Global Low Temperature Curing Epoxy Powder Encapsulation Material Supply, Demand and Key Producers, 2024-2030

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Published Date: 26 Oct 2024

Category: Chemical & Material

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Description
Table of Contents
Table of Figures
Research Methodology
Companies Mentioned
Related Reports
Product Tags

Description

Low-temperature curing epoxy powder encapsulation material is a special epoxy resin material that can be cured at a lower temperature. It is mainly used for the packaging and protection of electronic components. Compared with traditional high temperature curing materials, low temperature curing epoxy powder can be cured between 60-80°C, avoiding the damage of high temperature to heat sensitive components. It has excellent electrical insulation, mechanical strength, chemical corrosion resistance and moisture resistance, and can also remain stable in harsh environments.

The global Low Temperature Curing Epoxy Powder Encapsulation Material market size is expected to reach $ million by 2030, rising at a market growth of %CAGR during the forecast period (2024-2030).

This report studies the global Low Temperature Curing Epoxy Powder Encapsulation Material production, demand, key manufacturers, and key regions.

This report is a detailed and comprehensive analysis of the world market for Low Temperature Curing Epoxy Powder Encapsulation Material and provides market size (US$ million) and Year-over-Year (YoY) Growth, considering 2023 as the base year. This report explores demand trends and competition, as well as details the characteristics of Low Temperature Curing Epoxy Powder Encapsulation Material that contribute to its increasing demand across many markets.

Highlights and key features of the study
Global Low Temperature Curing Epoxy Powder Encapsulation Material total production and demand, 2019-2030, (Kilotons)
Global Low Temperature Curing Epoxy Powder Encapsulation Material total production value, 2019-2030, (USD Million)
Global Low Temperature Curing Epoxy Powder Encapsulation Material production by region & country, production, value, CAGR, 2019-2030, (USD Million) & (Kilotons), (based on production site)
Global Low Temperature Curing Epoxy Powder Encapsulation Material consumption by region & country, CAGR, 2019-2030 & (Kilotons)
U.S. VS China: Low Temperature Curing Epoxy Powder Encapsulation Material domestic production, consumption, key domestic manufacturers and share
Global Low Temperature Curing Epoxy Powder Encapsulation Material production by manufacturer, production, price, value and market share 2019-2024, (USD Million) & (Kilotons)
Global Low Temperature Curing Epoxy Powder Encapsulation Material production by Type, production, value, CAGR, 2019-2030, (USD Million) & (Kilotons)
Global Low Temperature Curing Epoxy Powder Encapsulation Material production by Application, production, value, CAGR, 2019-2030, (USD Million) & (Kilotons)
This report profiles key players in the global Low Temperature Curing Epoxy Powder Encapsulation Material market based on the following parameters - company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Pelnox, Sumitomo Bakelite, Chang Chun Group, NanYa Plastic, Akzonobel, Sherwin-Williams, Kaihua Insulation Materials, Daejoo Electronic Materials, Huaxin Electronic Materials, Kanglong Industrial, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World Low Temperature Curing Epoxy Powder Encapsulation Material market
Detailed Segmentation:
Each section contains quantitative market data including market by value (US$ Millions), volume (production, consumption) & (Kilotons) and average price (US$/Ton) by manufacturer, by Type, and by Application. Data is given for the years 2019-2030 by year with 2023 as the base year, 2024 as the estimate year, and 2025-2030 as the forecast year.

Global Low Temperature Curing Epoxy Powder Encapsulation Material Market, By Region:
    United States
    China
    Europe
    Japan
    South Korea
    ASEAN
    India
    Rest of World

Global Low Temperature Curing Epoxy Powder Encapsulation Material Market, Segmentation by Type:
    Flame Retardant
    Thermal Conductivity
    Others

Global Low Temperature Curing Epoxy Powder Encapsulation Material Market, Segmentation by Application:
    Resistance
    Capacitance
    Fuse
    Others

Companies Profiled:
    Pelnox
    Sumitomo Bakelite
    Chang Chun Group
    NanYa Plastic
    Akzonobel
    Sherwin-Williams
    Kaihua Insulation Materials
    Daejoo Electronic Materials
    Huaxin Electronic Materials
    Kanglong Industrial
    Better Electronics Materials
    Pengnuo Huili Electronic Materials

Key Questions Answered:
1. How big is the global Low Temperature Curing Epoxy Powder Encapsulation Material market?
2. What is the demand of the global Low Temperature Curing Epoxy Powder Encapsulation Material market?
3. What is the year over year growth of the global Low Temperature Curing Epoxy Powder Encapsulation Material market?
4. What is the production and production value of the global Low Temperature Curing Epoxy Powder Encapsulation Material market?
5. Who are the key producers in the global Low Temperature Curing Epoxy Powder Encapsulation Material market?
6. What are the growth factors driving the market demand?

Table of Contents

1 Supply Summary
    1.1 Low Temperature Curing Epoxy Powder Encapsulation Material Introduction
    1.2 World Low Temperature Curing Epoxy Powder Encapsulation Material Supply & Forecast
        1.2.1 World Low Temperature Curing Epoxy Powder Encapsulation Material Production Value (2019 & 2023 & 2030)
        1.2.2 World Low Temperature Curing Epoxy Powder Encapsulation Material Production (2019-2030)
        1.2.3 World Low Temperature Curing Epoxy Powder Encapsulation Material Pricing Trends (2019-2030)
    1.3 World Low Temperature Curing Epoxy Powder Encapsulation Material Production by Region (Based on Production Site)
        1.3.1 World Low Temperature Curing Epoxy Powder Encapsulation Material Production Value by Region (2019-2030)
        1.3.2 World Low Temperature Curing Epoxy Powder Encapsulation Material Production by Region (2019-2030)
        1.3.3 World Low Temperature Curing Epoxy Powder Encapsulation Material Average Price by Region (2019-2030)
        1.3.4 North America Low Temperature Curing Epoxy Powder Encapsulation Material Production (2019-2030)
        1.3.5 Europe Low Temperature Curing Epoxy Powder Encapsulation Material Production (2019-2030)
        1.3.6 China Low Temperature Curing Epoxy Powder Encapsulation Material Production (2019-2030)
        1.3.7 Japan Low Temperature Curing Epoxy Powder Encapsulation Material Production (2019-2030)
    1.4 Market Drivers, Restraints and Trends
        1.4.1 Low Temperature Curing Epoxy Powder Encapsulation Material Market Drivers
        1.4.2 Factors Affecting Demand
        1.4.3 Low Temperature Curing Epoxy Powder Encapsulation Material Major Market Trends

