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Total: 2 records, 1 pages

Global AMB Copper Clad Ceramic Substrate Supply, Demand and Key Producers, 2023-2029

date 17 Feb 2023

date Electronics & Semiconductor

new_biaoQian AMB Copper Clad Ceramic Substrate

The global AMB Copper Clad Ceramic Substrate market size is expected to reach $ million by 2029, rising at a market growth of % CAGR during the forecast period (2023-2029).

USD4480.00

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Global AMB Copper Clad Ceramic Substrate Market 2023 by Manufacturers, Regions, Type and Application, Forecast to 2029

date 10 Feb 2023

date Electronics & Semiconductor

new_biaoQian AMB Copper Clad Ceramic Substrate

AMB refers to active metal brazing and copper clad technology. As the name implies, it relies on active metal brazing to realize the high-temperature metallurgical combination of aluminum nitride and oxygen-free copper. It has the advantages of high bonding strength and good reliability. The ceramic substrate made by AMB active metal brazing copper clad technology is generally called AMB ceramic substrate.

USD3480.00

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industry 17 Feb 2023

industry Electronics & Semiconductor

new_biaoQian AMB Copper Clad Ceramic Substrate

The global AMB Copper Clad Ceramic Substrate market size is expected to reach $ million by 2029, rising at a market growth of % CAGR during the forecast period (2023-2029).

USD4480.00

addToCart

Add To Cart

industry 10 Feb 2023

industry Electronics & Semiconductor

new_biaoQian AMB Copper Clad Ceramic Substrate

AMB refers to active metal brazing and copper clad technology. As the name implies, it relies on active metal brazing to realize the high-temperature metallurgical combination of aluminum nitride and oxygen-free copper. It has the advantages of high bonding strength and good reliability. The ceramic substrate made by AMB active metal brazing copper clad technology is generally called AMB ceramic substrate.

USD3480.00

addToCart

Add To Cart