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Total: 2 records, 1 pages
Search For: Die Attach Compound
Global Die Attach Compound Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030
06 Sep 2024
Chemical & Material
Die attach compounds are materials used in the assembly of semiconductor devices to attach a die to a substrate, such as a leadframe or a printed circuit board. These compounds are used to bond the die to the substrate, and typically contain a filler material such as silver, copper, or aluminum, mixed with a resin or adhesive. The compound must have a high thermal conductivity to help dissipate heat generated by the device, and must also provide good adhesion and electrical conductivity. Die attach compounds are often applied to the substrate by dispensing, stenciling, or screen printing, and are then cured by heat or ultraviolet light.
USD3480.00
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Global Die Attach Compound Supply, Demand and Key Producers, 2024-2030
06 Sep 2024
Chemical & Material
Die attach compounds are materials used in the assembly of semiconductor devices to attach a die to a substrate, such as a leadframe or a printed circuit board. These compounds are used to bond the die to the substrate, and typically contain a filler material such as silver, copper, or aluminum, mixed with a resin or adhesive. The compound must have a high thermal conductivity to help dissipate heat generated by the device, and must also provide good adhesion and electrical conductivity. Die attach compounds are often applied to the substrate by dispensing, stenciling, or screen printing, and are then cured by heat or ultraviolet light.
USD4480.00
Add To Cart
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Search For: Die Attach Compound
Total: 2 records, 1 pages
Die attach compounds are materials used in the assembly of semiconductor devices to attach a die to a substrate, such as a leadframe or a printed circuit board. These compounds are used to bond the die to the substrate, and typically contain a filler material such as silver, copper, or aluminum, mixed with a resin or adhesive. The compound must have a high thermal conductivity to help dissipate heat generated by the device, and must also provide good adhesion and electrical conductivity. Die attach compounds are often applied to the substrate by dispensing, stenciling, or screen printing, and are then cured by heat or ultraviolet light.
USD3480.00
Add To Cart
Die attach compounds are materials used in the assembly of semiconductor devices to attach a die to a substrate, such as a leadframe or a printed circuit board. These compounds are used to bond the die to the substrate, and typically contain a filler material such as silver, copper, or aluminum, mixed with a resin or adhesive. The compound must have a high thermal conductivity to help dissipate heat generated by the device, and must also provide good adhesion and electrical conductivity. Die attach compounds are often applied to the substrate by dispensing, stenciling, or screen printing, and are then cured by heat or ultraviolet light.
USD4480.00
Add To Cart
Popular Product Keywords
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Our Clients
What We Can Provide?
With better results and higher quality products,Our professional reports can achieve four things:
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Insight into the industry market information
-
Analyze market development needs
-
Prospects for future development
-
Develop industry investment strategy
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