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Global Aluminum Nitride Filler (AlN) Supply, Demand and Key Producers, 2024-2030

date 12 Apr 2024

date Chemical & Material

new_biaoQian Aluminum Nitride Filler (AlN)

In accordance with the development of semiconductor devices with more power, heat generated in semiconductor devices continues to increase. On the other hand, progress in downsizing and high-density integration of semiconductor devices makes it more difficult to radiate heat from inside to outside of them. Accumulated heat may have harmful effects including a decline in efficiency, reliability and safety not only on semiconductor devices themselves but also on electronic devices in which those semiconductor devices are installed. Thus, it is very important for electronic device manufacturers to remove generated heat quickly in order to avoid these harmful effects of accumulated heat. Aluminum nitride has excellent properties including high insulation against electricity, almost the same coefficient of thermal expansion as that of silicon, and corrosion resistance against chlorinated gases which is used in the process to produce semiconductors. Aluminum nitride also has thermal conductivity higher than those of other fillers such as alumina and boron nitride.

USD4480.00

Add To Cart

Add To Cart

Global Aluminum Nitride Filler (AlN) Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

date 12 Apr 2024

date Chemical & Material

new_biaoQian Aluminum Nitride Filler (AlN)

In accordance with the development of semiconductor devices with more power, heat generated in semiconductor devices continues to increase. On the other hand, progress in downsizing and high-density integration of semiconductor devices makes it more difficult to radiate heat from inside to outside of them. Accumulated heat may have harmful effects including a decline in efficiency, reliability and safety not only on semiconductor devices themselves but also on electronic devices in which those semiconductor devices are installed. Thus, it is very important for electronic device manufacturers to remove generated heat quickly in order to avoid these harmful effects of accumulated heat. Aluminum nitride has excellent properties including high insulation against electricity, almost the same coefficient of thermal expansion as that of silicon, and corrosion resistance against chlorinated gases which is used in the process to produce semiconductors. Aluminum nitride also has thermal conductivity higher than those of other fillers such as alumina and boron nitride.

USD3480.00

Add To Cart

Add To Cart

industry 12 Apr 2024

industry Chemical & Material

new_biaoQian Aluminum Nitride Filler (AlN)

In accordance with the development of semiconductor devices with more power, heat generated in semiconductor devices continues to increase. On the other hand, progress in downsizing and high-density integration of semiconductor devices makes it more difficult to radiate heat from inside to outside of them. Accumulated heat may have harmful effects including a decline in efficiency, reliability and safety not only on semiconductor devices themselves but also on electronic devices in which those semiconductor devices are installed. Thus, it is very important for electronic device manufacturers to remove generated heat quickly in order to avoid these harmful effects of accumulated heat. Aluminum nitride has excellent properties including high insulation against electricity, almost the same coefficient of thermal expansion as that of silicon, and corrosion resistance against chlorinated gases which is used in the process to produce semiconductors. Aluminum nitride also has thermal conductivity higher than those of other fillers such as alumina and boron nitride.

USD4480.00

addToCart

Add To Cart

industry 12 Apr 2024

industry Chemical & Material

new_biaoQian Aluminum Nitride Filler (AlN)

In accordance with the development of semiconductor devices with more power, heat generated in semiconductor devices continues to increase. On the other hand, progress in downsizing and high-density integration of semiconductor devices makes it more difficult to radiate heat from inside to outside of them. Accumulated heat may have harmful effects including a decline in efficiency, reliability and safety not only on semiconductor devices themselves but also on electronic devices in which those semiconductor devices are installed. Thus, it is very important for electronic device manufacturers to remove generated heat quickly in order to avoid these harmful effects of accumulated heat. Aluminum nitride has excellent properties including high insulation against electricity, almost the same coefficient of thermal expansion as that of silicon, and corrosion resistance against chlorinated gases which is used in the process to produce semiconductors. Aluminum nitride also has thermal conductivity higher than those of other fillers such as alumina and boron nitride.

USD3480.00

addToCart

Add To Cart