Global IC Packaging Substrate (SUB) Supply, Demand and Key Producers, 2023-2029

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Published Date: 06 Feb 2023

Category: Electronics & Semiconductor

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Description
Table of Contents
Table of Figures
Research Methodology
Related Reports
Product Tags

Description

The global IC Packaging Substrate (SUB) market size is expected to reach $ million by 2029, rising at a market growth of % CAGR during the forecast period (2023-2029).

This report studies the global IC Packaging Substrate (SUB) production, demand, key manufacturers, and key regions.

This report is a detailed and comprehensive analysis of the world market for IC Packaging Substrate (SUB), and provides market size (US$ million) and Year-over-Year (YoY) Growth, considering 2022 as the base year. This report explores demand trends and competition, as well as details the characteristics of IC Packaging Substrate (SUB) that contribute to its increasing demand across many markets.

Highlights and key features of the study
Global IC Packaging Substrate (SUB) total production and demand, 2018-2029, (M Pcs)
Global IC Packaging Substrate (SUB) total production value, 2018-2029, (USD Million)
Global IC Packaging Substrate (SUB) production by region & country, production, value, CAGR, 2018-2029, (USD Million) & (M Pcs)
Global IC Packaging Substrate (SUB) consumption by region & country, CAGR, 2018-2029 & (M Pcs)
U.S. VS China: IC Packaging Substrate (SUB) domestic production, consumption, key domestic manufacturers and share
Global IC Packaging Substrate (SUB) production by manufacturer, production, price, value and market share 2018-2023, (USD Million) & (M Pcs)
Global IC Packaging Substrate (SUB) production by Type, production, value, CAGR, 2018-2029, (USD Million) & (M Pcs)
Global IC Packaging Substrate (SUB) production by Application production, value, CAGR, 2018-2029, (USD Million) & (M Pcs)
This reports profiles key players in the global IC Packaging Substrate (SUB) market based on the following parameters – company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Samsung Electro-Mechanics, MST, NGK, KLA Corporation, Panasonic, Simmtech, Daeduck, ASE Material and Kyocera, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals, COVID-19 and Russia-Ukraine War Influence.

Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World IC Packaging Substrate (SUB) market
Detailed Segmentation:
Each section contains quantitative market data including market by value (US$ Millions), volume (production, consumption) & (M Pcs) and average price (US$/Pc) by manufacturer, by Type, and by Application. Data is given for the years 2018-2029 by year with 2022 as the base year, 2023 as the estimate year, and 2024-2029 as the forecast year.

Global IC Packaging Substrate (SUB) Market, By Region:
    United States
    China
    Europe
    Japan
    South Korea
    ASEAN
    India
    Rest of World

Global IC Packaging Substrate (SUB) Market, Segmentation by Type
    Organic Substrate
    Inorganic Substrate
    Composite Substrate

Global IC Packaging Substrate (SUB) Market, Segmentation by Application
    Smart Phones
    PC (Tablet, Laptop)
    Wearable Devices
    Others

Companies Profiled:
    Samsung Electro-Mechanics
    MST
    NGK
    KLA Corporation
    Panasonic
    Simmtech
    Daeduck
    ASE Material
    Kyocera
    Ibiden
    Shinko Electric Industries
    AT&S
    LG InnoTek
    Fastprint Circuit Tech
    ACCESS
    Danbond Technology
    TTM Technologies
    Unimicron
    Nan Ya PCB
    Kinsus
    SCC

Key Questions Answered
1. How big is the global IC Packaging Substrate (SUB) market?
2. What is the demand of the global IC Packaging Substrate (SUB) market?
3. What is the year over year growth of the global IC Packaging Substrate (SUB) market?
4. What is the production and production value of the global IC Packaging Substrate (SUB) market?
5. Who are the key producers in the global IC Packaging Substrate (SUB) market?
6. What are the growth factors driving the market demand?

Table of Contents

1 Supply Summary
    1.1 IC Packaging Substrate (SUB) Introduction
    1.2 World IC Packaging Substrate (SUB) Supply & Forecast
        1.2.1 World IC Packaging Substrate (SUB) Production Value (2018 & 2022 & 2029)
        1.2.2 World IC Packaging Substrate (SUB) Production (2018-2029)
        1.2.3 World IC Packaging Substrate (SUB) Pricing Trends (2018-2029)
    1.3 World IC Packaging Substrate (SUB) Production by Region (Based on Production Site)
        1.3.1 World IC Packaging Substrate (SUB) Production Value by Region (2018-2029)
        1.3.2 World IC Packaging Substrate (SUB) Production by Region (2018-2029)
        1.3.3 World IC Packaging Substrate (SUB) Average Price by Region (2018-2029)
        1.3.4 North America IC Packaging Substrate (SUB) Production (2018-2029)
        1.3.5 Europe IC Packaging Substrate (SUB) Production (2018-2029)
        1.3.6 China IC Packaging Substrate (SUB) Production (2018-2029)
        1.3.7 Japan IC Packaging Substrate (SUB) Production (2018-2029)
        1.3.8 South Korea IC Packaging Substrate (SUB) Production (2018-2029)
    1.4 Market Drivers, Restraints and Trends
        1.4.1 IC Packaging Substrate (SUB) Market Drivers
        1.4.2 Factors Affecting Demand
        1.4.3 IC Packaging Substrate (SUB) Major Market Trends
    1.5 Influence of COVID-19 and Russia-Ukraine War
        1.5.1 Influence of COVID-19
        1.5.2 Influence of Russia-Ukraine War

