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Total: 3 records, 1 pages
Search For: Automotive Power Module Packaging
Global Automotive Power Module Packaging Market 2024 by Company, Regions, Type and Application, Forecast to 2030
10 Jan 2024
Electronics & Semiconductor
Automotive Power Module Packaging
According to our (Global Info Research) latest study, the global Automotive Power Module Packaging market size was valued at USD million in 2023 and is forecast to a readjusted size of USD million by 2030 with a CAGR of % during review period.
USD3480.00
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Global Automotive Power Module Packaging Supply, Demand and Key Producers, 2023-2029
16 Feb 2023
Electronics & Semiconductor
Automotive Power Module Packaging
Technical trends in power module packaging are mainly driven by the entrance of the Wide Band Gap (WBG) materials and the challenging system requirements of the booming EV/HEV industry. Indeed, the introduction of the WBG semiconductors SiC and GaN are pushing the development of new power packaging solutions, as these devices can work at higher junction temperatures and higher switching frequencies with smaller die sizes
USD4480.00
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Global Automotive Power Module Packaging Market 2023 by Company, Regions, Type and Application, Forecast to 2029
08 Jan 2023
Electronics & Semiconductor
Automotive Power Module Packaging
Technical trends in power module packaging are mainly driven by the entrance of the Wide Band Gap (WBG) materials and the challenging system requirements of the booming EV/HEV industry. Indeed, the introduction of the WBG semiconductors SiC and GaN are pushing the development of new power packaging solutions, as these devices can work at higher junction temperatures and higher switching frequencies with smaller die sizes
USD3480.00
Add To Cart
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Search For: Automotive Power Module Packaging
Total: 3 records, 1 pages
According to our (Global Info Research) latest study, the global Automotive Power Module Packaging market size was valued at USD million in 2023 and is forecast to a readjusted size of USD million by 2030 with a CAGR of % during review period.
USD3480.00
Add To Cart
Technical trends in power module packaging are mainly driven by the entrance of the Wide Band Gap (WBG) materials and the challenging system requirements of the booming EV/HEV industry. Indeed, the introduction of the WBG semiconductors SiC and GaN are pushing the development of new power packaging solutions, as these devices can work at higher junction temperatures and higher switching frequencies with smaller die sizes
USD4480.00
Add To Cart
Technical trends in power module packaging are mainly driven by the entrance of the Wide Band Gap (WBG) materials and the challenging system requirements of the booming EV/HEV industry. Indeed, the introduction of the WBG semiconductors SiC and GaN are pushing the development of new power packaging solutions, as these devices can work at higher junction temperatures and higher switching frequencies with smaller die sizes
USD3480.00
Add To Cart
Popular Product Keywords
- We Provide Professional, Accurate Market Analysis to Help You Stay Ahead of Your Competition.Speak to our analyst >>
Our Clients
What We Can Provide?
With better results and higher quality products,Our professional reports can achieve four things:
-
Insight into the industry market information
-
Analyze market development needs
-
Prospects for future development
-
Develop industry investment strategy
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