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Total: 2 records, 1 pages
Search For: Solid State Memory Chip Packaging Substrate
Global Solid State Memory Chip Packaging Substrate Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030
15 Aug 2024
Electronics & Semiconductor
Solid State Memory Chip Packaging Substrate
Solid-state memory chip packaging substrate is an important material used in the solid-state memory packaging process. As a bridge between the chip and the external circuit, it carries the chip's electrical connection and mechanical support functions. It is composed of multiple layers of materials, including metal layers, insulating layers, and conductive layers, and is used to connect the chip's tiny pins to larger external connectors or circuit boards, while providing the necessary electrical isolation and mechanical protection.
USD3480.00
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Global Solid State Memory Chip Packaging Substrate Supply, Demand and Key Producers, 2024-2030
15 Aug 2024
Electronics & Semiconductor
Solid State Memory Chip Packaging Substrate
Solid-state memory chip packaging substrate is an important material used in the solid-state memory packaging process. As a bridge between the chip and the external circuit, it carries the chip's electrical connection and mechanical support functions. It is composed of multiple layers of materials, including metal layers, insulating layers, and conductive layers, and is used to connect the chip's tiny pins to larger external connectors or circuit boards, while providing the necessary electrical isolation and mechanical protection.
USD4480.00
Add To Cart
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Search For: Solid State Memory Chip Packaging Substrate
Total: 2 records, 1 pages
Solid-state memory chip packaging substrate is an important material used in the solid-state memory packaging process. As a bridge between the chip and the external circuit, it carries the chip's electrical connection and mechanical support functions. It is composed of multiple layers of materials, including metal layers, insulating layers, and conductive layers, and is used to connect the chip's tiny pins to larger external connectors or circuit boards, while providing the necessary electrical isolation and mechanical protection.
USD3480.00
Add To Cart
Solid-state memory chip packaging substrate is an important material used in the solid-state memory packaging process. As a bridge between the chip and the external circuit, it carries the chip's electrical connection and mechanical support functions. It is composed of multiple layers of materials, including metal layers, insulating layers, and conductive layers, and is used to connect the chip's tiny pins to larger external connectors or circuit boards, while providing the necessary electrical isolation and mechanical protection.
USD4480.00
Add To Cart
Popular Product Keywords
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Our Clients
What We Can Provide?
With better results and higher quality products,Our professional reports can achieve four things:
-
Insight into the industry market information
-
Analyze market development needs
-
Prospects for future development
-
Develop industry investment strategy
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