Global Wafer Bonder Supply, Demand and Key Producers, 2024-2030

Global Wafer Bonder Supply, Demand and Key Producers, 2024-2030

Page: 122

Published Date: 03 Dec 2024

Category: Electronics & Semiconductor

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  • sp_icon1 sp_icon1_b Description
  • sp_icon2 sp_icon2_b Table of Contents
  • sp_icon3 sp_icon3_b Table of Figures
  • sp_icon4 sp_icon4_b Research Methodology
  • sp_icon1 sp_icon1_b Companies Mentioned
  • sp_icon1 sp_icon1_b Related Reports
  • sp_icon1 sp_icon1_b Product Tags
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Description

The global Wafer Bonder market size is expected to reach $ 442 million by 2030, rising at a market growth of 5.0% CAGR during the forecast period (2024-2030).

Wafer bonding is through chemical and physical effects of the two have mirror polished homogeneous or heterogeneous wafers closely together, after the wafer bonding, the interface of the atoms under the action of external forces to react to form a covalent bond bond into one, and make the interface to achieve a specific bond strength.

The wafer bonder market is a specialized segment of the semiconductor and electronics manufacturing industry. It focuses on providing advanced equipment for bonding wafers, which are essential for producing next-generation technologies, including 3D integrated circuits (3D ICs), MEMS (Micro-Electro-Mechanical Systems), photonics, and advanced packaging solutions.

Market Drivers
Growth of Semiconductor Industry: Increasing demand for compact, high-performance electronic devices fuels wafer bonding adoption. MEMS and Sensors Demand: Expanding use in consumer electronics, automotive (ADAS, LiDAR), and industrial IoT drives the need for precise wafer bonding. Advancements in Packaging Technologies: The shift to 3D ICs and advanced packaging techniques such as system-in-package (SiP) and fan-out wafer-level packaging (FOWLP) relies heavily on wafer bonding. Photonics and Optoelectronics: Rising applications in data centers, telecommunications, and quantum computing are increasing the demand for bonded wafers.

Market Restraints
High Capital Investment: Wafer bonders are high-precision, costly equipment, posing challenges for small-scale manufacturers. Technical Complexity: High-level expertise is required to operate and maintain the equipment. Material and Process Challenges: Bonding dissimilar materials with varying thermal and mechanical properties requires advanced process control.

Market Opportunities
Emerging Markets: Growing semiconductor production in countries like China, Taiwan, and India is expanding the market. Innovative Bonding Techniques: Advances in hybrid bonding and metal bonding are driving new applications in 3D integration and chip stacking. Photonics and Quantum Technologies: Increasing R&D in photonic integrated circuits (PICs) and quantum technologies are creating niche market opportunities.

This report studies the global Wafer Bonder production, demand, key manufacturers, and key regions.

This report is a detailed and comprehensive analysis of the world market for Wafer Bonder and provides market size (US$ million) and Year-over-Year (YoY) Growth, considering 2023 as the base year. This report explores demand trends and competition, as well as details the characteristics of Wafer Bonder that contribute to its increasing demand across many markets.

Highlights and key features of the study
Global Wafer Bonder total production and demand, 2019-2030, (Unit)
Global Wafer Bonder total production value, 2019-2030, (USD Million)
Global Wafer Bonder production by region & country, production, value, CAGR, 2019-2030, (USD Million) & (Unit), (based on production site)
Global Wafer Bonder consumption by region & country, CAGR, 2019-2030 & (Unit)
U.S. VS China: Wafer Bonder domestic production, consumption, key domestic manufacturers and share
Global Wafer Bonder production by manufacturer, production, price, value and market share 2019-2024, (USD Million) & (Unit)
Global Wafer Bonder production by Type, production, value, CAGR, 2019-2030, (USD Million) & (Unit)
Global Wafer Bonder production by Application, production, value, CAGR, 2019-2030, (USD Million) & (Unit)
This report profiles key players in the global Wafer Bonder market based on the following parameters - company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include EV Group, SUSS MicroTec, Tokyo Electron, Applied Microengineering, Nidec Machine Tool, Ayumi Industry, Bondtech, Aimechatec, U-Precision Tech, TAZMO, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World Wafer Bonder market
Detailed Segmentation:
Each section contains quantitative market data including market by value (US$ Millions), volume (production, consumption) & (Unit) and average price (K USD/Unit) by manufacturer, by Type, and by Application. Data is given for the years 2019-2030 by year with 2023 as the base year, 2024 as the estimate year, and 2025-2030 as the forecast year.

Global Wafer Bonder Market, By Region:
United States
China
Europe
Japan
South Korea
ASEAN
India
Rest of World

Global Wafer Bonder Market, Segmentation by Type:
Fully Automatic
Semi Automatic

Global Wafer Bonder Market, Segmentation by Application:
MEMS
Advanced Packaging
CIS
Others

Companies Profiled:
EV Group
SUSS MicroTec
Tokyo Electron
Applied Microengineering
Nidec Machine Tool
Ayumi Industry
Bondtech
Aimechatec
U-Precision Tech
TAZMO
Hutem
Shanghai Micro Electronics
Canon

Key Questions Answered:
1. How big is the global Wafer Bonder market?
2. What is the demand of the global Wafer Bonder market?
3. What is the year over year growth of the global Wafer Bonder market?
4. What is the production and production value of the global Wafer Bonder market?
5. Who are the key producers in the global Wafer Bonder market?
6. What are the growth factors driving the market demand?
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Table of Contents

1 Supply Summary
1.1 Wafer Bonder Introduction
1.2 World Wafer Bonder Supply & Forecast
1.2.1 World Wafer Bonder Production Value (2019 & 2023 & 2030)
1.2.2 World Wafer Bonder Production (2019-2030)
1.2.3 World Wafer Bonder Pricing Trends (2019-2030)
1.3 World Wafer Bonder Production by Region (Based on Production Site)
1.3.1 World Wafer Bonder Production Value by Region (2019-2030)
1.3.2 World Wafer Bonder Production by Region (2019-2030)
1.3.3 World Wafer Bonder Average Price by Region (2019-2030)
1.3.4 Europe Wafer Bonder Production (2019-2030)
1.3.5 China Wafer Bonder Production (2019-2030)
1.3.6 Japan Wafer Bonder Production (2019-2030)
1.4 Market Drivers, Restraints and Trends
1.4.1 Wafer Bonder Market Drivers
1.4.2 Factors Affecting Demand
1.4.3 Wafer Bonder Major Market Trends

2 Demand Summary
2.1 World Wafer Bonder Demand (2019-2030)
2.2 World Wafer Bonder Consumption by Region
2.2.1 World Wafer Bonder Consumption by Region (2019-2024)
2.2.2 World Wafer Bonder Consumption Forecast by Region (2025-2030)
2.3 United States Wafer Bonder Consumption (2019-2030)
2.4 China Wafer Bonder Consumption (2019-2030)
2.5 Europe Wafer Bonder Consumption (2019-2030)
2.6 Japan Wafer Bonder Consumption (2019-2030)
2.7 South Korea Wafer Bonder Consumption (2019-2030)
2.8 ASEAN Wafer Bonder Consumption (2019-2030)
2.9 India Wafer Bonder Consumption (2019-2030)

3 World Manufacturers Competitive Analysis
3.1 World Wafer Bonder Production Value by Manufacturer (2019-2024)
3.2 World Wafer Bonder Production by Manufacturer (2019-2024)
3.3 World Wafer Bonder Average Price by Manufacturer (2019-2024)
3.4 Wafer Bonder Company Evaluation Quadrant
3.5 Industry Rank and Concentration Rate (CR)
3.5.1 Global Wafer Bonder Industry Rank of Major Manufacturers
3.5.2 Global Concentration Ratios (CR4) for Wafer Bonder in 2023
3.5.3 Global Concentration Ratios (CR8) for Wafer Bonder in 2023
3.6 Wafer Bonder Market: Overall Company Footprint Analysis
3.6.1 Wafer Bonder Market: Region Footprint
3.6.2 Wafer Bonder Market: Company Product Type Footprint
3.6.3 Wafer Bonder Market: Company Product Application Footprint
3.7 Competitive Environment
3.7.1 Historical Structure of the Industry
3.7.2 Barriers of Market Entry
3.7.3 Factors of Competition
3.8 New Entrant and Capacity Expansion Plans
3.9 Mergers, Acquisition, Agreements, and Collaborations

