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Total: 2 records, 1 pages

Global CMP Slurry Filters Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

date 02 Jan 2024

date Electronics & Semiconductor

new_biaoQian CMP Slurry Filters

According to our (Global Info Research) latest study, the global CMP Slurry Filters market size was valued at USD 61 million in 2023 and is forecast to a readjusted size of USD 84 million by 2030 with a CAGR of 4.7% during review period.

USD3480.00

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Global CMP Slurry Filters Market 2023 by Manufacturers, Regions, Type and Application, Forecast to 2029

date 18 Mar 2023

date Electronics & Semiconductor

new_biaoQian CMP Slurry Filters

Chemical mechanical planarization (CMP) is a polishing process used to manufacture wafers for the semiconductor industry. It requires the use of a polishing tool and polishing slurry. The slurry in the tool is delivered to the wafer surface and may contain large particles/agglomerates (> 1 μ) as a result of shipping/handling issues, drying, and interactions within the slurry distribution systems. These large particles can, in turn, increase the level of defectives (scratches) on the semiconductor wafer surface found after the CMP process has been completed. One of the solutions for decreasing the level of defects caused by large slurry particles is through the use of slurry filtration. For these applications, 0.5 to 5 micron filters are typically used.

USD3480.00

Add To Cart

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industry 02 Jan 2024

industry Electronics & Semiconductor

new_biaoQian CMP Slurry Filters

According to our (Global Info Research) latest study, the global CMP Slurry Filters market size was valued at USD 61 million in 2023 and is forecast to a readjusted size of USD 84 million by 2030 with a CAGR of 4.7% during review period.

USD3480.00

addToCart

Add To Cart

industry 18 Mar 2023

industry Electronics & Semiconductor

new_biaoQian CMP Slurry Filters

Chemical mechanical planarization (CMP) is a polishing process used to manufacture wafers for the semiconductor industry. It requires the use of a polishing tool and polishing slurry. The slurry in the tool is delivered to the wafer surface and may contain large particles/agglomerates (> 1 μ) as a result of shipping/handling issues, drying, and interactions within the slurry distribution systems. These large particles can, in turn, increase the level of defectives (scratches) on the semiconductor wafer surface found after the CMP process has been completed. One of the solutions for decreasing the level of defects caused by large slurry particles is through the use of slurry filtration. For these applications, 0.5 to 5 micron filters are typically used.

USD3480.00

addToCart

Add To Cart