2 Demand Summary
    2.1 World IC Packaging Substrate (SUB) Demand (2018-2029)
    2.2 World IC Packaging Substrate (SUB) Consumption by Region
        2.2.1 World IC Packaging Substrate (SUB) Consumption by Region (2018-2023)
        2.2.2 World IC Packaging Substrate (SUB) Consumption Forecast by Region (2024-2029)
    2.3 United States IC Packaging Substrate (SUB) Consumption (2018-2029)
    2.4 China IC Packaging Substrate (SUB) Consumption (2018-2029)
    2.5 Europe IC Packaging Substrate (SUB) Consumption (2018-2029)
    2.6 Japan IC Packaging Substrate (SUB) Consumption (2018-2029)
    2.7 South Korea IC Packaging Substrate (SUB) Consumption (2018-2029)
    2.8 ASEAN IC Packaging Substrate (SUB) Consumption (2018-2029)
    2.9 India IC Packaging Substrate (SUB) Consumption (2018-2029)

3 World IC Packaging Substrate (SUB) Manufacturers Competitive Analysis
    3.1 World IC Packaging Substrate (SUB) Production Value by Manufacturer (2018-2023)
    3.2 World IC Packaging Substrate (SUB) Production by Manufacturer (2018-2023)
    3.3 World IC Packaging Substrate (SUB) Average Price by Manufacturer (2018-2023)
    3.4 IC Packaging Substrate (SUB) Company Evaluation Quadrant
    3.5 Industry Rank and Concentration Rate (CR)
        3.5.1 Global IC Packaging Substrate (SUB) Industry Rank of Major Manufacturers
        3.5.2 Global Concentration Ratios (CR4) for IC Packaging Substrate (SUB) in 2022
        3.5.3 Global Concentration Ratios (CR8) for IC Packaging Substrate (SUB) in 2022
    3.6 IC Packaging Substrate (SUB) Market: Overall Company Footprint Analysis
        3.6.1 IC Packaging Substrate (SUB) Market: Region Footprint
        3.6.2 IC Packaging Substrate (SUB) Market: Company Product Type Footprint
        3.6.3 IC Packaging Substrate (SUB) Market: Company Product Application Footprint
    3.7 Competitive Environment
        3.7.1 Historical Structure of the Industry
        3.7.2 Barriers of Market Entry
        3.7.3 Factors of Competition
    3.8 New Entrant and Capacity Expansion Plans
    3.9 Mergers, Acquisition, Agreements, and Collaborations

4 United States VS China VS Rest of the World
    4.1 United States VS China: IC Packaging Substrate (SUB) Production Value Comparison
        4.1.1 United States VS China: IC Packaging Substrate (SUB) Production Value Comparison (2018 & 2022 & 2029)
        4.1.2 United States VS China: IC Packaging Substrate (SUB) Production Value Market Share Comparison (2018 & 2022 & 2029)
    4.2 United States VS China: IC Packaging Substrate (SUB) Production Comparison
        4.2.1 United States VS China: IC Packaging Substrate (SUB) Production Comparison (2018 & 2022 & 2029)
        4.2.2 United States VS China: IC Packaging Substrate (SUB) Production Market Share Comparison (2018 & 2022 & 2029)
    4.3 United States VS China: IC Packaging Substrate (SUB) Consumption Comparison
        4.3.1 United States VS China: IC Packaging Substrate (SUB) Consumption Comparison (2018 & 2022 & 2029)
        4.3.2 United States VS China: IC Packaging Substrate (SUB) Consumption Market Share Comparison (2018 & 2022 & 2029)
    4.4 United States Based IC Packaging Substrate (SUB) Manufacturers and Market Share, 2018-2023
        4.4.1 United States Based IC Packaging Substrate (SUB) Manufacturers, Headquarters and Production Site (States, Country)
        4.4.2 United States Based Manufacturers IC Packaging Substrate (SUB) Production Value (2018-2023)
        4.4.3 United States Based Manufacturers IC Packaging Substrate (SUB) Production (2018-2023)
    4.5 China Based IC Packaging Substrate (SUB) Manufacturers and Market Share
        4.5.1 China Based IC Packaging Substrate (SUB) Manufacturers, Headquarters and Production Site (Province, Country)
        4.5.2 China Based Manufacturers IC Packaging Substrate (SUB) Production Value (2018-2023)
        4.5.3 China Based Manufacturers IC Packaging Substrate (SUB) Production (2018-2023)
    4.6 Rest of World Based IC Packaging Substrate (SUB) Manufacturers and Market Share, 2018-2023
        4.6.1 Rest of World Based IC Packaging Substrate (SUB) Manufacturers, Headquarters and Production Site (State, Country)
        4.6.2 Rest of World Based Manufacturers IC Packaging Substrate (SUB) Production Value (2018-2023)
        4.6.3 Rest of World Based Manufacturers IC Packaging Substrate (SUB) Production (2018-2023)

5 Market Analysis by Type
    5.1 World IC Packaging Substrate (SUB) Market Size Overview by Type: 2018 VS 2022 VS 2029
    5.2 Segment Introduction by Type
        5.2.1 Organic Substrate
        5.2.2 Inorganic Substrate
        5.2.3 Composite Substrate
    5.3 Market Segment by Type
        5.3.1 World IC Packaging Substrate (SUB) Production by Type (2018-2029)
        5.3.2 World IC Packaging Substrate (SUB) Production Value by Type (2018-2029)
        5.3.3 World IC Packaging Substrate (SUB) Average Price by Type (2018-2029)

