesas Electronics Major Business
        7.12.3 Renesas Electronics Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
        7.12.4 Renesas Electronics Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024)
        7.12.5 Renesas Electronics Recent Developments/Updates
        7.12.6 Renesas Electronics Competitive Strengths & Weaknesses
    7.13 Microchip Technology
        7.13.1 Microchip Technology Details
        7.13.2 Microchip Technology Major Business
        7.13.3 Microchip Technology Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
        7.13.4 Microchip Technology Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024)
        7.13.5 Microchip Technology Recent Developments/Updates
        7.13.6 Microchip Technology Competitive Strengths & Weaknesses
    7.14 Onsemi
        7.14.1 Onsemi Details
        7.14.2 Onsemi Major Business
        7.14.3 Onsemi Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
        7.14.4 Onsemi Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024)
        7.14.5 Onsemi Recent Developments/Updates
        7.14.6 Onsemi Competitive Strengths & Weaknesses
    7.15 NVIDIA
        7.15.1 NVIDIA Details
        7.15.2 NVIDIA Major Business
        7.15.3 NVIDIA Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
        7.15.4 NVIDIA Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024)
        7.15.5 NVIDIA Recent Developments/Updates
        7.15.6 NVIDIA Competitive Strengths & Weaknesses
    7.16 Qualcomm
        7.16.1 Qualcomm Details
        7.16.2 Qualcomm Major Business
        7.16.3 Qualcomm Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
        7.16.4 Qualcomm Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024)
        7.16.5 Qualcomm Recent Developments/Updates
        7.16.6 Qualcomm Competitive Strengths & Weaknesses
    7.17 Broadcom
        7.17.1 Broadcom Details
        7.17.2 Broadcom Major Business
        7.17.3 Broadcom Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
        7.17.4 Broadcom Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024)
        7.17.5 Broadcom Recent Developments/Updates
        7.17.6 Broadcom Competitive Strengths & Weaknesses
    7.18 Advanced Micro Devices, Inc. (AMD)
        7.18.1 Advanced Micro Devices, Inc. (AMD) Details
        7.18.2 Advanced Micro Devices, Inc. (AMD) Major Business
        7.18.3 Advanced Micro Devices, Inc. (AMD) Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
        7.18.4 Advanced Micro Devices, Inc. (AMD) Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024)
        7.18.5 Advanced Micro Devices, Inc. (AMD) Recent Developments/Updates
        7.18.6 Advanced Micro Devices, Inc. (AMD) Competitive Strengths & Weaknesses
    7.19 MediaTek
        7.19.1 MediaTek Details
        7.19.2 MediaTek Major Business
        7.19.3 MediaTek Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
        7.19.4 MediaTek Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024)
        7.19.5 MediaTek Recent Developments/Updates
        7.19.6 MediaTek Competitive Strengths & Weaknesses
    7.20 Marvell Technology Group
        7.20.1 Marvell Technology Group Details
        7.20.2 Marvell Technology Group Major Business
        7.20.3 Marvell Technology Group Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
        7.20.4 Marvell Technology Group Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024)
        7.20.5 Marvell Technology Group Recent Developments/Updates
        7.20.6 Marvell Technology Group Competitive Strengths & Weaknesses
    7.21 Novatek Microelectronics Corp.
        7.21.1 Novatek Microelectronics Corp. Details
        7.21.2 Novatek Microelectronics Corp. Major Business
        7.21.3 Novatek Microelectronics Corp. Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
        7.21.4 Novatek Microelectronics Corp. Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024)
        7.21.5 Novatek Microelectronics Corp. Recent Developments/Updates
        7.21.6 Novatek Microelectronics Corp. Competitive Strengths & Weaknesses
    7.22 Tsinghua Unigroup
        7.22.1 Tsinghua Unigroup Details
        7.22.2 Tsinghua Unigroup Major Business
        7.22.3 Tsinghua Unigroup Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
        7.22.4 Tsinghua Unigroup Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024)
        7.22.5 Tsinghua Unigroup Recent Developments/Updates
        7.22.6 Tsinghua Unigroup Competitive Strengths & Weaknesses
    7.23 Realtek Semiconductor Corporation
        7.23.1 Realtek Semiconductor Corporation Details
        7.23.2 Realtek Semiconductor Corporation Major Business
        7.23.3 Realtek Semiconductor Corporation Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
        7.23.4 Realtek Semiconductor Corporation Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024)
        7.23.5 Realtek Semiconductor Corporation Recent Developments/Updates
        7.23.6 Realtek Semiconductor Corporation Competitive Strengths & Weaknesses
    7.24 OmniVision Technology, Inc
        7.24.1 OmniVision Technology, Inc Details
        7.24.2 OmniVision Technology, Inc Major Business
        7.24.3 OmniVision Technology, Inc Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
        7.24.4 OmniVision Technology, Inc Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024)
        7.24.5 OmniVision Technology, Inc Recent Developments/Updates
        7.24.6 OmniVision Technology, Inc Competitive Strengths & Weaknesses
    7.25 Monolithic Power Systems, Inc. (MPS)
        7.25.1 Monolithic Power Systems, Inc. (MPS) Details
        7.25.2 Monolithic Power Systems, Inc. (MPS) Major Business
        7.25.3 Monolithic Power Systems, Inc. (MPS) Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
        7.25.4 Monolithic Power Systems, Inc. (MPS) Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024)
        7.25.5 Monolithic Power Systems, Inc. (MPS) Recent Developments/Updates
        7.25.6 Monolithic Power Systems, Inc. (MPS) Competitive Strengths & Weaknesses
    7.26 Cirrus Logic, Inc.
        7.26.1 Cirrus Logic, Inc. Details
