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The global Heat Pipe market size is expected to reach $ 3845 million by 2030, rising at a market growth of 4.4% CAGR during the forecast period (2024-2030).

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According to our (Global Info Research) latest study, the global Heat Pipe market size was valued at USD 2844 million in 2023 and is forecast to a readjusted size of USD 3845 million by 2030 with a CAGR of 4.4% during review period.

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The global Planer Heat Pipe market size is expected to reach $ million by 2030, rising at a market growth of % CAGR during the forecast period (2024-2030).

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The global Copper Heat Pipe market size is expected to reach $ million by 2030, rising at a market growth of % CAGR during the forecast period (2024-2030).

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According to our (Global Info Research) latest study, the global Planer Heat Pipe market size was valued at USD million in 2023 and is forecast to a readjusted size of USD million by 2030 with a CAGR of % during review period.

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According to our (Global Info Research) latest study, the global Copper Heat Pipe market size was valued at USD million in 2023 and is forecast to a readjusted size of USD million by 2030 with a CAGR of % during review period.

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According to our (Global Info Research) latest study, the global Variable Heat Pipe market size was valued at USD 1300.6 million in 2023 and is forecast to a readjusted size of USD 1758.4 million by 2030 with a CAGR of 4.4% during review period.

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‌Pulsating heat pipe‌ is a new type of high-efficiency heat pipe, which was first proposed by Japan's Akachi in the 1990s. It has the characteristics of simple structure, coreless, arbitrarily bendable shape, large heat transfer coefficient, small size, etc. It is an electronic device cooler with great potential. The pulsating heat pipe realizes heat transport through the gas-liquid two-phase pulsating phase change of the internal working medium, without consuming external mechanical or electrical power. It is completely self-oscillating under thermal drive.

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‌Pulsating heat pipe‌ is a new type of high-efficiency heat pipe, which was first proposed by Japan's Akachi in the 1990s. It has the characteristics of simple structure, coreless, arbitrarily bendable shape, large heat transfer coefficient, small size, etc. It is an electronic device cooler with great potential. The pulsating heat pipe realizes heat transport through the gas-liquid two-phase pulsating phase change of the internal working medium, without consuming external mechanical or electrical power. It is completely self-oscillating under thermal drive.

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3C copper heat pipe is a heat conduction device used in consumer electronic equipment. It is composed of a copper pipe and an internal medium. By utilizing the principle of thermal conduction, the medium in the copper pipe transfers heat from the heat source to the radiator or equipment shell, thereby achieving The effective transmission and dispersion of heat is used to improve the heat dissipation efficiency and stability of electronic equipment. 3C copper heat pipes are widely used in electronic devices such as laptops, tablets, smartphones, and TVs. They can effectively improve the heat dissipation efficiency of the equipment and protect the stable operation of the equipment.

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