Global Solid State Memory Chip Packaging Substrate Supply, Demand and Key Producers, 2024-2030

Page: 133

Published Date: 15 Aug 2024

Category: Electronics & Semiconductor

PDF Download

Get FREE Sample

Customize Request

Description
Table of Contents
Table of Figures
Research Methodology
Companies Mentioned
Related Reports
Product Tags

Description

Solid-state memory chip packaging substrate is an important material used in the solid-state memory packaging process. As a bridge between the chip and the external circuit, it carries the chip's electrical connection and mechanical support functions. It is composed of multiple layers of materials, including metal layers, insulating layers, and conductive layers, and is used to connect the chip's tiny pins to larger external connectors or circuit boards, while providing the necessary electrical isolation and mechanical protection.

The global Solid State Memory Chip Packaging Substrate market size is expected to reach $ million by 2030, rising at a market growth of %CAGR during the forecast period (2024-2030).

This report studies the global Solid State Memory Chip Packaging Substrate production, demand, key manufacturers, and key regions.

This report is a detailed and comprehensive analysis of the world market for Solid State Memory Chip Packaging Substrate and provides market size (US$ million) and Year-over-Year (YoY) Growth, considering 2023 as the base year. This report explores demand trends and competition, as well as details the characteristics of Solid State Memory Chip Packaging Substrate that contribute to its increasing demand across many markets.

Highlights and key features of the study
Global Solid State Memory Chip Packaging Substrate total production and demand, 2019-2030, (K Units)
Global Solid State Memory Chip Packaging Substrate total production value, 2019-2030, (USD Million)
Global Solid State Memory Chip Packaging Substrate production by region & country, production, value, CAGR, 2019-2030, (USD Million) & (K Units), (based on production site)
Global Solid State Memory Chip Packaging Substrate consumption by region & country, CAGR, 2019-2030 & (K Units)
U.S. VS China: Solid State Memory Chip Packaging Substrate domestic production, consumption, key domestic manufacturers and share
Global Solid State Memory Chip Packaging Substrate production by manufacturer, production, price, value and market share 2019-2024, (USD Million) & (K Units)
Global Solid State Memory Chip Packaging Substrate production by Type, production, value, CAGR, 2019-2030, (USD Million) & (K Units)
Global Solid State Memory Chip Packaging Substrate production by Application, production, value, CAGR, 2019-2030, (USD Million) & (K Units)
This report profiles key players in the global Solid State Memory Chip Packaging Substrate market based on the following parameters - company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include LG Innotek, Samsung Electro Mechanics, Simmtech, IBIDEN, Shinko Electric, AT&S, Kyocera, Hemei Jingyi Technology, Shennan Circuit, Newsen Technology, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World Solid State Memory Chip Packaging Substrate market
Detailed Segmentation:
Each section contains quantitative market data including market by value (US$ Millions), volume (production, consumption) & (K Units) and average price (US$/Unit) by manufacturer, by Type, and by Application. Data is given for the years 2019-2030 by year with 2023 as the base year, 2024 as the estimate year, and 2025-2030 as the forecast year.

Global Solid State Memory Chip Packaging Substrate Market, By Region:
    United States
    China
    Europe
    Japan
    South Korea
    ASEAN
    India
    Rest of World

Global Solid State Memory Chip Packaging Substrate Market, Segmentation by Type:
    WB-CSP Process
    WB-BGA Process

Global Solid State Memory Chip Packaging Substrate Market, Segmentation by Application:
    DRAM
    NAND Flash

Companies Profiled:
    LG Innotek
    Samsung Electro Mechanics
    Simmtech
    IBIDEN
    Shinko Electric
    AT&S
    Kyocera
    Hemei Jingyi Technology
    Shennan Circuit
    Newsen Technology
    V&G Information System
    ASE Group
    Unimicron
    KINSUS

Key Questions Answered:
1. How big is the global Solid State Memory Chip Packaging Substrate market?
2. What is the demand of the global Solid State Memory Chip Packaging Substrate market?
3. What is the year over year growth of the global Solid State Memory Chip Packaging Substrate market?
4. What is the production and production value of the global Solid State Memory Chip Packaging Substrate market?
5. Who are the key producers in the global Solid State Memory Chip Packaging Substrate market?
6. What are the growth factors driving the market demand?

Table of Contents

1 Supply Summary
    1.1 Solid State Memory Chip Packaging Substrate Introduction
    1.2 World Solid State Memory Chip Packaging Substrate Supply & Forecast
        1.2.1 World Solid State Memory Chip Packaging Substrate Production Value (2019 & 2023 & 2030)
        1.2.2 World Solid State Memory Chip Packaging Substrate Production (2019-2030)
        1.2.3 World Solid State Memory Chip Packaging Substrate Pricing Trends (2019-2030)
    1.3 World Solid State Memory Chip Packaging Substrate Production by Region (Based on Production Site)
        1.3.1 World Solid State Memory Chip Packaging Substrate Production Value by Region (2019-2030)
        1.3.2 World Solid State Memory Chip Packaging Substrate Production by Region (2019-2030)
        1.3.3 World Solid State Memory Chip Packaging Substrate Average Price by Region (2019-2030)
        1.3.4 North America Solid State Memory Chip Packaging Substrate Production (2019-2030)
        1.3.5 Europe Solid State Memory Chip Packaging Substrate Production (2019-2030)
        1.3.6 China Solid State Memory Chip Packaging Substrate Production (2019-2030)
        1.3.7 Japan Solid State Memory Chip Packaging Substrate Production (2019-2030)
        1.3.8 South Korea Solid State Memory Chip Packaging Substrate Production (2019-2030)
    1.4 Market Drivers, Restraints and Trends
        1.4.1 Solid State Memory Chip Packaging Substrate Market Drivers
        1.4.2 Factors Affecting Demand
        1.4.3 Solid State Memory Chip Packaging Substrate Major Market Trends