        7.26.2 Cirrus Logic, Inc. Major Business
        7.26.3 Cirrus Logic, Inc. Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
        7.26.4 Cirrus Logic, Inc. Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024)
        7.26.5 Cirrus Logic, Inc. Recent Developments/Updates
        7.26.6 Cirrus Logic, Inc. Competitive Strengths & Weaknesses
    7.27 Socionext Inc.
        7.27.1 Socionext Inc. Details
        7.27.2 Socionext Inc. Major Business
        7.27.3 Socionext Inc. Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
        7.27.4 Socionext Inc. Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024)
        7.27.5 Socionext Inc. Recent Developments/Updates
        7.27.6 Socionext Inc. Competitive Strengths & Weaknesses
    7.28 LX Semicon
        7.28.1 LX Semicon Details
        7.28.2 LX Semicon Major Business
        7.28.3 LX Semicon Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
        7.28.4 LX Semicon Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024)
        7.28.5 LX Semicon Recent Developments/Updates
        7.28.6 LX Semicon Competitive Strengths & Weaknesses
    7.29 HiSilicon Technologies
        7.29.1 HiSilicon Technologies Details
        7.29.2 HiSilicon Technologies Major Business
        7.29.3 HiSilicon Technologies Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
        7.29.4 HiSilicon Technologies Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024)
        7.29.5 HiSilicon Technologies Recent Developments/Updates
        7.29.6 HiSilicon Technologies Competitive Strengths & Weaknesses
    7.30 TSMC
        7.30.1 TSMC Details
        7.30.2 TSMC Major Business
        7.30.3 TSMC Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
        7.30.4 TSMC Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024)
        7.30.5 TSMC Recent Developments/Updates
        7.30.6 TSMC Competitive Strengths & Weaknesses
    7.31 Samsung Foundry
        7.31.1 Samsung Foundry Details
        7.31.2 Samsung Foundry Major Business
        7.31.3 Samsung Foundry Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
        7.31.4 Samsung Foundry Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024)
        7.31.5 Samsung Foundry Recent Developments/Updates
        7.31.6 Samsung Foundry Competitive Strengths & Weaknesses
    7.32 GlobalFoundries
        7.32.1 GlobalFoundries Details
        7.32.2 GlobalFoundries Major Business
        7.32.3 GlobalFoundries Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
        7.32.4 GlobalFoundries Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024)
        7.32.5 GlobalFoundries Recent Developments/Updates
        7.32.6 GlobalFoundries Competitive Strengths & Weaknesses
    7.33 United Microelectronics Corporation (UMC)
        7.33.1 United Microelectronics Corporation (UMC) Details
        7.33.2 United Microelectronics Corporation (UMC) Major Business
        7.33.3 United Microelectronics Corporation (UMC) Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
        7.33.4 United Microelectronics Corporation (UMC) Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024)
        7.33.5 United Microelectronics Corporation (UMC) Recent Developments/Updates
        7.33.6 United Microelectronics Corporation (UMC) Competitive Strengths & Weaknesses
    7.34 SMIC
        7.34.1 SMIC Details
        7.34.2 SMIC Major Business
        7.34.3 SMIC Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
        7.34.4 SMIC Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024)
        7.34.5 SMIC Recent Developments/Updates
        7.34.6 SMIC Competitive Strengths & Weaknesses
    7.35 Tower Semiconductor
        7.35.1 Tower Semiconductor Details
        7.35.2 Tower Semiconductor Major Business
        7.35.3 Tower Semiconductor Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
        7.35.4 Tower Semiconductor Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024)
        7.35.5 Tower Semiconductor Recent Developments/Updates
        7.35.6 Tower Semiconductor Competitive Strengths & Weaknesses
    7.36 PSMC
        7.36.1 PSMC Details
        7.36.2 PSMC Major Business
        7.36.3 PSMC Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
        7.36.4 PSMC Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024)
        7.36.5 PSMC Recent Developments/Updates
        7.36.6 PSMC Competitive Strengths & Weaknesses
    7.37 VIS (Vanguard International Semiconductor)
        7.37.1 VIS (Vanguard International Semiconductor) Details
        7.37.2 VIS (Vanguard International Semiconductor) Major Business
        7.37.3 VIS (Vanguard International Semiconductor) Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
        7.37.4 VIS (Vanguard International Semiconductor) Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024)
        7.37.5 VIS (Vanguard International Semiconductor) Recent Developments/Updates
        7.37.6 VIS (Vanguard International Semiconductor) Competitive Strengths & Weaknesses
    7.38 Hua Hong Semiconductor
        7.38.1 Hua Hong Semiconductor Details
        7.38.2 Hua Hong Semiconductor Major Business
        7.38.3 Hua Hong Semiconductor Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
        7.38.4 Hua Hong Semiconductor Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024)
        7.38.5 Hua Hong Semiconductor Recent Developments/Updates
        7.38.6 Hua Hong Semiconductor Competitive Strengths & Weaknesses
    7.39 HLMC
        7.39.1 HLMC Details
        7.39.2 HLMC Major Business
        7.39.3 HLMC Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
        7.39.4 HLMC Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024)
        7.39.5 HLMC Recent Developments/Updates
        7.39.6 HLMC Competitive Strengths & Weaknesses
    7.40 ASE (SPIL)
        7.40.1 ASE (SPIL) Details
        7.40.2 ASE (SPIL) Major Business
        7.40.3 ASE (SPIL) Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
        7.40.4 ASE (SPIL) Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024)
        7.40.5 ASE (SPIL) Recent Developments/Updates
        7.40.6 ASE (SPIL) Competitive Strengths & Weaknesses

