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Total: 2 records, 1 pages
Search For: FC-BGA Multi-layer Substrate
Global FC-BGA Multi-layer Substrate Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030
21 Aug 2024
Electronics & Semiconductor
The FC-BGA (Flip Chip Ball Grid Array) multi-layer substrate is a critical component in advanced electronic packaging, particularly in high-performance applications such as microprocessors, graphics processors, and other integrated circuits used in computing, telecommunications, and automotive industries. This substrate technology enables the integration of complex circuitry within a compact and reliable form factor.
USD3480.00
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Global FC-BGA Multi-layer Substrate Supply, Demand and Key Producers, 2024-2030
21 Aug 2024
Electronics & Semiconductor
The FC-BGA (Flip Chip Ball Grid Array) multi-layer substrate is a critical component in advanced electronic packaging, particularly in high-performance applications such as microprocessors, graphics processors, and other integrated circuits used in computing, telecommunications, and automotive industries. This substrate technology enables the integration of complex circuitry within a compact and reliable form factor.
USD4480.00
Add To Cart
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Search For: FC-BGA Multi-layer Substrate
Total: 2 records, 1 pages
The FC-BGA (Flip Chip Ball Grid Array) multi-layer substrate is a critical component in advanced electronic packaging, particularly in high-performance applications such as microprocessors, graphics processors, and other integrated circuits used in computing, telecommunications, and automotive industries. This substrate technology enables the integration of complex circuitry within a compact and reliable form factor.
USD3480.00
Add To Cart
The FC-BGA (Flip Chip Ball Grid Array) multi-layer substrate is a critical component in advanced electronic packaging, particularly in high-performance applications such as microprocessors, graphics processors, and other integrated circuits used in computing, telecommunications, and automotive industries. This substrate technology enables the integration of complex circuitry within a compact and reliable form factor.
USD4480.00
Add To Cart
Popular Product Keywords
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Our Clients
What We Can Provide?
With better results and higher quality products,Our professional reports can achieve four things:
-
Insight into the industry market information
-
Analyze market development needs
-
Prospects for future development
-
Develop industry investment strategy
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