2 Demand Summary
    2.1 World Solid State Memory Chip Packaging Substrate Demand (2019-2030)
    2.2 World Solid State Memory Chip Packaging Substrate Consumption by Region
        2.2.1 World Solid State Memory Chip Packaging Substrate Consumption by Region (2019-2024)
        2.2.2 World Solid State Memory Chip Packaging Substrate Consumption Forecast by Region (2025-2030)
    2.3 United States Solid State Memory Chip Packaging Substrate Consumption (2019-2030)
    2.4 China Solid State Memory Chip Packaging Substrate Consumption (2019-2030)
    2.5 Europe Solid State Memory Chip Packaging Substrate Consumption (2019-2030)
    2.6 Japan Solid State Memory Chip Packaging Substrate Consumption (2019-2030)
    2.7 South Korea Solid State Memory Chip Packaging Substrate Consumption (2019-2030)
    2.8 ASEAN Solid State Memory Chip Packaging Substrate Consumption (2019-2030)
    2.9 India Solid State Memory Chip Packaging Substrate Consumption (2019-2030)

3 World Manufacturers Competitive Analysis
    3.1 World Solid State Memory Chip Packaging Substrate Production Value by Manufacturer (2019-2024)
    3.2 World Solid State Memory Chip Packaging Substrate Production by Manufacturer (2019-2024)
    3.3 World Solid State Memory Chip Packaging Substrate Average Price by Manufacturer (2019-2024)
    3.4 Solid State Memory Chip Packaging Substrate Company Evaluation Quadrant
    3.5 Industry Rank and Concentration Rate (CR)
        3.5.1 Global Solid State Memory Chip Packaging Substrate Industry Rank of Major Manufacturers
        3.5.2 Global Concentration Ratios (CR4) for Solid State Memory Chip Packaging Substrate in 2023
        3.5.3 Global Concentration Ratios (CR8) for Solid State Memory Chip Packaging Substrate in 2023
    3.6 Solid State Memory Chip Packaging Substrate Market: Overall Company Footprint Analysis
        3.6.1 Solid State Memory Chip Packaging Substrate Market: Region Footprint
        3.6.2 Solid State Memory Chip Packaging Substrate Market: Company Product Type Footprint
        3.6.3 Solid State Memory Chip Packaging Substrate Market: Company Product Application Footprint
    3.7 Competitive Environment
        3.7.1 Historical Structure of the Industry
        3.7.2 Barriers of Market Entry
        3.7.3 Factors of Competition
    3.8 New Entrant and Capacity Expansion Plans
    3.9 Mergers, Acquisition, Agreements, and Collaborations

4 United States VS China VS Rest of the World
    4.1 United States VS China: Solid State Memory Chip Packaging Substrate Production Value Comparison
        4.1.1 United States VS China: Solid State Memory Chip Packaging Substrate Production Value Comparison (2019 & 2023 & 2030)
        4.1.2 United States VS China: Solid State Memory Chip Packaging Substrate Production Value Market Share Comparison (2019 & 2023 & 2030)
    4.2 United States VS China: Solid State Memory Chip Packaging Substrate Production Comparison
        4.2.1 United States VS China: Solid State Memory Chip Packaging Substrate Production Comparison (2019 & 2023 & 2030)
        4.2.2 United States VS China: Solid State Memory Chip Packaging Substrate Production Market Share Comparison (2019 & 2023 & 2030)
    4.3 United States VS China: Solid State Memory Chip Packaging Substrate Consumption Comparison
        4.3.1 United States VS China: Solid State Memory Chip Packaging Substrate Consumption Comparison (2019 & 2023 & 2030)
        4.3.2 United States VS China: Solid State Memory Chip Packaging Substrate Consumption Market Share Comparison (2019 & 2023 & 2030)
    4.4 United States Based Solid State Memory Chip Packaging Substrate Manufacturers and Market Share, 2019-2024
        4.4.1 United States Based Solid State Memory Chip Packaging Substrate Manufacturers, Headquarters and Production Site (States, Country)
        4.4.2 United States Based Manufacturers Solid State Memory Chip Packaging Substrate Production Value (2019-2024)
        4.4.3 United States Based Manufacturers Solid State Memory Chip Packaging Substrate Production (2019-2024)
    4.5 China Based Solid State Memory Chip Packaging Substrate Manufacturers and Market Share
        4.5.1 China Based Solid State Memory Chip Packaging Substrate Manufacturers, Headquarters and Production Site (Province, Country)
        4.5.2 China Based Manufacturers Solid State Memory Chip Packaging Substrate Production Value (2019-2024)
        4.5.3 China Based Manufacturers Solid State Memory Chip Packaging Substrate Production (2019-2024)
    4.6 Rest of World Based Solid State Memory Chip Packaging Substrate Manufacturers and Market Share, 2019-2024
        4.6.1 Rest of World Based Solid State Memory Chip Packaging Substrate Manufacturers, Headquarters and Production Site (State, Country)
        4.6.2 Rest of World Based Manufacturers Solid State Memory Chip Packaging Substrate Production Value (2019-2024)
        4.6.3 Rest of World Based Manufacturers Solid State Memory Chip Packaging Substrate Production (2019-2024)