2 Demand Summary
    2.1 World Low Temperature Curing Epoxy Powder Encapsulation Material Demand (2019-2030)
    2.2 World Low Temperature Curing Epoxy Powder Encapsulation Material Consumption by Region
        2.2.1 World Low Temperature Curing Epoxy Powder Encapsulation Material Consumption by Region (2019-2024)
        2.2.2 World Low Temperature Curing Epoxy Powder Encapsulation Material Consumption Forecast by Region (2025-2030)
    2.3 United States Low Temperature Curing Epoxy Powder Encapsulation Material Consumption (2019-2030)
    2.4 China Low Temperature Curing Epoxy Powder Encapsulation Material Consumption (2019-2030)
    2.5 Europe Low Temperature Curing Epoxy Powder Encapsulation Material Consumption (2019-2030)
    2.6 Japan Low Temperature Curing Epoxy Powder Encapsulation Material Consumption (2019-2030)
    2.7 South Korea Low Temperature Curing Epoxy Powder Encapsulation Material Consumption (2019-2030)
    2.8 ASEAN Low Temperature Curing Epoxy Powder Encapsulation Material Consumption (2019-2030)
    2.9 India Low Temperature Curing Epoxy Powder Encapsulation Material Consumption (2019-2030)

3 World Manufacturers Competitive Analysis
    3.1 World Low Temperature Curing Epoxy Powder Encapsulation Material Production Value by Manufacturer (2019-2024)
    3.2 World Low Temperature Curing Epoxy Powder Encapsulation Material Production by Manufacturer (2019-2024)
    3.3 World Low Temperature Curing Epoxy Powder Encapsulation Material Average Price by Manufacturer (2019-2024)
    3.4 Low Temperature Curing Epoxy Powder Encapsulation Material Company Evaluation Quadrant
    3.5 Industry Rank and Concentration Rate (CR)
        3.5.1 Global Low Temperature Curing Epoxy Powder Encapsulation Material Industry Rank of Major Manufacturers
        3.5.2 Global Concentration Ratios (CR4) for Low Temperature Curing Epoxy Powder Encapsulation Material in 2023
        3.5.3 Global Concentration Ratios (CR8) for Low Temperature Curing Epoxy Powder Encapsulation Material in 2023
    3.6 Low Temperature Curing Epoxy Powder Encapsulation Material Market: Overall Company Footprint Analysis
        3.6.1 Low Temperature Curing Epoxy Powder Encapsulation Material Market: Region Footprint
        3.6.2 Low Temperature Curing Epoxy Powder Encapsulation Material Market: Company Product Type Footprint
        3.6.3 Low Temperature Curing Epoxy Powder Encapsulation Material Market: Company Product Application Footprint
    3.7 Competitive Environment
        3.7.1 Historical Structure of the Industry
        3.7.2 Barriers of Market Entry
        3.7.3 Factors of Competition
    3.8 New Entrant and Capacity Expansion Plans
    3.9 Mergers, Acquisition, Agreements, and Collaborations

4 United States VS China VS Rest of the World
    4.1 United States VS China: Low Temperature Curing Epoxy Powder Encapsulation Material Production Value Comparison
        4.1.1 United States VS China: Low Temperature Curing Epoxy Powder Encapsulation Material Production Value Comparison (2019 & 2023 & 2030)
        4.1.2 United States VS China: Low Temperature Curing Epoxy Powder Encapsulation Material Production Value Market Share Comparison (2019 & 2023 & 2030)
    4.2 United States VS China: Low Temperature Curing Epoxy Powder Encapsulation Material Production Comparison
        4.2.1 United States VS China: Low Temperature Curing Epoxy Powder Encapsulation Material Production Comparison (2019 & 2023 & 2030)
        4.2.2 United States VS China: Low Temperature Curing Epoxy Powder Encapsulation Material Production Market Share Comparison (2019 & 2023 & 2030)
    4.3 United States VS China: Low Temperature Curing Epoxy Powder Encapsulation Material Consumption Comparison
        4.3.1 United States VS China: Low Temperature Curing Epoxy Powder Encapsulation Material Consumption Comparison (2019 & 2023 & 2030)
        4.3.2 United States VS China: Low Temperature Curing Epoxy Powder Encapsulation Material Consumption Market Share Comparison (2019 & 2023 & 2030)
    4.4 United States Based Low Temperature Curing Epoxy Powder Encapsulation Material Manufacturers and Market Share, 2019-2024
        4.4.1 United States Based Low Temperature Curing Epoxy Powder Encapsulation Material Manufacturers, Headquarters and Production Site (States, Country)
        4.4.2 United States Based Manufacturers Low Temperature Curing Epoxy Powder Encapsulation Material Production Value (2019-2024)
        4.4.3 United States Based Manufacturers Low Temperature Curing Epoxy Powder Encapsulation Material Production (2019-2024)
    4.5 China Based Low Temperature Curing Epoxy Powder Encapsulation Material Manufacturers and Market Share
        4.5.1 China Based Low Temperature Curing Epoxy Powder Encapsulation Material Manufacturers, Headquarters and Production Site (Province, Country)
        4.5.2 China Based Manufacturers Low Temperature Curing Epoxy Powder Encapsulation Material Production Value (2019-2024)
        4.5.3 China Based Manufacturers Low Temperature Curing Epoxy Powder Encapsulation Material Production (2019-2024)
    4.6 Rest of World Based Low Temperature Curing Epoxy Powder Encapsulation Material Manufacturers and Market Share, 2019-2024
        4.6.1 Rest of World Based Low Temperature Curing Epoxy Powder Encapsulation Material Manufacturers, Headquarters and Production Site (State, Country)
        4.6.2 Rest of World Based Manufacturers Low Temperature Curing Epoxy Powder Encapsulation Material Production Value (2019-2024)
        4.6.3 Rest of World Based Manufacturers Low Temperature Curing Epoxy Powder Encapsulation Material Production (2019-2024)

