Global Semiconductor Wafer Bonding Equipment Supply, Demand and Key Producers, 2024-2030
Page: 126
Published Date: 03 Dec 2024
Category: Machinery & Equipment
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Description
Table of Contents
Table of Figures
Research Methodology
Companies Mentioned
Related Reports
Product Tags
Table of Contents
Table of Figures
Research Methodology
Companies Mentioned
Related Reports
Product Tags
Description
The global Semiconductor Wafer Bonding Equipment market size is expected to reach $ 438 million by 2030, rising at a market growth of 5.0% CAGR during the forecast period (2024-2030).
Semiconductor Wafer Bonding Equipment refers to the specialized machinery used in the semiconductor manufacturing process to bond two or more semiconductor wafers together. This bonding is typically done to create multi-layer structures or to integrate different materials during the fabrication of advanced semiconductor devices. Wafer bonding is a crucial process in areas such as 3D integration, MEMS (Micro-Electro-Mechanical Systems), photonic devices, advanced packaging, and heterogeneous integration.
The semiconductor wafer bonding equipment market is a critical component of semiconductor manufacturing, supporting the bonding of semiconductor wafers used in advanced packaging, 3D integration, MEMS (Micro-Electro-Mechanical Systems), and photonics applications. These bonding technologies enable the creation of more powerful, smaller, and efficient semiconductor devices required for a wide range of industries, including consumer electronics, automotive, telecommunications, medical devices, and data centers.
Key Drivers of Market Growth
Advancement in 3D IC and Wafer-Level Packaging (WLP): The demand for 3D ICs, which require stacking multiple layers of wafers, is a major driver for wafer bonding equipment. Wafer bonding technologies such as direct bonding, adhesive bonding, and metal bonding are crucial for enabling these advanced packaging solutions. Furthermore, Fan-Out Wafer-Level Packaging (FOWLP) and System-in-Package (SiP) require wafer bonding techniques for compact and efficient multi-chip packages. Miniaturization and Performance Demands: The continuous trend of miniaturization in semiconductor devices, especially in smartphones, wearables, and IoT devices, drives the need for precise wafer bonding to enable wafer thinning, 3D stacking, and integration of heterogeneous materials. This enables the creation of smaller, lighter, and more powerful devices.
Challenges in the Market
High Capital Investment: Semiconductor wafer bonding equipment involves high upfront costs due to the precision and complexity required in the bonding process. This can be a barrier for small and medium-sized manufacturers looking to adopt these advanced technologies. Material Compatibility and Process Control: Ensuring compatibility between bonding materials and wafer types (e.g., silicon, glass, compound semiconductors) can be challenging. Additionally, wafer bonding requires precise control of temperature, pressure, and alignment, which can increase the complexity of the manufacturing process.
Market Opportunities
Growth in Advanced Packaging Solutions: The increasing adoption of 3D IC packaging, fan-out wafer-level packaging (FOWLP), and system-in-package (SiP) solutions offers significant growth opportunities for wafer bonding equipment. These technologies require advanced bonding methods to enable efficient integration of multiple chips or materials. Expanding Use of Flexible Electronics: As flexible electronics gain traction in applications such as wearables, smart textiles, and flexible displays, wafer bonding technology will play a key role in processing and integrating flexible substrates.
This report studies the global Semiconductor Wafer Bonding Equipment production, demand, key manufacturers, and key regions.
This report is a detailed and comprehensive analysis of the world market for Semiconductor Wafer Bonding Equipment and provides market size (US$ million) and Year-over-Year (YoY) Growth, considering 2023 as the base year. This report explores demand trends and competition, as well as details the characteristics of Semiconductor Wafer Bonding Equipment that contribute to its increasing demand across many markets.
Highlights and key features of the study
Global Semiconductor Wafer Bonding Equipment total production and demand, 2019-2030, (Units)
Global Semiconductor Wafer Bonding Equipment total production value, 2019-2030, (USD Million)
Global Semiconductor Wafer Bonding Equipment production by region & country, production, value, CAGR, 2019-2030, (USD Million) & (Units), (based on production site)
Global Semiconductor Wafer Bonding Equipment consumption by region & country, CAGR, 2019-2030 & (Units)
U.S. VS China: Semiconductor Wafer Bonding Equipment domestic production, consumption, key domestic manufacturers and share
Global Semiconductor Wafer Bonding Equipment production by manufacturer, production, price, value and market share 2019-2024, (USD Million) & (Units)
Global Semiconductor Wafer Bonding Equipment production by Type, production, value, CAGR, 2019-2030, (USD Million) & (Units)
Global Semiconductor Wafer Bonding Equipment production by Application, production, value, CAGR, 2019-2030, (USD Million) & (Units)
This report profiles key players in the global Semiconductor Wafer Bonding Equipment market based on the following parameters - company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include EV Group, SUSS MicroTec, Tokyo Electron, Applied Microengineering, Nidec Machine Tool, Ayumi Industry, Bondtech, Aimechatec, U-Precision Tech, TAZMO, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World Semiconductor Wafer Bonding Equipment market
Detailed Segmentation:
Each section contains quantitative market data including market by value (US$ Millions), volume (production, consumption) & (Units) and average price (K US$/Unit) by manufacturer, by Type, and by Application. Data is given for the years 2019-2030 by year with 2023 as the base year, 2024 as the estimate year, and 2025-2030 as the forecast year.