5 Market Analysis by Type
    5.1 World Solid State Memory Chip Packaging Substrate Market Size Overview by Type: 2019 VS 2023 VS 2030
    5.2 Segment Introduction by Type
        5.2.1 WB-CSP Process
        5.2.2 WB-BGA Process
    5.3 Market Segment by Type
        5.3.1 World Solid State Memory Chip Packaging Substrate Production by Type (2019-2030)
        5.3.2 World Solid State Memory Chip Packaging Substrate Production Value by Type (2019-2030)
        5.3.3 World Solid State Memory Chip Packaging Substrate Average Price by Type (2019-2030)

6 Market Analysis by Application
    6.1 World Solid State Memory Chip Packaging Substrate Market Size Overview by Application: 2019 VS 2023 VS 2030
    6.2 Segment Introduction by Application
        6.2.1 DRAM
        6.2.2 NAND Flash
    6.3 Market Segment by Application
        6.3.1 World Solid State Memory Chip Packaging Substrate Production by Application (2019-2030)
        6.3.2 World Solid State Memory Chip Packaging Substrate Production Value by Application (2019-2030)
        6.3.3 World Solid State Memory Chip Packaging Substrate Average Price by Application (2019-2030)

7 Company Profiles
    7.1 LG Innotek
        7.1.1 LG Innotek Details
        7.1.2 LG Innotek Major Business
        7.1.3 LG Innotek Solid State Memory Chip Packaging Substrate Product and Services
        7.1.4 LG Innotek Solid State Memory Chip Packaging Substrate Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.1.5 LG Innotek Recent Developments/Updates
        7.1.6 LG Innotek Competitive Strengths & Weaknesses
    7.2 Samsung Electro Mechanics
        7.2.1 Samsung Electro Mechanics Details
        7.2.2 Samsung Electro Mechanics Major Business
        7.2.3 Samsung Electro Mechanics Solid State Memory Chip Packaging Substrate Product and Services
        7.2.4 Samsung Electro Mechanics Solid State Memory Chip Packaging Substrate Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.2.5 Samsung Electro Mechanics Recent Developments/Updates
        7.2.6 Samsung Electro Mechanics Competitive Strengths & Weaknesses
    7.3 Simmtech
        7.3.1 Simmtech Details
        7.3.2 Simmtech Major Business
        7.3.3 Simmtech Solid State Memory Chip Packaging Substrate Product and Services
        7.3.4 Simmtech Solid State Memory Chip Packaging Substrate Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.3.5 Simmtech Recent Developments/Updates
        7.3.6 Simmtech Competitive Strengths & Weaknesses
    7.4 IBIDEN
        7.4.1 IBIDEN Details
        7.4.2 IBIDEN Major Business
        7.4.3 IBIDEN Solid State Memory Chip Packaging Substrate Product and Services
        7.4.4 IBIDEN Solid State Memory Chip Packaging Substrate Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.4.5 IBIDEN Recent Developments/Updates
        7.4.6 IBIDEN Competitive Strengths & Weaknesses
    7.5 Shinko Electric
        7.5.1 Shinko Electric Details
        7.5.2 Shinko Electric Major Business
        7.5.3 Shinko Electric Solid State Memory Chip Packaging Substrate Product and Services
        7.5.4 Shinko Electric Solid State Memory Chip Packaging Substrate Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.5.5 Shinko Electric Recent Developments/Updates
        7.5.6 Shinko Electric Competitive Strengths & Weaknesses
    7.6 AT&S
        7.6.1 AT&S Details
        7.6.2 AT&S Major Business
        7.6.3 AT&S Solid State Memory Chip Packaging Substrate Product and Services
        7.6.4 AT&S Solid State Memory Chip Packaging Substrate Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.6.5 AT&S Recent Developments/Updates
        7.6.6 AT&S Competitive Strengths & Weaknesses
    7.7 Kyocera
        7.7.1 Kyocera Details
        7.7.2 Kyocera Major Business
        7.7.3 Kyocera Solid State Memory Chip Packaging Substrate Product and Services
        7.7.4 Kyocera Solid State Memory Chip Packaging Substrate Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.7.5 Kyocera Recent Developments/Updates
        7.7.6 Kyocera Competitive Strengths & Weaknesses
    7.8 Hemei Jingyi Technology
        7.8.1 Hemei Jingyi Technology Details
        7.8.2 Hemei Jingyi Technology Major Business
        7.8.3 Hemei Jingyi Technology Solid State Memory Chip Packaging Substrate Product and Services
        7.8.4 Hemei Jingyi Technology Solid State Memory Chip Packaging Substrate Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.8.5 Hemei Jingyi Technology Recent Developments/Updates
        7.8.6 Hemei Jingyi Technology Competitive Strengths & Weaknesses
    7.9 Shennan Circuit
        7.9.1 Shennan Circuit Details
        7.9.2 Shennan Circuit Major Business
        7.9.3 Shennan Circuit Solid State Memory Chip Packaging Substrate Product and Services
        7.9.4 Shennan Circuit Solid State Memory Chip Packaging Substrate Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.9.5 Shennan Circuit Recent Developments/Updates
        7.9.6 Shennan Circuit Competitive Strengths & Weaknesses
    7.10 Newsen Technology
        7.10.1 Newsen Technology Details
        7.10.2 Newsen Technology Major Business
        7.10.3 Newsen Technology Solid State Memory Chip Packaging Substrate Product and Services
        7.10.4 Newsen Technology Solid State Memory Chip Packaging Substrate Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.10.5 Newsen Technology Recent Developments/Updates
        7.10.6 Newsen Technology Competitive Strengths & Weaknesses
    7.11 V&G Information System
        7.11.1 V&G Information System Details
        7.11.2 V&G Information System Major Business
        7.11.3 V&G Information System Solid State Memory Chip Packaging Substrate Product and Services
        7.11.4 V&G Information System Solid State Memory Chip Packaging Substrate Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.11.5 V&G Information System Recent Developments/Updates
        7.11.6 V&G Information System Competitive Strengths & Weaknesses
    7.12 ASE Group
        7.12.1 ASE Group Details
        7.12.2 ASE Group Major Business
        7.12.3 ASE Group Solid State Memory Chip Packaging Substrate Product and Services
        7.12.4 ASE Group Solid State Memory Chip Packaging Substrate Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.12.5 ASE Group Recent Developments/Updates
        7.12.6 ASE Group Competitive Strengths & Weaknesses
    7.13 Unimicron
        7.13.1 Unimicron Details
        7.13.2 Unimicron Major Business
        7.13.3 Unimicron Solid State Memory Chip Packaging Substrate Product and Services
        7.13.4 Unimicron Solid State Memory Chip Packaging Substrate Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.13.5 Unimicron Recent Developments/Updates
        7.13.6 Unimicron Competitive Strengths & Weaknesses
    7.14 KINSUS
        7.14.1 KINSUS Details
        7.14.2 KINSUS Major Business
        7.14.3 KINSUS Solid State Memory Chip Packaging Substrate Product and Services
        7.14.4 KINSUS Solid State Memory Chip Packaging Substrate Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.14.5 KINSUS Recent Developments/Updates
        7.14.6 KINSUS Competitive Strengths & Weaknesses