6 Market Analysis by Application
    6.1 World IC Packaging Substrate (SUB) Market Size Overview by Application: 2018 VS 2022 VS 2029
    6.2 Segment Introduction by Application
        6.2.1 Smart Phones
        6.2.2 PC (Tablet, Laptop)
        6.2.3 Wearable Devices
        6.2.4 Others
    6.3 Market Segment by Application
        6.3.1 World IC Packaging Substrate (SUB) Production by Application (2018-2029)
        6.3.2 World IC Packaging Substrate (SUB) Production Value by Application (2018-2029)
        6.3.3 World IC Packaging Substrate (SUB) Average Price by Application (2018-2029)

7 Company Profiles
    7.1 Samsung Electro-Mechanics
        7.1.1 Samsung Electro-Mechanics Details
        7.1.2 Samsung Electro-Mechanics Major Business
        7.1.3 Samsung Electro-Mechanics IC Packaging Substrate (SUB) Product and Services
        7.1.4 Samsung Electro-Mechanics IC Packaging Substrate (SUB) Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.1.5 Samsung Electro-Mechanics Recent Developments/Updates
        7.1.6 Samsung Electro-Mechanics Competitive Strengths & Weaknesses
    7.2 MST
        7.2.1 MST Details
        7.2.2 MST Major Business
        7.2.3 MST IC Packaging Substrate (SUB) Product and Services
        7.2.4 MST IC Packaging Substrate (SUB) Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.2.5 MST Recent Developments/Updates
        7.2.6 MST Competitive Strengths & Weaknesses
    7.3 NGK
        7.3.1 NGK Details
        7.3.2 NGK Major Business
        7.3.3 NGK IC Packaging Substrate (SUB) Product and Services
        7.3.4 NGK IC Packaging Substrate (SUB) Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.3.5 NGK Recent Developments/Updates
        7.3.6 NGK Competitive Strengths & Weaknesses
    7.4 KLA Corporation
        7.4.1 KLA Corporation Details
        7.4.2 KLA Corporation Major Business
        7.4.3 KLA Corporation IC Packaging Substrate (SUB) Product and Services
        7.4.4 KLA Corporation IC Packaging Substrate (SUB) Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.4.5 KLA Corporation Recent Developments/Updates
        7.4.6 KLA Corporation Competitive Strengths & Weaknesses
    7.5 Panasonic
        7.5.1 Panasonic Details
        7.5.2 Panasonic Major Business
        7.5.3 Panasonic IC Packaging Substrate (SUB) Product and Services
        7.5.4 Panasonic IC Packaging Substrate (SUB) Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.5.5 Panasonic Recent Developments/Updates
        7.5.6 Panasonic Competitive Strengths & Weaknesses
    7.6 Simmtech
        7.6.1 Simmtech Details
        7.6.2 Simmtech Major Business
        7.6.3 Simmtech IC Packaging Substrate (SUB) Product and Services
        7.6.4 Simmtech IC Packaging Substrate (SUB) Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.6.5 Simmtech Recent Developments/Updates
        7.6.6 Simmtech Competitive Strengths & Weaknesses
    7.7 Daeduck
        7.7.1 Daeduck Details
        7.7.2 Daeduck Major Business
        7.7.3 Daeduck IC Packaging Substrate (SUB) Product and Services
        7.7.4 Daeduck IC Packaging Substrate (SUB) Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.7.5 Daeduck Recent Developments/Updates
        7.7.6 Daeduck Competitive Strengths & Weaknesses
    7.8 ASE Material
        7.8.1 ASE Material Details
        7.8.2 ASE Material Major Business
        7.8.3 ASE Material IC Packaging Substrate (SUB) Product and Services
        7.8.4 ASE Material IC Packaging Substrate (SUB) Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.8.5 ASE Material Recent Developments/Updates
        7.8.6 ASE Material Competitive Strengths & Weaknesses
    7.9 Kyocera
        7.9.1 Kyocera Details
        7.9.2 Kyocera Major Business
        7.9.3 Kyocera IC Packaging Substrate (SUB) Product and Services
        7.9.4 Kyocera IC Packaging Substrate (SUB) Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.9.5 Kyocera Recent Developments/Updates
        7.9.6 Kyocera Competitive Strengths & Weaknesses
    7.10 Ibiden
        7.10.1 Ibiden Details
        7.10.2 Ibiden Major Business
        7.10.3 Ibiden IC Packaging Substrate (SUB) Product and Services
        7.10.4 Ibiden IC Packaging Substrate (SUB) Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.10.5 Ibiden Recent Developments/Updates
        7.10.6 Ibiden Competitive Strengths & Weaknesses
    7.11 Shinko Electric Industries
        7.11.1 Shinko Electric Industries Details
        7.11.2 Shinko Electric Industries Major Business
        7.11.3 Shinko Electric Industries IC Packaging Substrate (SUB) Product and Services
        7.11.4 Shinko Electric Industries IC Packaging Substrate (SUB) Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.11.5 Shinko Electric Industries Recent Developments/Updates
        7.11.6 Shinko Electric Industries Competitive Strengths & Weaknesses
    7.12 AT&S
        7.12.1 AT&S Details
        7.12.2 AT&S Major Business
        7.12.3 AT&S IC Packaging Substrate (SUB) Product and Services
        7.12.4 AT&S IC Packaging Substrate (SUB) Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.12.5 AT&S Recent Developments/Updates
        7.12.6 AT&S Competitive Strengths & Weaknesses
    7.13 LG InnoTek
        7.13.1 LG InnoTek Details
        7.13.2 LG InnoTek Major Business
        7.13.3 LG InnoTek IC Packaging Substrate (SUB) Product and Services
        7.13.4 LG InnoTek IC Packaging Substrate (SUB) Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.13.5 LG InnoTek Recent Developments/Updates
        7.13.6 LG InnoTek Competitive Strengths & Weaknesses
    7.14 Fastprint Circuit Tech
        7.14.1 Fastprint Circuit Tech Details
        7.14.2 Fastprint Circuit Tech Major Business
        7.14.3 Fastprint Circuit Tech IC Packaging Substrate (SUB) Product and Services
        7.14.4 Fastprint Circuit Tech IC Packaging Substrate (SUB) Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.14.5 Fastprint Circuit Tech Recent Developments/Updates
        7.14.6 Fastprint Circuit Tech Competitive Strengths & Weaknesses
    7.15 ACCESS
        7.15.1 ACCESS Details
        7.15.2 ACCESS Major Business
        7.15.3 ACCESS IC Packaging Substrate (SUB) Product and Services
        7.15.4 ACCESS IC Packaging Substrate (SUB) Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.15.5 ACCESS Recent Developments/Updates
        7.15.6 ACCESS Competitive Strengths & Weaknesses
    7.16 Danbond Technology
        7.16.1 Danbond Technology Details
        7.16.2 Danbond Technology Major Business
        7.16.3 Danbond Technology IC Packaging Substrate (SUB) Product and Services
        7.16.4 Danbond Technology IC Packaging Substrate (SUB) Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.16.5 Danbond Technology Recent Developments/Updates
        7.16.6 Danbond Technology Competitive Strengths & Weaknesses
    7.17 TTM Technologies
        7.17.1 TTM Technologies Details
        7.17.2 TTM Technologies Major Business
        7.17.3 TTM Technologies IC Packaging Substrate (SUB) Product and Services
        7.17.4 TTM Technologies IC Packaging Substrate (SUB) Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.17.5 TTM Technologies Recent Developments/Updates
        7.17.6 TTM Technologies Competitive Strengths & Weaknesses
    7.18 Unimicron
        7.18.1 Unimicron Details
        7.18.2 Unimicron Major Business
        7.18.3 Unimicron IC Packaging Substrate (SUB) Product and Services
        7.18.4 Unimicron IC Packaging Substrate (SUB) Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.18.5 Unimicron Recent Developments/Updates
        7.18.6 Unimicron Competitive Strengths & Weaknesses
    7.19 Nan Ya PCB
        7.19.1 Nan Ya PCB Details
        7.19.2 Nan Ya PCB Major Business
        7.19.3 Nan Ya PCB IC Packaging Substrate (SUB) Product and Services
        7.19.4 Nan Ya PCB IC Packaging Substrate (SUB) Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.19.5 Nan Ya PCB Recent Developments/Updates
        7.19.6 Nan Ya PCB Competitive Strengths & Weaknesses
    7.20 Kinsus
        7.20.1 Kinsus Details
        7.20.2 Kinsus Major Business
        7.20.3 Kinsus IC Packaging Substrate (SUB) Product and Services
        7.20.4 Kinsus IC Packaging Substrate (SUB) Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.20.5 Kinsus Recent Developments/Updates
        7.20.6 Kinsus Competitive Strengths & Weaknesses
    7.21 SCC
        7.21.1 SCC Details
        7.21.2 SCC Major Business
        7.21.3 SCC IC Packaging Substrate (SUB) Product and Services
        7.21.4 SCC IC Packaging Substrate (SUB) Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.21.5 SCC Recent Developments/Updates
        7.21.6 SCC Competitive Strengths & Weaknesses

