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Total: 17 records, 2 pages

HuiJianTou lanJianTou

Global Wafer Bonder Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

date 02 Jan 2024

date Electronics & Semiconductor

new_biaoQian Wafer Bonder

According to our (Global Info Research) latest study, the global Wafer Bonder market size was valued at USD 141.8 million in 2023 and is forecast to a readjusted size of USD 233.2 million by 2030 with a CAGR of 7.4% during review period.

USD3480.00

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Global Automatic Wafer Bonder Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

date 30 Jan 2024

date Machinery & Equipment

new_biaoQian Automatic Wafer Bonder

According to our (Global Info Research) latest study, the global Automatic Wafer Bonder market size was valued at USD million in 2023 and is forecast to a readjusted size of USD million by 2030 with a CAGR of % during review period.

USD3480.00

Add To Cart

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Global Automated Wafer Bonder Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

date 11 Jan 2024

date Machinery & Equipment

new_biaoQian Automated Wafer Bonder

According to our (Global Info Research) latest study, the global Automated Wafer Bonder market size was valued at USD 154.3 million in 2023 and is forecast to a readjusted size of USD 253.9 million by 2030 with a CAGR of 7.4% during review period.

USD3480.00

Add To Cart

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Global Wafer Bonder and Debonder Supply, Demand and Key Producers, 2024-2030

date 27 Jun 2024

date Machinery & Equipment

new_biaoQian Wafer Bonder and Debonder

Wafer Bonder is a device used to firmly bond two or more wafers together, usually used to manufacture three-dimensional integrated circuits (3D ICs), MEMS (micro-electromechanical systems), optoelectronic devices, etc. Wafer Debonder is a device used to separate bonded wafers or remove temporary bonding materials (such as temporary adhesives used in wafer thinning or other processing steps).

USD4480.00

Add To Cart

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Global Wafer Bonder and Debonder Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

date 27 Jun 2024

date Machinery & Equipment

new_biaoQian Wafer Bonder and Debonder

Wafer Bonder is a device used to firmly bond two or more wafers together, usually used to manufacture three-dimensional integrated circuits (3D ICs), MEMS (micro-electromechanical systems), optoelectronic devices, etc. Wafer Debonder is a device used to separate bonded wafers or remove temporary bonding materials (such as temporary adhesives used in wafer thinning or other processing steps).

USD3480.00

Add To Cart

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Global Semiconductor Wafer Bonder Supply, Demand and Key Producers, 2024-2030

date 20 Feb 2024

date Machinery & Equipment

new_biaoQian Semiconductor Wafer Bonder

The global Semiconductor Wafer Bonder market size is expected to reach $ million by 2030, rising at a market growth of % CAGR during the forecast period (2024-2030).

USD4480.00

Add To Cart

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Global Semiconductor Wafer Bonder Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

date 22 Jan 2024

date Machinery & Equipment

new_biaoQian Semiconductor Wafer Bonder

According to our (Global Info Research) latest study, the global Semiconductor Wafer Bonder market size was valued at USD million in 2023 and is forecast to a readjusted size of USD million by 2030 with a CAGR of % during review period.

USD3480.00

Add To Cart

Add To Cart

Global Room-temperature Wafer Bonder Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

date 21 May 2024

date Machinery & Equipment

new_biaoQian Room-temperature Wafer Bonder

According to our (Global Info Research) latest study, the global Room-temperature Wafer Bonder market size was valued at US$ million in 2023 and is forecast to a readjusted size of USD million by 2030 with a CAGR of %during review period.

USD3480.00

Add To Cart

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Global Room-temperature Wafer Bonder Supply, Demand and Key Producers, 2024-2030

date 21 May 2024

date Machinery & Equipment

new_biaoQian Room-temperature Wafer Bonder

The global Room-temperature Wafer Bonder market size is expected to reach $ million by 2030, rising at a market growth of %CAGR during the forecast period (2024-2030).

USD4480.00

Add To Cart

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Global Wafer Bonder Market 2023 by Manufacturers, Regions, Type and Application, Forecast to 2029

date 18 Mar 2023

date Electronics & Semiconductor

new_biaoQian Wafer Bonder

Wafer bonding is through chemical and physical effects of the two have mirror polished homogeneous or heterogeneous wafers closely together, after the wafer bonding, the interface of the atoms under the action of external forces to react to form a covalent bond bond into one, and make the interface to achieve a specific bond strength.