8 Industry Chain Analysis
    8.1 Solid State Memory Chip Packaging Substrate Industry Chain
    8.2 Solid State Memory Chip Packaging Substrate Upstream Analysis
        8.2.1 Solid State Memory Chip Packaging Substrate Core Raw Materials
        8.2.2 Main Manufacturers of Solid State Memory Chip Packaging Substrate Core Raw Materials
    8.3 Midstream Analysis
    8.4 Downstream Analysis
    8.5 Solid State Memory Chip Packaging Substrate Production Mode
    8.6 Solid State Memory Chip Packaging Substrate Procurement Model
    8.7 Solid State Memory Chip Packaging Substrate Industry Sales Model and Sales Channels
        8.7.1 Solid State Memory Chip Packaging Substrate Sales Model
        8.7.2 Solid State Memory Chip Packaging Substrate Typical Distributors

9 Research Findings and Conclusion

10 Appendix
    10.1 Methodology
    10.2 Research Process and Data Source
    10.3 Disclaimer

Table of Figures

List of Tables
 Table 1. World Solid State Memory Chip Packaging Substrate Production Value by Region (2019, 2023 and 2030) & (USD Million)
 Table 2. World Solid State Memory Chip Packaging Substrate Production Value by Region (2019-2024) & (USD Million)
 Table 3. World Solid State Memory Chip Packaging Substrate Production Value by Region (2025-2030) & (USD Million)
 Table 4. World Solid State Memory Chip Packaging Substrate Production Value Market Share by Region (2019-2024)
 Table 5. World Solid State Memory Chip Packaging Substrate Production Value Market Share by Region (2025-2030)
 Table 6. World Solid State Memory Chip Packaging Substrate Production by Region (2019-2024) & (K Units)
 Table 7. World Solid State Memory Chip Packaging Substrate Production by Region (2025-2030) & (K Units)
 Table 8. World Solid State Memory Chip Packaging Substrate Production Market Share by Region (2019-2024)
 Table 9. World Solid State Memory Chip Packaging Substrate Production Market Share by Region (2025-2030)
 Table 10. World Solid State Memory Chip Packaging Substrate Average Price by Region (2019-2024) & (US$/Unit)
 Table 11. World Solid State Memory Chip Packaging Substrate Average Price by Region (2025-2030) & (US$/Unit)
 Table 12. Solid State Memory Chip Packaging Substrate Major Market Trends
 Table 13. World Solid State Memory Chip Packaging Substrate Consumption Growth Rate Forecast by Region (2019 & 2023 & 2030) & (K Units)
 Table 14. World Solid State Memory Chip Packaging Substrate Consumption by Region (2019-2024) & (K Units)
 Table 15. World Solid State Memory Chip Packaging Substrate Consumption Forecast by Region (2025-2030) & (K Units)
 Table 16. World Solid State Memory Chip Packaging Substrate Production Value by Manufacturer (2019-2024) & (USD Million)
 Table 17. Production Value Market Share of Key Solid State Memory Chip Packaging Substrate Producers in 2023
 Table 18. World Solid State Memory Chip Packaging Substrate Production by Manufacturer (2019-2024) & (K Units)
 Table 19. Production Market Share of Key Solid State Memory Chip Packaging Substrate Producers in 2023
 Table 20. World Solid State Memory Chip Packaging Substrate Average Price by Manufacturer (2019-2024) & (US$/Unit)
 Table 21. Global Solid State Memory Chip Packaging Substrate Company Evaluation Quadrant
 Table 22. World Solid State Memory Chip Packaging Substrate Industry Rank of Major Manufacturers, Based on Production Value in 2023
 Table 23. Head Office and Solid State Memory Chip Packaging Substrate Production Site of Key Manufacturer
 Table 24. Solid State Memory Chip Packaging Substrate Market: Company Product Type Footprint
 Table 25. Solid State Memory Chip Packaging Substrate Market: Company Product Application Footprint
 Table 26. Solid State Memory Chip Packaging Substrate Competitive Factors
 Table 27. Solid State Memory Chip Packaging Substrate New Entrant and Capacity Expansion Plans
 Table 28. Solid State Memory Chip Packaging Substrate Mergers & Acquisitions Activity
 Table 29. United States VS China Solid State Memory Chip Packaging Substrate Production Value Comparison, (2019 & 2023 & 2030) & (USD Million)
 Table 30. United States VS China Solid State Memory Chip Packaging Substrate Production Comparison, (2019 & 2023 & 2030) & (K Units)
 Table 31. United States VS China Solid State Memory Chip Packaging Substrate Consumption Comparison, (2019 & 2023 & 2030) & (K Units)
 Table 32. United States Based Solid State Memory Chip Packaging Substrate Manufacturers, Headquarters and Production Site (States, Country)
 Table 33. United States Based Manufacturers Solid State Memory Chip Packaging Substrate Production Value, (2019-2024) & (USD Million)
 Table 34. United States Based Manufacturers Solid State Memory Chip Packaging Substrate Production Value Market Share (2019-2024)
 Table 35. United States Based Manufacturers Solid State Memory Chip Packaging Substrate Production (2019-2024) & (K Units)