4 United States VS China VS Rest of the World
4.1 United States VS China: Wafer Bonder Production Value Comparison
4.1.1 United States VS China: Wafer Bonder Production Value Comparison (2019 & 2023 & 2030)
4.1.2 United States VS China: Wafer Bonder Production Value Market Share Comparison (2019 & 2023 & 2030)
4.2 United States VS China: Wafer Bonder Production Comparison
4.2.1 United States VS China: Wafer Bonder Production Comparison (2019 & 2023 & 2030)
4.2.2 United States VS China: Wafer Bonder Production Market Share Comparison (2019 & 2023 & 2030)
4.3 United States VS China: Wafer Bonder Consumption Comparison
4.3.1 United States VS China: Wafer Bonder Consumption Comparison (2019 & 2023 & 2030)
4.3.2 United States VS China: Wafer Bonder Consumption Market Share Comparison (2019 & 2023 & 2030)
4.4 United States Based Wafer Bonder Manufacturers and Market Share, 2019-2024
4.4.1 United States Based Wafer Bonder Manufacturers, Headquarters and Production Site (States, Country)
4.4.2 United States Based Manufacturers Wafer Bonder Production Value (2019-2024)
4.4.3 United States Based Manufacturers Wafer Bonder Production (2019-2024)
4.5 China Based Wafer Bonder Manufacturers and Market Share
4.5.1 China Based Wafer Bonder Manufacturers, Headquarters and Production Site (Province, Country)
4.5.2 China Based Manufacturers Wafer Bonder Production Value (2019-2024)
4.5.3 China Based Manufacturers Wafer Bonder Production (2019-2024)
4.6 Rest of World Based Wafer Bonder Manufacturers and Market Share, 2019-2024
4.6.1 Rest of World Based Wafer Bonder Manufacturers, Headquarters and Production Site (State, Country)
4.6.2 Rest of World Based Manufacturers Wafer Bonder Production Value (2019-2024)
4.6.3 Rest of World Based Manufacturers Wafer Bonder Production (2019-2024)

5 Market Analysis by Type
5.1 World Wafer Bonder Market Size Overview by Type: 2019 VS 2023 VS 2030
5.2 Segment Introduction by Type
5.2.1 Fully Automatic
5.2.2 Semi Automatic
5.3 Market Segment by Type
5.3.1 World Wafer Bonder Production by Type (2019-2030)
5.3.2 World Wafer Bonder Production Value by Type (2019-2030)
5.3.3 World Wafer Bonder Average Price by Type (2019-2030)

6 Market Analysis by Application
6.1 World Wafer Bonder Market Size Overview by Application: 2019 VS 2023 VS 2030
6.2 Segment Introduction by Application
6.2.1 MEMS
6.2.2 Advanced Packaging
6.2.3 CIS
6.2.4 Others
6.3 Market Segment by Application
6.3.1 World Wafer Bonder Production by Application (2019-2030)
6.3.2 World Wafer Bonder Production Value by Application (2019-2030)
6.3.3 World Wafer Bonder Average Price by Application (2019-2030)

7 Company Profiles
7.1 EV Group
7.1.1 EV Group Details
7.1.2 EV Group Major Business
7.1.3 EV Group Wafer Bonder Product and Services
7.1.4 EV Group Wafer Bonder Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.1.5 EV Group Recent Developments/Updates
7.1.6 EV Group Competitive Strengths & Weaknesses
7.2 SUSS MicroTec
7.2.1 SUSS MicroTec Details
7.2.2 SUSS MicroTec Major Business
7.2.3 SUSS MicroTec Wafer Bonder Product and Services
7.2.4 SUSS MicroTec Wafer Bonder Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.2.5 SUSS MicroTec Recent Developments/Updates
7.2.6 SUSS MicroTec Competitive Strengths & Weaknesses
7.3 Tokyo Electron
7.3.1 Tokyo Electron Details
7.3.2 Tokyo Electron Major Business
7.3.3 Tokyo Electron Wafer Bonder Product and Services
7.3.4 Tokyo Electron Wafer Bonder Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.3.5 Tokyo Electron Recent Developments/Updates
7.3.6 Tokyo Electron Competitive Strengths & Weaknesses
7.4 Applied Microengineering
7.4.1 Applied Microengineering Details
7.4.2 Applied Microengineering Major Business
7.4.3 Applied Microengineering Wafer Bonder Product and Services
7.4.4 Applied Microengineering Wafer Bonder Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.4.5 Applied Microengineering Recent Developments/Updates
7.4.6 Applied Microengineering Competitive Strengths & Weaknesses
7.5 Nidec Machine Tool
7.5.1 Nidec Machine Tool Details
7.5.2 Nidec Machine Tool Major Business
7.5.3 Nidec Machine Tool Wafer Bonder Product and Services
7.5.4 Nidec Machine Tool Wafer Bonder Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.5.5 Nidec Machine Tool Recent Developments/Updates
7.5.6 Nidec Machine Tool Competitive Strengths & Weaknesses
7.6 Ayumi Industry
7.6.1 Ayumi Industry Details
7.6.2 Ayumi Industry Major Business
7.6.3 Ayumi Industry Wafer Bonder Product and Services
7.6.4 Ayumi Industry Wafer Bonder Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.6.5 Ayumi Industry Recent Developments/Updates
7.6.6 Ayumi Industry Competitive Strengths & Weaknesses
7.7 Bondtech
7.7.1 Bondtech Details
7.7.2 Bondtech Major Business
7.7.3 Bondtech Wafer Bonder Product and Services
7.7.4 Bondtech Wafer Bonder Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.7.5 Bondtech Recent Developments/Updates
7.7.6 Bondtech Competitive Strengths & Weaknesses
7.8 Aimechatec
7.8.1 Aimechatec Details
7.8.2 Aimechatec Major Business
7.8.3 Aimechatec Wafer Bonder Product and Services
7.8.4 Aimechatec Wafer Bonder Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.8.5 Aimechatec Recent Developments/Updates
7.8.6 Aimechatec Competitive Strengths & Weaknesses
7.9 U-Precision Tech
7.9.1 U-Precision Tech Details
7.9.2 U-Precision Tech Major Business
7.9.3 U-Precision Tech Wafer Bonder Product and Services
7.9.4 U-Precision Tech Wafer Bonder Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.9.5 U-Precision Tech Recent Developments/Updates
7.9.6 U-Precision Tech Competitive Strengths & Weaknesses
7.10 TAZMO
7.10.1 TAZMO Details
7.10.2 TAZMO Major Business
7.10.3 TAZMO Wafer Bonder Product and Services
7.10.4 TAZMO Wafer Bonder Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.10.5 TAZMO Recent Developments/Updates
7.10.6 TAZMO Competitive Strengths & Weaknesses
7.11 Hutem
7.11.1 Hutem Details
7.11.2 Hutem Major Business
7.11.3 Hutem Wafer Bonder Product and Services
7.11.4 Hutem Wafer Bonder Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.11.5 Hutem Recent Developments/Updates
7.11.6 Hutem Competitive Strengths & Weaknesses
7.12 Shanghai Micro Electronics
7.12.1 Shanghai Micro Electronics Details
7.12.2 Shanghai Micro Electronics Major Business
7.12.3 Shanghai Micro Electronics Wafer Bonder Product and Services
7.12.4 Shanghai Micro Electronics Wafer Bonder Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.12.5 Shanghai Micro Electronics Recent Developments/Updates
7.12.6 Shanghai Micro Electronics Competitive Strengths & Weaknesses
7.13 Canon
7.13.1 Canon Details
7.13.2 Canon Major Business
7.13.3 Canon Wafer Bonder Product and Services
7.13.4 Canon Wafer Bonder Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.13.5 Canon Recent Developments/Updates
7.13.6 Canon Competitive Strengths & Weaknesses

8 Industry Chain Analysis
8.1 Wafer Bonder Industry Chain
8.2 Wafer Bonder Upstream Analysis
8.2.1 Wafer Bonder Core Raw Materials
8.2.2 Main Manufacturers of Wafer Bonder Core Raw Materials
8.3 Midstream Analysis
8.4 Downstream Analysis
8.5 Wafer Bonder Production Mode
8.6 Wafer Bonder Procurement Model
8.7 Wafer Bonder Industry Sales Model and Sales Channels
8.7.1 Wafer Bonder Sales Model
8.7.2 Wafer Bonder Typical Distributors

9 Research Findings and Conclusion

10 Appendix
10.1 Methodology
10.2 Research Process and Data Source
10.3 Disclaimer
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Table of Figures

