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Total: 3 records, 1 pages

Global Epoxy Resin for Encapsulation Supply, Demand and Key Producers, 2024-2030

date 27 Feb 2024

date Chemical & Material

new_biaoQian Epoxy Resin for Encapsulation

The global Epoxy Resin for Encapsulation market size is expected to reach $ million by 2030, rising at a market growth of % CAGR during the forecast period (2024-2030).

USD4480.00

Add To Cart

Add To Cart

Global Epoxy Resin for Encapsulation Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

date 02 Jan 2024

date Chemical & Material

new_biaoQian Epoxy Resin for Encapsulation

According to our (Global Info Research) latest study, the global Epoxy Resin for Encapsulation market size was valued at USD million in 2023 and is forecast to a readjusted size of USD million by 2030 with a CAGR of % during review period.

USD3480.00

Add To Cart

Add To Cart

Global Epoxy Resin for Encapsulation Market 2023 by Manufacturers, Regions, Type and Application, Forecast to 2029

date 18 Mar 2023

date Chemical & Material

new_biaoQian Epoxy Resin for Encapsulation

Epoxy resins are organic compounds whose molecules contain two or more epoxy groups. Electronic grade epoxy resin is mainly used in the production of copper clad plates; The second is the packaging of various electronic parts, semiconductors and integrated circuits.

USD3480.00

Add To Cart

Add To Cart

industry 27 Feb 2024

industry Chemical & Material

new_biaoQian Epoxy Resin for Encapsulation

The global Epoxy Resin for Encapsulation market size is expected to reach $ million by 2030, rising at a market growth of % CAGR during the forecast period (2024-2030).

USD4480.00

addToCart

Add To Cart

industry 02 Jan 2024

industry Chemical & Material

new_biaoQian Epoxy Resin for Encapsulation

According to our (Global Info Research) latest study, the global Epoxy Resin for Encapsulation market size was valued at USD million in 2023 and is forecast to a readjusted size of USD million by 2030 with a CAGR of % during review period.

USD3480.00

addToCart

Add To Cart

industry 18 Mar 2023

industry Chemical & Material

new_biaoQian Epoxy Resin for Encapsulation

Epoxy resins are organic compounds whose molecules contain two or more epoxy groups. Electronic grade epoxy resin is mainly used in the production of copper clad plates; The second is the packaging of various electronic parts, semiconductors and integrated circuits.

USD3480.00

addToCart

Add To Cart