8 Industry Chain Analysis
    8.1 IC Packaging Substrate (SUB) Industry Chain
    8.2 IC Packaging Substrate (SUB) Upstream Analysis
        8.2.1 IC Packaging Substrate (SUB) Core Raw Materials
        8.2.2 Main Manufacturers of IC Packaging Substrate (SUB) Core Raw Materials
    8.3 Midstream Analysis
    8.4 Downstream Analysis
    8.5 IC Packaging Substrate (SUB) Production Mode
    8.6 IC Packaging Substrate (SUB) Procurement Model
    8.7 IC Packaging Substrate (SUB) Industry Sales Model and Sales Channels
        8.7.1 IC Packaging Substrate (SUB) Sales Model
        8.7.2 IC Packaging Substrate (SUB) Typical Customers

9 Research Findings and Conclusion

10 Appendix
    10.1 Methodology
    10.2 Research Process and Data Source
    10.3 Disclaimer

Table of Figures

List of Tables
    Table 1. World IC Packaging Substrate (SUB) Production Value by Region (2018, 2022 and 2029) & (USD Million)
    Table 2. World IC Packaging Substrate (SUB) Production Value by Region (2018-2023) & (USD Million)
    Table 3. World IC Packaging Substrate (SUB) Production Value by Region (2024-2029) & (USD Million)
    Table 4. World IC Packaging Substrate (SUB) Production Value Market Share by Region (2018-2023)
    Table 5. World IC Packaging Substrate (SUB) Production Value Market Share by Region (2024-2029)
    Table 6. World IC Packaging Substrate (SUB) Production by Region (2018-2023) & (M Pcs)
    Table 7. World IC Packaging Substrate (SUB) Production by Region (2024-2029) & (M Pcs)
    Table 8. World IC Packaging Substrate (SUB) Production Market Share by Region (2018-2023)
    Table 9. World IC Packaging Substrate (SUB) Production Market Share by Region (2024-2029)
    Table 10. World IC Packaging Substrate (SUB) Average Price by Region (2018-2023) & (US$/Pc)
    Table 11. World IC Packaging Substrate (SUB) Average Price by Region (2024-2029) & (US$/Pc)
    Table 12. IC Packaging Substrate (SUB) Major Market Trends
    Table 13. World IC Packaging Substrate (SUB) Consumption Growth Rate Forecast by Region (2018 & 2022 & 2029) & (M Pcs)
    Table 14. World IC Packaging Substrate (SUB) Consumption by Region (2018-2023) & (M Pcs)
    Table 15. World IC Packaging Substrate (SUB) Consumption Forecast by Region (2024-2029) & (M Pcs)
    Table 16. World IC Packaging Substrate (SUB) Production Value by Manufacturer (2018-2023) & (USD Million)
    Table 17. Production Value Market Share of Key IC Packaging Substrate (SUB) Producers in 2022
    Table 18. World IC Packaging Substrate (SUB) Production by Manufacturer (2018-2023) & (M Pcs)
    Table 19. Production Market Share of Key IC Packaging Substrate (SUB) Producers in 2022
    Table 20. World IC Packaging Substrate (SUB) Average Price by Manufacturer (2018-2023) & (US$/Pc)
    Table 21. Global IC Packaging Substrate (SUB) Company Evaluation Quadrant
    Table 22. World IC Packaging Substrate (SUB) Industry Rank of Major Manufacturers, Based on Production Value in 2022
    Table 23. Head Office and IC Packaging Substrate (SUB) Production Site of Key Manufacturer
    Table 24. IC Packaging Substrate (SUB) Market: Company Product Type Footprint
    Table 25. IC Packaging Substrate (SUB) Market: Company Product Application Footprint
    Table 26. IC Packaging Substrate (SUB) Competitive Factors
    Table 27. IC Packaging Substrate (SUB) New Entrant and Capacity Expansion Plans
    Table 28. IC Packaging Substrate (SUB) Mergers & Acquisitions Activity
    Table 29. United States VS China IC Packaging Substrate (SUB) Production Value Comparison, (2018 & 2022 & 2029) & (USD Million)
    Table 30. United States VS China IC Packaging Substrate (SUB) Production Comparison, (2018 & 2022 & 2029) & (M Pcs)
    Table 31. United States VS China IC Packaging Substrate (SUB) Consumption Comparison, (2018 & 2022 & 2029) & (M Pcs)
    Table 32. United States Based IC Packaging Substrate (SUB) Manufacturers, Headquarters and Production Site (States, Country)
    Table 33. United States Based Manufacturers IC Packaging Substrate (SUB) Production Value, (2018-2023) & (USD Million)
    Table 34. United States Based Manufacturers IC Packaging Substrate (SUB) Production Value Market Share (2018-2023)
    Table 35. United States Based Manufacturers IC Packaging Substrate (SUB) Production (2018-2023) & (M Pcs)
    Table 36. United States Based Manufacturers IC Packaging Substrate (SUB) Production Market Share (2018-2023)
    Table 37. China Based IC Packaging Substrate (SUB) Manufacturers, Headquarters and Production Site (Province, Country)
    Table 38. China Based Manufacturers IC Packaging Substrate (SUB) Production Value, (2018-2023) & (USD Million)
    Table 39. China Based Manufacturers IC Packaging Substrate (SUB) Production Value Market Share (2018-2023)
    Table 40. China Based Manufacturers IC Packaging Substrate (SUB) Production (2018-2023) & (M Pcs)
    Table 41. China Based Manufacturers IC Packaging Substrate (SUB) Production Market Share (2018-2023)
    Table 42. Rest of World Based IC Packaging Substrate (SUB) Manufacturers, Headquarters and Production Site (States, Country)
    Table 43. Rest of World Based Manufacturers IC Packaging Substrate (SUB) Production Value, (2018-2023) & (USD Million)
