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Total: 2 records, 1 pages
Search For: Low Temperature Curing Epoxy Powder Encapsulation Material
Global Low Temperature Curing Epoxy Powder Encapsulation Material Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030
26 Oct 2024
Chemical & Material
Low Temperature Curing Epoxy Powder Encapsulation Material
Low-temperature curing epoxy powder encapsulation material is a special epoxy resin material that can be cured at a lower temperature. It is mainly used for the packaging and protection of electronic components. Compared with traditional high temperature curing materials, low temperature curing epoxy powder can be cured between 60-80°C, avoiding the damage of high temperature to heat sensitive components. It has excellent electrical insulation, mechanical strength, chemical corrosion resistance and moisture resistance, and can also remain stable in harsh environments.
USD3480.00
Add To Cart
Global Low Temperature Curing Epoxy Powder Encapsulation Material Supply, Demand and Key Producers, 2024-2030
26 Oct 2024
Chemical & Material
Low Temperature Curing Epoxy Powder Encapsulation Material
Low-temperature curing epoxy powder encapsulation material is a special epoxy resin material that can be cured at a lower temperature. It is mainly used for the packaging and protection of electronic components. Compared with traditional high temperature curing materials, low temperature curing epoxy powder can be cured between 60-80°C, avoiding the damage of high temperature to heat sensitive components. It has excellent electrical insulation, mechanical strength, chemical corrosion resistance and moisture resistance, and can also remain stable in harsh environments.
USD4480.00
Add To Cart
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Search For: Low Temperature Curing Epoxy Powder Encapsulation Material
Total: 2 records, 1 pages
Low-temperature curing epoxy powder encapsulation material is a special epoxy resin material that can be cured at a lower temperature. It is mainly used for the packaging and protection of electronic components. Compared with traditional high temperature curing materials, low temperature curing epoxy powder can be cured between 60-80°C, avoiding the damage of high temperature to heat sensitive components. It has excellent electrical insulation, mechanical strength, chemical corrosion resistance and moisture resistance, and can also remain stable in harsh environments.
USD3480.00
Add To Cart
Low-temperature curing epoxy powder encapsulation material is a special epoxy resin material that can be cured at a lower temperature. It is mainly used for the packaging and protection of electronic components. Compared with traditional high temperature curing materials, low temperature curing epoxy powder can be cured between 60-80°C, avoiding the damage of high temperature to heat sensitive components. It has excellent electrical insulation, mechanical strength, chemical corrosion resistance and moisture resistance, and can also remain stable in harsh environments.
USD4480.00
Add To Cart
Popular Product Keywords
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Our Clients
What We Can Provide?
With better results and higher quality products,Our professional reports can achieve four things:
-
Insight into the industry market information
-
Analyze market development needs
-
Prospects for future development
-
Develop industry investment strategy
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