Global Semiconductor Wafer Bonding Equipment Market, By Region:
United States
China
Europe
Japan
South Korea
ASEAN
India
Rest of World
Global Semiconductor Wafer Bonding Equipment Market, Segmentation by Type:
Fully Automatic
Semi Automatic
Global Semiconductor Wafer Bonding Equipment Market, Segmentation by Application:
MEMS
Advanced Packaging
CIS
Others
Companies Profiled:
EV Group
SUSS MicroTec
Tokyo Electron
Applied Microengineering
Nidec Machine Tool
Ayumi Industry
Bondtech
Aimechatec
U-Precision Tech
TAZMO
Hutem
Shanghai Micro Electronics
Canon
Key Questions Answered:
1. How big is the global Semiconductor Wafer Bonding Equipment market?
2. What is the demand of the global Semiconductor Wafer Bonding Equipment market?
3. What is the year over year growth of the global Semiconductor Wafer Bonding Equipment market?
4. What is the production and production value of the global Semiconductor Wafer Bonding Equipment market?
5. Who are the key producers in the global Semiconductor Wafer Bonding Equipment market?
6. What are the growth factors driving the market demand?
Table of Contents
1 Supply Summary
1.1 Semiconductor Wafer Bonding Equipment Introduction
1.2 World Semiconductor Wafer Bonding Equipment Supply & Forecast
1.2.1 World Semiconductor Wafer Bonding Equipment Production Value (2019 & 2023 & 2030)
1.2.2 World Semiconductor Wafer Bonding Equipment Production (2019-2030)
1.2.3 World Semiconductor Wafer Bonding Equipment Pricing Trends (2019-2030)
1.3 World Semiconductor Wafer Bonding Equipment Production by Region (Based on Production Site)
1.3.1 World Semiconductor Wafer Bonding Equipment Production Value by Region (2019-2030)
1.3.2 World Semiconductor Wafer Bonding Equipment Production by Region (2019-2030)
1.3.3 World Semiconductor Wafer Bonding Equipment Average Price by Region (2019-2030)
1.3.4 Europe Semiconductor Wafer Bonding Equipment Production (2019-2030)
1.3.5 China Semiconductor Wafer Bonding Equipment Production (2019-2030)
1.3.6 Japan Semiconductor Wafer Bonding Equipment Production (2019-2030)
1.4 Market Drivers, Restraints and Trends
1.4.1 Semiconductor Wafer Bonding Equipment Market Drivers
1.4.2 Factors Affecting Demand
1.4.3 Semiconductor Wafer Bonding Equipment Major Market Trends
2.1 World Semiconductor Wafer Bonding Equipment Demand (2019-2030)
2.2 World Semiconductor Wafer Bonding Equipment Consumption by Region
2.2.1 World Semiconductor Wafer Bonding Equipment Consumption by Region (2019-2024)
2.2.2 World Semiconductor Wafer Bonding Equipment Consumption Forecast by Region (2025-2030)
2.3 United States Semiconductor Wafer Bonding Equipment Consumption (2019-2030)
2.4 China Semiconductor Wafer Bonding Equipment Consumption (2019-2030)
2.5 Europe Semiconductor Wafer Bonding Equipment Consumption (2019-2030)
2.6 Japan Semiconductor Wafer Bonding Equipment Consumption (2019-2030)
2.7 South Korea Semiconductor Wafer Bonding Equipment Consumption (2019-2030)
2.8 ASEAN Semiconductor Wafer Bonding Equipment Consumption (2019-2030)
2.9 India Semiconductor Wafer Bonding Equipment Consumption (2019-2030)
3.1 World Semiconductor Wafer Bonding Equipment Production Value by Manufacturer (2019-2024)
3.2 World Semiconductor Wafer Bonding Equipment Production by Manufacturer (2019-2024)
3.3 World Semiconductor Wafer Bonding Equipment Average Price by Manufacturer (2019-2024)
3.4 Semiconductor Wafer Bonding Equipment Company Evaluation Quadrant
3.5 Industry Rank and Concentration Rate (CR)
3.5.1 Global Semiconductor Wafer Bonding Equipment Industry Rank of Major Manufacturers
3.5.2 Global Concentration Ratios (CR4) for Semiconductor Wafer Bonding Equipment in 2023
3.5.3 Global Concentration Ratios (CR8) for Semiconductor Wafer Bonding Equipment in 2023
3.6 Semiconductor Wafer Bonding Equipment Market: Overall Company Footprint Analysis
3.6.1 Semiconductor Wafer Bonding Equipment Market: Region Footprint
3.6.2 Semiconductor Wafer Bonding Equipment Market: Company Product Type Footprint
3.6.3 Semiconductor Wafer Bonding Equipment Market: Company Product Application Footprint
3.7 Competitive Environment
3.7.1 Historical Structure of the Industry
3.7.2 Barriers of Market Entry
3.7.3 Factors of Competition
3.8 New Entrant and Capacity Expansion Plans
3.9 Mergers, Acquisition, Agreements, and Collaborations
4.1 United States VS China: Semiconductor Wafer Bonding Equipment Production Value Comparison
4.1.1 United States VS China: Semiconductor Wafer Bonding Equipment Production Value Comparison (2019 & 2023 & 2030)
4.1.2 United States VS China: Semiconductor Wafer Bonding Equipment Production Value Market Share Comparison (2019 & 2023 & 2030)
4.2 United States VS China: Semiconductor Wafer Bonding Equipment Production Comparison
4.2.1 United States VS China: Semiconductor Wafer Bonding Equipment Production Comparison (2019 & 2023 & 2030)