5 Market Analysis by Type
    5.1 World Low Temperature Curing Epoxy Powder Encapsulation Material Market Size Overview by Type: 2019 VS 2023 VS 2030
    5.2 Segment Introduction by Type
        5.2.1 Flame Retardant
        5.2.2 Thermal Conductivity
        5.2.3 Others
    5.3 Market Segment by Type
        5.3.1 World Low Temperature Curing Epoxy Powder Encapsulation Material Production by Type (2019-2030)
        5.3.2 World Low Temperature Curing Epoxy Powder Encapsulation Material Production Value by Type (2019-2030)
        5.3.3 World Low Temperature Curing Epoxy Powder Encapsulation Material Average Price by Type (2019-2030)

6 Market Analysis by Application
    6.1 World Low Temperature Curing Epoxy Powder Encapsulation Material Market Size Overview by Application: 2019 VS 2023 VS 2030
    6.2 Segment Introduction by Application
        6.2.1 Resistance
        6.2.2 Capacitance
        6.2.3 Fuse
        6.2.4 Others
    6.3 Market Segment by Application
        6.3.1 World Low Temperature Curing Epoxy Powder Encapsulation Material Production by Application (2019-2030)
        6.3.2 World Low Temperature Curing Epoxy Powder Encapsulation Material Production Value by Application (2019-2030)
        6.3.3 World Low Temperature Curing Epoxy Powder Encapsulation Material Average Price by Application (2019-2030)

7 Company Profiles
    7.1 Pelnox
        7.1.1 Pelnox Details
        7.1.2 Pelnox Major Business
        7.1.3 Pelnox Low Temperature Curing Epoxy Powder Encapsulation Material Product and Services
        7.1.4 Pelnox Low Temperature Curing Epoxy Powder Encapsulation Material Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.1.5 Pelnox Recent Developments/Updates
        7.1.6 Pelnox Competitive Strengths & Weaknesses
    7.2 Sumitomo Bakelite
        7.2.1 Sumitomo Bakelite Details
        7.2.2 Sumitomo Bakelite Major Business
        7.2.3 Sumitomo Bakelite Low Temperature Curing Epoxy Powder Encapsulation Material Product and Services
        7.2.4 Sumitomo Bakelite Low Temperature Curing Epoxy Powder Encapsulation Material Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.2.5 Sumitomo Bakelite Recent Developments/Updates
        7.2.6 Sumitomo Bakelite Competitive Strengths & Weaknesses
    7.3 Chang Chun Group
        7.3.1 Chang Chun Group Details
        7.3.2 Chang Chun Group Major Business
        7.3.3 Chang Chun Group Low Temperature Curing Epoxy Powder Encapsulation Material Product and Services
        7.3.4 Chang Chun Group Low Temperature Curing Epoxy Powder Encapsulation Material Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.3.5 Chang Chun Group Recent Developments/Updates
        7.3.6 Chang Chun Group Competitive Strengths & Weaknesses
    7.4 NanYa Plastic
        7.4.1 NanYa Plastic Details
        7.4.2 NanYa Plastic Major Business
        7.4.3 NanYa Plastic Low Temperature Curing Epoxy Powder Encapsulation Material Product and Services
        7.4.4 NanYa Plastic Low Temperature Curing Epoxy Powder Encapsulation Material Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.4.5 NanYa Plastic Recent Developments/Updates
        7.4.6 NanYa Plastic Competitive Strengths & Weaknesses
    7.5 Akzonobel
        7.5.1 Akzonobel Details
        7.5.2 Akzonobel Major Business
        7.5.3 Akzonobel Low Temperature Curing Epoxy Powder Encapsulation Material Product and Services
        7.5.4 Akzonobel Low Temperature Curing Epoxy Powder Encapsulation Material Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.5.5 Akzonobel Recent Developments/Updates
        7.5.6 Akzonobel Competitive Strengths & Weaknesses
    7.6 Sherwin-Williams
        7.6.1 Sherwin-Williams Details
        7.6.2 Sherwin-Williams Major Business
        7.6.3 Sherwin-Williams Low Temperature Curing Epoxy Powder Encapsulation Material Product and Services
        7.6.4 Sherwin-Williams Low Temperature Curing Epoxy Powder Encapsulation Material Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.6.5 Sherwin-Williams Recent Developments/Updates
        7.6.6 Sherwin-Williams Competitive Strengths & Weaknesses
    7.7 Kaihua Insulation Materials
        7.7.1 Kaihua Insulation Materials Details
        7.7.2 Kaihua Insulation Materials Major Business
        7.7.3 Kaihua Insulation Materials Low Temperature Curing Epoxy Powder Encapsulation Material Product and Services
        7.7.4 Kaihua Insulation Materials Low Temperature Curing Epoxy Powder Encapsulation Material Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.7.5 Kaihua Insulation Materials Recent Developments/Updates
        7.7.6 Kaihua Insulation Materials Competitive Strengths & Weaknesses
    7.8 Daejoo Electronic Materials
        7.8.1 Daejoo Electronic Materials Details
        7.8.2 Daejoo Electronic Materials Major Business
        7.8.3 Daejoo Electronic Materials Low Temperature Curing Epoxy Powder Encapsulation Material Product and Services
        7.8.4 Daejoo Electronic Materials Low Temperature Curing Epoxy Powder Encapsulation Material Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.8.5 Daejoo Electronic Materials Recent Developments/Updates
        7.8.6 Daejoo Electronic Materials Competitive Strengths & Weaknesses
    7.9 Huaxin Electronic Materials
        7.9.1 Huaxin Electronic Materials Details
        7.9.2 Huaxin Electronic Materials Major Business
        7.9.3 Huaxin Electronic Materials Low Temperature Curing Epoxy Powder Encapsulation Material Product and Services
        7.9.4 Huaxin Electronic Materials Low Temperature Curing Epoxy Powder Encapsulation Material Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.9.5 Huaxin Electronic Materials Recent Developments/Updates
        7.9.6 Huaxin Electronic Materials Competitive Strengths & Weaknesses
    7.10 Kanglong Industrial
        7.10.1 Kanglong Industrial Details
        7.10.2 Kanglong Industrial Major Business
        7.10.3 Kanglong Industrial Low Temperature Curing Epoxy Powder Encapsulation Material Product and Services
        7.10.4 Kanglong Industrial Low Temperature Curing Epoxy Powder Encapsulation Material Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.10.5 Kanglong Industrial Recent Developments/Updates
        7.10.6 Kanglong Industrial Competitive Strengths & Weaknesses
    7.11 Better Electronics Materials
        7.11.1 Better Electronics Materials Details
        7.11.2 Better Electronics Materials Major Business
        7.11.3 Better Electronics Materials Low Temperature Curing Epoxy Powder Encapsulation Material Product and Services
        7.11.4 Better Electronics Materials Low Temperature Curing Epoxy Powder Encapsulation Material Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.11.5 Better Electronics Materials Recent Developments/Updates
        7.11.6 Better Electronics Materials Competitive Strengths & Weaknesses
    7.12 Pengnuo Huili Electronic Materials
        7.12.1 Pengnuo Huili Electronic Materials Details
        7.12.2 Pengnuo Huili Electronic Materials Major Business
        7.12.3 Pengnuo Huili Electronic Materials Low Temperature Curing Epoxy Powder Encapsulation Material Product and Services
        7.12.4 Pengnuo Huili Electronic Materials Low Temperature Curing Epoxy Powder Encapsulation Material Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.12.5 Pengnuo Huili Electronic Materials Recent Developments/Updates
        7.12.6 Pengnuo Huili Electronic Materials Competitive Strengths & Weaknesses