8 Industry Chain Analysis
    8.1 Semiconductor IC Design, Manufacturing, Packaging and Testing Industry Chain
    8.2 Semiconductor IC Design, Manufacturing, Packaging and Testing Upstream Analysis
    8.3 Semiconductor IC Design, Manufacturing, Packaging and Testing Midstream Analysis
    8.4 Semiconductor IC Design, Manufacturing, Packaging and Testing Downstream Analysis

9 Research Findings and Conclusion

10 Appendix
    10.1 Methodology
    10.2 Research Process and Data Source
    10.3 Disclaimer

Table of Figures

List of Tables
 Table 1. World Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue by Region (2019, 2023 and 2030) & (USD Million), (by Headquarter Location)
 Table 2. World Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue by Region (2019-2024) & (USD Million), (by Headquarter Location)
 Table 3. World Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue by Region (2025-2030) & (USD Million), (by Headquarter Location)
 Table 4. World Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue Market Share by Region (2019-2024), (by Headquarter Location)
 Table 5. World Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue Market Share by Region (2025-2030), (by Headquarter Location)
 Table 6. Major Market Trends
 Table 7. World Semiconductor IC Design, Manufacturing, Packaging and Testing Consumption Value Growth Rate Forecast by Region (2019 & 2023 & 2030) & (USD Million)
 Table 8. World Semiconductor IC Design, Manufacturing, Packaging and Testing Consumption Value by Region (2019-2024) & (USD Million)
 Table 9. World Semiconductor IC Design, Manufacturing, Packaging and Testing Consumption Value Forecast by Region (2025-2030) & (USD Million)
 Table 10. World Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue by Player (2019-2024) & (USD Million)
 Table 11. Revenue Market Share of Key Semiconductor IC Design, Manufacturing, Packaging and Testing Players in 2023
 Table 12. World Semiconductor IC Design, Manufacturing, Packaging and Testing Industry Rank of Major Player, Based on Revenue in 2023
 Table 13. Global Semiconductor IC Design, Manufacturing, Packaging and Testing Company Evaluation Quadrant
 Table 14. Head Office of Key Semiconductor IC Design, Manufacturing, Packaging and Testing Players
 Table 15. Semiconductor IC Design, Manufacturing, Packaging and Testing Market: Company Product Type Footprint
 Table 16. Semiconductor IC Design, Manufacturing, Packaging and Testing Market: Company Product Application Footprint
 Table 17. Semiconductor IC Design, Manufacturing, Packaging and Testing Mergers & Acquisitions Activity
 Table 18. United States VS China Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue Comparison, (2019 & 2023 & 2030) & (USD Million)
 Table 19. United States VS China Semiconductor IC Design, Manufacturing, Packaging and Testing Consumption Value Comparison, (2019 & 2023 & 2030) & (USD Million)
 Table 20. United States Based Semiconductor IC Design, Manufacturing, Packaging and Testing Companies, Headquarters (States, Country)
 Table 21. United States Based Companies Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, (2019-2024) & (USD Million)
 Table 22. United States Based Companies Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue Market Share (2019-2024)
 Table 23. China Based Semiconductor IC Design, Manufacturing, Packaging and Testing Companies, Headquarters (Province, Country)
 Table 24. China Based Companies Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, (2019-2024) & (USD Million)
 Table 25. China Based Companies Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue Market Share (2019-2024)
 Table 26. Rest of World Based Semiconductor IC Design, Manufacturing, Packaging and Testing Companies, Headquarters (Province, Country)
 Table 27. Rest of World Based Companies Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue (2019-2024) & (USD Million)
 Table 28. Rest of World Based Companies Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue Market Share (2019-2024)
 Table 29. World Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size by Type, (USD Million), 2019 & 2023 & 2030
 Table 30. World Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size Value by Type (2019-2024) & (USD Million)
 Table 31. World Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size by Type (2025-2030) & (USD Million)
 Table 32. World Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size by Application, (USD Million), 2019 & 2023 & 2030
 Table 33. World Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size by Application (2019-2024) & (USD Million)
 Table 34. World Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size by Application (2025-2030) & (USD Million)
 Table 35. Samsung-Memory Basic Information, Manufacturing Base and Competitors
 Table 36. Samsung-Memory Major Business
 Table 37. Samsung-Memory Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
 Table 38. Samsung-Memory Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
 Table 39. Samsung-Memory Recent Developments/Updates
 Table 40. Samsung-Memory Competitive Strengths & Weaknesses
 Table 41. Intel Basic Information, Manufacturing Base and Competitors
 Table 42. Intel Major Business
 Table 43. Intel Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
 Table 44. Intel Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
 Table 45. Intel Recent Developments/Updates
