Global Non-Memory Chip Packaging Substrate Supply, Demand and Key Producers, 2024-2030

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Published Date: 15 Aug 2024

Category: Electronics & Semiconductor

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Description
Table of Contents
Table of Figures
Research Methodology
Companies Mentioned
Related Reports
Product Tags

Description

Non-memory chip packaging substrate refers to the substrate material used to package non-memory type chips (such as processors, analog chips, RF chips, sensors, etc.). Similar to the memory chip packaging substrate, it plays a key role in chip packaging, providing electrical connection, mechanical support, heat dissipation management and other functions, but its design and application requirements may be different.

The global Non-Memory Chip Packaging Substrate market size is expected to reach $ million by 2030, rising at a market growth of %CAGR during the forecast period (2024-2030).

This report studies the global Non-Memory Chip Packaging Substrate production, demand, key manufacturers, and key regions.

This report is a detailed and comprehensive analysis of the world market for Non-Memory Chip Packaging Substrate and provides market size (US$ million) and Year-over-Year (YoY) Growth, considering 2023 as the base year. This report explores demand trends and competition, as well as details the characteristics of Non-Memory Chip Packaging Substrate that contribute to its increasing demand across many markets.

Highlights and key features of the study
Global Non-Memory Chip Packaging Substrate total production and demand, 2019-2030, (K Units)
Global Non-Memory Chip Packaging Substrate total production value, 2019-2030, (USD Million)
Global Non-Memory Chip Packaging Substrate production by region & country, production, value, CAGR, 2019-2030, (USD Million) & (K Units), (based on production site)
Global Non-Memory Chip Packaging Substrate consumption by region & country, CAGR, 2019-2030 & (K Units)
U.S. VS China: Non-Memory Chip Packaging Substrate domestic production, consumption, key domestic manufacturers and share
Global Non-Memory Chip Packaging Substrate production by manufacturer, production, price, value and market share 2019-2024, (USD Million) & (K Units)
Global Non-Memory Chip Packaging Substrate production by Type, production, value, CAGR, 2019-2030, (USD Million) & (K Units)
Global Non-Memory Chip Packaging Substrate production by Application, production, value, CAGR, 2019-2030, (USD Million) & (K Units)
This report profiles key players in the global Non-Memory Chip Packaging Substrate market based on the following parameters - company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Ibiden, Shinko, kyocera, LGInnotek, Samsung Electro Mechanics, AT&S, ASE Group, Unimicron, KINSUS, Hemei Jingyi Technology, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World Non-Memory Chip Packaging Substrate market
Detailed Segmentation:
Each section contains quantitative market data including market by value (US$ Millions), volume (production, consumption) & (K Units) and average price (US$/Unit) by manufacturer, by Type, and by Application. Data is given for the years 2019-2030 by year with 2023 as the base year, 2024 as the estimate year, and 2025-2030 as the forecast year.

Global Non-Memory Chip Packaging Substrate Market, By Region:
    United States
    China
    Europe
    Japan
    South Korea
    ASEAN
    India
    Rest of World

Global Non-Memory Chip Packaging Substrate Market, Segmentation by Type:
    Logic Chip Packaging Substrate
    Communication Chip Packaging Substrate
    Sensor Chip Packaging Substrate
    Others

Global Non-Memory Chip Packaging Substrate Market, Segmentation by Application:
    Consumer Electronics
    Industrial Control
    Communication Equipment
    Others

Companies Profiled:
    Ibiden
    Shinko
    kyocera
    LGInnotek
    Samsung Electro Mechanics
    AT&S
    ASE Group
    Unimicron
    KINSUS
    Hemei Jingyi Technology
    NanYa PCB
    Simmtech

Key Questions Answered:
1. How big is the global Non-Memory Chip Packaging Substrate market?
2. What is the demand of the global Non-Memory Chip Packaging Substrate market?
3. What is the year over year growth of the global Non-Memory Chip Packaging Substrate market?
4. What is the production and production value of the global Non-Memory Chip Packaging Substrate market?
5. Who are the key producers in the global Non-Memory Chip Packaging Substrate market?
6. What are the growth factors driving the market demand?

Table of Contents

1 Supply Summary
    1.1 Non-Memory Chip Packaging Substrate Introduction
    1.2 World Non-Memory Chip Packaging Substrate Supply & Forecast
        1.2.1 World Non-Memory Chip Packaging Substrate Production Value (2019 & 2023 & 2030)
        1.2.2 World Non-Memory Chip Packaging Substrate Production (2019-2030)
        1.2.3 World Non-Memory Chip Packaging Substrate Pricing Trends (2019-2030)
    1.3 World Non-Memory Chip Packaging Substrate Production by Region (Based on Production Site)
        1.3.1 World Non-Memory Chip Packaging Substrate Production Value by Region (2019-2030)
        1.3.2 World Non-Memory Chip Packaging Substrate Production by Region (2019-2030)
        1.3.3 World Non-Memory Chip Packaging Substrate Average Price by Region (2019-2030)
        1.3.4 North America Non-Memory Chip Packaging Substrate Production (2019-2030)
        1.3.5 Europe Non-Memory Chip Packaging Substrate Production (2019-2030)
        1.3.6 China Non-Memory Chip Packaging Substrate Production (2019-2030)
        1.3.7 Japan Non-Memory Chip Packaging Substrate Production (2019-2030)
        1.3.8 South Korea Non-Memory Chip Packaging Substrate Production (2019-2030)
    1.4 Market Drivers, Restraints and Trends
        1.4.1 Non-Memory Chip Packaging Substrate Market Drivers
        1.4.2 Factors Affecting Demand
        1.4.3 Non-Memory Chip Packaging Substrate Major Market Trends

