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Flip Chip Ball Grid Array is a mid-cost, high-performance, semiconductor packaging solution that utilizes the controlled collapse chip connection technology, also known as flip chip, for its die to substrate interconnection. FC BGA provides the design flexibility for much higher signal density and functionality into a smaller die and packaging footprint. FC BGA packaging is attractive where performance is more important than cost. Flip-chip BGA packages can be mounted using standard printed circuit boards and can be replaced using existing standard repair practices. This report studies the FC BGA substrate, also called ABF (Ajinomoto Build-up Film) substrates, which are IC Substrates made of Ajinomoto Build-up Film. The ABF (Ajinomoto Build-up Film) substrate consists of multiple layers of microcircuits, known as a “build-up substrate” which allows the formation of these miniature components as its surface is receptive to laser processing and direct copper plating. Most modern chipmakers use ABF to design the smaller components of their CPUs and GPUs.

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Flip Chip Ball Grid Array is a mid-cost, high-performance, semiconductor packaging solution that utilizes the controlled collapse chip connection technology, also known as flip chip, for its die to substrate interconnection. FC BGA provides the design flexibility for much higher signal density and functionality into a smaller die and packaging footprint. FC BGA packaging is attractive where performance is more important than cost. Flip-chip BGA packages can be mounted using standard printed circuit boards and can be replaced using existing standard repair practices. This report studies the FC BGA substrate, also called ABF (Ajinomoto Build-up Film) substrates, which are IC Substrates made of Ajinomoto Build-up Film. The ABF (Ajinomoto Build-up Film) substrate consists of multiple layers of microcircuits, known as a “build-up substrate” which allows the formation of these miniature components as its surface is receptive to laser processing and direct copper plating. Most modern chipmakers use ABF to design the smaller components of their CPUs and GPUs.

USD3480.00

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The global ABF Substrate (FC-BGA) market size is expected to reach $ 6980.7 million by 2029, rising at a market growth of 5.3% CAGR during the forecast period (2023-2029).

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According to our (Global Info Research) latest study, the global ABF Substrate (FC-BGA) market size was valued at USD 4856.2 million in 2022 and is forecast to a readjusted size of USD 6980.7 million by 2029 with a CAGR of 5.3% during review period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.

USD3480.00

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