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The global Epoxy Based Thermal Conductive Adhesives market size is expected to reach $ 561.6 million by 2030, rising at a market growth of 5.1% CAGR during the forecast period (2024-2030).

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According to our (Global Info Research) latest study, the global Epoxy Based Thermal Conductive Adhesives market size was valued at USD 397.2 million in 2023 and is forecast to a readjusted size of USD 561.6 million by 2030 with a CAGR of 5.1% during review period.

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Epoxy Based Thermal Conductive Adhesives is a material that consists of an Epoxy resin mixed with a Thermally conductive material, Thermally conductive adhesives are often used to dissipate heat from power electronics. Used to bond heat sinks, for example, their heat conductivity reduces thermal strain to prevent performance loss or failure of electronic components. Thermally conductive adhesives are also used as encapsulation compound for temperature sensors for enclosures or reactors. Adhesives with thermal conductivity are synthetic resins augmented with metallic or inorganic filler materials. The best thermal conduction coefficients can be achieved with metallic fillers such as silver or graphite. These, however, also make the adhesive electrically conductive, which is undesirable in many applications. To achieve thermal conductivity and electrical insulation at the same time, adhesives augmented with ceramic or mineral-based fillers must be used.

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