the global Through Glass Via (TGV) Technology market size is projected to reach USD 0.28 billion by 2029

A through-glass via (TGV) provides a vertical electrical connection through a glass substrate. TGVs are used in advanced packaging solutions, such as glass interposers and wafer-level packaging of microelectromechanical systems (MEMS). This report studies the TGV substrate (TGV wafer).

According to the new market research report “Global Through Glass Via (TGV) Technology Market Report 2023-2029”, published by GlobalInfoResearch, the global Through Glass Via (TGV) Technology market size is projected to reach USD 0.28 billion by 2029, at a CAGR of 22.4% during the forecast period.

• Global Through Glass Via (TGV) Technology MarketSize(US$ Million), 2018-2029

Source: GlobalInfoResearch, “Global Through Glass Via (TGV) Technology Market 2023 by Manufacturers, Regions, Type and Application, Forecast to 2029”(TGV) Technology Market Report 2023-2029.

• Global Through Glass Via (TGV) Technology Top9Players Ranking and Market Share（Based on data of 2021, Continually updated）

Source: GlobalInfoResearch, “Global Through Glass Via (TGV) Technology Market 2023 by Manufacturers, Regions, Type and Application, Forecast to 2029”(TGV) Technology Market Report 2023-2029.

The global key manufacturers of Through Glass Via (TGV) Technology include Corning, LPKF, etc. In 2021, the global top three players had a share approximately 57.0% in terms of revenue.

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