2 Demand Summary
    2.1 World Non-Memory Chip Packaging Substrate Demand (2019-2030)
    2.2 World Non-Memory Chip Packaging Substrate Consumption by Region
        2.2.1 World Non-Memory Chip Packaging Substrate Consumption by Region (2019-2024)
        2.2.2 World Non-Memory Chip Packaging Substrate Consumption Forecast by Region (2025-2030)
    2.3 United States Non-Memory Chip Packaging Substrate Consumption (2019-2030)
    2.4 China Non-Memory Chip Packaging Substrate Consumption (2019-2030)
    2.5 Europe Non-Memory Chip Packaging Substrate Consumption (2019-2030)
    2.6 Japan Non-Memory Chip Packaging Substrate Consumption (2019-2030)
    2.7 South Korea Non-Memory Chip Packaging Substrate Consumption (2019-2030)
    2.8 ASEAN Non-Memory Chip Packaging Substrate Consumption (2019-2030)
    2.9 India Non-Memory Chip Packaging Substrate Consumption (2019-2030)

3 World Manufacturers Competitive Analysis
    3.1 World Non-Memory Chip Packaging Substrate Production Value by Manufacturer (2019-2024)
    3.2 World Non-Memory Chip Packaging Substrate Production by Manufacturer (2019-2024)
    3.3 World Non-Memory Chip Packaging Substrate Average Price by Manufacturer (2019-2024)
    3.4 Non-Memory Chip Packaging Substrate Company Evaluation Quadrant
    3.5 Industry Rank and Concentration Rate (CR)
        3.5.1 Global Non-Memory Chip Packaging Substrate Industry Rank of Major Manufacturers
        3.5.2 Global Concentration Ratios (CR4) for Non-Memory Chip Packaging Substrate in 2023
        3.5.3 Global Concentration Ratios (CR8) for Non-Memory Chip Packaging Substrate in 2023
    3.6 Non-Memory Chip Packaging Substrate Market: Overall Company Footprint Analysis
        3.6.1 Non-Memory Chip Packaging Substrate Market: Region Footprint
        3.6.2 Non-Memory Chip Packaging Substrate Market: Company Product Type Footprint
        3.6.3 Non-Memory Chip Packaging Substrate Market: Company Product Application Footprint
    3.7 Competitive Environment
        3.7.1 Historical Structure of the Industry
        3.7.2 Barriers of Market Entry
        3.7.3 Factors of Competition
    3.8 New Entrant and Capacity Expansion Plans
    3.9 Mergers, Acquisition, Agreements, and Collaborations

4 United States VS China VS Rest of the World
    4.1 United States VS China: Non-Memory Chip Packaging Substrate Production Value Comparison
        4.1.1 United States VS China: Non-Memory Chip Packaging Substrate Production Value Comparison (2019 & 2023 & 2030)
        4.1.2 United States VS China: Non-Memory Chip Packaging Substrate Production Value Market Share Comparison (2019 & 2023 & 2030)
    4.2 United States VS China: Non-Memory Chip Packaging Substrate Production Comparison
        4.2.1 United States VS China: Non-Memory Chip Packaging Substrate Production Comparison (2019 & 2023 & 2030)
        4.2.2 United States VS China: Non-Memory Chip Packaging Substrate Production Market Share Comparison (2019 & 2023 & 2030)
    4.3 United States VS China: Non-Memory Chip Packaging Substrate Consumption Comparison
        4.3.1 United States VS China: Non-Memory Chip Packaging Substrate Consumption Comparison (2019 & 2023 & 2030)
        4.3.2 United States VS China: Non-Memory Chip Packaging Substrate Consumption Market Share Comparison (2019 & 2023 & 2030)
    4.4 United States Based Non-Memory Chip Packaging Substrate Manufacturers and Market Share, 2019-2024
        4.4.1 United States Based Non-Memory Chip Packaging Substrate Manufacturers, Headquarters and Production Site (States, Country)
        4.4.2 United States Based Manufacturers Non-Memory Chip Packaging Substrate Production Value (2019-2024)
        4.4.3 United States Based Manufacturers Non-Memory Chip Packaging Substrate Production (2019-2024)
    4.5 China Based Non-Memory Chip Packaging Substrate Manufacturers and Market Share
        4.5.1 China Based Non-Memory Chip Packaging Substrate Manufacturers, Headquarters and Production Site (Province, Country)
        4.5.2 China Based Manufacturers Non-Memory Chip Packaging Substrate Production Value (2019-2024)
        4.5.3 China Based Manufacturers Non-Memory Chip Packaging Substrate Production (2019-2024)
    4.6 Rest of World Based Non-Memory Chip Packaging Substrate Manufacturers and Market Share, 2019-2024
        4.6.1 Rest of World Based Non-Memory Chip Packaging Substrate Manufacturers, Headquarters and Production Site (State, Country)
        4.6.2 Rest of World Based Manufacturers Non-Memory Chip Packaging Substrate Production Value (2019-2024)
        4.6.3 Rest of World Based Manufacturers Non-Memory Chip Packaging Substrate Production (2019-2024)