4.2.2 United States VS China: Semiconductor Wafer Bonding Equipment Production Market Share Comparison (2019 & 2023 & 2030)
4.3 United States VS China: Semiconductor Wafer Bonding Equipment Consumption Comparison
4.3.1 United States VS China: Semiconductor Wafer Bonding Equipment Consumption Comparison (2019 & 2023 & 2030)
4.3.2 United States VS China: Semiconductor Wafer Bonding Equipment Consumption Market Share Comparison (2019 & 2023 & 2030)
4.4 United States Based Semiconductor Wafer Bonding Equipment Manufacturers and Market Share, 2019-2024
4.4.1 United States Based Semiconductor Wafer Bonding Equipment Manufacturers, Headquarters and Production Site (States, Country)
4.4.2 United States Based Manufacturers Semiconductor Wafer Bonding Equipment Production Value (2019-2024)
4.4.3 United States Based Manufacturers Semiconductor Wafer Bonding Equipment Production (2019-2024)
4.5 China Based Semiconductor Wafer Bonding Equipment Manufacturers and Market Share
4.5.1 China Based Semiconductor Wafer Bonding Equipment Manufacturers, Headquarters and Production Site (Province, Country)
4.5.2 China Based Manufacturers Semiconductor Wafer Bonding Equipment Production Value (2019-2024)
4.5.3 China Based Manufacturers Semiconductor Wafer Bonding Equipment Production (2019-2024)
4.6 Rest of World Based Semiconductor Wafer Bonding Equipment Manufacturers and Market Share, 2019-2024
4.6.1 Rest of World Based Semiconductor Wafer Bonding Equipment Manufacturers, Headquarters and Production Site (State, Country)
4.6.2 Rest of World Based Manufacturers Semiconductor Wafer Bonding Equipment Production Value (2019-2024)
4.6.3 Rest of World Based Manufacturers Semiconductor Wafer Bonding Equipment Production (2019-2024)
5.1 World Semiconductor Wafer Bonding Equipment Market Size Overview by Type: 2019 VS 2023 VS 2030
5.2 Segment Introduction by Type
5.2.1 Fully Automatic
5.2.2 Semi Automatic
5.3 Market Segment by Type
5.3.1 World Semiconductor Wafer Bonding Equipment Production by Type (2019-2030)
5.3.2 World Semiconductor Wafer Bonding Equipment Production Value by Type (2019-2030)
5.3.3 World Semiconductor Wafer Bonding Equipment Average Price by Type (2019-2030)
6.1 World Semiconductor Wafer Bonding Equipment Market Size Overview by Application: 2019 VS 2023 VS 2030
6.2 Segment Introduction by Application
6.2.1 MEMS
6.2.2 Advanced Packaging
6.2.3 CIS
6.2.4 Others
6.3 Market Segment by Application
6.3.1 World Semiconductor Wafer Bonding Equipment Production by Application (2019-2030)
6.3.2 World Semiconductor Wafer Bonding Equipment Production Value by Application (2019-2030)
6.3.3 World Semiconductor Wafer Bonding Equipment Average Price by Application (2019-2030)
7.1 EV Group
7.1.1 EV Group Details
7.1.2 EV Group Major Business
7.1.3 EV Group Semiconductor Wafer Bonding Equipment Product and Services
7.1.4 EV Group Semiconductor Wafer Bonding Equipment Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.1.5 EV Group Recent Developments/Updates
7.1.6 EV Group Competitive Strengths & Weaknesses
7.2 SUSS MicroTec
7.2.1 SUSS MicroTec Details
7.2.2 SUSS MicroTec Major Business
7.2.3 SUSS MicroTec Semiconductor Wafer Bonding Equipment Product and Services
7.2.4 SUSS MicroTec Semiconductor Wafer Bonding Equipment Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.2.5 SUSS MicroTec Recent Developments/Updates
7.2.6 SUSS MicroTec Competitive Strengths & Weaknesses
7.3 Tokyo Electron
7.3.1 Tokyo Electron Details
7.3.2 Tokyo Electron Major Business
7.3.3 Tokyo Electron Semiconductor Wafer Bonding Equipment Product and Services
7.3.4 Tokyo Electron Semiconductor Wafer Bonding Equipment Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.3.5 Tokyo Electron Recent Developments/Updates
7.3.6 Tokyo Electron Competitive Strengths & Weaknesses
7.4 Applied Microengineering
7.4.1 Applied Microengineering Details
7.4.2 Applied Microengineering Major Business
7.4.3 Applied Microengineering Semiconductor Wafer Bonding Equipment Product and Services
7.4.4 Applied Microengineering Semiconductor Wafer Bonding Equipment Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.4.5 Applied Microengineering Recent Developments/Updates
7.4.6 Applied Microengineering Competitive Strengths & Weaknesses
7.5 Nidec Machine Tool
7.5.1 Nidec Machine Tool Details
7.5.2 Nidec Machine Tool Major Business
7.5.3 Nidec Machine Tool Semiconductor Wafer Bonding Equipment Product and Services
7.5.4 Nidec Machine Tool Semiconductor Wafer Bonding Equipment Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.5.5 Nidec Machine Tool Recent Developments/Updates
7.5.6 Nidec Machine Tool Competitive Strengths & Weaknesses
7.6 Ayumi Industry
7.6.1 Ayumi Industry Details
7.6.2 Ayumi Industry Major Business
7.6.3 Ayumi Industry Semiconductor Wafer Bonding Equipment Product and Services