 Table 46. Intel Competitive Strengths & Weaknesses
 Table 47. SK Hynix Basic Information, Manufacturing Base and Competitors
 Table 48. SK Hynix Major Business
 Table 49. SK Hynix Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
 Table 50. SK Hynix Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
 Table 51. SK Hynix Recent Developments/Updates
 Table 52. SK Hynix Competitive Strengths & Weaknesses
 Table 53. Micron Technology Basic Information, Manufacturing Base and Competitors
 Table 54. Micron Technology Major Business
 Table 55. Micron Technology Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
 Table 56. Micron Technology Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
 Table 57. Micron Technology Recent Developments/Updates
 Table 58. Micron Technology Competitive Strengths & Weaknesses
 Table 59. Texas Instruments (TI) Basic Information, Manufacturing Base and Competitors
 Table 60. Texas Instruments (TI) Major Business
 Table 61. Texas Instruments (TI) Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
 Table 62. Texas Instruments (TI) Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
 Table 63. Texas Instruments (TI) Recent Developments/Updates
 Table 64. Texas Instruments (TI) Competitive Strengths & Weaknesses
 Table 65. STMicroelectronics Basic Information, Manufacturing Base and Competitors
 Table 66. STMicroelectronics Major Business
 Table 67. STMicroelectronics Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
 Table 68. STMicroelectronics Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
 Table 69. STMicroelectronics Recent Developments/Updates
 Table 70. STMicroelectronics Competitive Strengths & Weaknesses
 Table 71. Kioxia Basic Information, Manufacturing Base and Competitors
 Table 72. Kioxia Major Business
 Table 73. Kioxia Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
 Table 74. Kioxia Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
 Table 75. Kioxia Recent Developments/Updates
 Table 76. Kioxia Competitive Strengths & Weaknesses
 Table 77. Sony Semiconductor Solutions Corporation (SSS) Basic Information, Manufacturing Base and Competitors
 Table 78. Sony Semiconductor Solutions Corporation (SSS) Major Business
 Table 79. Sony Semiconductor Solutions Corporation (SSS) Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
 Table 80. Sony Semiconductor Solutions Corporation (SSS) Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
 Table 81. Sony Semiconductor Solutions Corporation (SSS) Recent Developments/Updates
 Table 82. Sony Semiconductor Solutions Corporation (SSS) Competitive Strengths & Weaknesses
 Table 83. Infineon Basic Information, Manufacturing Base and Competitors
 Table 84. Infineon Major Business
 Table 85. Infineon Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
 Table 86. Infineon Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
 Table 87. Infineon Recent Developments/Updates
 Table 88. Infineon Competitive Strengths & Weaknesses
 Table 89. NXP Basic Information, Manufacturing Base and Competitors
 Table 90. NXP Major Business
 Table 91. NXP Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
 Table 92. NXP Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
 Table 93. NXP Recent Developments/Updates
 Table 94. NXP Competitive Strengths & Weaknesses
 Table 95. Analog Devices, Inc. (ADI) Basic Information, Manufacturing Base and Competitors
 Table 96. Analog Devices, Inc. (ADI) Major Business
 Table 97. Analog Devices, Inc. (ADI) Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
 Table 98. Analog Devices, Inc. (ADI) Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
 Table 99. Analog Devices, Inc. (ADI) Recent Developments/Updates
 Table 100. Analog Devices, Inc. (ADI) Competitive Strengths & Weaknesses
 Table 101. Renesas Electronics Basic Information, Manufacturing Base and Competitors
 Table 102. Renesas Electronics Major Business
 Table 103. Renesas Electronics Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
 Table 104. Renesas Electronics Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
 Table 105. Renesas Electronics Recent Developments/Updates
 Table 106. Renesas Electronics Competitive Strengths & Weaknesses
 Table 107. Microchip Technology Basic Information, Manufacturing Base and Competitors
 Table 108. Microchip Technology Major Business
 Table 109. Microchip Technology Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
 Table 110. Microchip Technology Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
 Table 111. Microchip Technology Recent Developments/Updates
 Table 112. Microchip Technology Competitive Strengths & Weaknesses
 Table 113. Onsemi Basic Information, Manufacturing Base and Competitors
 Table 114. Onsemi Major Business
 Table 115. Onsemi Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
 Table 116. Onsemi Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
 Table 117. Onsemi Recent Developments/Updates
 Table 118. Onsemi Competitive Strengths & Weaknesses
 Table 119. NVIDIA Basic Information, Manufacturing Base and Competitors
 Table 120. NVIDIA Major Business
 Table 121. NVIDIA Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
 Table 122. NVIDIA Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
 Table 123. NVIDIA Recent Developments/Updates
 Table 124. NVIDIA Competitive Strengths & Weaknesses
 Table 125. Qualcomm Basic Information, Manufacturing Base and Competitors
 Table 126. Qualcomm Major Business