List of Tables
Table 1. World Wafer Bonder Production Value by Region (2019, 2023 and 2030) & (USD Million)
Table 2. World Wafer Bonder Production Value by Region (2019-2024) & (USD Million)
Table 3. World Wafer Bonder Production Value by Region (2025-2030) & (USD Million)
Table 4. World Wafer Bonder Production Value Market Share by Region (2019-2024)
Table 5. World Wafer Bonder Production Value Market Share by Region (2025-2030)
Table 6. World Wafer Bonder Production by Region (2019-2024) & (Unit)
Table 7. World Wafer Bonder Production by Region (2025-2030) & (Unit)
Table 8. World Wafer Bonder Production Market Share by Region (2019-2024)
Table 9. World Wafer Bonder Production Market Share by Region (2025-2030)
Table 10. World Wafer Bonder Average Price by Region (2019-2024) & (K USD/Unit)
Table 11. World Wafer Bonder Average Price by Region (2025-2030) & (K USD/Unit)
Table 12. Wafer Bonder Major Market Trends
Table 13. World Wafer Bonder Consumption Growth Rate Forecast by Region (2019 & 2023 & 2030) & (Unit)
Table 14. World Wafer Bonder Consumption by Region (2019-2024) & (Unit)
Table 15. World Wafer Bonder Consumption Forecast by Region (2025-2030) & (Unit)
Table 16. World Wafer Bonder Production Value by Manufacturer (2019-2024) & (USD Million)
Table 17. Production Value Market Share of Key Wafer Bonder Producers in 2023
Table 18. World Wafer Bonder Production by Manufacturer (2019-2024) & (Unit)
Table 19. Production Market Share of Key Wafer Bonder Producers in 2023
Table 20. World Wafer Bonder Average Price by Manufacturer (2019-2024) & (K USD/Unit)
Table 21. Global Wafer Bonder Company Evaluation Quadrant
Table 22. World Wafer Bonder Industry Rank of Major Manufacturers, Based on Production Value in 2023
Table 23. Head Office and Wafer Bonder Production Site of Key Manufacturer
Table 24. Wafer Bonder Market: Company Product Type Footprint
Table 25. Wafer Bonder Market: Company Product Application Footprint
Table 26. Wafer Bonder Competitive Factors
Table 27. Wafer Bonder New Entrant and Capacity Expansion Plans
Table 28. Wafer Bonder Mergers & Acquisitions Activity
Table 29. United States VS China Wafer Bonder Production Value Comparison, (2019 & 2023 & 2030) & (USD Million)
Table 30. United States VS China Wafer Bonder Production Comparison, (2019 & 2023 & 2030) & (Unit)
Table 31. United States VS China Wafer Bonder Consumption Comparison, (2019 & 2023 & 2030) & (Unit)
Table 32. United States Based Wafer Bonder Manufacturers, Headquarters and Production Site (States, Country)
Table 33. United States Based Manufacturers Wafer Bonder Production Value, (2019-2024) & (USD Million)
Table 34. United States Based Manufacturers Wafer Bonder Production Value Market Share (2019-2024)
Table 35. United States Based Manufacturers Wafer Bonder Production (2019-2024) & (Unit)
Table 36. United States Based Manufacturers Wafer Bonder Production Market Share (2019-2024)
Table 37. China Based Wafer Bonder Manufacturers, Headquarters and Production Site (Province, Country)
Table 38. China Based Manufacturers Wafer Bonder Production Value, (2019-2024) & (USD Million)
Table 39. China Based Manufacturers Wafer Bonder Production Value Market Share (2019-2024)
Table 40. China Based Manufacturers Wafer Bonder Production, (2019-2024) & (Unit)
Table 41. China Based Manufacturers Wafer Bonder Production Market Share (2019-2024)
Table 42. Rest of World Based Wafer Bonder Manufacturers, Headquarters and Production Site (State, Country)
Table 43. Rest of World Based Manufacturers Wafer Bonder Production Value, (2019-2024) & (USD Million)
Table 44. Rest of World Based Manufacturers Wafer Bonder Production Value Market Share (2019-2024)
Table 45. Rest of World Based Manufacturers Wafer Bonder Production, (2019-2024) & (Unit)
Table 46. Rest of World Based Manufacturers Wafer Bonder Production Market Share (2019-2024)
Table 47. World Wafer Bonder Production Value by Type, (USD Million), 2019 & 2023 & 2030
Table 48. World Wafer Bonder Production by Type (2019-2024) & (Unit)
Table 49. World Wafer Bonder Production by Type (2025-2030) & (Unit)
Table 50. World Wafer Bonder Production Value by Type (2019-2024) & (USD Million)
Table 51. World Wafer Bonder Production Value by Type (2025-2030) & (USD Million)
Table 52. World Wafer Bonder Average Price by Type (2019-2024) & (K USD/Unit)
Table 53. World Wafer Bonder Average Price by Type (2025-2030) & (K USD/Unit)
Table 54. World Wafer Bonder Production Value by Application, (USD Million), 2019 & 2023 & 2030
Table 55. World Wafer Bonder Production by Application (2019-2024) & (Unit)
Table 56. World Wafer Bonder Production by Application (2025-2030) & (Unit)
Table 57. World Wafer Bonder Production Value by Application (2019-2024) & (USD Million)
Table 58. World Wafer Bonder Production Value by Application (2025-2030) & (USD Million)
Table 59. World Wafer Bonder Average Price by Application (2019-2024) & (K USD/Unit)
Table 60. World Wafer Bonder Average Price by Application (2025-2030) & (K USD/Unit)
Table 61. EV Group Basic Information, Manufacturing Base and Competitors
Table 62. EV Group Major Business
Table 63. EV Group Wafer Bonder Product and Services
Table 64. EV Group Wafer Bonder Production (Unit), Price (K USD/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 65. EV Group Recent Developments/Updates
Table 66. EV Group Competitive Strengths & Weaknesses
Table 67. SUSS MicroTec Basic Information, Manufacturing Base and Competitors
Table 68. SUSS MicroTec Major Business
Table 69. SUSS MicroTec Wafer Bonder Product and Services
Table 70. SUSS MicroTec Wafer Bonder Production (Unit), Price (K USD/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 71. SUSS MicroTec Recent Developments/Updates
Table 72. SUSS MicroTec Competitive Strengths & Weaknesses
Table 73. Tokyo Electron Basic Information, Manufacturing Base and Competitors
Table 74. Tokyo Electron Major Business
Table 75. Tokyo Electron Wafer Bonder Product and Services
Table 76. Tokyo Electron Wafer Bonder Production (Unit), Price (K USD/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 77. Tokyo Electron Recent Developments/Updates
Table 78. Tokyo Electron Competitive Strengths & Weaknesses
Table 79. Applied Microengineering Basic Information, Manufacturing Base and Competitors
Table 80. Applied Microengineering Major Business
Table 81. Applied Microengineering Wafer Bonder Product and Services
Table 82. Applied Microengineering Wafer Bonder Production (Unit), Price (K USD/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 83. Applied Microengineering Recent Developments/Updates
Table 84. Applied Microengineering Competitive Strengths & Weaknesses
Table 85. Nidec Machine Tool Basic Information, Manufacturing Base and Competitors
Table 86. Nidec Machine Tool Major Business
Table 87. Nidec Machine Tool Wafer Bonder Product and Services
Table 88. Nidec Machine Tool Wafer Bonder Production (Unit), Price (K USD/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 89. Nidec Machine Tool Recent Developments/Updates
Table 90. Nidec Machine Tool Competitive Strengths & Weaknesses
Table 91. Ayumi Industry Basic Information, Manufacturing Base and Competitors
Table 92. Ayumi Industry Major Business
Table 93. Ayumi Industry Wafer Bonder Product and Services
Table 94. Ayumi Industry Wafer Bonder Production (Unit), Price (K USD/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 95. Ayumi Industry Recent Developments/Updates
Table 96. Ayumi Industry Competitive Strengths & Weaknesses
Table 97. Bondtech Basic Information, Manufacturing Base and Competitors
Table 98. Bondtech Major Business
Table 99. Bondtech Wafer Bonder Product and Services
Table 100. Bondtech Wafer Bonder Production (Unit), Price (K USD/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 101. Bondtech Recent Developments/Updates
Table 102. Bondtech Competitive Strengths & Weaknesses
Table 103. Aimechatec Basic Information, Manufacturing Base and Competitors
Table 104. Aimechatec Major Business
Table 105. Aimechatec Wafer Bonder Product and Services
Table 106. Aimechatec Wafer Bonder Production (Unit), Price (K USD/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 107. Aimechatec Recent Developments/Updates
Table 108. Aimechatec Competitive Strengths & Weaknesses
Table 109. U-Precision Tech Basic Information, Manufacturing Base and Competitors
Table 110. U-Precision Tech Major Business
Table 111. U-Precision Tech Wafer Bonder Product and Services
Table 112. U-Precision Tech Wafer Bonder Production (Unit), Price (K USD/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 113. U-Precision Tech Recent Developments/Updates
Table 114. U-Precision Tech Competitive Strengths & Weaknesses
Table 115. TAZMO Basic Information, Manufacturing Base and Competitors
Table 116. TAZMO Major Business
Table 117. TAZMO Wafer Bonder Product and Services
Table 118. TAZMO Wafer Bonder Production (Unit), Price (K USD/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 119. TAZMO Recent Developments/Updates
Table 120. TAZMO Competitive Strengths & Weaknesses
Table 121. Hutem Basic Information, Manufacturing Base and Competitors
Table 122. Hutem Major Business
Table 123. Hutem Wafer Bonder Product and Services
Table 124. Hutem Wafer Bonder Production (Unit), Price (K USD/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 125. Hutem Recent Developments/Updates
Table 126. Hutem Competitive Strengths & Weaknesses
Table 127. Shanghai Micro Electronics Basic Information, Manufacturing Base and Competitors
Table 128. Shanghai Micro Electronics Major Business
Table 129. Shanghai Micro Electronics Wafer Bonder Product and Services
Table 130. Shanghai Micro Electronics Wafer Bonder Production (Unit), Price (K USD/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 131. Shanghai Micro Electronics Recent Developments/Updates
Table 132. Shanghai Micro Electronics Competitive Strengths & Weaknesses
Table 133. Canon Basic Information, Manufacturing Base and Competitors
Table 134. Canon Major Business
Table 135. Canon Wafer Bonder Product and Services
Table 136. Canon Wafer Bonder Production (Unit), Price (K USD/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 137. Canon Recent Developments/Updates
Table 138. Canon Competitive Strengths & Weaknesses
Table 139. Global Key Players of Wafer Bonder Upstream (Raw Materials)
Table 140. Global Wafer Bonder Typical Customers
Table 141. Wafer Bonder Typical Distributors