7.6.4 Ayumi Industry Semiconductor Wafer Bonding Equipment Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.6.5 Ayumi Industry Recent Developments/Updates
7.6.6 Ayumi Industry Competitive Strengths & Weaknesses
7.7 Bondtech
7.7.1 Bondtech Details
7.7.2 Bondtech Major Business
7.7.3 Bondtech Semiconductor Wafer Bonding Equipment Product and Services
7.7.4 Bondtech Semiconductor Wafer Bonding Equipment Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.7.5 Bondtech Recent Developments/Updates
7.7.6 Bondtech Competitive Strengths & Weaknesses
7.8 Aimechatec
7.8.1 Aimechatec Details
7.8.2 Aimechatec Major Business
7.8.3 Aimechatec Semiconductor Wafer Bonding Equipment Product and Services
7.8.4 Aimechatec Semiconductor Wafer Bonding Equipment Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.8.5 Aimechatec Recent Developments/Updates
7.8.6 Aimechatec Competitive Strengths & Weaknesses
7.9 U-Precision Tech
7.9.1 U-Precision Tech Details
7.9.2 U-Precision Tech Major Business
7.9.3 U-Precision Tech Semiconductor Wafer Bonding Equipment Product and Services
7.9.4 U-Precision Tech Semiconductor Wafer Bonding Equipment Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.9.5 U-Precision Tech Recent Developments/Updates
7.9.6 U-Precision Tech Competitive Strengths & Weaknesses
7.10 TAZMO
7.10.1 TAZMO Details
7.10.2 TAZMO Major Business
7.10.3 TAZMO Semiconductor Wafer Bonding Equipment Product and Services
7.10.4 TAZMO Semiconductor Wafer Bonding Equipment Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.10.5 TAZMO Recent Developments/Updates
7.10.6 TAZMO Competitive Strengths & Weaknesses
7.11 Hutem
7.11.1 Hutem Details
7.11.2 Hutem Major Business
7.11.3 Hutem Semiconductor Wafer Bonding Equipment Product and Services
7.11.4 Hutem Semiconductor Wafer Bonding Equipment Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.11.5 Hutem Recent Developments/Updates
7.11.6 Hutem Competitive Strengths & Weaknesses
7.12 Shanghai Micro Electronics
7.12.1 Shanghai Micro Electronics Details
7.12.2 Shanghai Micro Electronics Major Business
7.12.3 Shanghai Micro Electronics Semiconductor Wafer Bonding Equipment Product and Services
7.12.4 Shanghai Micro Electronics Semiconductor Wafer Bonding Equipment Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.12.5 Shanghai Micro Electronics Recent Developments/Updates
7.12.6 Shanghai Micro Electronics Competitive Strengths & Weaknesses
7.13 Canon
7.13.1 Canon Details
7.13.2 Canon Major Business
7.13.3 Canon Semiconductor Wafer Bonding Equipment Product and Services
7.13.4 Canon Semiconductor Wafer Bonding Equipment Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.13.5 Canon Recent Developments/Updates
7.13.6 Canon Competitive Strengths & Weaknesses
8.1 Semiconductor Wafer Bonding Equipment Industry Chain
8.2 Semiconductor Wafer Bonding Equipment Upstream Analysis
8.2.1 Semiconductor Wafer Bonding Equipment Core Raw Materials
8.2.2 Main Manufacturers of Semiconductor Wafer Bonding Equipment Core Raw Materials
8.3 Midstream Analysis
8.4 Downstream Analysis
8.5 Semiconductor Wafer Bonding Equipment Production Mode
8.6 Semiconductor Wafer Bonding Equipment Procurement Model
8.7 Semiconductor Wafer Bonding Equipment Industry Sales Model and Sales Channels
8.7.1 Semiconductor Wafer Bonding Equipment Sales Model
8.7.2 Semiconductor Wafer Bonding Equipment Typical Distributors
10.1 Methodology
10.2 Research Process and Data Source
10.3 Disclaimer
Table of Figures
List of Tables
Table 1. World Semiconductor Wafer Bonding Equipment Production Value by Region (2019, 2023 and 2030) & (USD Million)
Table 2. World Semiconductor Wafer Bonding Equipment Production Value by Region (2019-2024) & (USD Million)
Table 3. World Semiconductor Wafer Bonding Equipment Production Value by Region (2025-2030) & (USD Million)
Table 4. World Semiconductor Wafer Bonding Equipment Production Value Market Share by Region (2019-2024)
Table 5. World Semiconductor Wafer Bonding Equipment Production Value Market Share by Region (2025-2030)
Table 6. World Semiconductor Wafer Bonding Equipment Production by Region (2019-2024) & (Units)
Table 7. World Semiconductor Wafer Bonding Equipment Production by Region (2025-2030) & (Units)
Table 8. World Semiconductor Wafer Bonding Equipment Production Market Share by Region (2019-2024)
Table 9. World Semiconductor Wafer Bonding Equipment Production Market Share by Region (2025-2030)
Table 10. World Semiconductor Wafer Bonding Equipment Average Price by Region (2019-2024) & (K US$/Unit)
Table 11. World Semiconductor Wafer Bonding Equipment Average Price by Region (2025-2030) & (K US$/Unit)
Table 12. Semiconductor Wafer Bonding Equipment Major Market Trends
Table 13. World Semiconductor Wafer Bonding Equipment Consumption Growth Rate Forecast by Region (2019 & 2023 & 2030) & (Units)