 Table 36. United States Based Manufacturers Solid State Memory Chip Packaging Substrate Production Market Share (2019-2024)
 Table 37. China Based Solid State Memory Chip Packaging Substrate Manufacturers, Headquarters and Production Site (Province, Country)
 Table 38. China Based Manufacturers Solid State Memory Chip Packaging Substrate Production Value, (2019-2024) & (USD Million)
 Table 39. China Based Manufacturers Solid State Memory Chip Packaging Substrate Production Value Market Share (2019-2024)
 Table 40. China Based Manufacturers Solid State Memory Chip Packaging Substrate Production, (2019-2024) & (K Units)
 Table 41. China Based Manufacturers Solid State Memory Chip Packaging Substrate Production Market Share (2019-2024)
 Table 42. Rest of World Based Solid State Memory Chip Packaging Substrate Manufacturers, Headquarters and Production Site (State, Country)
 Table 43. Rest of World Based Manufacturers Solid State Memory Chip Packaging Substrate Production Value, (2019-2024) & (USD Million)
 Table 44. Rest of World Based Manufacturers Solid State Memory Chip Packaging Substrate Production Value Market Share (2019-2024)
 Table 45. Rest of World Based Manufacturers Solid State Memory Chip Packaging Substrate Production, (2019-2024) & (K Units)
 Table 46. Rest of World Based Manufacturers Solid State Memory Chip Packaging Substrate Production Market Share (2019-2024)
 Table 47. World Solid State Memory Chip Packaging Substrate Production Value by Type, (USD Million), 2019 & 2023 & 2030
 Table 48. World Solid State Memory Chip Packaging Substrate Production by Type (2019-2024) & (K Units)
 Table 49. World Solid State Memory Chip Packaging Substrate Production by Type (2025-2030) & (K Units)
 Table 50. World Solid State Memory Chip Packaging Substrate Production Value by Type (2019-2024) & (USD Million)
 Table 51. World Solid State Memory Chip Packaging Substrate Production Value by Type (2025-2030) & (USD Million)
 Table 52. World Solid State Memory Chip Packaging Substrate Average Price by Type (2019-2024) & (US$/Unit)
 Table 53. World Solid State Memory Chip Packaging Substrate Average Price by Type (2025-2030) & (US$/Unit)
 Table 54. World Solid State Memory Chip Packaging Substrate Production Value by Application, (USD Million), 2019 & 2023 & 2030
 Table 55. World Solid State Memory Chip Packaging Substrate Production by Application (2019-2024) & (K Units)
 Table 56. World Solid State Memory Chip Packaging Substrate Production by Application (2025-2030) & (K Units)
 Table 57. World Solid State Memory Chip Packaging Substrate Production Value by Application (2019-2024) & (USD Million)
 Table 58. World Solid State Memory Chip Packaging Substrate Production Value by Application (2025-2030) & (USD Million)
 Table 59. World Solid State Memory Chip Packaging Substrate Average Price by Application (2019-2024) & (US$/Unit)
 Table 60. World Solid State Memory Chip Packaging Substrate Average Price by Application (2025-2030) & (US$/Unit)
 Table 61. LG Innotek Basic Information, Manufacturing Base and Competitors
 Table 62. LG Innotek Major Business
 Table 63. LG Innotek Solid State Memory Chip Packaging Substrate Product and Services
 Table 64. LG Innotek Solid State Memory Chip Packaging Substrate Production (K Units), Price (US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 65. LG Innotek Recent Developments/Updates
 Table 66. LG Innotek Competitive Strengths & Weaknesses
 Table 67. Samsung Electro Mechanics Basic Information, Manufacturing Base and Competitors
 Table 68. Samsung Electro Mechanics Major Business
 Table 69. Samsung Electro Mechanics Solid State Memory Chip Packaging Substrate Product and Services
 Table 70. Samsung Electro Mechanics Solid State Memory Chip Packaging Substrate Production (K Units), Price (US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 71. Samsung Electro Mechanics Recent Developments/Updates
 Table 72. Samsung Electro Mechanics Competitive Strengths & Weaknesses
 Table 73. Simmtech Basic Information, Manufacturing Base and Competitors
 Table 74. Simmtech Major Business
 Table 75. Simmtech Solid State Memory Chip Packaging Substrate Product and Services
 Table 76. Simmtech Solid State Memory Chip Packaging Substrate Production (K Units), Price (US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 77. Simmtech Recent Developments/Updates
 Table 78. Simmtech Competitive Strengths & Weaknesses
 Table 79. IBIDEN Basic Information, Manufacturing Base and Competitors
 Table 80. IBIDEN Major Business
 Table 81. IBIDEN Solid State Memory Chip Packaging Substrate Product and Services
 Table 82. IBIDEN Solid State Memory Chip Packaging Substrate Production (K Units), Price (US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 83. IBIDEN Recent Developments/Updates
 Table 84. IBIDEN Competitive Strengths & Weaknesses
 Table 85. Shinko Electric Basic Information, Manufacturing Base and Competitors