5 Market Analysis by Type
    5.1 World Non-Memory Chip Packaging Substrate Market Size Overview by Type: 2019 VS 2023 VS 2030
    5.2 Segment Introduction by Type
        5.2.1 Logic Chip Packaging Substrate
        5.2.2 Communication Chip Packaging Substrate
        5.2.3 Sensor Chip Packaging Substrate
        5.2.4 Others
    5.3 Market Segment by Type
        5.3.1 World Non-Memory Chip Packaging Substrate Production by Type (2019-2030)
        5.3.2 World Non-Memory Chip Packaging Substrate Production Value by Type (2019-2030)
        5.3.3 World Non-Memory Chip Packaging Substrate Average Price by Type (2019-2030)

6 Market Analysis by Application
    6.1 World Non-Memory Chip Packaging Substrate Market Size Overview by Application: 2019 VS 2023 VS 2030
    6.2 Segment Introduction by Application
        6.2.1 Consumer Electronics
        6.2.2 Industrial Control
        6.2.3 Communication Equipment
        6.2.4 Others
    6.3 Market Segment by Application
        6.3.1 World Non-Memory Chip Packaging Substrate Production by Application (2019-2030)
        6.3.2 World Non-Memory Chip Packaging Substrate Production Value by Application (2019-2030)
        6.3.3 World Non-Memory Chip Packaging Substrate Average Price by Application (2019-2030)

7 Company Profiles
    7.1 Ibiden
        7.1.1 Ibiden Details
        7.1.2 Ibiden Major Business
        7.1.3 Ibiden Non-Memory Chip Packaging Substrate Product and Services
        7.1.4 Ibiden Non-Memory Chip Packaging Substrate Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.1.5 Ibiden Recent Developments/Updates
        7.1.6 Ibiden Competitive Strengths & Weaknesses
    7.2 Shinko
        7.2.1 Shinko Details
        7.2.2 Shinko Major Business
        7.2.3 Shinko Non-Memory Chip Packaging Substrate Product and Services
        7.2.4 Shinko Non-Memory Chip Packaging Substrate Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.2.5 Shinko Recent Developments/Updates
        7.2.6 Shinko Competitive Strengths & Weaknesses
    7.3 kyocera
        7.3.1 kyocera Details
        7.3.2 kyocera Major Business
        7.3.3 kyocera Non-Memory Chip Packaging Substrate Product and Services
        7.3.4 kyocera Non-Memory Chip Packaging Substrate Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.3.5 kyocera Recent Developments/Updates
        7.3.6 kyocera Competitive Strengths & Weaknesses
    7.4 LGInnotek
        7.4.1 LGInnotek Details
        7.4.2 LGInnotek Major Business
        7.4.3 LGInnotek Non-Memory Chip Packaging Substrate Product and Services
        7.4.4 LGInnotek Non-Memory Chip Packaging Substrate Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.4.5 LGInnotek Recent Developments/Updates
        7.4.6 LGInnotek Competitive Strengths & Weaknesses
    7.5 Samsung Electro Mechanics
        7.5.1 Samsung Electro Mechanics Details
        7.5.2 Samsung Electro Mechanics Major Business
        7.5.3 Samsung Electro Mechanics Non-Memory Chip Packaging Substrate Product and Services
        7.5.4 Samsung Electro Mechanics Non-Memory Chip Packaging Substrate Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.5.5 Samsung Electro Mechanics Recent Developments/Updates
        7.5.6 Samsung Electro Mechanics Competitive Strengths & Weaknesses
    7.6 AT&S
        7.6.1 AT&S Details
        7.6.2 AT&S Major Business
        7.6.3 AT&S Non-Memory Chip Packaging Substrate Product and Services
        7.6.4 AT&S Non-Memory Chip Packaging Substrate Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.6.5 AT&S Recent Developments/Updates
        7.6.6 AT&S Competitive Strengths & Weaknesses
    7.7 ASE Group
        7.7.1 ASE Group Details
        7.7.2 ASE Group Major Business
        7.7.3 ASE Group Non-Memory Chip Packaging Substrate Product and Services
        7.7.4 ASE Group Non-Memory Chip Packaging Substrate Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.7.5 ASE Group Recent Developments/Updates
        7.7.6 ASE Group Competitive Strengths & Weaknesses
    7.8 Unimicron
        7.8.1 Unimicron Details
        7.8.2 Unimicron Major Business
        7.8.3 Unimicron Non-Memory Chip Packaging Substrate Product and Services
        7.8.4 Unimicron Non-Memory Chip Packaging Substrate Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.8.5 Unimicron Recent Developments/Updates
        7.8.6 Unimicron Competitive Strengths & Weaknesses
    7.9 KINSUS
        7.9.1 KINSUS Details
        7.9.2 KINSUS Major Business
        7.9.3 KINSUS Non-Memory Chip Packaging Substrate Product and Services
        7.9.4 KINSUS Non-Memory Chip Packaging Substrate Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.9.5 KINSUS Recent Developments/Updates
        7.9.6 KINSUS Competitive Strengths & Weaknesses
    7.10 Hemei Jingyi Technology
        7.10.1 Hemei Jingyi Technology Details
        7.10.2 Hemei Jingyi Technology Major Business
        7.10.3 Hemei Jingyi Technology Non-Memory Chip Packaging Substrate Product and Services
        7.10.4 Hemei Jingyi Technology Non-Memory Chip Packaging Substrate Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.10.5 Hemei Jingyi Technology Recent Developments/Updates
        7.10.6 Hemei Jingyi Technology Competitive Strengths & Weaknesses
    7.11 NanYa PCB
        7.11.1 NanYa PCB Details
        7.11.2 NanYa PCB Major Business
        7.11.3 NanYa PCB Non-Memory Chip Packaging Substrate Product and Services
        7.11.4 NanYa PCB Non-Memory Chip Packaging Substrate Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.11.5 NanYa PCB Recent Developments/Updates
        7.11.6 NanYa PCB Competitive Strengths & Weaknesses
    7.12 Simmtech
        7.12.1 Simmtech Details
        7.12.2 Simmtech Major Business
        7.12.3 Simmtech Non-Memory Chip Packaging Substrate Product and Services
        7.12.4 Simmtech Non-Memory Chip Packaging Substrate Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.12.5 Simmtech Recent Developments/Updates
        7.12.6 Simmtech Competitive Strengths & Weaknesses