8 Industry Chain Analysis
    8.1 Low Temperature Curing Epoxy Powder Encapsulation Material Industry Chain
    8.2 Low Temperature Curing Epoxy Powder Encapsulation Material Upstream Analysis
        8.2.1 Low Temperature Curing Epoxy Powder Encapsulation Material Core Raw Materials
        8.2.2 Main Manufacturers of Low Temperature Curing Epoxy Powder Encapsulation Material Core Raw Materials
    8.3 Midstream Analysis
    8.4 Downstream Analysis
    8.5 Low Temperature Curing Epoxy Powder Encapsulation Material Production Mode
    8.6 Low Temperature Curing Epoxy Powder Encapsulation Material Procurement Model
    8.7 Low Temperature Curing Epoxy Powder Encapsulation Material Industry Sales Model and Sales Channels
        8.7.1 Low Temperature Curing Epoxy Powder Encapsulation Material Sales Model
        8.7.2 Low Temperature Curing Epoxy Powder Encapsulation Material Typical Distributors

9 Research Findings and Conclusion

10 Appendix
    10.1 Methodology
    10.2 Research Process and Data Source
    10.3 Disclaimer

Table of Figures

List of Tables
 Table 1. World Low Temperature Curing Epoxy Powder Encapsulation Material Production Value by Region (2019, 2023 and 2030) & (USD Million)
 Table 2. World Low Temperature Curing Epoxy Powder Encapsulation Material Production Value by Region (2019-2024) & (USD Million)
 Table 3. World Low Temperature Curing Epoxy Powder Encapsulation Material Production Value by Region (2025-2030) & (USD Million)
 Table 4. World Low Temperature Curing Epoxy Powder Encapsulation Material Production Value Market Share by Region (2019-2024)
 Table 5. World Low Temperature Curing Epoxy Powder Encapsulation Material Production Value Market Share by Region (2025-2030)
 Table 6. World Low Temperature Curing Epoxy Powder Encapsulation Material Production by Region (2019-2024) & (Kilotons)
 Table 7. World Low Temperature Curing Epoxy Powder Encapsulation Material Production by Region (2025-2030) & (Kilotons)
 Table 8. World Low Temperature Curing Epoxy Powder Encapsulation Material Production Market Share by Region (2019-2024)
 Table 9. World Low Temperature Curing Epoxy Powder Encapsulation Material Production Market Share by Region (2025-2030)
 Table 10. World Low Temperature Curing Epoxy Powder Encapsulation Material Average Price by Region (2019-2024) & (US$/Ton)
 Table 11. World Low Temperature Curing Epoxy Powder Encapsulation Material Average Price by Region (2025-2030) & (US$/Ton)
 Table 12. Low Temperature Curing Epoxy Powder Encapsulation Material Major Market Trends
 Table 13. World Low Temperature Curing Epoxy Powder Encapsulation Material Consumption Growth Rate Forecast by Region (2019 & 2023 & 2030) & (Kilotons)
 Table 14. World Low Temperature Curing Epoxy Powder Encapsulation Material Consumption by Region (2019-2024) & (Kilotons)
 Table 15. World Low Temperature Curing Epoxy Powder Encapsulation Material Consumption Forecast by Region (2025-2030) & (Kilotons)
 Table 16. World Low Temperature Curing Epoxy Powder Encapsulation Material Production Value by Manufacturer (2019-2024) & (USD Million)
 Table 17. Production Value Market Share of Key Low Temperature Curing Epoxy Powder Encapsulation Material Producers in 2023
 Table 18. World Low Temperature Curing Epoxy Powder Encapsulation Material Production by Manufacturer (2019-2024) & (Kilotons)
 Table 19. Production Market Share of Key Low Temperature Curing Epoxy Powder Encapsulation Material Producers in 2023
 Table 20. World Low Temperature Curing Epoxy Powder Encapsulation Material Average Price by Manufacturer (2019-2024) & (US$/Ton)
 Table 21. Global Low Temperature Curing Epoxy Powder Encapsulation Material Company Evaluation Quadrant
 Table 22. World Low Temperature Curing Epoxy Powder Encapsulation Material Industry Rank of Major Manufacturers, Based on Production Value in 2023
 Table 23. Head Office and Low Temperature Curing Epoxy Powder Encapsulation Material Production Site of Key Manufacturer
 Table 24. Low Temperature Curing Epoxy Powder Encapsulation Material Market: Company Product Type Footprint
 Table 25. Low Temperature Curing Epoxy Powder Encapsulation Material Market: Company Product Application Footprint
 Table 26. Low Temperature Curing Epoxy Powder Encapsulation Material Competitive Factors
 Table 27. Low Temperature Curing Epoxy Powder Encapsulation Material New Entrant and Capacity Expansion Plans
 Table 28. Low Temperature Curing Epoxy Powder Encapsulation Material Mergers & Acquisitions Activity
 Table 29. United States VS China Low Temperature Curing Epoxy Powder Encapsulation Material Production Value Comparison, (2019 & 2023 & 2030) & (USD Million)
 Table 30. United States VS China Low Temperature Curing Epoxy Powder Encapsulation Material Production Comparison, (2019 & 2023 & 2030) & (Kilotons)
 Table 31. United States VS China Low Temperature Curing Epoxy Powder Encapsulation Material Consumption Comparison, (2019 & 2023 & 2030) & (Kilotons)
 Table 32. United States Based Low Temperature Curing Epoxy Powder Encapsulation Material Manufacturers, Headquarters and Production Site (States, Country)
 Table 33. United States Based Manufacturers Low Temperature Curing Epoxy Powder Encapsulation Material Production Value, (2019-2024) & (USD Million)