 Table 86. Shinko Electric Major Business
 Table 87. Shinko Electric Solid State Memory Chip Packaging Substrate Product and Services
 Table 88. Shinko Electric Solid State Memory Chip Packaging Substrate Production (K Units), Price (US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 89. Shinko Electric Recent Developments/Updates
 Table 90. Shinko Electric Competitive Strengths & Weaknesses
 Table 91. AT&S Basic Information, Manufacturing Base and Competitors
 Table 92. AT&S Major Business
 Table 93. AT&S Solid State Memory Chip Packaging Substrate Product and Services
 Table 94. AT&S Solid State Memory Chip Packaging Substrate Production (K Units), Price (US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 95. AT&S Recent Developments/Updates
 Table 96. AT&S Competitive Strengths & Weaknesses
 Table 97. Kyocera Basic Information, Manufacturing Base and Competitors
 Table 98. Kyocera Major Business
 Table 99. Kyocera Solid State Memory Chip Packaging Substrate Product and Services
 Table 100. Kyocera Solid State Memory Chip Packaging Substrate Production (K Units), Price (US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 101. Kyocera Recent Developments/Updates
 Table 102. Kyocera Competitive Strengths & Weaknesses
 Table 103. Hemei Jingyi Technology Basic Information, Manufacturing Base and Competitors
 Table 104. Hemei Jingyi Technology Major Business
 Table 105. Hemei Jingyi Technology Solid State Memory Chip Packaging Substrate Product and Services
 Table 106. Hemei Jingyi Technology Solid State Memory Chip Packaging Substrate Production (K Units), Price (US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 107. Hemei Jingyi Technology Recent Developments/Updates
 Table 108. Hemei Jingyi Technology Competitive Strengths & Weaknesses
 Table 109. Shennan Circuit Basic Information, Manufacturing Base and Competitors
 Table 110. Shennan Circuit Major Business
 Table 111. Shennan Circuit Solid State Memory Chip Packaging Substrate Product and Services
 Table 112. Shennan Circuit Solid State Memory Chip Packaging Substrate Production (K Units), Price (US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 113. Shennan Circuit Recent Developments/Updates
 Table 114. Shennan Circuit Competitive Strengths & Weaknesses
 Table 115. Newsen Technology Basic Information, Manufacturing Base and Competitors
 Table 116. Newsen Technology Major Business
 Table 117. Newsen Technology Solid State Memory Chip Packaging Substrate Product and Services
 Table 118. Newsen Technology Solid State Memory Chip Packaging Substrate Production (K Units), Price (US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 119. Newsen Technology Recent Developments/Updates
 Table 120. Newsen Technology Competitive Strengths & Weaknesses
 Table 121. V&G Information System Basic Information, Manufacturing Base and Competitors
 Table 122. V&G Information System Major Business
 Table 123. V&G Information System Solid State Memory Chip Packaging Substrate Product and Services
 Table 124. V&G Information System Solid State Memory Chip Packaging Substrate Production (K Units), Price (US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 125. V&G Information System Recent Developments/Updates
 Table 126. V&G Information System Competitive Strengths & Weaknesses
 Table 127. ASE Group Basic Information, Manufacturing Base and Competitors
 Table 128. ASE Group Major Business
 Table 129. ASE Group Solid State Memory Chip Packaging Substrate Product and Services
 Table 130. ASE Group Solid State Memory Chip Packaging Substrate Production (K Units), Price (US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 131. ASE Group Recent Developments/Updates
 Table 132. ASE Group Competitive Strengths & Weaknesses
 Table 133. Unimicron Basic Information, Manufacturing Base and Competitors
 Table 134. Unimicron Major Business
 Table 135. Unimicron Solid State Memory Chip Packaging Substrate Product and Services
 Table 136. Unimicron Solid State Memory Chip Packaging Substrate Production (K Units), Price (US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 137. Unimicron Recent Developments/Updates
 Table 138. Unimicron Competitive Strengths & Weaknesses
 Table 139. KINSUS Basic Information, Manufacturing Base and Competitors
 Table 140. KINSUS Major Business
 Table 141. KINSUS Solid State Memory Chip Packaging Substrate Product and Services
 Table 142. KINSUS Solid State Memory Chip Packaging Substrate Production (K Units), Price (US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 143. KINSUS Recent Developments/Updates
 Table 144. KINSUS Competitive Strengths & Weaknesses
 Table 145. Global Key Players of Solid State Memory Chip Packaging Substrate Upstream (Raw Materials)
 Table 146. Global Solid State Memory Chip Packaging Substrate Typical Customers
 Table 147. Solid State Memory Chip Packaging Substrate Typical Distributors