 Table 127. Qualcomm Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
 Table 128. Qualcomm Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
 Table 129. Qualcomm Recent Developments/Updates
 Table 130. Qualcomm Competitive Strengths & Weaknesses
 Table 131. Broadcom Basic Information, Manufacturing Base and Competitors
 Table 132. Broadcom Major Business
 Table 133. Broadcom Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
 Table 134. Broadcom Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
 Table 135. Broadcom Recent Developments/Updates
 Table 136. Broadcom Competitive Strengths & Weaknesses
 Table 137. Advanced Micro Devices, Inc. (AMD) Basic Information, Manufacturing Base and Competitors
 Table 138. Advanced Micro Devices, Inc. (AMD) Major Business
 Table 139. Advanced Micro Devices, Inc. (AMD) Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
 Table 140. Advanced Micro Devices, Inc. (AMD) Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
 Table 141. Advanced Micro Devices, Inc. (AMD) Recent Developments/Updates
 Table 142. Advanced Micro Devices, Inc. (AMD) Competitive Strengths & Weaknesses
 Table 143. MediaTek Basic Information, Manufacturing Base and Competitors
 Table 144. MediaTek Major Business
 Table 145. MediaTek Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
 Table 146. MediaTek Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
 Table 147. MediaTek Recent Developments/Updates
 Table 148. MediaTek Competitive Strengths & Weaknesses
 Table 149. Marvell Technology Group Basic Information, Manufacturing Base and Competitors
 Table 150. Marvell Technology Group Major Business
 Table 151. Marvell Technology Group Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
 Table 152. Marvell Technology Group Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
 Table 153. Marvell Technology Group Recent Developments/Updates
 Table 154. Marvell Technology Group Competitive Strengths & Weaknesses
 Table 155. Novatek Microelectronics Corp. Basic Information, Manufacturing Base and Competitors
 Table 156. Novatek Microelectronics Corp. Major Business
 Table 157. Novatek Microelectronics Corp. Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
 Table 158. Novatek Microelectronics Corp. Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
 Table 159. Novatek Microelectronics Corp. Recent Developments/Updates
 Table 160. Novatek Microelectronics Corp. Competitive Strengths & Weaknesses
 Table 161. Tsinghua Unigroup Basic Information, Manufacturing Base and Competitors
 Table 162. Tsinghua Unigroup Major Business
 Table 163. Tsinghua Unigroup Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
 Table 164. Tsinghua Unigroup Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
 Table 165. Tsinghua Unigroup Recent Developments/Updates
 Table 166. Tsinghua Unigroup Competitive Strengths & Weaknesses
 Table 167. Realtek Semiconductor Corporation Basic Information, Manufacturing Base and Competitors
 Table 168. Realtek Semiconductor Corporation Major Business
 Table 169. Realtek Semiconductor Corporation Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
 Table 170. Realtek Semiconductor Corporation Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
 Table 171. Realtek Semiconductor Corporation Recent Developments/Updates
 Table 172. Realtek Semiconductor Corporation Competitive Strengths & Weaknesses
 Table 173. OmniVision Technology, Inc Basic Information, Manufacturing Base and Competitors
 Table 174. OmniVision Technology, Inc Major Business
 Table 175. OmniVision Technology, Inc Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
 Table 176. OmniVision Technology, Inc Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
 Table 177. OmniVision Technology, Inc Recent Developments/Updates
 Table 178. OmniVision Technology, Inc Competitive Strengths & Weaknesses
 Table 179. Monolithic Power Systems, Inc. (MPS) Basic Information, Manufacturing Base and Competitors
 Table 180. Monolithic Power Systems, Inc. (MPS) Major Business
 Table 181. Monolithic Power Systems, Inc. (MPS) Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
 Table 182. Monolithic Power Systems, Inc. (MPS) Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
 Table 183. Monolithic Power Systems, Inc. (MPS) Recent Developments/Updates
 Table 184. Monolithic Power Systems, Inc. (MPS) Competitive Strengths & Weaknesses
 Table 185. Cirrus Logic, Inc. Basic Information, Manufacturing Base and Competitors
 Table 186. Cirrus Logic, Inc. Major Business
 Table 187. Cirrus Logic, Inc. Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
 Table 188. Cirrus Logic, Inc. Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
 Table 189. Cirrus Logic, Inc. Recent Developments/Updates
 Table 190. Cirrus Logic, Inc. Competitive Strengths & Weaknesses
 Table 191. Socionext Inc. Basic Information, Manufacturing Base and Competitors
 Table 192. Socionext Inc. Major Business
 Table 193. Socionext Inc. Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
 Table 194. Socionext Inc. Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
 Table 195. Socionext Inc. Recent Developments/Updates
 Table 196. Socionext Inc. Competitive Strengths & Weaknesses
 Table 197. LX Semicon Basic Information, Manufacturing Base and Competitors
 Table 198. LX Semicon Major Business
 Table 199. LX Semicon Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