USD3480.00

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industry 02 Jan 2024

industry Electronics & Semiconductor

new_biaoQian Wafer Bonder

According to our (Global Info Research) latest study, the global Wafer Bonder market size was valued at USD 141.8 million in 2023 and is forecast to a readjusted size of USD 233.2 million by 2030 with a CAGR of 7.4% during review period.

USD3480.00

addToCart

Add To Cart

industry 30 Jan 2024

industry Machinery & Equipment

new_biaoQian Automatic Wafer Bonder

According to our (Global Info Research) latest study, the global Automatic Wafer Bonder market size was valued at USD million in 2023 and is forecast to a readjusted size of USD million by 2030 with a CAGR of % during review period.

USD3480.00

addToCart

Add To Cart

industry 11 Jan 2024

industry Machinery & Equipment

new_biaoQian Automated Wafer Bonder

According to our (Global Info Research) latest study, the global Automated Wafer Bonder market size was valued at USD 154.3 million in 2023 and is forecast to a readjusted size of USD 253.9 million by 2030 with a CAGR of 7.4% during review period.

USD3480.00

addToCart

Add To Cart

industry 27 Jun 2024

industry Machinery & Equipment

new_biaoQian Wafer Bonder and Debonder

Wafer Bonder is a device used to firmly bond two or more wafers together, usually used to manufacture three-dimensional integrated circuits (3D ICs), MEMS (micro-electromechanical systems), optoelectronic devices, etc. Wafer Debonder is a device used to separate bonded wafers or remove temporary bonding materials (such as temporary adhesives used in wafer thinning or other processing steps).

USD4480.00

addToCart

Add To Cart

industry 27 Jun 2024

industry Machinery & Equipment

new_biaoQian Wafer Bonder and Debonder

Wafer Bonder is a device used to firmly bond two or more wafers together, usually used to manufacture three-dimensional integrated circuits (3D ICs), MEMS (micro-electromechanical systems), optoelectronic devices, etc. Wafer Debonder is a device used to separate bonded wafers or remove temporary bonding materials (such as temporary adhesives used in wafer thinning or other processing steps).

USD3480.00

addToCart

Add To Cart

industry 20 Feb 2024

industry Machinery & Equipment

new_biaoQian Semiconductor Wafer Bonder

The global Semiconductor Wafer Bonder market size is expected to reach $ million by 2030, rising at a market growth of % CAGR during the forecast period (2024-2030).

USD4480.00

addToCart

Add To Cart

industry 22 Jan 2024

industry Machinery & Equipment

new_biaoQian Semiconductor Wafer Bonder

According to our (Global Info Research) latest study, the global Semiconductor Wafer Bonder market size was valued at USD million in 2023 and is forecast to a readjusted size of USD million by 2030 with a CAGR of % during review period.

USD3480.00

addToCart

Add To Cart

industry 21 May 2024

industry Machinery & Equipment

new_biaoQian Room-temperature Wafer Bonder

According to our (Global Info Research) latest study, the global Room-temperature Wafer Bonder market size was valued at US$ million in 2023 and is forecast to a readjusted size of USD million by 2030 with a CAGR of %during review period.

USD3480.00

addToCart

Add To Cart

industry 21 May 2024

industry Machinery & Equipment

new_biaoQian Room-temperature Wafer Bonder

The global Room-temperature Wafer Bonder market size is expected to reach $ million by 2030, rising at a market growth of %CAGR during the forecast period (2024-2030).

USD4480.00

addToCart

Add To Cart

industry 18 Mar 2023

industry Electronics & Semiconductor

new_biaoQian Wafer Bonder

Wafer bonding is through chemical and physical effects of the two have mirror polished homogeneous or heterogeneous wafers closely together, after the wafer bonding, the interface of the atoms under the action of external forces to react to form a covalent bond bond into one, and make the interface to achieve a specific bond strength.

USD3480.00

addToCart

Add To Cart

Go To Page

Confirm