List of Figures
Figure 1. Wafer Bonder Picture
Figure 2. World Wafer Bonder Production Value: 2019 & 2023 & 2030, (USD Million)
Figure 3. World Wafer Bonder Production Value and Forecast (2019-2030) & (USD Million)
Figure 4. World Wafer Bonder Production (2019-2030) & (Unit)
Figure 5. World Wafer Bonder Average Price (2019-2030) & (K USD/Unit)
Figure 6. World Wafer Bonder Production Value Market Share by Region (2019-2030)
Figure 7. World Wafer Bonder Production Market Share by Region (2019-2030)
Figure 8. Europe Wafer Bonder Production (2019-2030) & (Unit)
Figure 9. China Wafer Bonder Production (2019-2030) & (Unit)
Figure 10. Japan Wafer Bonder Production (2019-2030) & (Unit)
Figure 11. Wafer Bonder Market Drivers
Figure 12. Factors Affecting Demand
Figure 13. World Wafer Bonder Consumption (2019-2030) & (Unit)
Figure 14. World Wafer Bonder Consumption Market Share by Region (2019-2030)
Figure 15. United States Wafer Bonder Consumption (2019-2030) & (Unit)
Figure 16. China Wafer Bonder Consumption (2019-2030) & (Unit)
Figure 17. Europe Wafer Bonder Consumption (2019-2030) & (Unit)
Figure 18. Japan Wafer Bonder Consumption (2019-2030) & (Unit)
Figure 19. South Korea Wafer Bonder Consumption (2019-2030) & (Unit)
Figure 20. ASEAN Wafer Bonder Consumption (2019-2030) & (Unit)
Figure 21. India Wafer Bonder Consumption (2019-2030) & (Unit)
Figure 22. Producer Shipments of Wafer Bonder by Manufacturer Revenue ($MM) and Market Share (%): 2023
Figure 23. Global Four-firm Concentration Ratios (CR4) for Wafer Bonder Markets in 2023
Figure 24. Global Four-firm Concentration Ratios (CR8) for Wafer Bonder Markets in 2023
Figure 25. United States VS China: Wafer Bonder Production Value Market Share Comparison (2019 & 2023 & 2030)
Figure 26. United States VS China: Wafer Bonder Production Market Share Comparison (2019 & 2023 & 2030)
Figure 27. United States VS China: Wafer Bonder Consumption Market Share Comparison (2019 & 2023 & 2030)
Figure 28. United States Based Manufacturers Wafer Bonder Production Market Share 2023
Figure 29. China Based Manufacturers Wafer Bonder Production Market Share 2023
Figure 30. Rest of World Based Manufacturers Wafer Bonder Production Market Share 2023
Figure 31. World Wafer Bonder Production Value by Type, (USD Million), 2019 & 2023 & 2030
Figure 32. World Wafer Bonder Production Value Market Share by Type in 2023
Figure 33. Fully Automatic
Figure 34. Semi Automatic
Figure 35. World Wafer Bonder Production Market Share by Type (2019-2030)
Figure 36. World Wafer Bonder Production Value Market Share by Type (2019-2030)
Figure 37. World Wafer Bonder Average Price by Type (2019-2030) & (K USD/Unit)
Figure 38. World Wafer Bonder Production Value by Application, (USD Million), 2019 & 2023 & 2030
Figure 39. World Wafer Bonder Production Value Market Share by Application in 2023
Figure 40. MEMS
Figure 41. Advanced Packaging
Figure 42. CIS
Figure 43. Others
Figure 44. World Wafer Bonder Production Market Share by Application (2019-2030)
Figure 45. World Wafer Bonder Production Value Market Share by Application (2019-2030)
Figure 46. World Wafer Bonder Average Price by Application (2019-2030) & (K USD/Unit)
Figure 47. Wafer Bonder Industry Chain
Figure 48. Wafer Bonder Procurement Model
Figure 49. Wafer Bonder Sales Model
Figure 50. Wafer Bonder Sales Channels, Direct Sales, and Distribution
Figure 51. Methodology
Figure 52. Research Process and Data Source
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Research Methodology

Client Requirements

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Review and analyze client requirements

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Discussion of all the project requirements and queries

Flexibility Check

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Project Feasibility Analysis

yuan2

Finalizing tentative research programme

yuan2

Structuring project proposal with scope, timeline, and costs

Analyzing Market Dynamics

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Determination of key drivers, restraints, challenge, and opportunity

yuan2

Identifies market needs and trends

Market Size Estimation & Forecast

yuan2

Estimation of historical data based on secondary and primary data

yuan2

Anticipating market recast by assigning weightage to market forces (drivers, restraints, opportunities)

yuan2

Freezing historical and forecast market size estimations based on evolution, trends, outlook, and strategies

yuan2

Consideration of geography, region-specific product/service demand for region segments

yuan2

Consideration of product utilization rates, product demand outlook for segments by application or end-user.

tuBiao1

Data Source

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Secondary Source
Data collections from annual reports, presentations,associations, journals, analyst reports, paid database, press releases, blogs, newsletters,and GIR repositories.

yuan2

Primary Source
Research discussion with manufacturers, distributors, suppliers, end user, industry experts to verify insights.

Validation and
triangulation of
secondary and primary source.

yuan2

Collection of data

yuan2

Cumulating and collating the essential qualitative and quantitative data

yuan2

Generation of report in client requested format by research analysts

yuan2

Reviews by expert analysts

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Final quality check

yuan2

Clarifying queries

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Receiving feedback

yuan2

Ensuring satisfaction

  • yuan01
    liuCheng01

    01 Identification of data

    This step involves identification of several primary and secondary data research sources, including Global Info Research's internal data sources. The primary sources consist of in-depth discussions and interviews with policy makers, industry experts, and data evaluators, whereas secondary sources include a thorough study of market journals, press releases, annual reports, and government and non-government agencies websites.

  • yuan01
    liuCheng01

    02 Evaluation of Market Dynamic

    This phase includes a detailed evaluation of several factors that are likely to affect the market dynamics. It involves a comprehensive assessment of major market pain points, drivers, and trends. It also comprises a detailed study of research plans and methodology.

  • yuan01
    liuCheng01

    03 Collection of Data

    This process consists of gathering data, accessing proprietary databases, and reaching out to key industry participants that operate in the market across the value chain. It also involves studying several patterns in the historical data and comparing it with the current scenario.

  • yuan01
    liuCheng01

    04 Collaboration of Data

    This stage involves the validation of data and arrival at actual statistics, and evolution of the market over the years. It entails the study and analyzes various segments and verticals of the market. An impact analysis is also performed to observe which factors will affect the market in the next few years.

  • yuan01
    liuCheng01

    05 Verification and Analysis

    This is the final stage, which involves both quantity and quality checks. Although the process of data verification is an integral part of the research process, all data points and statistics and figures are re-checked to uphold their authenticity and validity.