8 Industry Chain Analysis
    8.1 Non-Memory Chip Packaging Substrate Industry Chain
    8.2 Non-Memory Chip Packaging Substrate Upstream Analysis
        8.2.1 Non-Memory Chip Packaging Substrate Core Raw Materials
        8.2.2 Main Manufacturers of Non-Memory Chip Packaging Substrate Core Raw Materials
    8.3 Midstream Analysis
    8.4 Downstream Analysis
    8.5 Non-Memory Chip Packaging Substrate Production Mode
    8.6 Non-Memory Chip Packaging Substrate Procurement Model
    8.7 Non-Memory Chip Packaging Substrate Industry Sales Model and Sales Channels
        8.7.1 Non-Memory Chip Packaging Substrate Sales Model
        8.7.2 Non-Memory Chip Packaging Substrate Typical Distributors

9 Research Findings and Conclusion

10 Appendix
    10.1 Methodology
    10.2 Research Process and Data Source
    10.3 Disclaimer

Table of Figures

List of Tables
 Table 1. World Non-Memory Chip Packaging Substrate Production Value by Region (2019, 2023 and 2030) & (USD Million)
 Table 2. World Non-Memory Chip Packaging Substrate Production Value by Region (2019-2024) & (USD Million)
 Table 3. World Non-Memory Chip Packaging Substrate Production Value by Region (2025-2030) & (USD Million)
 Table 4. World Non-Memory Chip Packaging Substrate Production Value Market Share by Region (2019-2024)
 Table 5. World Non-Memory Chip Packaging Substrate Production Value Market Share by Region (2025-2030)
 Table 6. World Non-Memory Chip Packaging Substrate Production by Region (2019-2024) & (K Units)
 Table 7. World Non-Memory Chip Packaging Substrate Production by Region (2025-2030) & (K Units)
 Table 8. World Non-Memory Chip Packaging Substrate Production Market Share by Region (2019-2024)
 Table 9. World Non-Memory Chip Packaging Substrate Production Market Share by Region (2025-2030)
 Table 10. World Non-Memory Chip Packaging Substrate Average Price by Region (2019-2024) & (US$/Unit)
 Table 11. World Non-Memory Chip Packaging Substrate Average Price by Region (2025-2030) & (US$/Unit)
 Table 12. Non-Memory Chip Packaging Substrate Major Market Trends
 Table 13. World Non-Memory Chip Packaging Substrate Consumption Growth Rate Forecast by Region (2019 & 2023 & 2030) & (K Units)
 Table 14. World Non-Memory Chip Packaging Substrate Consumption by Region (2019-2024) & (K Units)
 Table 15. World Non-Memory Chip Packaging Substrate Consumption Forecast by Region (2025-2030) & (K Units)
 Table 16. World Non-Memory Chip Packaging Substrate Production Value by Manufacturer (2019-2024) & (USD Million)
 Table 17. Production Value Market Share of Key Non-Memory Chip Packaging Substrate Producers in 2023
 Table 18. World Non-Memory Chip Packaging Substrate Production by Manufacturer (2019-2024) & (K Units)
 Table 19. Production Market Share of Key Non-Memory Chip Packaging Substrate Producers in 2023
 Table 20. World Non-Memory Chip Packaging Substrate Average Price by Manufacturer (2019-2024) & (US$/Unit)
 Table 21. Global Non-Memory Chip Packaging Substrate Company Evaluation Quadrant
 Table 22. World Non-Memory Chip Packaging Substrate Industry Rank of Major Manufacturers, Based on Production Value in 2023
 Table 23. Head Office and Non-Memory Chip Packaging Substrate Production Site of Key Manufacturer
 Table 24. Non-Memory Chip Packaging Substrate Market: Company Product Type Footprint
 Table 25. Non-Memory Chip Packaging Substrate Market: Company Product Application Footprint
 Table 26. Non-Memory Chip Packaging Substrate Competitive Factors
 Table 27. Non-Memory Chip Packaging Substrate New Entrant and Capacity Expansion Plans
 Table 28. Non-Memory Chip Packaging Substrate Mergers & Acquisitions Activity
 Table 29. United States VS China Non-Memory Chip Packaging Substrate Production Value Comparison, (2019 & 2023 & 2030) & (USD Million)
 Table 30. United States VS China Non-Memory Chip Packaging Substrate Production Comparison, (2019 & 2023 & 2030) & (K Units)
 Table 31. United States VS China Non-Memory Chip Packaging Substrate Consumption Comparison, (2019 & 2023 & 2030) & (K Units)
 Table 32. United States Based Non-Memory Chip Packaging Substrate Manufacturers, Headquarters and Production Site (States, Country)
 Table 33. United States Based Manufacturers Non-Memory Chip Packaging Substrate Production Value, (2019-2024) & (USD Million)