 Table 200. LX Semicon Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
 Table 201. LX Semicon Recent Developments/Updates
 Table 202. LX Semicon Competitive Strengths & Weaknesses
 Table 203. HiSilicon Technologies Basic Information, Manufacturing Base and Competitors
 Table 204. HiSilicon Technologies Major Business
 Table 205. HiSilicon Technologies Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
 Table 206. HiSilicon Technologies Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
 Table 207. HiSilicon Technologies Recent Developments/Updates
 Table 208. HiSilicon Technologies Competitive Strengths & Weaknesses
 Table 209. TSMC Basic Information, Manufacturing Base and Competitors
 Table 210. TSMC Major Business
 Table 211. TSMC Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
 Table 212. TSMC Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
 Table 213. TSMC Recent Developments/Updates
 Table 214. TSMC Competitive Strengths & Weaknesses
 Table 215. Samsung Foundry Basic Information, Manufacturing Base and Competitors
 Table 216. Samsung Foundry Major Business
 Table 217. Samsung Foundry Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
 Table 218. Samsung Foundry Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
 Table 219. Samsung Foundry Recent Developments/Updates
 Table 220. Samsung Foundry Competitive Strengths & Weaknesses
 Table 221. GlobalFoundries Basic Information, Manufacturing Base and Competitors
 Table 222. GlobalFoundries Major Business
 Table 223. GlobalFoundries Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
 Table 224. GlobalFoundries Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
 Table 225. GlobalFoundries Recent Developments/Updates
 Table 226. GlobalFoundries Competitive Strengths & Weaknesses
 Table 227. United Microelectronics Corporation (UMC) Basic Information, Manufacturing Base and Competitors
 Table 228. United Microelectronics Corporation (UMC) Major Business
 Table 229. United Microelectronics Corporation (UMC) Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
 Table 230. United Microelectronics Corporation (UMC) Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
 Table 231. United Microelectronics Corporation (UMC) Recent Developments/Updates
 Table 232. United Microelectronics Corporation (UMC) Competitive Strengths & Weaknesses
 Table 233. SMIC Basic Information, Manufacturing Base and Competitors
 Table 234. SMIC Major Business
 Table 235. SMIC Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
 Table 236. SMIC Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
 Table 237. SMIC Recent Developments/Updates
 Table 238. SMIC Competitive Strengths & Weaknesses
 Table 239. Tower Semiconductor Basic Information, Manufacturing Base and Competitors
 Table 240. Tower Semiconductor Major Business
 Table 241. Tower Semiconductor Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
 Table 242. Tower Semiconductor Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
 Table 243. Tower Semiconductor Recent Developments/Updates
 Table 244. Tower Semiconductor Competitive Strengths & Weaknesses
 Table 245. PSMC Basic Information, Manufacturing Base and Competitors
 Table 246. PSMC Major Business
 Table 247. PSMC Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
 Table 248. PSMC Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
 Table 249. PSMC Recent Developments/Updates
 Table 250. PSMC Competitive Strengths & Weaknesses
 Table 251. VIS (Vanguard International Semiconductor) Basic Information, Manufacturing Base and Competitors
 Table 252. VIS (Vanguard International Semiconductor) Major Business
 Table 253. VIS (Vanguard International Semiconductor) Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
 Table 254. VIS (Vanguard International Semiconductor) Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
 Table 255. VIS (Vanguard International Semiconductor) Recent Developments/Updates
 Table 256. VIS (Vanguard International Semiconductor) Competitive Strengths & Weaknesses
 Table 257. Hua Hong Semiconductor Basic Information, Manufacturing Base and Competitors
 Table 258. Hua Hong Semiconductor Major Business
 Table 259. Hua Hong Semiconductor Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
 Table 260. Hua Hong Semiconductor Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
 Table 261. Hua Hong Semiconductor Recent Developments/Updates
 Table 262. Hua Hong Semiconductor Competitive Strengths & Weaknesses
 Table 263. HLMC Basic Information, Manufacturing Base and Competitors
 Table 264. HLMC Major Business
 Table 265. HLMC Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
 Table 266. HLMC Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
 Table 267. HLMC Recent Developments/Updates
 Table 268. HLMC Competitive Strengths & Weaknesses
 Table 269. ASE (SPIL) Basic Information, Manufacturing Base and Competitors
 Table 270. ASE (SPIL) Major Business
 Table 271. ASE (SPIL) Semiconductor IC Design, Manufacturing, Packaging and Testing Product and Services
 Table 272. ASE (SPIL) Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
 Table 273. ASE (SPIL) Recent Developments/Updates
 Table 274. ASE (SPIL) Competitive Strengths & Weaknesses
 Table 275. Global Key Players of Semiconductor IC Design, Manufacturing, Packaging and Testing Upstream (Raw Materials)
 Table 276. Global Semiconductor IC Design, Manufacturing, Packaging and Testing Typical Customers