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Companies Mentioned

EV Group
SUSS MicroTec
Tokyo Electron
Applied Microengineering
Nidec Machine Tool
Ayumi Industry
Bondtech
Aimechatec
U-Precision Tech
TAZMO
Hutem
Shanghai Micro Electronics
Canon
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Global Wafer Bonder Supply, Demand and Key Producers, 2024-2030

Global Wafer Bonder Supply, Demand and Key Producers, 2024-2030

Page: 122

Published Date: 03 Dec 2024

Category: Electronics & Semiconductor

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Description

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Description

The global Wafer Bonder market size is expected to reach $ 442 million by 2030, rising at a market growth of 5.0% CAGR during the forecast period (2024-2030).

Wafer bonding is through chemical and physical effects of the two have mirror polished homogeneous or heterogeneous wafers closely together, after the wafer bonding, the interface of the atoms under the action of external forces to react to form a covalent bond bond into one, and make the interface to achieve a specific bond strength.

The wafer bonder market is a specialized segment of the semiconductor and electronics manufacturing industry. It focuses on providing advanced equipment for bonding wafers, which are essential for producing next-generation technologies, including 3D integrated circuits (3D ICs), MEMS (Micro-Electro-Mechanical Systems), photonics, and advanced packaging solutions.

Market Drivers
Growth of Semiconductor Industry: Increasing demand for compact, high-performance electronic devices fuels wafer bonding adoption. MEMS and Sensors Demand: Expanding use in consumer electronics, automotive (ADAS, LiDAR), and industrial IoT drives the need for precise wafer bonding. Advancements in Packaging Technologies: The shift to 3D ICs and advanced packaging techniques such as system-in-package (SiP) and fan-out wafer-level packaging (FOWLP) relies heavily on wafer bonding. Photonics and Optoelectronics: Rising applications in data centers, telecommunications, and quantum computing are increasing the demand for bonded wafers.

Market Restraints
High Capital Investment: Wafer bonders are high-precision, costly equipment, posing challenges for small-scale manufacturers. Technical Complexity: High-level expertise is required to operate and maintain the equipment. Material and Process Challenges: Bonding dissimilar materials with varying thermal and mechanical properties requires advanced process control.

Market Opportunities
Emerging Markets: Growing semiconductor production in countries like China, Taiwan, and India is expanding the market. Innovative Bonding Techniques: Advances in hybrid bonding and metal bonding are driving new applications in 3D integration and chip stacking. Photonics and Quantum Technologies: Increasing R&D in photonic integrated circuits (PICs) and quantum technologies are creating niche market opportunities.

This report studies the global Wafer Bonder production, demand, key manufacturers, and key regions.

This report is a detailed and comprehensive analysis of the world market for Wafer Bonder and provides market size (US$ million) and Year-over-Year (YoY) Growth, considering 2023 as the base year. This report explores demand trends and competition, as well as details the characteristics of Wafer Bonder that contribute to its increasing demand across many markets.

Highlights and key features of the study
Global Wafer Bonder total production and demand, 2019-2030, (Unit)
Global Wafer Bonder total production value, 2019-2030, (USD Million)
Global Wafer Bonder production by region & country, production, value, CAGR, 2019-2030, (USD Million) & (Unit), (based on production site)
Global Wafer Bonder consumption by region & country, CAGR, 2019-2030 & (Unit)
U.S. VS China: Wafer Bonder domestic production, consumption, key domestic manufacturers and share
Global Wafer Bonder production by manufacturer, production, price, value and market share 2019-2024, (USD Million) & (Unit)
Global Wafer Bonder production by Type, production, value, CAGR, 2019-2030, (USD Million) & (Unit)
Global Wafer Bonder production by Application, production, value, CAGR, 2019-2030, (USD Million) & (Unit)
This report profiles key players in the global Wafer Bonder market based on the following parameters - company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include EV Group, SUSS MicroTec, Tokyo Electron, Applied Microengineering, Nidec Machine Tool, Ayumi Industry, Bondtech, Aimechatec, U-Precision Tech, TAZMO, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World Wafer Bonder market
Detailed Segmentation:
Each section contains quantitative market data including market by value (US$ Millions), volume (production, consumption) & (Unit) and average price (K USD/Unit) by manufacturer, by Type, and by Application. Data is given for the years 2019-2030 by year with 2023 as the base year, 2024 as the estimate year, and 2025-2030 as the forecast year.

Global Wafer Bonder Market, By Region:
United States
China
Europe
Japan
South Korea
ASEAN
India
Rest of World

Global Wafer Bonder Market, Segmentation by Type:
Fully Automatic
Semi Automatic

Global Wafer Bonder Market, Segmentation by Application:
MEMS
Advanced Packaging
CIS
Others

Companies Profiled:
EV Group
SUSS MicroTec
Tokyo Electron
Applied Microengineering
Nidec Machine Tool
Ayumi Industry
Bondtech
Aimechatec
U-Precision Tech
TAZMO
Hutem
Shanghai Micro Electronics
Canon

Key Questions Answered:
1. How big is the global Wafer Bonder market?
2. What is the demand of the global Wafer Bonder market?
3. What is the year over year growth of the global Wafer Bonder market?
4. What is the production and production value of the global Wafer Bonder market?
5. Who are the key producers in the global Wafer Bonder market?
6. What are the growth factors driving the market demand?
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Table of Contents

1 Supply Summary
1.1 Wafer Bonder Introduction
1.2 World Wafer Bonder Supply & Forecast
1.2.1 World Wafer Bonder Production Value (2019 & 2023 & 2030)
1.2.2 World Wafer Bonder Production (2019-2030)
1.2.3 World Wafer Bonder Pricing Trends (2019-2030)
1.3 World Wafer Bonder Production by Region (Based on Production Site)
1.3.1 World Wafer Bonder Production Value by Region (2019-2030)
1.3.2 World Wafer Bonder Production by Region (2019-2030)
1.3.3 World Wafer Bonder Average Price by Region (2019-2030)
1.3.4 Europe Wafer Bonder Production (2019-2030)
1.3.5 China Wafer Bonder Production (2019-2030)
1.3.6 Japan Wafer Bonder Production (2019-2030)
1.4 Market Drivers, Restraints and Trends
1.4.1 Wafer Bonder Market Drivers
1.4.2 Factors Affecting Demand
1.4.3 Wafer Bonder Major Market Trends

2 Demand Summary
2.1 World Wafer Bonder Demand (2019-2030)
2.2 World Wafer Bonder Consumption by Region
2.2.1 World Wafer Bonder Consumption by Region (2019-2024)
2.2.2 World Wafer Bonder Consumption Forecast by Region (2025-2030)
2.3 United States Wafer Bonder Consumption (2019-2030)
2.4 China Wafer Bonder Consumption (2019-2030)
2.5 Europe Wafer Bonder Consumption (2019-2030)
2.6 Japan Wafer Bonder Consumption (2019-2030)
2.7 South Korea Wafer Bonder Consumption (2019-2030)
2.8 ASEAN Wafer Bonder Consumption (2019-2030)
2.9 India Wafer Bonder Consumption (2019-2030)

3 World Manufacturers Competitive Analysis
3.1 World Wafer Bonder Production Value by Manufacturer (2019-2024)
3.2 World Wafer Bonder Production by Manufacturer (2019-2024)
3.3 World Wafer Bonder Average Price by Manufacturer (2019-2024)
3.4 Wafer Bonder Company Evaluation Quadrant
3.5 Industry Rank and Concentration Rate (CR)
3.5.1 Global Wafer Bonder Industry Rank of Major Manufacturers
3.5.2 Global Concentration Ratios (CR4) for Wafer Bonder in 2023
3.5.3 Global Concentration Ratios (CR8) for Wafer Bonder in 2023
3.6 Wafer Bonder Market: Overall Company Footprint Analysis
3.6.1 Wafer Bonder Market: Region Footprint
3.6.2 Wafer Bonder Market: Company Product Type Footprint
3.6.3 Wafer Bonder Market: Company Product Application Footprint
3.7 Competitive Environment
3.7.1 Historical Structure of the Industry
3.7.2 Barriers of Market Entry
3.7.3 Factors of Competition
3.8 New Entrant and Capacity Expansion Plans
3.9 Mergers, Acquisition, Agreements, and Collaborations