 Table 34. United States Based Manufacturers Low Temperature Curing Epoxy Powder Encapsulation Material Production Value Market Share (2019-2024)
 Table 35. United States Based Manufacturers Low Temperature Curing Epoxy Powder Encapsulation Material Production (2019-2024) & (Kilotons)
 Table 36. United States Based Manufacturers Low Temperature Curing Epoxy Powder Encapsulation Material Production Market Share (2019-2024)
 Table 37. China Based Low Temperature Curing Epoxy Powder Encapsulation Material Manufacturers, Headquarters and Production Site (Province, Country)
 Table 38. China Based Manufacturers Low Temperature Curing Epoxy Powder Encapsulation Material Production Value, (2019-2024) & (USD Million)
 Table 39. China Based Manufacturers Low Temperature Curing Epoxy Powder Encapsulation Material Production Value Market Share (2019-2024)
 Table 40. China Based Manufacturers Low Temperature Curing Epoxy Powder Encapsulation Material Production, (2019-2024) & (Kilotons)
 Table 41. China Based Manufacturers Low Temperature Curing Epoxy Powder Encapsulation Material Production Market Share (2019-2024)
 Table 42. Rest of World Based Low Temperature Curing Epoxy Powder Encapsulation Material Manufacturers, Headquarters and Production Site (State, Country)
 Table 43. Rest of World Based Manufacturers Low Temperature Curing Epoxy Powder Encapsulation Material Production Value, (2019-2024) & (USD Million)
 Table 44. Rest of World Based Manufacturers Low Temperature Curing Epoxy Powder Encapsulation Material Production Value Market Share (2019-2024)
 Table 45. Rest of World Based Manufacturers Low Temperature Curing Epoxy Powder Encapsulation Material Production, (2019-2024) & (Kilotons)
 Table 46. Rest of World Based Manufacturers Low Temperature Curing Epoxy Powder Encapsulation Material Production Market Share (2019-2024)
 Table 47. World Low Temperature Curing Epoxy Powder Encapsulation Material Production Value by Type, (USD Million), 2019 & 2023 & 2030
 Table 48. World Low Temperature Curing Epoxy Powder Encapsulation Material Production by Type (2019-2024) & (Kilotons)
 Table 49. World Low Temperature Curing Epoxy Powder Encapsulation Material Production by Type (2025-2030) & (Kilotons)
 Table 50. World Low Temperature Curing Epoxy Powder Encapsulation Material Production Value by Type (2019-2024) & (USD Million)
 Table 51. World Low Temperature Curing Epoxy Powder Encapsulation Material Production Value by Type (2025-2030) & (USD Million)
 Table 52. World Low Temperature Curing Epoxy Powder Encapsulation Material Average Price by Type (2019-2024) & (US$/Ton)
 Table 53. World Low Temperature Curing Epoxy Powder Encapsulation Material Average Price by Type (2025-2030) & (US$/Ton)
 Table 54. World Low Temperature Curing Epoxy Powder Encapsulation Material Production Value by Application, (USD Million), 2019 & 2023 & 2030
 Table 55. World Low Temperature Curing Epoxy Powder Encapsulation Material Production by Application (2019-2024) & (Kilotons)
 Table 56. World Low Temperature Curing Epoxy Powder Encapsulation Material Production by Application (2025-2030) & (Kilotons)
 Table 57. World Low Temperature Curing Epoxy Powder Encapsulation Material Production Value by Application (2019-2024) & (USD Million)
 Table 58. World Low Temperature Curing Epoxy Powder Encapsulation Material Production Value by Application (2025-2030) & (USD Million)
 Table 59. World Low Temperature Curing Epoxy Powder Encapsulation Material Average Price by Application (2019-2024) & (US$/Ton)
 Table 60. World Low Temperature Curing Epoxy Powder Encapsulation Material Average Price by Application (2025-2030) & (US$/Ton)
 Table 61. Pelnox Basic Information, Manufacturing Base and Competitors
 Table 62. Pelnox Major Business
 Table 63. Pelnox Low Temperature Curing Epoxy Powder Encapsulation Material Product and Services
 Table 64. Pelnox Low Temperature Curing Epoxy Powder Encapsulation Material Production (Kilotons), Price (US$/Ton), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 65. Pelnox Recent Developments/Updates
 Table 66. Pelnox Competitive Strengths & Weaknesses
 Table 67. Sumitomo Bakelite Basic Information, Manufacturing Base and Competitors
 Table 68. Sumitomo Bakelite Major Business
 Table 69. Sumitomo Bakelite Low Temperature Curing Epoxy Powder Encapsulation Material Product and Services
 Table 70. Sumitomo Bakelite Low Temperature Curing Epoxy Powder Encapsulation Material Production (Kilotons), Price (US$/Ton), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 71. Sumitomo Bakelite Recent Developments/Updates
 Table 72. Sumitomo Bakelite Competitive Strengths & Weaknesses
 Table 73. Chang Chun Group Basic Information, Manufacturing Base and Competitors
 Table 74. Chang Chun Group Major Business
 Table 75. Chang Chun Group Low Temperature Curing Epoxy Powder Encapsulation Material Product and Services
 Table 76. Chang Chun Group Low Temperature Curing Epoxy Powder Encapsulation Material Production (Kilotons), Price (US$/Ton), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 77. Chang Chun Group Recent Developments/Updates
 Table 78. Chang Chun Group Competitive Strengths & Weaknesses
 Table 79. NanYa Plastic Basic Information, Manufacturing Base and Competitors
 Table 80. NanYa Plastic Major Business