    Table 44. Rest of World Based Manufacturers IC Packaging Substrate (SUB) Production Value Market Share (2018-2023)
    Table 45. Rest of World Based Manufacturers IC Packaging Substrate (SUB) Production (2018-2023) & (M Pcs)
    Table 46. Rest of World Based Manufacturers IC Packaging Substrate (SUB) Production Market Share (2018-2023)
    Table 47. World IC Packaging Substrate (SUB) Production Value by Type, (USD Million), 2018 & 2022 & 2029
    Table 48. World IC Packaging Substrate (SUB) Production by Type (2018-2023) & (M Pcs)
    Table 49. World IC Packaging Substrate (SUB) Production by Type (2024-2029) & (M Pcs)
    Table 50. World IC Packaging Substrate (SUB) Production Value by Type (2018-2023) & (USD Million)
    Table 51. World IC Packaging Substrate (SUB) Production Value by Type (2024-2029) & (USD Million)
    Table 52. World IC Packaging Substrate (SUB) Average Price by Type (2018-2023) & (US$/Pc)
    Table 53. World IC Packaging Substrate (SUB) Average Price by Type (2024-2029) & (US$/Pc)
    Table 54. World IC Packaging Substrate (SUB) Production Value by Application, (USD Million), 2018 & 2022 & 2029
    Table 55. World IC Packaging Substrate (SUB) Production by Application (2018-2023) & (M Pcs)
    Table 56. World IC Packaging Substrate (SUB) Production by Application (2024-2029) & (M Pcs)
    Table 57. World IC Packaging Substrate (SUB) Production Value by Application (2018-2023) & (USD Million)
    Table 58. World IC Packaging Substrate (SUB) Production Value by Application (2024-2029) & (USD Million)
    Table 59. World IC Packaging Substrate (SUB) Average Price by Application (2018-2023) & (US$/Pc)
    Table 60. World IC Packaging Substrate (SUB) Average Price by Application (2024-2029) & (US$/Pc)
    Table 61. Samsung Electro-Mechanics Basic Information, Manufacturing Base and Competitors
    Table 62. Samsung Electro-Mechanics Major Business
    Table 63. Samsung Electro-Mechanics IC Packaging Substrate (SUB) Product and Services
    Table 64. Samsung Electro-Mechanics IC Packaging Substrate (SUB) Production (M Pcs), Price (US$/Pc), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 65. Samsung Electro-Mechanics Recent Developments/Updates
    Table 66. Samsung Electro-Mechanics Competitive Strengths & Weaknesses
    Table 67. MST Basic Information, Manufacturing Base and Competitors
    Table 68. MST Major Business
    Table 69. MST IC Packaging Substrate (SUB) Product and Services
    Table 70. MST IC Packaging Substrate (SUB) Production (M Pcs), Price (US$/Pc), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 71. MST Recent Developments/Updates
    Table 72. MST Competitive Strengths & Weaknesses
    Table 73. NGK Basic Information, Manufacturing Base and Competitors
    Table 74. NGK Major Business
    Table 75. NGK IC Packaging Substrate (SUB) Product and Services
    Table 76. NGK IC Packaging Substrate (SUB) Production (M Pcs), Price (US$/Pc), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 77. NGK Recent Developments/Updates
    Table 78. NGK Competitive Strengths & Weaknesses
    Table 79. KLA Corporation Basic Information, Manufacturing Base and Competitors
    Table 80. KLA Corporation Major Business
    Table 81. KLA Corporation IC Packaging Substrate (SUB) Product and Services
    Table 82. KLA Corporation IC Packaging Substrate (SUB) Production (M Pcs), Price (US$/Pc), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 83. KLA Corporation Recent Developments/Updates
    Table 84. KLA Corporation Competitive Strengths & Weaknesses
    Table 85. Panasonic Basic Information, Manufacturing Base and Competitors
    Table 86. Panasonic Major Business
    Table 87. Panasonic IC Packaging Substrate (SUB) Product and Services
    Table 88. Panasonic IC Packaging Substrate (SUB) Production (M Pcs), Price (US$/Pc), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 89. Panasonic Recent Developments/Updates
    Table 90. Panasonic Competitive Strengths & Weaknesses
    Table 91. Simmtech Basic Information, Manufacturing Base and Competitors
    Table 92. Simmtech Major Business
    Table 93. Simmtech IC Packaging Substrate (SUB) Product and Services
    Table 94. Simmtech IC Packaging Substrate (SUB) Production (M Pcs), Price (US$/Pc), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 95. Simmtech Recent Developments/Updates
    Table 96. Simmtech Competitive Strengths & Weaknesses
    Table 97. Daeduck Basic Information, Manufacturing Base and Competitors
    Table 98. Daeduck Major Business
    Table 99. Daeduck IC Packaging Substrate (SUB) Product and Services
    Table 100. Daeduck IC Packaging Substrate (SUB) Production (M Pcs), Price (US$/Pc), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 101. Daeduck Recent Developments/Updates
    Table 102. Daeduck Competitive Strengths & Weaknesses
    Table 103. ASE Material Basic Information, Manufacturing Base and Competitors
    Table 104. ASE Material Major Business
    Table 105. ASE Material IC Packaging Substrate (SUB) Product and Services
    Table 106. ASE Material IC Packaging Substrate (SUB) Production (M Pcs), Price (US$/Pc), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 107. ASE Material Recent Developments/Updates
    Table 108. ASE Material Competitive Strengths & Weaknesses