Table 14. World Semiconductor Wafer Bonding Equipment Consumption by Region (2019-2024) & (Units)
Table 15. World Semiconductor Wafer Bonding Equipment Consumption Forecast by Region (2025-2030) & (Units)
Table 16. World Semiconductor Wafer Bonding Equipment Production Value by Manufacturer (2019-2024) & (USD Million)
Table 17. Production Value Market Share of Key Semiconductor Wafer Bonding Equipment Producers in 2023
Table 18. World Semiconductor Wafer Bonding Equipment Production by Manufacturer (2019-2024) & (Units)
Table 19. Production Market Share of Key Semiconductor Wafer Bonding Equipment Producers in 2023
Table 20. World Semiconductor Wafer Bonding Equipment Average Price by Manufacturer (2019-2024) & (K US$/Unit)
Table 21. Global Semiconductor Wafer Bonding Equipment Company Evaluation Quadrant
Table 22. World Semiconductor Wafer Bonding Equipment Industry Rank of Major Manufacturers, Based on Production Value in 2023
Table 23. Head Office and Semiconductor Wafer Bonding Equipment Production Site of Key Manufacturer
Table 24. Semiconductor Wafer Bonding Equipment Market: Company Product Type Footprint
Table 25. Semiconductor Wafer Bonding Equipment Market: Company Product Application Footprint
Table 26. Semiconductor Wafer Bonding Equipment Competitive Factors
Table 27. Semiconductor Wafer Bonding Equipment New Entrant and Capacity Expansion Plans
Table 28. Semiconductor Wafer Bonding Equipment Mergers & Acquisitions Activity
Table 29. United States VS China Semiconductor Wafer Bonding Equipment Production Value Comparison, (2019 & 2023 & 2030) & (USD Million)
Table 30. United States VS China Semiconductor Wafer Bonding Equipment Production Comparison, (2019 & 2023 & 2030) & (Units)
Table 31. United States VS China Semiconductor Wafer Bonding Equipment Consumption Comparison, (2019 & 2023 & 2030) & (Units)
Table 32. United States Based Semiconductor Wafer Bonding Equipment Manufacturers, Headquarters and Production Site (States, Country)
Table 33. United States Based Manufacturers Semiconductor Wafer Bonding Equipment Production Value, (2019-2024) & (USD Million)
Table 34. United States Based Manufacturers Semiconductor Wafer Bonding Equipment Production Value Market Share (2019-2024)
Table 35. United States Based Manufacturers Semiconductor Wafer Bonding Equipment Production (2019-2024) & (Units)
Table 36. United States Based Manufacturers Semiconductor Wafer Bonding Equipment Production Market Share (2019-2024)
Table 37. China Based Semiconductor Wafer Bonding Equipment Manufacturers, Headquarters and Production Site (Province, Country)
Table 38. China Based Manufacturers Semiconductor Wafer Bonding Equipment Production Value, (2019-2024) & (USD Million)
Table 39. China Based Manufacturers Semiconductor Wafer Bonding Equipment Production Value Market Share (2019-2024)
Table 40. China Based Manufacturers Semiconductor Wafer Bonding Equipment Production, (2019-2024) & (Units)
Table 41. China Based Manufacturers Semiconductor Wafer Bonding Equipment Production Market Share (2019-2024)
Table 42. Rest of World Based Semiconductor Wafer Bonding Equipment Manufacturers, Headquarters and Production Site (State, Country)
Table 43. Rest of World Based Manufacturers Semiconductor Wafer Bonding Equipment Production Value, (2019-2024) & (USD Million)
Table 44. Rest of World Based Manufacturers Semiconductor Wafer Bonding Equipment Production Value Market Share (2019-2024)
Table 45. Rest of World Based Manufacturers Semiconductor Wafer Bonding Equipment Production, (2019-2024) & (Units)
Table 46. Rest of World Based Manufacturers Semiconductor Wafer Bonding Equipment Production Market Share (2019-2024)
Table 47. World Semiconductor Wafer Bonding Equipment Production Value by Type, (USD Million), 2019 & 2023 & 2030
Table 48. World Semiconductor Wafer Bonding Equipment Production by Type (2019-2024) & (Units)
Table 49. World Semiconductor Wafer Bonding Equipment Production by Type (2025-2030) & (Units)
Table 50. World Semiconductor Wafer Bonding Equipment Production Value by Type (2019-2024) & (USD Million)
Table 51. World Semiconductor Wafer Bonding Equipment Production Value by Type (2025-2030) & (USD Million)
Table 52. World Semiconductor Wafer Bonding Equipment Average Price by Type (2019-2024) & (K US$/Unit)
Table 53. World Semiconductor Wafer Bonding Equipment Average Price by Type (2025-2030) & (K US$/Unit)
Table 54. World Semiconductor Wafer Bonding Equipment Production Value by Application, (USD Million), 2019 & 2023 & 2030
Table 55. World Semiconductor Wafer Bonding Equipment Production by Application (2019-2024) & (Units)
Table 56. World Semiconductor Wafer Bonding Equipment Production by Application (2025-2030) & (Units)
Table 57. World Semiconductor Wafer Bonding Equipment Production Value by Application (2019-2024) & (USD Million)