 Table 81. NanYa Plastic Low Temperature Curing Epoxy Powder Encapsulation Material Product and Services
 Table 82. NanYa Plastic Low Temperature Curing Epoxy Powder Encapsulation Material Production (Kilotons), Price (US$/Ton), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 83. NanYa Plastic Recent Developments/Updates
 Table 84. NanYa Plastic Competitive Strengths & Weaknesses
 Table 85. Akzonobel Basic Information, Manufacturing Base and Competitors
 Table 86. Akzonobel Major Business
 Table 87. Akzonobel Low Temperature Curing Epoxy Powder Encapsulation Material Product and Services
 Table 88. Akzonobel Low Temperature Curing Epoxy Powder Encapsulation Material Production (Kilotons), Price (US$/Ton), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 89. Akzonobel Recent Developments/Updates
 Table 90. Akzonobel Competitive Strengths & Weaknesses
 Table 91. Sherwin-Williams Basic Information, Manufacturing Base and Competitors
 Table 92. Sherwin-Williams Major Business
 Table 93. Sherwin-Williams Low Temperature Curing Epoxy Powder Encapsulation Material Product and Services
 Table 94. Sherwin-Williams Low Temperature Curing Epoxy Powder Encapsulation Material Production (Kilotons), Price (US$/Ton), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 95. Sherwin-Williams Recent Developments/Updates
 Table 96. Sherwin-Williams Competitive Strengths & Weaknesses
 Table 97. Kaihua Insulation Materials Basic Information, Manufacturing Base and Competitors
 Table 98. Kaihua Insulation Materials Major Business
 Table 99. Kaihua Insulation Materials Low Temperature Curing Epoxy Powder Encapsulation Material Product and Services
 Table 100. Kaihua Insulation Materials Low Temperature Curing Epoxy Powder Encapsulation Material Production (Kilotons), Price (US$/Ton), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 101. Kaihua Insulation Materials Recent Developments/Updates
 Table 102. Kaihua Insulation Materials Competitive Strengths & Weaknesses
 Table 103. Daejoo Electronic Materials Basic Information, Manufacturing Base and Competitors
 Table 104. Daejoo Electronic Materials Major Business
 Table 105. Daejoo Electronic Materials Low Temperature Curing Epoxy Powder Encapsulation Material Product and Services
 Table 106. Daejoo Electronic Materials Low Temperature Curing Epoxy Powder Encapsulation Material Production (Kilotons), Price (US$/Ton), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 107. Daejoo Electronic Materials Recent Developments/Updates
 Table 108. Daejoo Electronic Materials Competitive Strengths & Weaknesses
 Table 109. Huaxin Electronic Materials Basic Information, Manufacturing Base and Competitors
 Table 110. Huaxin Electronic Materials Major Business
 Table 111. Huaxin Electronic Materials Low Temperature Curing Epoxy Powder Encapsulation Material Product and Services
 Table 112. Huaxin Electronic Materials Low Temperature Curing Epoxy Powder Encapsulation Material Production (Kilotons), Price (US$/Ton), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 113. Huaxin Electronic Materials Recent Developments/Updates
 Table 114. Huaxin Electronic Materials Competitive Strengths & Weaknesses
 Table 115. Kanglong Industrial Basic Information, Manufacturing Base and Competitors
 Table 116. Kanglong Industrial Major Business
 Table 117. Kanglong Industrial Low Temperature Curing Epoxy Powder Encapsulation Material Product and Services
 Table 118. Kanglong Industrial Low Temperature Curing Epoxy Powder Encapsulation Material Production (Kilotons), Price (US$/Ton), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 119. Kanglong Industrial Recent Developments/Updates
 Table 120. Kanglong Industrial Competitive Strengths & Weaknesses
 Table 121. Better Electronics Materials Basic Information, Manufacturing Base and Competitors
 Table 122. Better Electronics Materials Major Business
 Table 123. Better Electronics Materials Low Temperature Curing Epoxy Powder Encapsulation Material Product and Services
 Table 124. Better Electronics Materials Low Temperature Curing Epoxy Powder Encapsulation Material Production (Kilotons), Price (US$/Ton), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 125. Better Electronics Materials Recent Developments/Updates
 Table 126. Better Electronics Materials Competitive Strengths & Weaknesses
 Table 127. Pengnuo Huili Electronic Materials Basic Information, Manufacturing Base and Competitors
 Table 128. Pengnuo Huili Electronic Materials Major Business
 Table 129. Pengnuo Huili Electronic Materials Low Temperature Curing Epoxy Powder Encapsulation Material Product and Services
 Table 130. Pengnuo Huili Electronic Materials Low Temperature Curing Epoxy Powder Encapsulation Material Production (Kilotons), Price (US$/Ton), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 131. Pengnuo Huili Electronic Materials Recent Developments/Updates
 Table 132. Pengnuo Huili Electronic Materials Competitive Strengths & Weaknesses
 Table 133. Global Key Players of Low Temperature Curing Epoxy Powder Encapsulation Material Upstream (Raw Materials)
 Table 134. Global Low Temperature Curing Epoxy Powder Encapsulation Material Typical Customers
 Table 135. Low Temperature Curing Epoxy Powder Encapsulation Material Typical Distributors