    Table 109. Kyocera Basic Information, Manufacturing Base and Competitors
    Table 110. Kyocera Major Business
    Table 111. Kyocera IC Packaging Substrate (SUB) Product and Services
    Table 112. Kyocera IC Packaging Substrate (SUB) Production (M Pcs), Price (US$/Pc), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 113. Kyocera Recent Developments/Updates
    Table 114. Kyocera Competitive Strengths & Weaknesses
    Table 115. Ibiden Basic Information, Manufacturing Base and Competitors
    Table 116. Ibiden Major Business
    Table 117. Ibiden IC Packaging Substrate (SUB) Product and Services
    Table 118. Ibiden IC Packaging Substrate (SUB) Production (M Pcs), Price (US$/Pc), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 119. Ibiden Recent Developments/Updates
    Table 120. Ibiden Competitive Strengths & Weaknesses
    Table 121. Shinko Electric Industries Basic Information, Manufacturing Base and Competitors
    Table 122. Shinko Electric Industries Major Business
    Table 123. Shinko Electric Industries IC Packaging Substrate (SUB) Product and Services
    Table 124. Shinko Electric Industries IC Packaging Substrate (SUB) Production (M Pcs), Price (US$/Pc), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 125. Shinko Electric Industries Recent Developments/Updates
    Table 126. Shinko Electric Industries Competitive Strengths & Weaknesses
    Table 127. AT&S Basic Information, Manufacturing Base and Competitors
    Table 128. AT&S Major Business
    Table 129. AT&S IC Packaging Substrate (SUB) Product and Services
    Table 130. AT&S IC Packaging Substrate (SUB) Production (M Pcs), Price (US$/Pc), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 131. AT&S Recent Developments/Updates
    Table 132. AT&S Competitive Strengths & Weaknesses
    Table 133. LG InnoTek Basic Information, Manufacturing Base and Competitors
    Table 134. LG InnoTek Major Business
    Table 135. LG InnoTek IC Packaging Substrate (SUB) Product and Services
    Table 136. LG InnoTek IC Packaging Substrate (SUB) Production (M Pcs), Price (US$/Pc), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 137. LG InnoTek Recent Developments/Updates
    Table 138. LG InnoTek Competitive Strengths & Weaknesses
    Table 139. Fastprint Circuit Tech Basic Information, Manufacturing Base and Competitors
    Table 140. Fastprint Circuit Tech Major Business
    Table 141. Fastprint Circuit Tech IC Packaging Substrate (SUB) Product and Services
    Table 142. Fastprint Circuit Tech IC Packaging Substrate (SUB) Production (M Pcs), Price (US$/Pc), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 143. Fastprint Circuit Tech Recent Developments/Updates
    Table 144. Fastprint Circuit Tech Competitive Strengths & Weaknesses
    Table 145. ACCESS Basic Information, Manufacturing Base and Competitors
    Table 146. ACCESS Major Business
    Table 147. ACCESS IC Packaging Substrate (SUB) Product and Services
    Table 148. ACCESS IC Packaging Substrate (SUB) Production (M Pcs), Price (US$/Pc), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 149. ACCESS Recent Developments/Updates
    Table 150. ACCESS Competitive Strengths & Weaknesses
    Table 151. Danbond Technology Basic Information, Manufacturing Base and Competitors
    Table 152. Danbond Technology Major Business
    Table 153. Danbond Technology IC Packaging Substrate (SUB) Product and Services
    Table 154. Danbond Technology IC Packaging Substrate (SUB) Production (M Pcs), Price (US$/Pc), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 155. Danbond Technology Recent Developments/Updates
    Table 156. Danbond Technology Competitive Strengths & Weaknesses
    Table 157. TTM Technologies Basic Information, Manufacturing Base and Competitors
    Table 158. TTM Technologies Major Business
    Table 159. TTM Technologies IC Packaging Substrate (SUB) Product and Services
    Table 160. TTM Technologies IC Packaging Substrate (SUB) Production (M Pcs), Price (US$/Pc), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 161. TTM Technologies Recent Developments/Updates
    Table 162. TTM Technologies Competitive Strengths & Weaknesses
    Table 163. Unimicron Basic Information, Manufacturing Base and Competitors
    Table 164. Unimicron Major Business
    Table 165. Unimicron IC Packaging Substrate (SUB) Product and Services
    Table 166. Unimicron IC Packaging Substrate (SUB) Production (M Pcs), Price (US$/Pc), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 167. Unimicron Recent Developments/Updates
    Table 168. Unimicron Competitive Strengths & Weaknesses
    Table 169. Nan Ya PCB Basic Information, Manufacturing Base and Competitors
    Table 170. Nan Ya PCB Major Business
    Table 171. Nan Ya PCB IC Packaging Substrate (SUB) Product and Services
    Table 172. Nan Ya PCB IC Packaging Substrate (SUB) Production (M Pcs), Price (US$/Pc), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 173. Nan Ya PCB Recent Developments/Updates
    Table 174. Nan Ya PCB Competitive Strengths & Weaknesses
    Table 175. Kinsus Basic Information, Manufacturing Base and Competitors
    Table 176. Kinsus Major Business
    Table 177. Kinsus IC Packaging Substrate (SUB) Product and Services
