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The global Solder Ball Mounter (SBM) market size is expected to reach $ million by 2030, rising at a market growth of % CAGR during the forecast period (2024-2030).

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According to our (Global Info Research) latest study, the global Solder Ball Mounter (SBM) market size was valued at USD million in 2023 and is forecast to a readjusted size of USD million by 2030 with a CAGR of % during review period.

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The global Automatic Solder Ball Mounter market size is expected to reach $ 748.3 million by 2030, rising at a market growth of 4.9% CAGR during the forecast period (2024-2030).

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According to our (Global Info Research) latest study, the global Automatic Solder Ball Mounter market size was valued at USD 536.1 million in 2023 and is forecast to a readjusted size of USD 748.3 million by 2030 with a CAGR of 4.9% during review period.

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Wafer Level Solder Ball Mounter is a piece of equipment in semiconductor manufacturing, mainly used to permanently connect wafers of different materials. As a part of the back-end engineering of semiconductor production, it is mainly used to perform ball bonding on the electrodes in the chip using bonding metal wires and ceramic cleavers before the wafer is cut, and the wire tails are cut to form protruding electrodes (threads). pillar bump) process. After the ball is planted, the protruding electrodes of the chip are connected through the key flip chip process to form an electronic circuit.

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The global Automatic BGA Solder Ball Mounter market size is expected to reach $ 472.8 million by 2030, rising at a market growth of 5.1% CAGR during the forecast period (2024-2030).

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According to our (Global Info Research) latest study, the global Automatic BGA Solder Ball Mounter market size was valued at USD 334.4 million in 2023 and is forecast to a readjusted size of USD 472.8 million by 2030 with a CAGR of 5.1% during review period.

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After the automatic alignment by vision inspection, the solder balls as well as Coper core balls are gang-mounted on the BGA (ball grid array) strip-formed or flip chip BGA substrate at high throughput.

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After the automatic alignment by vision inspection, the solder balls as well as Coper core balls are gang-mounted on the BGA (ball grid array) strip-formed or flip chip BGA substrate at high throughput.

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A Fully-Automatic Solder Ball Mounter is a specialized piece of equipment used in the semiconductor manufacturing process to accurately place solder balls onto the surface of a semiconductor package, such as a Ball Grid Array (BGA) or Chip Scale Package (CSP). These machines are critical for ensuring the reliability and performance of electronic components, particularly in applications requiring high-density and precision connections.

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