List of Figures
 Figure 1. Solid State Memory Chip Packaging Substrate Picture
 Figure 2. World Solid State Memory Chip Packaging Substrate Production Value: 2019 & 2023 & 2030, (USD Million)
 Figure 3. World Solid State Memory Chip Packaging Substrate Production Value and Forecast (2019-2030) & (USD Million)
 Figure 4. World Solid State Memory Chip Packaging Substrate Production (2019-2030) & (K Units)
 Figure 5. World Solid State Memory Chip Packaging Substrate Average Price (2019-2030) & (US$/Unit)
 Figure 6. World Solid State Memory Chip Packaging Substrate Production Value Market Share by Region (2019-2030)
 Figure 7. World Solid State Memory Chip Packaging Substrate Production Market Share by Region (2019-2030)
 Figure 8. North America Solid State Memory Chip Packaging Substrate Production (2019-2030) & (K Units)
 Figure 9. Europe Solid State Memory Chip Packaging Substrate Production (2019-2030) & (K Units)
 Figure 10. China Solid State Memory Chip Packaging Substrate Production (2019-2030) & (K Units)
 Figure 11. Japan Solid State Memory Chip Packaging Substrate Production (2019-2030) & (K Units)
 Figure 12. South Korea Solid State Memory Chip Packaging Substrate Production (2019-2030) & (K Units)
 Figure 13. Solid State Memory Chip Packaging Substrate Market Drivers
 Figure 14. Factors Affecting Demand
 Figure 15. World Solid State Memory Chip Packaging Substrate Consumption (2019-2030) & (K Units)
 Figure 16. World Solid State Memory Chip Packaging Substrate Consumption Market Share by Region (2019-2030)
 Figure 17. United States Solid State Memory Chip Packaging Substrate Consumption (2019-2030) & (K Units)
 Figure 18. China Solid State Memory Chip Packaging Substrate Consumption (2019-2030) & (K Units)
 Figure 19. Europe Solid State Memory Chip Packaging Substrate Consumption (2019-2030) & (K Units)
 Figure 20. Japan Solid State Memory Chip Packaging Substrate Consumption (2019-2030) & (K Units)
 Figure 21. South Korea Solid State Memory Chip Packaging Substrate Consumption (2019-2030) & (K Units)
 Figure 22. ASEAN Solid State Memory Chip Packaging Substrate Consumption (2019-2030) & (K Units)
 Figure 23. India Solid State Memory Chip Packaging Substrate Consumption (2019-2030) & (K Units)
 Figure 24. Producer Shipments of Solid State Memory Chip Packaging Substrate by Manufacturer Revenue ($MM) and Market Share (%): 2023
 Figure 25. Global Four-firm Concentration Ratios (CR4) for Solid State Memory Chip Packaging Substrate Markets in 2023
 Figure 26. Global Four-firm Concentration Ratios (CR8) for Solid State Memory Chip Packaging Substrate Markets in 2023
 Figure 27. United States VS China: Solid State Memory Chip Packaging Substrate Production Value Market Share Comparison (2019 & 2023 & 2030)
 Figure 28. United States VS China: Solid State Memory Chip Packaging Substrate Production Market Share Comparison (2019 & 2023 & 2030)
 Figure 29. United States VS China: Solid State Memory Chip Packaging Substrate Consumption Market Share Comparison (2019 & 2023 & 2030)
 Figure 30. United States Based Manufacturers Solid State Memory Chip Packaging Substrate Production Market Share 2023
 Figure 31. China Based Manufacturers Solid State Memory Chip Packaging Substrate Production Market Share 2023
 Figure 32. Rest of World Based Manufacturers Solid State Memory Chip Packaging Substrate Production Market Share 2023
 Figure 33. World Solid State Memory Chip Packaging Substrate Production Value by Type, (USD Million), 2019 & 2023 & 2030
 Figure 34. World Solid State Memory Chip Packaging Substrate Production Value Market Share by Type in 2023
 Figure 35. WB-CSP Process
 Figure 36. WB-BGA Process
 Figure 37. World Solid State Memory Chip Packaging Substrate Production Market Share by Type (2019-2030)
 Figure 38. World Solid State Memory Chip Packaging Substrate Production Value Market Share by Type (2019-2030)
 Figure 39. World Solid State Memory Chip Packaging Substrate Average Price by Type (2019-2030) & (US$/Unit)
 Figure 40. World Solid State Memory Chip Packaging Substrate Production Value by Application, (USD Million), 2019 & 2023 & 2030
 Figure 41. World Solid State Memory Chip Packaging Substrate Production Value Market Share by Application in 2023
 Figure 42. DRAM
 Figure 43. NAND Flash
 Figure 44. World Solid State Memory Chip Packaging Substrate Production Market Share by Application (2019-2030)
 Figure 45. World Solid State Memory Chip Packaging Substrate Production Value Market Share by Application (2019-2030)
 Figure 46. World Solid State Memory Chip Packaging Substrate Average Price by Application (2019-2030) & (US$/Unit)
 Figure 47. Solid State Memory Chip Packaging Substrate Industry Chain
 Figure 48. Solid State Memory Chip Packaging Substrate Procurement Model
 Figure 49. Solid State Memory Chip Packaging Substrate Sales Model
 Figure 50. Solid State Memory Chip Packaging Substrate Sales Channels, Direct Sales, and Distribution
 Figure 51. Methodology
 Figure 52. Research Process and Data Source