    Table 178. Kinsus IC Packaging Substrate (SUB) Production (M Pcs), Price (US$/Pc), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 179. Kinsus Recent Developments/Updates
    Table 180. SCC Basic Information, Manufacturing Base and Competitors
    Table 181. SCC Major Business
    Table 182. SCC IC Packaging Substrate (SUB) Product and Services
    Table 183. SCC IC Packaging Substrate (SUB) Production (M Pcs), Price (US$/Pc), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 184. Global Key Players of IC Packaging Substrate (SUB) Upstream (Raw Materials)
    Table 185. IC Packaging Substrate (SUB) Typical Customers
    Table 186. IC Packaging Substrate (SUB) Typical Distributors
List of Figure
    Figure 1. IC Packaging Substrate (SUB) Picture
    Figure 2. World IC Packaging Substrate (SUB) Production Value: 2018 & 2022 & 2029, (USD Million)
    Figure 3. World IC Packaging Substrate (SUB) Production Value and Forecast (2018-2029) & (USD Million)
    Figure 4. World IC Packaging Substrate (SUB) Production (2018-2029) & (M Pcs)
    Figure 5. World IC Packaging Substrate (SUB) Average Price (2018-2029) & (US$/Pc)
    Figure 6. World IC Packaging Substrate (SUB) Production Value Market Share by Region (2018-2029)
    Figure 7. World IC Packaging Substrate (SUB) Production Market Share by Region (2018-2029)
    Figure 8. North America IC Packaging Substrate (SUB) Production (2018-2029) & (M Pcs)
    Figure 9. Europe IC Packaging Substrate (SUB) Production (2018-2029) & (M Pcs)
    Figure 10. China IC Packaging Substrate (SUB) Production (2018-2029) & (M Pcs)
    Figure 11. Japan IC Packaging Substrate (SUB) Production (2018-2029) & (M Pcs)
    Figure 12. South Korea IC Packaging Substrate (SUB) Production (2018-2029) & (M Pcs)
    Figure 13. IC Packaging Substrate (SUB) Market Drivers
    Figure 14. Factors Affecting Demand
    Figure 15. World IC Packaging Substrate (SUB) Consumption (2018-2029) & (M Pcs)
    Figure 16. World IC Packaging Substrate (SUB) Consumption Market Share by Region (2018-2029)
    Figure 17. United States IC Packaging Substrate (SUB) Consumption (2018-2029) & (M Pcs)
    Figure 18. China IC Packaging Substrate (SUB) Consumption (2018-2029) & (M Pcs)
    Figure 19. Europe IC Packaging Substrate (SUB) Consumption (2018-2029) & (M Pcs)
    Figure 20. Japan IC Packaging Substrate (SUB) Consumption (2018-2029) & (M Pcs)
    Figure 21. South Korea IC Packaging Substrate (SUB) Consumption (2018-2029) & (M Pcs)
    Figure 22. ASEAN IC Packaging Substrate (SUB) Consumption (2018-2029) & (M Pcs)
    Figure 23. India IC Packaging Substrate (SUB) Consumption (2018-2029) & (M Pcs)
    Figure 24. Producer Shipments of IC Packaging Substrate (SUB) by Manufacturer Revenue ($MM) and Market Share (%): 2022
    Figure 25. Global Four-firm Concentration Ratios (CR4) for IC Packaging Substrate (SUB) Markets in 2022
    Figure 26. Global Four-firm Concentration Ratios (CR8) for IC Packaging Substrate (SUB) Markets in 2022
    Figure 27. United States VS China: IC Packaging Substrate (SUB) Production Value Market Share Comparison (2018 & 2022 & 2029)
    Figure 28. United States VS China: IC Packaging Substrate (SUB) Production Market Share Comparison (2018 & 2022 & 2029)
    Figure 29. United States VS China: IC Packaging Substrate (SUB) Consumption Market Share Comparison (2018 & 2022 & 2029)
    Figure 30. United States Based Manufacturers IC Packaging Substrate (SUB) Production Market Share 2022
    Figure 31. China Based Manufacturers IC Packaging Substrate (SUB) Production Market Share 2022
    Figure 32. Rest of World Based Manufacturers IC Packaging Substrate (SUB) Production Market Share 2022
    Figure 33. World IC Packaging Substrate (SUB) Production Value by Type, (USD Million), 2018 & 2022 & 2029
    Figure 34. World IC Packaging Substrate (SUB) Production Value Market Share by Type in 2022
    Figure 35. Organic Substrate
    Figure 36. Inorganic Substrate
    Figure 37. Composite Substrate
    Figure 38. World IC Packaging Substrate (SUB) Production Market Share by Type (2018-2029)
    Figure 39. World IC Packaging Substrate (SUB) Production Value Market Share by Type (2018-2029)
    Figure 40. World IC Packaging Substrate (SUB) Average Price by Type (2018-2029) & (US$/Pc)
    Figure 41. World IC Packaging Substrate (SUB) Production Value by Application, (USD Million), 2018 & 2022 & 2029
    Figure 42. World IC Packaging Substrate (SUB) Production Value Market Share by Application in 2022
    Figure 43. Smart Phones
    Figure 44. PC (Tablet, Laptop)
    Figure 45. Wearable Devices
    Figure 46. Others
    Figure 47. World IC Packaging Substrate (SUB) Production Market Share by Application (2018-2029)
    Figure 48. World IC Packaging Substrate (SUB) Production Value Market Share by Application (2018-2029)
    Figure 49. World IC Packaging Substrate (SUB) Average Price by Application (2018-2029) & (US$/Pc)
    Figure 50. IC Packaging Substrate (SUB) Industry Chain
    Figure 51. IC Packaging Substrate (SUB) Procurement Model
    Figure 52. IC Packaging Substrate (SUB) Sales Model
    Figure 53. IC Packaging Substrate (SUB) Sales Channels, Direct Sales, and Distribution
    Figure 54. Methodology
    Figure 55. Research Process and Data Source