 Table 34. United States Based Manufacturers Non-Memory Chip Packaging Substrate Production Value Market Share (2019-2024)
 Table 35. United States Based Manufacturers Non-Memory Chip Packaging Substrate Production (2019-2024) & (K Units)
 Table 36. United States Based Manufacturers Non-Memory Chip Packaging Substrate Production Market Share (2019-2024)
 Table 37. China Based Non-Memory Chip Packaging Substrate Manufacturers, Headquarters and Production Site (Province, Country)
 Table 38. China Based Manufacturers Non-Memory Chip Packaging Substrate Production Value, (2019-2024) & (USD Million)
 Table 39. China Based Manufacturers Non-Memory Chip Packaging Substrate Production Value Market Share (2019-2024)
 Table 40. China Based Manufacturers Non-Memory Chip Packaging Substrate Production, (2019-2024) & (K Units)
 Table 41. China Based Manufacturers Non-Memory Chip Packaging Substrate Production Market Share (2019-2024)
 Table 42. Rest of World Based Non-Memory Chip Packaging Substrate Manufacturers, Headquarters and Production Site (State, Country)
 Table 43. Rest of World Based Manufacturers Non-Memory Chip Packaging Substrate Production Value, (2019-2024) & (USD Million)
 Table 44. Rest of World Based Manufacturers Non-Memory Chip Packaging Substrate Production Value Market Share (2019-2024)
 Table 45. Rest of World Based Manufacturers Non-Memory Chip Packaging Substrate Production, (2019-2024) & (K Units)
 Table 46. Rest of World Based Manufacturers Non-Memory Chip Packaging Substrate Production Market Share (2019-2024)
 Table 47. World Non-Memory Chip Packaging Substrate Production Value by Type, (USD Million), 2019 & 2023 & 2030
 Table 48. World Non-Memory Chip Packaging Substrate Production by Type (2019-2024) & (K Units)
 Table 49. World Non-Memory Chip Packaging Substrate Production by Type (2025-2030) & (K Units)
 Table 50. World Non-Memory Chip Packaging Substrate Production Value by Type (2019-2024) & (USD Million)
 Table 51. World Non-Memory Chip Packaging Substrate Production Value by Type (2025-2030) & (USD Million)
 Table 52. World Non-Memory Chip Packaging Substrate Average Price by Type (2019-2024) & (US$/Unit)
 Table 53. World Non-Memory Chip Packaging Substrate Average Price by Type (2025-2030) & (US$/Unit)
 Table 54. World Non-Memory Chip Packaging Substrate Production Value by Application, (USD Million), 2019 & 2023 & 2030
 Table 55. World Non-Memory Chip Packaging Substrate Production by Application (2019-2024) & (K Units)
 Table 56. World Non-Memory Chip Packaging Substrate Production by Application (2025-2030) & (K Units)
 Table 57. World Non-Memory Chip Packaging Substrate Production Value by Application (2019-2024) & (USD Million)
 Table 58. World Non-Memory Chip Packaging Substrate Production Value by Application (2025-2030) & (USD Million)
 Table 59. World Non-Memory Chip Packaging Substrate Average Price by Application (2019-2024) & (US$/Unit)
 Table 60. World Non-Memory Chip Packaging Substrate Average Price by Application (2025-2030) & (US$/Unit)
 Table 61. Ibiden Basic Information, Manufacturing Base and Competitors
 Table 62. Ibiden Major Business
 Table 63. Ibiden Non-Memory Chip Packaging Substrate Product and Services
 Table 64. Ibiden Non-Memory Chip Packaging Substrate Production (K Units), Price (US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 65. Ibiden Recent Developments/Updates
 Table 66. Ibiden Competitive Strengths & Weaknesses
 Table 67. Shinko Basic Information, Manufacturing Base and Competitors
 Table 68. Shinko Major Business
 Table 69. Shinko Non-Memory Chip Packaging Substrate Product and Services
 Table 70. Shinko Non-Memory Chip Packaging Substrate Production (K Units), Price (US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 71. Shinko Recent Developments/Updates
 Table 72. Shinko Competitive Strengths & Weaknesses
 Table 73. kyocera Basic Information, Manufacturing Base and Competitors
 Table 74. kyocera Major Business
 Table 75. kyocera Non-Memory Chip Packaging Substrate Product and Services
 Table 76. kyocera Non-Memory Chip Packaging Substrate Production (K Units), Price (US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 77. kyocera Recent Developments/Updates
 Table 78. kyocera Competitive Strengths & Weaknesses
