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Total: 2 records, 1 pages
Search For: Cu CMP Slurry
Global Cu CMP Slurry Supply, Demand and Key Producers, 2024-2030
28 Apr 2024
Chemical & Material
Chemical mechanical polishing/planarization (CMP) slurries are abrasive materials, also called non-crystalline inorganic oxides, which are dispersed in water blended with other chemicals and used in CMP processes for semiconductors. CMP process is employed in semiconductor manufacturing, where surfaces of wafers are smoothed and leveled with the help of abrasive slurries. This process is critical for precise lithography patterning, and is utilized after every deposition-etch step. CMP slurries are liquid solutions generally composed of high-purity deionized water and a proprietary mix of chemical additives and engineered abrasives that chemically and mechanically interact at an atomic level with the surface material of the IC device. CMP slurries for polishing a wide range of materials used in semiconductors, including tungsten, dielectric materials, copper, tantalum (commonly referred to as "barrier"), aluminum, silicon carbide, or SiC, and gallium nitride, or GaN.
USD4480.00
Add To Cart
Global Cu CMP Slurry Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030
28 Apr 2024
Chemical & Material
Chemical mechanical polishing/planarization (CMP) slurries are abrasive materials, also called non-crystalline inorganic oxides, which are dispersed in water blended with other chemicals and used in CMP processes for semiconductors. CMP process is employed in semiconductor manufacturing, where surfaces of wafers are smoothed and leveled with the help of abrasive slurries. This process is critical for precise lithography patterning, and is utilized after every deposition-etch step. CMP slurries are liquid solutions generally composed of high-purity deionized water and a proprietary mix of chemical additives and engineered abrasives that chemically and mechanically interact at an atomic level with the surface material of the IC device. CMP slurries for polishing a wide range of materials used in semiconductors, including tungsten, dielectric materials, copper, tantalum (commonly referred to as "barrier"), aluminum, silicon carbide, or SiC, and gallium nitride, or GaN.
USD3480.00
Add To Cart
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Search For: Cu CMP Slurry
Total: 2 records, 1 pages
Chemical mechanical polishing/planarization (CMP) slurries are abrasive materials, also called non-crystalline inorganic oxides, which are dispersed in water blended with other chemicals and used in CMP processes for semiconductors. CMP process is employed in semiconductor manufacturing, where surfaces of wafers are smoothed and leveled with the help of abrasive slurries. This process is critical for precise lithography patterning, and is utilized after every deposition-etch step. CMP slurries are liquid solutions generally composed of high-purity deionized water and a proprietary mix of chemical additives and engineered abrasives that chemically and mechanically interact at an atomic level with the surface material of the IC device. CMP slurries for polishing a wide range of materials used in semiconductors, including tungsten, dielectric materials, copper, tantalum (commonly referred to as "barrier"), aluminum, silicon carbide, or SiC, and gallium nitride, or GaN.
USD4480.00
Add To Cart
Chemical mechanical polishing/planarization (CMP) slurries are abrasive materials, also called non-crystalline inorganic oxides, which are dispersed in water blended with other chemicals and used in CMP processes for semiconductors. CMP process is employed in semiconductor manufacturing, where surfaces of wafers are smoothed and leveled with the help of abrasive slurries. This process is critical for precise lithography patterning, and is utilized after every deposition-etch step. CMP slurries are liquid solutions generally composed of high-purity deionized water and a proprietary mix of chemical additives and engineered abrasives that chemically and mechanically interact at an atomic level with the surface material of the IC device. CMP slurries for polishing a wide range of materials used in semiconductors, including tungsten, dielectric materials, copper, tantalum (commonly referred to as "barrier"), aluminum, silicon carbide, or SiC, and gallium nitride, or GaN.
USD3480.00
Add To Cart
Popular Product Keywords
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Our Clients
What We Can Provide?
With better results and higher quality products,Our professional reports can achieve four things:
-
Insight into the industry market information
-
Analyze market development needs
-
Prospects for future development
-
Develop industry investment strategy
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