Research Methodology

Client Requirements

Review and analyze client requirements

Discussion of all the project requirements and queries

Flexibility Check

Project Feasibility Analysis

Finalizing tentative research programme

Structuring project proposal with scope, timeline, and costs

Analyzing Market Dynamics

Determination of key drivers, restraints, challenge, and opportunity

Identifies market needs and trends

Market Size Estimation & Forecast

Estimation of historical data based on secondary and primary data

Anticipating market recast by assigning weightage to market forces (drivers, restraints, opportunities)

Freezing historical and forecast market size estimations based on evolution, trends, outlook, and strategies

Consideration of geography, region-specific product/service demand for region segments

Consideration of product utilization rates, product demand outlook for segments by application or end-user.

Data Source

Secondary Source
Data collections from annual reports, presentations,associations, journals, analyst reports, paid database, press releases, blogs, newsletters,and GIR repositories.

Primary Source
Research discussion with manufacturers, distributors, suppliers, end user, industry experts to verify insights.

Validation and
triangulation of
secondary and primary source.

Collection of data

Cumulating and collating the essential qualitative and quantitative data

Generation of report in client requested format by research analysts

Reviews by expert analysts

Final quality check

Clarifying queries

Receiving feedback

Ensuring satisfaction

01 Identification of data

This step involves identification of several primary and secondary data research sources, including Global Info Research's internal data sources. The primary sources consist of in-depth discussions and interviews with policy makers, industry experts, and data evaluators, whereas secondary sources include a thorough study of market journals, press releases, annual reports, and government and non-government agencies websites.
02 Evaluation of Market Dynamic

This phase includes a detailed evaluation of several factors that are likely to affect the market dynamics. It involves a comprehensive assessment of major market pain points, drivers, and trends. It also comprises a detailed study of research plans and methodology.
03 Collection of Data

This process consists of gathering data, accessing proprietary databases, and reaching out to key industry participants that operate in the market across the value chain. It also involves studying several patterns in the historical data and comparing it with the current scenario.
04 Collaboration of Data

This stage involves the validation of data and arrival at actual statistics, and evolution of the market over the years. It entails the study and analyzes various segments and verticals of the market. An impact analysis is also performed to observe which factors will affect the market in the next few years.
05 Verification and Analysis

This is the final stage, which involves both quantity and quality checks. Although the process of data verification is an integral part of the research process, all data points and statistics and figures are re-checked to uphold their authenticity and validity.

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