List of Figures
 Figure 1. Semiconductor IC Design, Manufacturing, Packaging and Testing Picture
 Figure 2. World Semiconductor IC Design, Manufacturing, Packaging and Testing Total Revenue: 2019 & 2023 & 2030, (USD Million)
 Figure 3. World Semiconductor IC Design, Manufacturing, Packaging and Testing Total Revenue (2019-2030) & (USD Million)
 Figure 4. World Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue by Region (2019, 2023 and 2030) & (USD Million), (by Headquarter Location)
 Figure 5. World Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue Market Share by Region (2019-2030), (by Headquarter Location)
 Figure 6. United States Based Company Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue (2019-2030) & (USD Million)
 Figure 7. China Based Company Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue (2019-2030) & (USD Million)
 Figure 8. Europe Based Company Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue (2019-2030) & (USD Million)
 Figure 9. Japan Based Company Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue (2019-2030) & (USD Million)
 Figure 10. South Korea Based Company Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue (2019-2030) & (USD Million)
 Figure 11. ASEAN Based Company Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue (2019-2030) & (USD Million)
 Figure 12. India Based Company Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue (2019-2030) & (USD Million)
 Figure 13. Semiconductor IC Design, Manufacturing, Packaging and Testing Market Drivers
 Figure 14. Factors Affecting Demand
 Figure 15. World Semiconductor IC Design, Manufacturing, Packaging and Testing Consumption Value (2019-2030) & (USD Million)
 Figure 16. World Semiconductor IC Design, Manufacturing, Packaging and Testing Consumption Value Market Share by Region (2019-2030)
 Figure 17. United States Semiconductor IC Design, Manufacturing, Packaging and Testing Consumption Value (2019-2030) & (USD Million)
 Figure 18. China Semiconductor IC Design, Manufacturing, Packaging and Testing Consumption Value (2019-2030) & (USD Million)
 Figure 19. Europe Semiconductor IC Design, Manufacturing, Packaging and Testing Consumption Value (2019-2030) & (USD Million)
 Figure 20. Japan Semiconductor IC Design, Manufacturing, Packaging and Testing Consumption Value (2019-2030) & (USD Million)
 Figure 21. South Korea Semiconductor IC Design, Manufacturing, Packaging and Testing Consumption Value (2019-2030) & (USD Million)
 Figure 22. ASEAN Semiconductor IC Design, Manufacturing, Packaging and Testing Consumption Value (2019-2030) & (USD Million)
 Figure 23. India Semiconductor IC Design, Manufacturing, Packaging and Testing Consumption Value (2019-2030) & (USD Million)
 Figure 24. Producer Shipments of Semiconductor IC Design, Manufacturing, Packaging and Testing by Player Revenue ($MM) and Market Share (%): 2023
 Figure 25. Global Four-firm Concentration Ratios (CR4) for Semiconductor IC Design, Manufacturing, Packaging and Testing Markets in 2023
 Figure 26. Global Four-firm Concentration Ratios (CR8) for Semiconductor IC Design, Manufacturing, Packaging and Testing Markets in 2023
 Figure 27. United States VS China: Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue Market Share Comparison (2019 & 2023 & 2030)
 Figure 28. United States VS China: Semiconductor IC Design, Manufacturing, Packaging and Testing Consumption Value Market Share Comparison (2019 & 2023 & 2030)
 Figure 29. World Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size by Type, (USD Million), 2019 & 2023 & 2030
 Figure 30. World Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size Market Share by Type in 2023
 Figure 31. IC Design
 Figure 32. IC Manufacturing
 Figure 33. IC Packaging & Testing
 Figure 34. World Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size Market Share by Type (2019-2030)
 Figure 35. World Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size by Application, (USD Million), 2019 & 2023 & 2030
 Figure 36. World Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size Market Share by Application in 2023
 Figure 37. Communication
 Figure 38. Computer/PC
 Figure 39. Consumer
 Figure 40. Automotive
 Figure 41. Industrial
 Figure 42. Others
 Figure 43. World Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size Market Share by Application (2019-2030)
 Figure 44. Semiconductor IC Design, Manufacturing, Packaging and Testing Industrial Chain
 Figure 45. Methodology
 Figure 46. Research Process and Data Source