List of Figures
 Figure 1. Low Temperature Curing Epoxy Powder Encapsulation Material Picture
 Figure 2. World Low Temperature Curing Epoxy Powder Encapsulation Material Production Value: 2019 & 2023 & 2030, (USD Million)
 Figure 3. World Low Temperature Curing Epoxy Powder Encapsulation Material Production Value and Forecast (2019-2030) & (USD Million)
 Figure 4. World Low Temperature Curing Epoxy Powder Encapsulation Material Production (2019-2030) & (Kilotons)
 Figure 5. World Low Temperature Curing Epoxy Powder Encapsulation Material Average Price (2019-2030) & (US$/Ton)
 Figure 6. World Low Temperature Curing Epoxy Powder Encapsulation Material Production Value Market Share by Region (2019-2030)
 Figure 7. World Low Temperature Curing Epoxy Powder Encapsulation Material Production Market Share by Region (2019-2030)
 Figure 8. North America Low Temperature Curing Epoxy Powder Encapsulation Material Production (2019-2030) & (Kilotons)
 Figure 9. Europe Low Temperature Curing Epoxy Powder Encapsulation Material Production (2019-2030) & (Kilotons)
 Figure 10. China Low Temperature Curing Epoxy Powder Encapsulation Material Production (2019-2030) & (Kilotons)
 Figure 11. Japan Low Temperature Curing Epoxy Powder Encapsulation Material Production (2019-2030) & (Kilotons)
 Figure 12. Low Temperature Curing Epoxy Powder Encapsulation Material Market Drivers
 Figure 13. Factors Affecting Demand
 Figure 14. World Low Temperature Curing Epoxy Powder Encapsulation Material Consumption (2019-2030) & (Kilotons)
 Figure 15. World Low Temperature Curing Epoxy Powder Encapsulation Material Consumption Market Share by Region (2019-2030)
 Figure 16. United States Low Temperature Curing Epoxy Powder Encapsulation Material Consumption (2019-2030) & (Kilotons)
 Figure 17. China Low Temperature Curing Epoxy Powder Encapsulation Material Consumption (2019-2030) & (Kilotons)
 Figure 18. Europe Low Temperature Curing Epoxy Powder Encapsulation Material Consumption (2019-2030) & (Kilotons)
 Figure 19. Japan Low Temperature Curing Epoxy Powder Encapsulation Material Consumption (2019-2030) & (Kilotons)
 Figure 20. South Korea Low Temperature Curing Epoxy Powder Encapsulation Material Consumption (2019-2030) & (Kilotons)
 Figure 21. ASEAN Low Temperature Curing Epoxy Powder Encapsulation Material Consumption (2019-2030) & (Kilotons)
 Figure 22. India Low Temperature Curing Epoxy Powder Encapsulation Material Consumption (2019-2030) & (Kilotons)
 Figure 23. Producer Shipments of Low Temperature Curing Epoxy Powder Encapsulation Material by Manufacturer Revenue ($MM) and Market Share (%): 2023
 Figure 24. Global Four-firm Concentration Ratios (CR4) for Low Temperature Curing Epoxy Powder Encapsulation Material Markets in 2023
 Figure 25. Global Four-firm Concentration Ratios (CR8) for Low Temperature Curing Epoxy Powder Encapsulation Material Markets in 2023
 Figure 26. United States VS China: Low Temperature Curing Epoxy Powder Encapsulation Material Production Value Market Share Comparison (2019 & 2023 & 2030)
 Figure 27. United States VS China: Low Temperature Curing Epoxy Powder Encapsulation Material Production Market Share Comparison (2019 & 2023 & 2030)
 Figure 28. United States VS China: Low Temperature Curing Epoxy Powder Encapsulation Material Consumption Market Share Comparison (2019 & 2023 & 2030)
 Figure 29. United States Based Manufacturers Low Temperature Curing Epoxy Powder Encapsulation Material Production Market Share 2023
 Figure 30. China Based Manufacturers Low Temperature Curing Epoxy Powder Encapsulation Material Production Market Share 2023
 Figure 31. Rest of World Based Manufacturers Low Temperature Curing Epoxy Powder Encapsulation Material Production Market Share 2023
 Figure 32. World Low Temperature Curing Epoxy Powder Encapsulation Material Production Value by Type, (USD Million), 2019 & 2023 & 2030
 Figure 33. World Low Temperature Curing Epoxy Powder Encapsulation Material Production Value Market Share by Type in 2023
 Figure 34. Flame Retardant
 Figure 35. Thermal Conductivity
 Figure 36. Others
 Figure 37. World Low Temperature Curing Epoxy Powder Encapsulation Material Production Market Share by Type (2019-2030)
 Figure 38. World Low Temperature Curing Epoxy Powder Encapsulation Material Production Value Market Share by Type (2019-2030)
 Figure 39. World Low Temperature Curing Epoxy Powder Encapsulation Material Average Price by Type (2019-2030) & (US$/Ton)
 Figure 40. World Low Temperature Curing Epoxy Powder Encapsulation Material Production Value by Application, (USD Million), 2019 & 2023 & 2030
 Figure 41. World Low Temperature Curing Epoxy Powder Encapsulation Material Production Value Market Share by Application in 2023
 Figure 42. Resistance
 Figure 43. Capacitance
 Figure 44. Fuse
 Figure 45. Others
 Figure 46. World Low Temperature Curing Epoxy Powder Encapsulation Material Production Market Share by Application (2019-2030)
 Figure 47. World Low Temperature Curing Epoxy Powder Encapsulation Material Production Value Market Share by Application (2019-2030)
 Figure 48. World Low Temperature Curing Epoxy Powder Encapsulation Material Average Price by Application (2019-2030) & (US$/Ton)
 Figure 49. Low Temperature Curing Epoxy Powder Encapsulation Material Industry Chain
 Figure 50. Low Temperature Curing Epoxy Powder Encapsulation Material Procurement Model
 Figure 51. Low Temperature Curing Epoxy Powder Encapsulation Material Sales Model
 Figure 52. Low Temperature Curing Epoxy Powder Encapsulation Material Sales Channels, Direct Sales, and Distribution
 Figure 53. Methodology
 Figure 54. Research Process and Data Source