Table 58. World Semiconductor Wafer Bonding Equipment Production Value by Application (2025-2030) & (USD Million)
Table 59. World Semiconductor Wafer Bonding Equipment Average Price by Application (2019-2024) & (K US$/Unit)
Table 60. World Semiconductor Wafer Bonding Equipment Average Price by Application (2025-2030) & (K US$/Unit)
Table 61. EV Group Basic Information, Manufacturing Base and Competitors
Table 62. EV Group Major Business
Table 63. EV Group Semiconductor Wafer Bonding Equipment Product and Services
Table 64. EV Group Semiconductor Wafer Bonding Equipment Production (Units), Price (K US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 65. EV Group Recent Developments/Updates
Table 66. EV Group Competitive Strengths & Weaknesses
Table 67. SUSS MicroTec Basic Information, Manufacturing Base and Competitors
Table 68. SUSS MicroTec Major Business
Table 69. SUSS MicroTec Semiconductor Wafer Bonding Equipment Product and Services
Table 70. SUSS MicroTec Semiconductor Wafer Bonding Equipment Production (Units), Price (K US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 71. SUSS MicroTec Recent Developments/Updates
Table 72. SUSS MicroTec Competitive Strengths & Weaknesses
Table 73. Tokyo Electron Basic Information, Manufacturing Base and Competitors
Table 74. Tokyo Electron Major Business
Table 75. Tokyo Electron Semiconductor Wafer Bonding Equipment Product and Services
Table 76. Tokyo Electron Semiconductor Wafer Bonding Equipment Production (Units), Price (K US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 77. Tokyo Electron Recent Developments/Updates
Table 78. Tokyo Electron Competitive Strengths & Weaknesses
Table 79. Applied Microengineering Basic Information, Manufacturing Base and Competitors
Table 80. Applied Microengineering Major Business
Table 81. Applied Microengineering Semiconductor Wafer Bonding Equipment Product and Services
Table 82. Applied Microengineering Semiconductor Wafer Bonding Equipment Production (Units), Price (K US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 83. Applied Microengineering Recent Developments/Updates
Table 84. Applied Microengineering Competitive Strengths & Weaknesses
Table 85. Nidec Machine Tool Basic Information, Manufacturing Base and Competitors
Table 86. Nidec Machine Tool Major Business
Table 87. Nidec Machine Tool Semiconductor Wafer Bonding Equipment Product and Services
Table 88. Nidec Machine Tool Semiconductor Wafer Bonding Equipment Production (Units), Price (K US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 89. Nidec Machine Tool Recent Developments/Updates
Table 90. Nidec Machine Tool Competitive Strengths & Weaknesses
Table 91. Ayumi Industry Basic Information, Manufacturing Base and Competitors
Table 92. Ayumi Industry Major Business
Table 93. Ayumi Industry Semiconductor Wafer Bonding Equipment Product and Services
Table 94. Ayumi Industry Semiconductor Wafer Bonding Equipment Production (Units), Price (K US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 95. Ayumi Industry Recent Developments/Updates
Table 96. Ayumi Industry Competitive Strengths & Weaknesses
Table 97. Bondtech Basic Information, Manufacturing Base and Competitors
Table 98. Bondtech Major Business
Table 99. Bondtech Semiconductor Wafer Bonding Equipment Product and Services
Table 100. Bondtech Semiconductor Wafer Bonding Equipment Production (Units), Price (K US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 101. Bondtech Recent Developments/Updates
Table 102. Bondtech Competitive Strengths & Weaknesses
Table 103. Aimechatec Basic Information, Manufacturing Base and Competitors
Table 104. Aimechatec Major Business
Table 105. Aimechatec Semiconductor Wafer Bonding Equipment Product and Services
Table 106. Aimechatec Semiconductor Wafer Bonding Equipment Production (Units), Price (K US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 107. Aimechatec Recent Developments/Updates
Table 108. Aimechatec Competitive Strengths & Weaknesses
Table 109. U-Precision Tech Basic Information, Manufacturing Base and Competitors
Table 110. U-Precision Tech Major Business
Table 111. U-Precision Tech Semiconductor Wafer Bonding Equipment Product and Services
Table 112. U-Precision Tech Semiconductor Wafer Bonding Equipment Production (Units), Price (K US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 113. U-Precision Tech Recent Developments/Updates
Table 114. U-Precision Tech Competitive Strengths & Weaknesses
Table 115. TAZMO Basic Information, Manufacturing Base and Competitors
Table 116. TAZMO Major Business
Table 117. TAZMO Semiconductor Wafer Bonding Equipment Product and Services
Table 118. TAZMO Semiconductor Wafer Bonding Equipment Production (Units), Price (K US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 119. TAZMO Recent Developments/Updates