Research Methodology

Client Requirements

Review and analyze client requirements

Discussion of all the project requirements and queries

Flexibility Check

Project Feasibility Analysis

Finalizing tentative research programme

Structuring project proposal with scope, timeline, and costs

Analyzing Market Dynamics

Determination of key drivers, restraints, challenge, and opportunity

Identifies market needs and trends

Market Size Estimation & Forecast

Estimation of historical data based on secondary and primary data

Anticipating market recast by assigning weightage to market forces (drivers, restraints, opportunities)

Freezing historical and forecast market size estimations based on evolution, trends, outlook, and strategies

Consideration of geography, region-specific product/service demand for region segments

Consideration of product utilization rates, product demand outlook for segments by application or end-user.

Data Source

Secondary Source
Data collections from annual reports, presentations,associations, journals, analyst reports, paid database, press releases, blogs, newsletters,and GIR repositories.

Primary Source
Research discussion with manufacturers, distributors, suppliers, end user, industry experts to verify insights.

Validation and
triangulation of
secondary and primary source.

Collection of data

Cumulating and collating the essential qualitative and quantitative data

Generation of report in client requested format by research analysts

Reviews by expert analysts

Final quality check

Clarifying queries

Receiving feedback

Ensuring satisfaction

01 Identification of data

This step involves identification of several primary and secondary data research sources, including Global Info Research's internal data sources. The primary sources consist of in-depth discussions and interviews with policy makers, industry experts, and data evaluators, whereas secondary sources include a thorough study of market journals, press releases, annual reports, and government and non-government agencies websites.
02 Evaluation of Market Dynamic

This phase includes a detailed evaluation of several factors that are likely to affect the market dynamics. It involves a comprehensive assessment of major market pain points, drivers, and trends. It also comprises a detailed study of research plans and methodology.
03 Collection of Data

This process consists of gathering data, accessing proprietary databases, and reaching out to key industry participants that operate in the market across the value chain. It also involves studying several patterns in the historical data and comparing it with the current scenario.
04 Collaboration of Data

This stage involves the validation of data and arrival at actual statistics, and evolution of the market over the years. It entails the study and analyzes various segments and verticals of the market. An impact analysis is also performed to observe which factors will affect the market in the next few years.
05 Verification and Analysis

This is the final stage, which involves both quantity and quality checks. Although the process of data verification is an integral part of the research process, all data points and statistics and figures are re-checked to uphold their authenticity and validity.

Companies Mentioned

Samsung-Memory
Intel
SK Hynix
Micron Technology
Texas Instruments (TI)
STMicroelectronics
Kioxia
Sony Semiconductor Solutions Corporation (SSS)
Infineon
NXP
Analog Devices, Inc. (ADI)
Renesas Electronics
Microchip Technology
Onsemi
NVIDIA
Qualcomm
Broadcom
Advanced Micro Devices, Inc. (AMD)
MediaTek
Marvell Technology Group
Novatek Microelectronics Corp.
Tsinghua Unigroup
Realtek Semiconductor Corporation
OmniVision Technology, Inc
Monolithic Power Systems, Inc. (MPS)
Cirrus Logic, Inc.
Socionext Inc.
LX Semicon
HiSilicon Technologies
TSMC
Samsung Foundry
GlobalFoundries
United Microelectronics Corporation (UMC)
SMIC
Tower Semiconductor
PSMC
VIS (Vanguard International Semiconductor)
Hua Hong Semiconductor
HLMC
ASE (SPIL)
Amkor
JCET (STATS ChipPAC)
Tongfu Microelectronics (TFME)
Powertech Technology Inc. (PTI)
HT-tech
King Yuan Electronics Corp. (KYEC)
ChipMOS TECHNOLOGIES
SFA Semicon
Chipbond Technology Corporation
UTAC
ASML
TEL (Tokyo Electron Ltd.)
Lam Research
KLA
Nikon
Carsem
SFA Semicon
Forehope Electronic (Ningbo) Co.,Ltd.
Unisem Group
OSE CORP.

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Global Semiconductor IC Design, Manufacturing, Packaging and Testing Market 2024 by Company, Regions, Type and Application, Forecast to 2030

date 15 Aug 2024

date Electronics & Semiconductor

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