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Total: 2 records, 1 pages

Global Die Attach Compound Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

date 06 Sep 2024

date Chemical & Material

new_biaoQian Die Attach Compound

Die attach compounds are materials used in the assembly of semiconductor devices to attach a die to a substrate, such as a leadframe or a printed circuit board. These compounds are used to bond the die to the substrate, and typically contain a filler material such as silver, copper, or aluminum, mixed with a resin or adhesive. The compound must have a high thermal conductivity to help dissipate heat generated by the device, and must also provide good adhesion and electrical conductivity. Die attach compounds are often applied to the substrate by dispensing, stenciling, or screen printing, and are then cured by heat or ultraviolet light.

USD3480.00

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Global Die Attach Compound Supply, Demand and Key Producers, 2024-2030

date 06 Sep 2024

date Chemical & Material

new_biaoQian Die Attach Compound

Die attach compounds are materials used in the assembly of semiconductor devices to attach a die to a substrate, such as a leadframe or a printed circuit board. These compounds are used to bond the die to the substrate, and typically contain a filler material such as silver, copper, or aluminum, mixed with a resin or adhesive. The compound must have a high thermal conductivity to help dissipate heat generated by the device, and must also provide good adhesion and electrical conductivity. Die attach compounds are often applied to the substrate by dispensing, stenciling, or screen printing, and are then cured by heat or ultraviolet light.

USD4480.00

Add To Cart

Add To Cart

industry 06 Sep 2024

industry Chemical & Material

new_biaoQian Die Attach Compound

Die attach compounds are materials used in the assembly of semiconductor devices to attach a die to a substrate, such as a leadframe or a printed circuit board. These compounds are used to bond the die to the substrate, and typically contain a filler material such as silver, copper, or aluminum, mixed with a resin or adhesive. The compound must have a high thermal conductivity to help dissipate heat generated by the device, and must also provide good adhesion and electrical conductivity. Die attach compounds are often applied to the substrate by dispensing, stenciling, or screen printing, and are then cured by heat or ultraviolet light.

USD3480.00

addToCart

Add To Cart

industry 06 Sep 2024

industry Chemical & Material

new_biaoQian Die Attach Compound

Die attach compounds are materials used in the assembly of semiconductor devices to attach a die to a substrate, such as a leadframe or a printed circuit board. These compounds are used to bond the die to the substrate, and typically contain a filler material such as silver, copper, or aluminum, mixed with a resin or adhesive. The compound must have a high thermal conductivity to help dissipate heat generated by the device, and must also provide good adhesion and electrical conductivity. Die attach compounds are often applied to the substrate by dispensing, stenciling, or screen printing, and are then cured by heat or ultraviolet light.

USD4480.00

addToCart

Add To Cart