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Global Test & Burn-in Socket Supply, Demand and Key Producers, 2024-2030

date 20 Oct 2024

date Electronics & Semiconductor

new_biaoQian Test & Burn-in Socket

There are two important tests in semiconductor manufacturing. One is the wafer test during the wafer process, in which electrical characteristics of chips are tested before dicing a wafer into many pieces of semiconductor (called dies or chips). The other is the final test during the assembly and testing process, which is conducted after packaging the diced chips. An IC socket is used in the final test. It plays the crucial role of connecting the device and the tester, just as a probe card does in the wafer test (see the figure below). Depending on the purpose of the test, IC sockets are categorized into two groups: burn-in sockets for testing reliability, including durability, and test sockets for measuring electrical characteristics. Although these two types are both generally referred to as IC sockets, the required performance varies depending on the difference in use.

USD4480.00

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Global Test & Burn-in Socket Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

date 20 Oct 2024

date Electronics & Semiconductor

new_biaoQian Test & Burn-in Socket

There are two important tests in semiconductor manufacturing. One is the wafer test during the wafer process, in which electrical characteristics of chips are tested before dicing a wafer into many pieces of semiconductor (called dies or chips). The other is the final test during the assembly and testing process, which is conducted after packaging the diced chips. An IC socket is used in the final test. It plays the crucial role of connecting the device and the tester, just as a probe card does in the wafer test (see the figure below). Depending on the purpose of the test, IC sockets are categorized into two groups: burn-in sockets for testing reliability, including durability, and test sockets for measuring electrical characteristics. Although these two types are both generally referred to as IC sockets, the required performance varies depending on the difference in use.

USD3480.00

Add To Cart

Add To Cart

Global Test & Burn-in Socket Market 2023 by Manufacturers, Regions, Type and Application, Forecast to 2029

date 18 Mar 2023

date Electronics & Semiconductor

new_biaoQian Test & Burn-in Socket

There are two important tests in semiconductor manufacturing. One is the wafer test during the wafer process, in which electrical characteristics of chips are tested before dicing a wafer into many pieces of semiconductor (called dies or chips). The other is the final test during the assembly and testing process, which is conducted after packaging the diced chips. An IC socket is used in the final test. It plays the crucial role of connecting the device and the tester, just as a probe card does in the wafer test (see the figure below). Depending on the purpose of the test, IC sockets are categorized into two groups: burn-in sockets for testing reliability, including durability, and test sockets for measuring electrical characteristics. Although these two types are both generally referred to as IC sockets, the required performance varies depending on the difference in use.

USD3480.00

Add To Cart

Add To Cart

Global Test & Burn-in Socket Supply, Demand and Key Producers, 2023-2029

date 12 Jan 2023

date Electronics & Semiconductor

new_biaoQian Test & Burn-in Socket

The global Test & Burn-in Socket market size is expected to reach $ 2066.3 million by 2029, rising at a market growth of 7.2% CAGR during the forecast period (2023-2029).

USD4480.00

Add To Cart

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industry 20 Oct 2024

industry Electronics & Semiconductor

new_biaoQian Test & Burn-in Socket

There are two important tests in semiconductor manufacturing. One is the wafer test during the wafer process, in which electrical characteristics of chips are tested before dicing a wafer into many pieces of semiconductor (called dies or chips). The other is the final test during the assembly and testing process, which is conducted after packaging the diced chips. An IC socket is used in the final test. It plays the crucial role of connecting the device and the tester, just as a probe card does in the wafer test (see the figure below). Depending on the purpose of the test, IC sockets are categorized into two groups: burn-in sockets for testing reliability, including durability, and test sockets for measuring electrical characteristics. Although these two types are both generally referred to as IC sockets, the required performance varies depending on the difference in use.

USD4480.00

addToCart

Add To Cart

industry 20 Oct 2024

industry Electronics & Semiconductor

new_biaoQian Test & Burn-in Socket

There are two important tests in semiconductor manufacturing. One is the wafer test during the wafer process, in which electrical characteristics of chips are tested before dicing a wafer into many pieces of semiconductor (called dies or chips). The other is the final test during the assembly and testing process, which is conducted after packaging the diced chips. An IC socket is used in the final test. It plays the crucial role of connecting the device and the tester, just as a probe card does in the wafer test (see the figure below). Depending on the purpose of the test, IC sockets are categorized into two groups: burn-in sockets for testing reliability, including durability, and test sockets for measuring electrical characteristics. Although these two types are both generally referred to as IC sockets, the required performance varies depending on the difference in use.

USD3480.00

addToCart

Add To Cart

industry 18 Mar 2023

industry Electronics & Semiconductor

new_biaoQian Test & Burn-in Socket

There are two important tests in semiconductor manufacturing. One is the wafer test during the wafer process, in which electrical characteristics of chips are tested before dicing a wafer into many pieces of semiconductor (called dies or chips). The other is the final test during the assembly and testing process, which is conducted after packaging the diced chips. An IC socket is used in the final test. It plays the crucial role of connecting the device and the tester, just as a probe card does in the wafer test (see the figure below). Depending on the purpose of the test, IC sockets are categorized into two groups: burn-in sockets for testing reliability, including durability, and test sockets for measuring electrical characteristics. Although these two types are both generally referred to as IC sockets, the required performance varies depending on the difference in use.

USD3480.00

addToCart

Add To Cart

industry 12 Jan 2023

industry Electronics & Semiconductor

new_biaoQian Test & Burn-in Socket

The global Test & Burn-in Socket market size is expected to reach $ 2066.3 million by 2029, rising at a market growth of 7.2% CAGR during the forecast period (2023-2029).

USD4480.00

addToCart

Add To Cart