4 United States VS China VS Rest of the World
4.1 United States VS China: Wafer Bonder Production Value Comparison
4.1.1 United States VS China: Wafer Bonder Production Value Comparison (2019 & 2023 & 2030)
4.1.2 United States VS China: Wafer Bonder Production Value Market Share Comparison (2019 & 2023 & 2030)
4.2 United States VS China: Wafer Bonder Production Comparison
4.2.1 United States VS China: Wafer Bonder Production Comparison (2019 & 2023 & 2030)
4.2.2 United States VS China: Wafer Bonder Production Market Share Comparison (2019 & 2023 & 2030)
4.3 United States VS China: Wafer Bonder Consumption Comparison
4.3.1 United States VS China: Wafer Bonder Consumption Comparison (2019 & 2023 & 2030)
4.3.2 United States VS China: Wafer Bonder Consumption Market Share Comparison (2019 & 2023 & 2030)
4.4 United States Based Wafer Bonder Manufacturers and Market Share, 2019-2024
4.4.1 United States Based Wafer Bonder Manufacturers, Headquarters and Production Site (States, Country)
4.4.2 United States Based Manufacturers Wafer Bonder Production Value (2019-2024)
4.4.3 United States Based Manufacturers Wafer Bonder Production (2019-2024)
4.5 China Based Wafer Bonder Manufacturers and Market Share
4.5.1 China Based Wafer Bonder Manufacturers, Headquarters and Production Site (Province, Country)
4.5.2 China Based Manufacturers Wafer Bonder Production Value (2019-2024)
4.5.3 China Based Manufacturers Wafer Bonder Production (2019-2024)
4.6 Rest of World Based Wafer Bonder Manufacturers and Market Share, 2019-2024
4.6.1 Rest of World Based Wafer Bonder Manufacturers, Headquarters and Production Site (State, Country)
4.6.2 Rest of World Based Manufacturers Wafer Bonder Production Value (2019-2024)
4.6.3 Rest of World Based Manufacturers Wafer Bonder Production (2019-2024)

5 Market Analysis by Type
5.1 World Wafer Bonder Market Size Overview by Type: 2019 VS 2023 VS 2030
5.2 Segment Introduction by Type
5.2.1 Fully Automatic
5.2.2 Semi Automatic
5.3 Market Segment by Type
5.3.1 World Wafer Bonder Production by Type (2019-2030)
5.3.2 World Wafer Bonder Production Value by Type (2019-2030)
5.3.3 World Wafer Bonder Average Price by Type (2019-2030)

6 Market Analysis by Application
6.1 World Wafer Bonder Market Size Overview by Application: 2019 VS 2023 VS 2030
6.2 Segment Introduction by Application
6.2.1 MEMS
6.2.2 Advanced Packaging
6.2.3 CIS
6.2.4 Others
6.3 Market Segment by Application
6.3.1 World Wafer Bonder Production by Application (2019-2030)
6.3.2 World Wafer Bonder Production Value by Application (2019-2030)
6.3.3 World Wafer Bonder Average Price by Application (2019-2030)

7 Company Profiles
7.1 EV Group
7.1.1 EV Group Details
7.1.2 EV Group Major Business
7.1.3 EV Group Wafer Bonder Product and Services
7.1.4 EV Group Wafer Bonder Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.1.5 EV Group Recent Developments/Updates
7.1.6 EV Group Competitive Strengths & Weaknesses
7.2 SUSS MicroTec
7.2.1 SUSS MicroTec Details
7.2.2 SUSS MicroTec Major Business
7.2.3 SUSS MicroTec Wafer Bonder Product and Services
7.2.4 SUSS MicroTec Wafer Bonder Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.2.5 SUSS MicroTec Recent Developments/Updates
7.2.6 SUSS MicroTec Competitive Strengths & Weaknesses
7.3 Tokyo Electron
7.3.1 Tokyo Electron Details
7.3.2 Tokyo Electron Major Business
7.3.3 Tokyo Electron Wafer Bonder Product and Services
7.3.4 Tokyo Electron Wafer Bonder Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.3.5 Tokyo Electron Recent Developments/Updates
7.3.6 Tokyo Electron Competitive Strengths & Weaknesses
7.4 Applied Microengineering
7.4.1 Applied Microengineering Details
7.4.2 Applied Microengineering Major Business
7.4.3 Applied Microengineering Wafer Bonder Product and Services
7.4.4 Applied Microengineering Wafer Bonder Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.4.5 Applied Microengineering Recent Developments/Updates
7.4.6 Applied Microengineering Competitive Strengths & Weaknesses
7.5 Nidec Machine Tool
7.5.1 Nidec Machine Tool Details
7.5.2 Nidec Machine Tool Major Business
7.5.3 Nidec Machine Tool Wafer Bonder Product and Services
7.5.4 Nidec Machine Tool Wafer Bonder Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.5.5 Nidec Machine Tool Recent Developments/Updates
7.5.6 Nidec Machine Tool Competitive Strengths & Weaknesses
7.6 Ayumi Industry
7.6.1 Ayumi Industry Details
7.6.2 Ayumi Industry Major Business
7.6.3 Ayumi Industry Wafer Bonder Product and Services
7.6.4 Ayumi Industry Wafer Bonder Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.6.5 Ayumi Industry Recent Developments/Updates
7.6.6 Ayumi Industry Competitive Strengths & Weaknesses
7.7 Bondtech
7.7.1 Bondtech Details
7.7.2 Bondtech Major Business
7.7.3 Bondtech Wafer Bonder Product and Services
7.7.4 Bondtech Wafer Bonder Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.7.5 Bondtech Recent Developments/Updates
7.7.6 Bondtech Competitive Strengths & Weaknesses
7.8 Aimechatec
7.8.1 Aimechatec Details
7.8.2 Aimechatec Major Business
7.8.3 Aimechatec Wafer Bonder Product and Services
7.8.4 Aimechatec Wafer Bonder Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.8.5 Aimechatec Recent Developments/Updates
7.8.6 Aimechatec Competitive Strengths & Weaknesses
7.9 U-Precision Tech
7.9.1 U-Precision Tech Details
7.9.2 U-Precision Tech Major Business
7.9.3 U-Precision Tech Wafer Bonder Product and Services
7.9.4 U-Precision Tech Wafer Bonder Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.9.5 U-Precision Tech Recent Developments/Updates
7.9.6 U-Precision Tech Competitive Strengths & Weaknesses
7.10 TAZMO
7.10.1 TAZMO Details
7.10.2 TAZMO Major Business
7.10.3 TAZMO Wafer Bonder Product and Services
7.10.4 TAZMO Wafer Bonder Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.10.5 TAZMO Recent Developments/Updates
7.10.6 TAZMO Competitive Strengths & Weaknesses
7.11 Hutem
7.11.1 Hutem Details
7.11.2 Hutem Major Business
7.11.3 Hutem Wafer Bonder Product and Services
7.11.4 Hutem Wafer Bonder Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.11.5 Hutem Recent Developments/Updates
7.11.6 Hutem Competitive Strengths & Weaknesses
7.12 Shanghai Micro Electronics
7.12.1 Shanghai Micro Electronics Details
7.12.2 Shanghai Micro Electronics Major Business
7.12.3 Shanghai Micro Electronics Wafer Bonder Product and Services
7.12.4 Shanghai Micro Electronics Wafer Bonder Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.12.5 Shanghai Micro Electronics Recent Developments/Updates
7.12.6 Shanghai Micro Electronics Competitive Strengths & Weaknesses
7.13 Canon
7.13.1 Canon Details
7.13.2 Canon Major Business
7.13.3 Canon Wafer Bonder Product and Services
7.13.4 Canon Wafer Bonder Production, Price, Value, Gross Margin and Market Share (2019-2024)
7.13.5 Canon Recent Developments/Updates
7.13.6 Canon Competitive Strengths & Weaknesses

8 Industry Chain Analysis
8.1 Wafer Bonder Industry Chain
8.2 Wafer Bonder Upstream Analysis
8.2.1 Wafer Bonder Core Raw Materials
8.2.2 Main Manufacturers of Wafer Bonder Core Raw Materials
8.3 Midstream Analysis
8.4 Downstream Analysis
8.5 Wafer Bonder Production Mode
8.6 Wafer Bonder Procurement Model
8.7 Wafer Bonder Industry Sales Model and Sales Channels
8.7.1 Wafer Bonder Sales Model
8.7.2 Wafer Bonder Typical Distributors

9 Research Findings and Conclusion

10 Appendix
10.1 Methodology
10.2 Research Process and Data Source
10.3 Disclaimer
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Table of Figures