Research Methodology

Client Requirements

Review and analyze client requirements

Discussion of all the project requirements and queries

Flexibility Check

Project Feasibility Analysis

Finalizing tentative research programme

Structuring project proposal with scope, timeline, and costs

Analyzing Market Dynamics

Determination of key drivers, restraints, challenge, and opportunity

Identifies market needs and trends

Market Size Estimation & Forecast

Estimation of historical data based on secondary and primary data

Anticipating market recast by assigning weightage to market forces (drivers, restraints, opportunities)

Freezing historical and forecast market size estimations based on evolution, trends, outlook, and strategies

Consideration of geography, region-specific product/service demand for region segments

Consideration of product utilization rates, product demand outlook for segments by application or end-user.

Data Source

Secondary Source
Data collections from annual reports, presentations,associations, journals, analyst reports, paid database, press releases, blogs, newsletters,and GIR repositories.

Primary Source
Research discussion with manufacturers, distributors, suppliers, end user, industry experts to verify insights.

Validation and
triangulation of
secondary and primary source.

Collection of data

Cumulating and collating the essential qualitative and quantitative data

Generation of report in client requested format by research analysts

Reviews by expert analysts

Final quality check

Clarifying queries

Receiving feedback

Ensuring satisfaction

01 Identification of data

This step involves identification of several primary and secondary data research sources, including Global Info Research's internal data sources. The primary sources consist of in-depth discussions and interviews with policy makers, industry experts, and data evaluators, whereas secondary sources include a thorough study of market journals, press releases, annual reports, and government and non-government agencies websites.
02 Evaluation of Market Dynamic

This phase includes a detailed evaluation of several factors that are likely to affect the market dynamics. It involves a comprehensive assessment of major market pain points, drivers, and trends. It also comprises a detailed study of research plans and methodology.
03 Collection of Data

This process consists of gathering data, accessing proprietary databases, and reaching out to key industry participants that operate in the market across the value chain. It also involves studying several patterns in the historical data and comparing it with the current scenario.
04 Collaboration of Data

This stage involves the validation of data and arrival at actual statistics, and evolution of the market over the years. It entails the study and analyzes various segments and verticals of the market. An impact analysis is also performed to observe which factors will affect the market in the next few years.
05 Verification and Analysis

This is the final stage, which involves both quantity and quality checks. Although the process of data verification is an integral part of the research process, all data points and statistics and figures are re-checked to uphold their authenticity and validity.

Companies Mentioned

LG Innotek
Samsung Electro Mechanics
Simmtech
IBIDEN
Shinko Electric
AT&S
Kyocera
Hemei Jingyi Technology
Shennan Circuit
Newsen Technology
V&G Information System
ASE Group
Unimicron
KINSUS

Related Reports

Global Solid State Memory Chip Packaging Substrate Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

Global Solid State Memory Chip Packaging Substrate Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

date 15 Aug 2024

date Electronics & Semiconductor

Solid-state memory chip packaging substrate is an important material used in the solid-state memory packaging process. As a bridge between the chip and the external circuit, it carries the chip's electrical connection and mechanical support functions. It is composed of multiple layers of materials, including metal layers, insulating layers, and conductive layers, and is used to connect the chip's tiny pins to larger external connectors or circuit boards, while providing the necessary electrical isolation and mechanical protection.

Product Tags

Solid State Memory Chip Packaging Substrate

Fault Line Indicator Supply

Low Response Time Display Supply

Hi-Fi Stereo Power Amplifiers

Purchase Options

Single User License

USD4480.00

Multi User License

USD6720.00

Corporate Users License

USD8960.00

Add To Cart

Buy Now

Popular Product Keywords

AI
semiconductor
electron
5G
artificial intelligence
Battery
new energy
We Provide Professional, Accurate Market Analysis to Help You Stay Ahead of Your Competition.

Speak to our analyst >>
Our Clients
What We Can Provide?

With better results and higher quality products,Our professional reports can achieve four things:
- Insight into the industry market information
- Analyze market development needs
- Prospects for future development
- Develop industry investment strategy
Digging deeper into global industry information and providing market strategies.

Contact Us >>