Table 120. TAZMO Competitive Strengths & Weaknesses
Table 121. Hutem Basic Information, Manufacturing Base and Competitors
Table 122. Hutem Major Business
Table 123. Hutem Semiconductor Wafer Bonding Equipment Product and Services
Table 124. Hutem Semiconductor Wafer Bonding Equipment Production (Units), Price (K US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 125. Hutem Recent Developments/Updates
Table 126. Hutem Competitive Strengths & Weaknesses
Table 127. Shanghai Micro Electronics Basic Information, Manufacturing Base and Competitors
Table 128. Shanghai Micro Electronics Major Business
Table 129. Shanghai Micro Electronics Semiconductor Wafer Bonding Equipment Product and Services
Table 130. Shanghai Micro Electronics Semiconductor Wafer Bonding Equipment Production (Units), Price (K US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 131. Shanghai Micro Electronics Recent Developments/Updates
Table 132. Shanghai Micro Electronics Competitive Strengths & Weaknesses
Table 133. Canon Basic Information, Manufacturing Base and Competitors
Table 134. Canon Major Business
Table 135. Canon Semiconductor Wafer Bonding Equipment Product and Services
Table 136. Canon Semiconductor Wafer Bonding Equipment Production (Units), Price (K US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 137. Canon Recent Developments/Updates
Table 138. Canon Competitive Strengths & Weaknesses
Table 139. Global Key Players of Semiconductor Wafer Bonding Equipment Upstream (Raw Materials)
Table 140. Global Semiconductor Wafer Bonding Equipment Typical Customers
Table 141. Semiconductor Wafer Bonding Equipment Typical Distributors
List of Figures
Figure 1. Semiconductor Wafer Bonding Equipment Picture
Figure 2. World Semiconductor Wafer Bonding Equipment Production Value: 2019 & 2023 & 2030, (USD Million)
Figure 3. World Semiconductor Wafer Bonding Equipment Production Value and Forecast (2019-2030) & (USD Million)
Figure 4. World Semiconductor Wafer Bonding Equipment Production (2019-2030) & (Units)
Figure 5. World Semiconductor Wafer Bonding Equipment Average Price (2019-2030) & (K US$/Unit)
Figure 6. World Semiconductor Wafer Bonding Equipment Production Value Market Share by Region (2019-2030)
Figure 7. World Semiconductor Wafer Bonding Equipment Production Market Share by Region (2019-2030)
Figure 8. Europe Semiconductor Wafer Bonding Equipment Production (2019-2030) & (Units)
Figure 9. China Semiconductor Wafer Bonding Equipment Production (2019-2030) & (Units)
Figure 10. Japan Semiconductor Wafer Bonding Equipment Production (2019-2030) & (Units)
Figure 11. Semiconductor Wafer Bonding Equipment Market Drivers
Figure 12. Factors Affecting Demand
Figure 13. World Semiconductor Wafer Bonding Equipment Consumption (2019-2030) & (Units)
Figure 14. World Semiconductor Wafer Bonding Equipment Consumption Market Share by Region (2019-2030)
Figure 15. United States Semiconductor Wafer Bonding Equipment Consumption (2019-2030) & (Units)
Figure 16. China Semiconductor Wafer Bonding Equipment Consumption (2019-2030) & (Units)
Figure 17. Europe Semiconductor Wafer Bonding Equipment Consumption (2019-2030) & (Units)
Figure 18. Japan Semiconductor Wafer Bonding Equipment Consumption (2019-2030) & (Units)
Figure 19. South Korea Semiconductor Wafer Bonding Equipment Consumption (2019-2030) & (Units)
Figure 20. ASEAN Semiconductor Wafer Bonding Equipment Consumption (2019-2030) & (Units)
Figure 21. India Semiconductor Wafer Bonding Equipment Consumption (2019-2030) & (Units)
Figure 22. Producer Shipments of Semiconductor Wafer Bonding Equipment by Manufacturer Revenue ($MM) and Market Share (%): 2023
Figure 23. Global Four-firm Concentration Ratios (CR4) for Semiconductor Wafer Bonding Equipment Markets in 2023
Figure 24. Global Four-firm Concentration Ratios (CR8) for Semiconductor Wafer Bonding Equipment Markets in 2023
Figure 25. United States VS China: Semiconductor Wafer Bonding Equipment Production Value Market Share Comparison (2019 & 2023 & 2030)
Figure 26. United States VS China: Semiconductor Wafer Bonding Equipment Production Market Share Comparison (2019 & 2023 & 2030)
Figure 27. United States VS China: Semiconductor Wafer Bonding Equipment Consumption Market Share Comparison (2019 & 2023 & 2030)
Figure 28. United States Based Manufacturers Semiconductor Wafer Bonding Equipment Production Market Share 2023
Figure 29. China Based Manufacturers Semiconductor Wafer Bonding Equipment Production Market Share 2023
Figure 30. Rest of World Based Manufacturers Semiconductor Wafer Bonding Equipment Production Market Share 2023
Figure 31. World Semiconductor Wafer Bonding Equipment Production Value by Type, (USD Million), 2019 & 2023 & 2030
Figure 32. World Semiconductor Wafer Bonding Equipment Production Value Market Share by Type in 2023
Figure 33. Fully Automatic