List of Tables
Table 1. World Wafer Bonder Production Value by Region (2019, 2023 and 2030) & (USD Million)
Table 2. World Wafer Bonder Production Value by Region (2019-2024) & (USD Million)
Table 3. World Wafer Bonder Production Value by Region (2025-2030) & (USD Million)
Table 4. World Wafer Bonder Production Value Market Share by Region (2019-2024)
Table 5. World Wafer Bonder Production Value Market Share by Region (2025-2030)
Table 6. World Wafer Bonder Production by Region (2019-2024) & (Unit)
Table 7. World Wafer Bonder Production by Region (2025-2030) & (Unit)
Table 8. World Wafer Bonder Production Market Share by Region (2019-2024)
Table 9. World Wafer Bonder Production Market Share by Region (2025-2030)
Table 10. World Wafer Bonder Average Price by Region (2019-2024) & (K USD/Unit)
Table 11. World Wafer Bonder Average Price by Region (2025-2030) & (K USD/Unit)
Table 12. Wafer Bonder Major Market Trends
Table 13. World Wafer Bonder Consumption Growth Rate Forecast by Region (2019 & 2023 & 2030) & (Unit)
Table 14. World Wafer Bonder Consumption by Region (2019-2024) & (Unit)
Table 15. World Wafer Bonder Consumption Forecast by Region (2025-2030) & (Unit)
Table 16. World Wafer Bonder Production Value by Manufacturer (2019-2024) & (USD Million)
Table 17. Production Value Market Share of Key Wafer Bonder Producers in 2023
Table 18. World Wafer Bonder Production by Manufacturer (2019-2024) & (Unit)
Table 19. Production Market Share of Key Wafer Bonder Producers in 2023
Table 20. World Wafer Bonder Average Price by Manufacturer (2019-2024) & (K USD/Unit)
Table 21. Global Wafer Bonder Company Evaluation Quadrant
Table 22. World Wafer Bonder Industry Rank of Major Manufacturers, Based on Production Value in 2023
Table 23. Head Office and Wafer Bonder Production Site of Key Manufacturer
Table 24. Wafer Bonder Market: Company Product Type Footprint
Table 25. Wafer Bonder Market: Company Product Application Footprint
Table 26. Wafer Bonder Competitive Factors
Table 27. Wafer Bonder New Entrant and Capacity Expansion Plans
Table 28. Wafer Bonder Mergers & Acquisitions Activity
Table 29. United States VS China Wafer Bonder Production Value Comparison, (2019 & 2023 & 2030) & (USD Million)
Table 30. United States VS China Wafer Bonder Production Comparison, (2019 & 2023 & 2030) & (Unit)
Table 31. United States VS China Wafer Bonder Consumption Comparison, (2019 & 2023 & 2030) & (Unit)
Table 32. United States Based Wafer Bonder Manufacturers, Headquarters and Production Site (States, Country)
Table 33. United States Based Manufacturers Wafer Bonder Production Value, (2019-2024) & (USD Million)
Table 34. United States Based Manufacturers Wafer Bonder Production Value Market Share (2019-2024)
Table 35. United States Based Manufacturers Wafer Bonder Production (2019-2024) & (Unit)
Table 36. United States Based Manufacturers Wafer Bonder Production Market Share (2019-2024)
Table 37. China Based Wafer Bonder Manufacturers, Headquarters and Production Site (Province, Country)
Table 38. China Based Manufacturers Wafer Bonder Production Value, (2019-2024) & (USD Million)
Table 39. China Based Manufacturers Wafer Bonder Production Value Market Share (2019-2024)
Table 40. China Based Manufacturers Wafer Bonder Production, (2019-2024) & (Unit)
Table 41. China Based Manufacturers Wafer Bonder Production Market Share (2019-2024)
Table 42. Rest of World Based Wafer Bonder Manufacturers, Headquarters and Production Site (State, Country)
Table 43. Rest of World Based Manufacturers Wafer Bonder Production Value, (2019-2024) & (USD Million)
Table 44. Rest of World Based Manufacturers Wafer Bonder Production Value Market Share (2019-2024)
Table 45. Rest of World Based Manufacturers Wafer Bonder Production, (2019-2024) & (Unit)
Table 46. Rest of World Based Manufacturers Wafer Bonder Production Market Share (2019-2024)
Table 47. World Wafer Bonder Production Value by Type, (USD Million), 2019 & 2023 & 2030
Table 48. World Wafer Bonder Production by Type (2019-2024) & (Unit)
Table 49. World Wafer Bonder Production by Type (2025-2030) & (Unit)
Table 50. World Wafer Bonder Production Value by Type (2019-2024) & (USD Million)
Table 51. World Wafer Bonder Production Value by Type (2025-2030) & (USD Million)
Table 52. World Wafer Bonder Average Price by Type (2019-2024) & (K USD/Unit)
Table 53. World Wafer Bonder Average Price by Type (2025-2030) & (K USD/Unit)
Table 54. World Wafer Bonder Production Value by Application, (USD Million), 2019 & 2023 & 2030
Table 55. World Wafer Bonder Production by Application (2019-2024) & (Unit)
Table 56. World Wafer Bonder Production by Application (2025-2030) & (Unit)
Table 57. World Wafer Bonder Production Value by Application (2019-2024) & (USD Million)
Table 58. World Wafer Bonder Production Value by Application (2025-2030) & (USD Million)
Table 59. World Wafer Bonder Average Price by Application (2019-2024) & (K USD/Unit)
Table 60. World Wafer Bonder Average Price by Application (2025-2030) & (K USD/Unit)
Table 61. EV Group Basic Information, Manufacturing Base and Competitors
Table 62. EV Group Major Business
Table 63. EV Group Wafer Bonder Product and Services
Table 64. EV Group Wafer Bonder Production (Unit), Price (K USD/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 65. EV Group Recent Developments/Updates
Table 66. EV Group Competitive Strengths & Weaknesses
Table 67. SUSS MicroTec Basic Information, Manufacturing Base and Competitors
Table 68. SUSS MicroTec Major Business
Table 69. SUSS MicroTec Wafer Bonder Product and Services
Table 70. SUSS MicroTec Wafer Bonder Production (Unit), Price (K USD/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 71. SUSS MicroTec Recent Developments/Updates
Table 72. SUSS MicroTec Competitive Strengths & Weaknesses
Table 73. Tokyo Electron Basic Information, Manufacturing Base and Competitors
Table 74. Tokyo Electron Major Business
Table 75. Tokyo Electron Wafer Bonder Product and Services
Table 76. Tokyo Electron Wafer Bonder Production (Unit), Price (K USD/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 77. Tokyo Electron Recent Developments/Updates
Table 78. Tokyo Electron Competitive Strengths & Weaknesses
Table 79. Applied Microengineering Basic Information, Manufacturing Base and Competitors
Table 80. Applied Microengineering Major Business
Table 81. Applied Microengineering Wafer Bonder Product and Services
Table 82. Applied Microengineering Wafer Bonder Production (Unit), Price (K USD/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 83. Applied Microengineering Recent Developments/Updates
Table 84. Applied Microengineering Competitive Strengths & Weaknesses
Table 85. Nidec Machine Tool Basic Information, Manufacturing Base and Competitors
Table 86. Nidec Machine Tool Major Business
Table 87. Nidec Machine Tool Wafer Bonder Product and Services
Table 88. Nidec Machine Tool Wafer Bonder Production (Unit), Price (K USD/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 89. Nidec Machine Tool Recent Developments/Updates
Table 90. Nidec Machine Tool Competitive Strengths & Weaknesses
Table 91. Ayumi Industry Basic Information, Manufacturing Base and Competitors
Table 92. Ayumi Industry Major Business
Table 93. Ayumi Industry Wafer Bonder Product and Services
Table 94. Ayumi Industry Wafer Bonder Production (Unit), Price (K USD/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 95. Ayumi Industry Recent Developments/Updates
Table 96. Ayumi Industry Competitive Strengths & Weaknesses
Table 97. Bondtech Basic Information, Manufacturing Base and Competitors
Table 98. Bondtech Major Business
Table 99. Bondtech Wafer Bonder Product and Services
Table 100. Bondtech Wafer Bonder Production (Unit), Price (K USD/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 101. Bondtech Recent Developments/Updates
Table 102. Bondtech Competitive Strengths & Weaknesses
Table 103. Aimechatec Basic Information, Manufacturing Base and Competitors
Table 104. Aimechatec Major Business
Table 105. Aimechatec Wafer Bonder Product and Services
Table 106. Aimechatec Wafer Bonder Production (Unit), Price (K USD/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 107. Aimechatec Recent Developments/Updates
Table 108. Aimechatec Competitive Strengths & Weaknesses
Table 109. U-Precision Tech Basic Information, Manufacturing Base and Competitors
Table 110. U-Precision Tech Major Business
Table 111. U-Precision Tech Wafer Bonder Product and Services
Table 112. U-Precision Tech Wafer Bonder Production (Unit), Price (K USD/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 113. U-Precision Tech Recent Developments/Updates
Table 114. U-Precision Tech Competitive Strengths & Weaknesses
Table 115. TAZMO Basic Information, Manufacturing Base and Competitors
Table 116. TAZMO Major Business
Table 117. TAZMO Wafer Bonder Product and Services
Table 118. TAZMO Wafer Bonder Production (Unit), Price (K USD/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 119. TAZMO Recent Developments/Updates
Table 120. TAZMO Competitive Strengths & Weaknesses
Table 121. Hutem Basic Information, Manufacturing Base and Competitors
Table 122. Hutem Major Business
Table 123. Hutem Wafer Bonder Product and Services
Table 124. Hutem Wafer Bonder Production (Unit), Price (K USD/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 125. Hutem Recent Developments/Updates
Table 126. Hutem Competitive Strengths & Weaknesses
Table 127. Shanghai Micro Electronics Basic Information, Manufacturing Base and Competitors
Table 128. Shanghai Micro Electronics Major Business
Table 129. Shanghai Micro Electronics Wafer Bonder Product and Services
Table 130. Shanghai Micro Electronics Wafer Bonder Production (Unit), Price (K USD/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 131. Shanghai Micro Electronics Recent Developments/Updates
Table 132. Shanghai Micro Electronics Competitive Strengths & Weaknesses
Table 133. Canon Basic Information, Manufacturing Base and Competitors
Table 134. Canon Major Business
Table 135. Canon Wafer Bonder Product and Services
Table 136. Canon Wafer Bonder Production (Unit), Price (K USD/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
Table 137. Canon Recent Developments/Updates
Table 138. Canon Competitive Strengths & Weaknesses
Table 139. Global Key Players of Wafer Bonder Upstream (Raw Materials)
Table 140. Global Wafer Bonder Typical Customers
Table 141. Wafer Bonder Typical Distributors