 Table 79. LGInnotek Basic Information, Manufacturing Base and Competitors
 Table 80. LGInnotek Major Business
 Table 81. LGInnotek Non-Memory Chip Packaging Substrate Product and Services
 Table 82. LGInnotek Non-Memory Chip Packaging Substrate Production (K Units), Price (US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 83. LGInnotek Recent Developments/Updates
 Table 84. LGInnotek Competitive Strengths & Weaknesses
 Table 85. Samsung Electro Mechanics Basic Information, Manufacturing Base and Competitors
 Table 86. Samsung Electro Mechanics Major Business
 Table 87. Samsung Electro Mechanics Non-Memory Chip Packaging Substrate Product and Services
 Table 88. Samsung Electro Mechanics Non-Memory Chip Packaging Substrate Production (K Units), Price (US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 89. Samsung Electro Mechanics Recent Developments/Updates
 Table 90. Samsung Electro Mechanics Competitive Strengths & Weaknesses
 Table 91. AT&S Basic Information, Manufacturing Base and Competitors
 Table 92. AT&S Major Business
 Table 93. AT&S Non-Memory Chip Packaging Substrate Product and Services
 Table 94. AT&S Non-Memory Chip Packaging Substrate Production (K Units), Price (US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 95. AT&S Recent Developments/Updates
 Table 96. AT&S Competitive Strengths & Weaknesses
 Table 97. ASE Group Basic Information, Manufacturing Base and Competitors
 Table 98. ASE Group Major Business
 Table 99. ASE Group Non-Memory Chip Packaging Substrate Product and Services
 Table 100. ASE Group Non-Memory Chip Packaging Substrate Production (K Units), Price (US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 101. ASE Group Recent Developments/Updates
 Table 102. ASE Group Competitive Strengths & Weaknesses
 Table 103. Unimicron Basic Information, Manufacturing Base and Competitors
 Table 104. Unimicron Major Business
 Table 105. Unimicron Non-Memory Chip Packaging Substrate Product and Services
 Table 106. Unimicron Non-Memory Chip Packaging Substrate Production (K Units), Price (US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 107. Unimicron Recent Developments/Updates
 Table 108. Unimicron Competitive Strengths & Weaknesses
 Table 109. KINSUS Basic Information, Manufacturing Base and Competitors
 Table 110. KINSUS Major Business
 Table 111. KINSUS Non-Memory Chip Packaging Substrate Product and Services
 Table 112. KINSUS Non-Memory Chip Packaging Substrate Production (K Units), Price (US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 113. KINSUS Recent Developments/Updates
 Table 114. KINSUS Competitive Strengths & Weaknesses
 Table 115. Hemei Jingyi Technology Basic Information, Manufacturing Base and Competitors
 Table 116. Hemei Jingyi Technology Major Business
 Table 117. Hemei Jingyi Technology Non-Memory Chip Packaging Substrate Product and Services
 Table 118. Hemei Jingyi Technology Non-Memory Chip Packaging Substrate Production (K Units), Price (US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 119. Hemei Jingyi Technology Recent Developments/Updates
 Table 120. Hemei Jingyi Technology Competitive Strengths & Weaknesses
 Table 121. NanYa PCB Basic Information, Manufacturing Base and Competitors
 Table 122. NanYa PCB Major Business
 Table 123. NanYa PCB Non-Memory Chip Packaging Substrate Product and Services
 Table 124. NanYa PCB Non-Memory Chip Packaging Substrate Production (K Units), Price (US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 125. NanYa PCB Recent Developments/Updates
 Table 126. NanYa PCB Competitive Strengths & Weaknesses
 Table 127. Simmtech Basic Information, Manufacturing Base and Competitors
 Table 128. Simmtech Major Business
 Table 129. Simmtech Non-Memory Chip Packaging Substrate Product and Services
 Table 130. Simmtech Non-Memory Chip Packaging Substrate Production (K Units), Price (US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 131. Simmtech Recent Developments/Updates
 Table 132. Simmtech Competitive Strengths & Weaknesses
 Table 133. Global Key Players of Non-Memory Chip Packaging Substrate Upstream (Raw Materials)
 Table 134. Global Non-Memory Chip Packaging Substrate Typical Customers
 Table 135. Non-Memory Chip Packaging Substrate Typical Distributors