Figure 34. Semi Automatic
Figure 35. World Semiconductor Wafer Bonding Equipment Production Market Share by Type (2019-2030)
Figure 36. World Semiconductor Wafer Bonding Equipment Production Value Market Share by Type (2019-2030)
Figure 37. World Semiconductor Wafer Bonding Equipment Average Price by Type (2019-2030) & (K US$/Unit)
Figure 38. World Semiconductor Wafer Bonding Equipment Production Value by Application, (USD Million), 2019 & 2023 & 2030
Figure 39. World Semiconductor Wafer Bonding Equipment Production Value Market Share by Application in 2023
Figure 40. MEMS
Figure 41. Advanced Packaging
Figure 42. CIS
Figure 43. Others
Figure 44. World Semiconductor Wafer Bonding Equipment Production Market Share by Application (2019-2030)
Figure 45. World Semiconductor Wafer Bonding Equipment Production Value Market Share by Application (2019-2030)
Figure 46. World Semiconductor Wafer Bonding Equipment Average Price by Application (2019-2030) & (K US$/Unit)
Figure 47. Semiconductor Wafer Bonding Equipment Industry Chain
Figure 48. Semiconductor Wafer Bonding Equipment Procurement Model
Figure 49. Semiconductor Wafer Bonding Equipment Sales Model
Figure 50. Semiconductor Wafer Bonding Equipment Sales Channels, Direct Sales, and Distribution
Figure 51. Methodology
Figure 52. Research Process and Data Source
Research Methodology
Client Requirements
Review and analyze client requirements
Discussion of all the project requirements and queries
Flexibility Check
Project Feasibility Analysis
Finalizing tentative research programme
Structuring project proposal with scope, timeline, and costs
Analyzing Market Dynamics
Determination of key drivers, restraints, challenge, and opportunity
Identifies market needs and trends
Market Size Estimation & Forecast
Estimation of historical data based on secondary and primary data
Anticipating market recast by assigning weightage to market forces (drivers, restraints, opportunities)
Freezing historical and forecast market size estimations based on evolution, trends, outlook, and strategies
Consideration of geography, region-specific product/service demand for region segments
Consideration of product utilization rates, product demand outlook for segments by application or end-user.
Data Source
Secondary Source
Data collections from annual reports, presentations,associations, journals, analyst reports,
paid database, press releases, blogs, newsletters,and GIR repositories.
Primary Source
Research discussion with manufacturers, distributors, suppliers, end user, industry experts
to verify insights.
Validation
and
triangulation of
secondary and primary source.
Collection of data
Cumulating and collating the essential qualitative and quantitative data
Generation of report in client requested format by research analysts
Reviews by expert analysts
Final quality check
Clarifying queries
Receiving feedback
Ensuring satisfaction
01 Identification of data
This step involves identification of several primary and secondary data research sources, including Global Info Research's internal data sources. The primary sources consist of in-depth discussions and interviews with policy makers, industry experts, and data evaluators, whereas secondary sources include a thorough study of market journals, press releases, annual reports, and government and non-government agencies websites.
-
02 Evaluation of Market Dynamic
This phase includes a detailed evaluation of several factors that are likely to affect the market dynamics. It involves a comprehensive assessment of major market pain points, drivers, and trends. It also comprises a detailed study of research plans and methodology.
-
03 Collection of Data
This process consists of gathering data, accessing proprietary databases, and reaching out to key industry participants that operate in the market across the value chain. It also involves studying several patterns in the historical data and comparing it with the current scenario.
-
04 Collaboration of Data
This stage involves the validation of data and arrival at actual statistics, and evolution of the market over the years. It entails the study and analyzes various segments and verticals of the market. An impact analysis is also performed to observe which factors will affect the market in the next few years.
05 Verification and Analysis
This is the final stage, which involves both quantity and quality checks. Although the process of data verification is an integral part of the research process, all data points and statistics and figures are re-checked to uphold their authenticity and validity.
Companies Mentioned
EV Group SUSS MicroTec Tokyo Electron Applied Microengineering Nidec Machine Tool Ayumi Industry Bondtech Aimechatec U-Precision Tech TAZMO Hutem Shanghai Micro Electronics Canon
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