List of Figures
Figure 1. Wafer Bonder Picture
Figure 2. World Wafer Bonder Production Value: 2019 & 2023 & 2030, (USD Million)
Figure 3. World Wafer Bonder Production Value and Forecast (2019-2030) & (USD Million)
Figure 4. World Wafer Bonder Production (2019-2030) & (Unit)
Figure 5. World Wafer Bonder Average Price (2019-2030) & (K USD/Unit)
Figure 6. World Wafer Bonder Production Value Market Share by Region (2019-2030)
Figure 7. World Wafer Bonder Production Market Share by Region (2019-2030)
Figure 8. Europe Wafer Bonder Production (2019-2030) & (Unit)
Figure 9. China Wafer Bonder Production (2019-2030) & (Unit)
Figure 10. Japan Wafer Bonder Production (2019-2030) & (Unit)
Figure 11. Wafer Bonder Market Drivers
Figure 12. Factors Affecting Demand
Figure 13. World Wafer Bonder Consumption (2019-2030) & (Unit)
Figure 14. World Wafer Bonder Consumption Market Share by Region (2019-2030)
Figure 15. United States Wafer Bonder Consumption (2019-2030) & (Unit)
Figure 16. China Wafer Bonder Consumption (2019-2030) & (Unit)
Figure 17. Europe Wafer Bonder Consumption (2019-2030) & (Unit)
Figure 18. Japan Wafer Bonder Consumption (2019-2030) & (Unit)
Figure 19. South Korea Wafer Bonder Consumption (2019-2030) & (Unit)
Figure 20. ASEAN Wafer Bonder Consumption (2019-2030) & (Unit)
Figure 21. India Wafer Bonder Consumption (2019-2030) & (Unit)
Figure 22. Producer Shipments of Wafer Bonder by Manufacturer Revenue ($MM) and Market Share (%): 2023
Figure 23. Global Four-firm Concentration Ratios (CR4) for Wafer Bonder Markets in 2023
Figure 24. Global Four-firm Concentration Ratios (CR8) for Wafer Bonder Markets in 2023
Figure 25. United States VS China: Wafer Bonder Production Value Market Share Comparison (2019 & 2023 & 2030)
Figure 26. United States VS China: Wafer Bonder Production Market Share Comparison (2019 & 2023 & 2030)
Figure 27. United States VS China: Wafer Bonder Consumption Market Share Comparison (2019 & 2023 & 2030)
Figure 28. United States Based Manufacturers Wafer Bonder Production Market Share 2023
Figure 29. China Based Manufacturers Wafer Bonder Production Market Share 2023
Figure 30. Rest of World Based Manufacturers Wafer Bonder Production Market Share 2023
Figure 31. World Wafer Bonder Production Value by Type, (USD Million), 2019 & 2023 & 2030
Figure 32. World Wafer Bonder Production Value Market Share by Type in 2023
Figure 33. Fully Automatic
Figure 34. Semi Automatic
Figure 35. World Wafer Bonder Production Market Share by Type (2019-2030)
Figure 36. World Wafer Bonder Production Value Market Share by Type (2019-2030)
Figure 37. World Wafer Bonder Average Price by Type (2019-2030) & (K USD/Unit)
Figure 38. World Wafer Bonder Production Value by Application, (USD Million), 2019 & 2023 & 2030
Figure 39. World Wafer Bonder Production Value Market Share by Application in 2023
Figure 40. MEMS
Figure 41. Advanced Packaging
Figure 42. CIS
Figure 43. Others
Figure 44. World Wafer Bonder Production Market Share by Application (2019-2030)
Figure 45. World Wafer Bonder Production Value Market Share by Application (2019-2030)
Figure 46. World Wafer Bonder Average Price by Application (2019-2030) & (K USD/Unit)
Figure 47. Wafer Bonder Industry Chain
Figure 48. Wafer Bonder Procurement Model
Figure 49. Wafer Bonder Sales Model
Figure 50. Wafer Bonder Sales Channels, Direct Sales, and Distribution
Figure 51. Methodology
Figure 52. Research Process and Data Source
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Research Methodology

Client Requirements

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Review and analyze client requirements

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Discussion of all the project requirements and queries

Flexibility Check

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Project Feasibility Analysis

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Finalizing tentative research programme

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Structuring project proposal with scope, timeline, and costs

Analyzing Market Dynamics

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Determination of key drivers, restraints, challenge, and opportunity

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Identifies market needs and trends

Market Size Estimation & Forecast

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Estimation of historical data based on secondary and primary data

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Anticipating market recast by assigning weightage to market forces (drivers, restraints, opportunities)

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Freezing historical and forecast market size estimations based on evolution, trends, outlook, and strategies

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Consideration of geography, region-specific product/service demand for region segments

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Consideration of product utilization rates, product demand outlook for segments by application or end-user.

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Data Source

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Secondary Source
Data collections from annual reports, presentations,associations, journals, analyst reports, paid database, press releases, blogs, newsletters,and GIR repositories.

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Discussion of all the project requirements and queries

Validation and triangulation of secondary and primary source.

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Collection of data

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Cumulating and collating the essential qualitative and quantitative data

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Generation of report in client requested format by research analysts

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Reviews by expert analysts

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Final quality check

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Clarifying queries

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Receiving feedback

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Ensuring satisfaction

  • yuan01
    liuCheng01

    01 Identification of data

    This step involves identification of several primary and secondary data research sources, including Global Info Research's internal data sources. The primary sources consist of in-depth discussions and interviews with policy makers, industry experts, and data evaluators, whereas secondary sources include a thorough study of market journals, press releases, annual reports, and government and non-government agencies websites.

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    liuCheng01

    02 Evaluation of Market Dynamic

    This phase includes a detailed evaluation of several factors that are likely to affect the market dynamics. It involves a comprehensive assessment of major market pain points, drivers, and trends. It also comprises a detailed study of research plans and methodology.

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    liuCheng01

    03 Collection of Data

    This process consists of gathering data, accessing proprietary databases, and reaching out to key industry participants that operate in the market across the value chain. It also involves studying several patterns in the historical data and comparing it with the current scenario.

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    liuCheng01

    04 Collaboration of Data

    This stage involves the validation of data and arrival at actual statistics, and evolution of the market over the years. It entails the study and analyzes various segments and verticals of the market. An impact analysis is also performed to observe which factors will affect the market in the next few years.

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    05 Verification and Analysis

    This is the final stage, which involves both quantity and quality checks. Although the process of data verification is an integral part of the research process, all data points and statistics and figures are re-checked to uphold their authenticity and validity.

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Companies Mentioned

EV Group
SUSS MicroTec
Tokyo Electron
Applied Microengineering
Nidec Machine Tool
Ayumi Industry
Bondtech
Aimechatec
U-Precision Tech
TAZMO
Hutem
Shanghai Micro Electronics
Canon
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