List of Figures
 Figure 1. Non-Memory Chip Packaging Substrate Picture
 Figure 2. World Non-Memory Chip Packaging Substrate Production Value: 2019 & 2023 & 2030, (USD Million)
 Figure 3. World Non-Memory Chip Packaging Substrate Production Value and Forecast (2019-2030) & (USD Million)
 Figure 4. World Non-Memory Chip Packaging Substrate Production (2019-2030) & (K Units)
 Figure 5. World Non-Memory Chip Packaging Substrate Average Price (2019-2030) & (US$/Unit)
 Figure 6. World Non-Memory Chip Packaging Substrate Production Value Market Share by Region (2019-2030)
 Figure 7. World Non-Memory Chip Packaging Substrate Production Market Share by Region (2019-2030)
 Figure 8. North America Non-Memory Chip Packaging Substrate Production (2019-2030) & (K Units)
 Figure 9. Europe Non-Memory Chip Packaging Substrate Production (2019-2030) & (K Units)
 Figure 10. China Non-Memory Chip Packaging Substrate Production (2019-2030) & (K Units)
 Figure 11. Japan Non-Memory Chip Packaging Substrate Production (2019-2030) & (K Units)
 Figure 12. South Korea Non-Memory Chip Packaging Substrate Production (2019-2030) & (K Units)
 Figure 13. Non-Memory Chip Packaging Substrate Market Drivers
 Figure 14. Factors Affecting Demand
 Figure 15. World Non-Memory Chip Packaging Substrate Consumption (2019-2030) & (K Units)
 Figure 16. World Non-Memory Chip Packaging Substrate Consumption Market Share by Region (2019-2030)
 Figure 17. United States Non-Memory Chip Packaging Substrate Consumption (2019-2030) & (K Units)
 Figure 18. China Non-Memory Chip Packaging Substrate Consumption (2019-2030) & (K Units)
 Figure 19. Europe Non-Memory Chip Packaging Substrate Consumption (2019-2030) & (K Units)
 Figure 20. Japan Non-Memory Chip Packaging Substrate Consumption (2019-2030) & (K Units)
 Figure 21. South Korea Non-Memory Chip Packaging Substrate Consumption (2019-2030) & (K Units)
 Figure 22. ASEAN Non-Memory Chip Packaging Substrate Consumption (2019-2030) & (K Units)
 Figure 23. India Non-Memory Chip Packaging Substrate Consumption (2019-2030) & (K Units)
 Figure 24. Producer Shipments of Non-Memory Chip Packaging Substrate by Manufacturer Revenue ($MM) and Market Share (%): 2023
 Figure 25. Global Four-firm Concentration Ratios (CR4) for Non-Memory Chip Packaging Substrate Markets in 2023
 Figure 26. Global Four-firm Concentration Ratios (CR8) for Non-Memory Chip Packaging Substrate Markets in 2023
 Figure 27. United States VS China: Non-Memory Chip Packaging Substrate Production Value Market Share Comparison (2019 & 2023 & 2030)
 Figure 28. United States VS China: Non-Memory Chip Packaging Substrate Production Market Share Comparison (2019 & 2023 & 2030)
 Figure 29. United States VS China: Non-Memory Chip Packaging Substrate Consumption Market Share Comparison (2019 & 2023 & 2030)
 Figure 30. United States Based Manufacturers Non-Memory Chip Packaging Substrate Production Market Share 2023
 Figure 31. China Based Manufacturers Non-Memory Chip Packaging Substrate Production Market Share 2023
 Figure 32. Rest of World Based Manufacturers Non-Memory Chip Packaging Substrate Production Market Share 2023
 Figure 33. World Non-Memory Chip Packaging Substrate Production Value by Type, (USD Million), 2019 & 2023 & 2030
 Figure 34. World Non-Memory Chip Packaging Substrate Production Value Market Share by Type in 2023
 Figure 35. Logic Chip Packaging Substrate
 Figure 36. Communication Chip Packaging Substrate
 Figure 37. Sensor Chip Packaging Substrate
 Figure 38. Others
 Figure 39. World Non-Memory Chip Packaging Substrate Production Market Share by Type (2019-2030)
 Figure 40. World Non-Memory Chip Packaging Substrate Production Value Market Share by Type (2019-2030)
 Figure 41. World Non-Memory Chip Packaging Substrate Average Price by Type (2019-2030) & (US$/Unit)
 Figure 42. World Non-Memory Chip Packaging Substrate Production Value by Application, (USD Million), 2019 & 2023 & 2030
 Figure 43. World Non-Memory Chip Packaging Substrate Production Value Market Share by Application in 2023
 Figure 44. Consumer Electronics
 Figure 45. Industrial Control
 Figure 46. Communication Equipment
 Figure 47. Others
 Figure 48. World Non-Memory Chip Packaging Substrate Production Market Share by Application (2019-2030)
 Figure 49. World Non-Memory Chip Packaging Substrate Production Value Market Share by Application (2019-2030)
 Figure 50. World Non-Memory Chip Packaging Substrate Average Price by Application (2019-2030) & (US$/Unit)
 Figure 51. Non-Memory Chip Packaging Substrate Industry Chain
 Figure 52. Non-Memory Chip Packaging Substrate Procurement Model
 Figure 53. Non-Memory Chip Packaging Substrate Sales Model
 Figure 54. Non-Memory Chip Packaging Substrate Sales Channels, Direct Sales, and Distribution
 Figure 55. Methodology
 Figure 56. Research Process and Data Source

