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Total: 3 records, 1 pages
Search For: Through Glass Via (TGV) Technology
Global Through Glass Via (TGV) Technology Supply, Demand and Key Producers, 2024-2030
17 Oct 2024
Chemical & Material
Through Glass Via (TGV) Technology
Glass Through-Via (TGV, short for Through-Glass Via) is a miniaturization packaging technology used in semiconductor encapsulation and microelectronic devices. The TGV process enables the creation of precise through-holes (i.e., vias) in glass substrates, which are subsequently filled with conductive materials (such as metals) in subsequent processes. TGV features numerous through-holes in glass with diameters measured in micrometers, positioning it as a promising material for the next-generation semiconductor packaging substrates. High-quality TGV achieved through glass materials and hole processing technologies facilitates the miniaturization of devices in various markets, including data centers, 5G communication networks, and IoT devices, enabling high-density packaging and GHz-speed data processing.
USD4480.00
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Global Through Glass Via (TGV) Technology Market 2024 by Company, Regions, Type and Application, Forecast to 2030
17 Oct 2024
Chemical & Material
Through Glass Via (TGV) Technology
Glass Through-Via (TGV, short for Through-Glass Via) is a miniaturization packaging technology used in semiconductor encapsulation and microelectronic devices. The TGV process enables the creation of precise through-holes (i.e., vias) in glass substrates, which are subsequently filled with conductive materials (such as metals) in subsequent processes. TGV features numerous through-holes in glass with diameters measured in micrometers, positioning it as a promising material for the next-generation semiconductor packaging substrates. High-quality TGV achieved through glass materials and hole processing technologies facilitates the miniaturization of devices in various markets, including data centers, 5G communication networks, and IoT devices, enabling high-density packaging and GHz-speed data processing.
USD3480.00
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Global Through Glass Via (TGV) Technology Market 2023 by Company, Regions, Type and Application, Forecast to 2029
18 Mar 2023
Chemical & Material
Through Glass Via (TGV) Technology
A through-glass via (TGV) provides a vertical electrical connection through a glass substrate. TGVs are used in advanced packaging solutions, such as glass interposers and wafer-level packaging of microelectromechanical systems (MEMS). This report studies the TGV substrate (TGV wafer).
USD3480.00
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Search For: Through Glass Via (TGV) Technology
Total: 3 records, 1 pages
Glass Through-Via (TGV, short for Through-Glass Via) is a miniaturization packaging technology used in semiconductor encapsulation and microelectronic devices. The TGV process enables the creation of precise through-holes (i.e., vias) in glass substrates, which are subsequently filled with conductive materials (such as metals) in subsequent processes. TGV features numerous through-holes in glass with diameters measured in micrometers, positioning it as a promising material for the next-generation semiconductor packaging substrates. High-quality TGV achieved through glass materials and hole processing technologies facilitates the miniaturization of devices in various markets, including data centers, 5G communication networks, and IoT devices, enabling high-density packaging and GHz-speed data processing.
USD4480.00
Add To Cart
Glass Through-Via (TGV, short for Through-Glass Via) is a miniaturization packaging technology used in semiconductor encapsulation and microelectronic devices. The TGV process enables the creation of precise through-holes (i.e., vias) in glass substrates, which are subsequently filled with conductive materials (such as metals) in subsequent processes. TGV features numerous through-holes in glass with diameters measured in micrometers, positioning it as a promising material for the next-generation semiconductor packaging substrates. High-quality TGV achieved through glass materials and hole processing technologies facilitates the miniaturization of devices in various markets, including data centers, 5G communication networks, and IoT devices, enabling high-density packaging and GHz-speed data processing.
USD3480.00
Add To Cart
A through-glass via (TGV) provides a vertical electrical connection through a glass substrate. TGVs are used in advanced packaging solutions, such as glass interposers and wafer-level packaging of microelectromechanical systems (MEMS). This report studies the TGV substrate (TGV wafer).
USD3480.00
Add To Cart
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What We Can Provide?
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Insight into the industry market information
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Analyze market development needs
-
Prospects for future development
-
Develop industry investment strategy
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