Research Methodology

Client Requirements

Review and analyze client requirements

Discussion of all the project requirements and queries

Flexibility Check

Project Feasibility Analysis

Finalizing tentative research programme

Structuring project proposal with scope, timeline, and costs

Analyzing Market Dynamics

Determination of key drivers, restraints, challenge, and opportunity

Identifies market needs and trends

Market Size Estimation & Forecast

Estimation of historical data based on secondary and primary data

Anticipating market recast by assigning weightage to market forces (drivers, restraints, opportunities)

Freezing historical and forecast market size estimations based on evolution, trends, outlook, and strategies

Consideration of geography, region-specific product/service demand for region segments

Consideration of product utilization rates, product demand outlook for segments by application or end-user.

Data Source

Secondary Source
Data collections from annual reports, presentations,associations, journals, analyst reports, paid database, press releases, blogs, newsletters,and GIR repositories.

Primary Source
Research discussion with manufacturers, distributors, suppliers, end user, industry experts to verify insights.

Validation and
triangulation of
secondary and primary source.

Collection of data

Cumulating and collating the essential qualitative and quantitative data

Generation of report in client requested format by research analysts

Reviews by expert analysts

Final quality check

Clarifying queries

Receiving feedback

Ensuring satisfaction

01 Identification of data

This step involves identification of several primary and secondary data research sources, including Global Info Research's internal data sources. The primary sources consist of in-depth discussions and interviews with policy makers, industry experts, and data evaluators, whereas secondary sources include a thorough study of market journals, press releases, annual reports, and government and non-government agencies websites.
02 Evaluation of Market Dynamic

This phase includes a detailed evaluation of several factors that are likely to affect the market dynamics. It involves a comprehensive assessment of major market pain points, drivers, and trends. It also comprises a detailed study of research plans and methodology.
03 Collection of Data

This process consists of gathering data, accessing proprietary databases, and reaching out to key industry participants that operate in the market across the value chain. It also involves studying several patterns in the historical data and comparing it with the current scenario.
04 Collaboration of Data

This stage involves the validation of data and arrival at actual statistics, and evolution of the market over the years. It entails the study and analyzes various segments and verticals of the market. An impact analysis is also performed to observe which factors will affect the market in the next few years.
05 Verification and Analysis

This is the final stage, which involves both quantity and quality checks. Although the process of data verification is an integral part of the research process, all data points and statistics and figures are re-checked to uphold their authenticity and validity.

Companies Mentioned

Pelnox
Sumitomo Bakelite
Chang Chun Group
NanYa Plastic
Akzonobel
Sherwin-Williams
Kaihua Insulation Materials
Daejoo Electronic Materials
Huaxin Electronic Materials
Kanglong Industrial
Better Electronics Materials
Pengnuo Huili Electronic Materials

Related Reports

Global Low Temperature Curing Epoxy Powder Encapsulation Material Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

Global Low Temperature Curing Epoxy Powder Encapsulation Material Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

date 26 Oct 2024

date Chemical & Material

Low-temperature curing epoxy powder encapsulation material is a special epoxy resin material that can be cured at a lower temperature. It is mainly used for the packaging and protection of electronic components. Compared with traditional high temperature curing materials, low temperature curing epoxy powder can be cured between 60-80°C, avoiding the damage of high temperature to heat sensitive components. It has excellent electrical insulation, mechanical strength, chemical corrosion resistance and moisture resistance, and can also remain stable in harsh environments.

Product Tags

Low Temperature Curing Epoxy Powder Encapsulation Material

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