Research Methodology

Client Requirements

Review and analyze client requirements

Discussion of all the project requirements and queries

Flexibility Check

Project Feasibility Analysis

Finalizing tentative research programme

Structuring project proposal with scope, timeline, and costs

Analyzing Market Dynamics

Determination of key drivers, restraints, challenge, and opportunity

Identifies market needs and trends

Market Size Estimation & Forecast

Estimation of historical data based on secondary and primary data

Anticipating market recast by assigning weightage to market forces (drivers, restraints, opportunities)

Freezing historical and forecast market size estimations based on evolution, trends, outlook, and strategies

Consideration of geography, region-specific product/service demand for region segments

Consideration of product utilization rates, product demand outlook for segments by application or end-user.

Data Source

Secondary Source
Data collections from annual reports, presentations,associations, journals, analyst reports, paid database, press releases, blogs, newsletters,and GIR repositories.

Primary Source
Research discussion with manufacturers, distributors, suppliers, end user, industry experts to verify insights.

Validation and
triangulation of
secondary and primary source.

Collection of data

Cumulating and collating the essential qualitative and quantitative data

Generation of report in client requested format by research analysts

Reviews by expert analysts

Final quality check

Clarifying queries

Receiving feedback

Ensuring satisfaction

01 Identification of data

This step involves identification of several primary and secondary data research sources, including Global Info Research's internal data sources. The primary sources consist of in-depth discussions and interviews with policy makers, industry experts, and data evaluators, whereas secondary sources include a thorough study of market journals, press releases, annual reports, and government and non-government agencies websites.
02 Evaluation of Market Dynamic

This phase includes a detailed evaluation of several factors that are likely to affect the market dynamics. It involves a comprehensive assessment of major market pain points, drivers, and trends. It also comprises a detailed study of research plans and methodology.
03 Collection of Data

This process consists of gathering data, accessing proprietary databases, and reaching out to key industry participants that operate in the market across the value chain. It also involves studying several patterns in the historical data and comparing it with the current scenario.
04 Collaboration of Data

This stage involves the validation of data and arrival at actual statistics, and evolution of the market over the years. It entails the study and analyzes various segments and verticals of the market. An impact analysis is also performed to observe which factors will affect the market in the next few years.
05 Verification and Analysis

This is the final stage, which involves both quantity and quality checks. Although the process of data verification is an integral part of the research process, all data points and statistics and figures are re-checked to uphold their authenticity and validity.

Companies Mentioned

Ibiden
Shinko
kyocera
LGInnotek
Samsung Electro Mechanics
AT&S
ASE Group
Unimicron
KINSUS
Hemei Jingyi Technology
NanYa PCB
Simmtech

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Global Non-Memory Chip Packaging Substrate Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

Global Non-Memory Chip Packaging Substrate Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

date 15 Aug 2024

date Electronics & Semiconductor

Non-memory chip packaging substrate refers to the substrate material used to package non-memory type chips (such as processors, analog chips, RF chips, sensors, etc.). Similar to the memory chip packaging substrate, it plays a key role in chip packaging, providing electrical connection, mechanical support, heat dissipation management and other functions, but its design and application requirements may be different.

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