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Total: 2 records, 1 pages
Search For: Heat Treatment Furnace Tube Equipment
Global Heat Treatment Furnace Tube Equipment Supply, Demand and Key Producers, 2024-2030
09 Apr 2024
Machinery & Equipment
Heat Treatment Furnace Tube Equipment
Heat treatment equipment, also known as furnace tube equipment, is used for heat treatment processes in semiconductor front-end processes, including oxidation furnaces, diffusion furnaces, annealing furnaces and rapid annealing furnaces, etc., which are used in oxidation, diffusion and annealing processes respectively. According to the equipment form, it can be divided into three categories: horizontal furnace, vertical furnace and rapid heat treatment furnace. The difference between horizontal furnaces and vertical furnaces lies in the shape of the reaction chamber. Because vertical furnaces have the advantages of small footprint, low cost, batch heat treatment, and high controllability, they are currently the most widely used. However, both horizontal furnaces and vertical furnaces heat up and cool down the cavity together with the silicon wafers placed in it, so the temperature rise and fall rate is slow, but 100 to 200 wafers can be placed at one time, while the Rapid Thermal Processing Furnace (RTP) only Changing the temperature of the wafer inside does not change the cavity temperature, so rapid annealing can be performed, but only a single wafer can be processed.
USD4480.00
Add To Cart
Global Heat Treatment Furnace Tube Equipment Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030
09 Apr 2024
Machinery & Equipment
Heat Treatment Furnace Tube Equipment
Heat treatment equipment, also known as furnace tube equipment, is used for heat treatment processes in semiconductor front-end processes, including oxidation furnaces, diffusion furnaces, annealing furnaces and rapid annealing furnaces, etc., which are used in oxidation, diffusion and annealing processes respectively. According to the equipment form, it can be divided into three categories: horizontal furnace, vertical furnace and rapid heat treatment furnace. The difference between horizontal furnaces and vertical furnaces lies in the shape of the reaction chamber. Because vertical furnaces have the advantages of small footprint, low cost, batch heat treatment, and high controllability, they are currently the most widely used. However, both horizontal furnaces and vertical furnaces heat up and cool down the cavity together with the silicon wafers placed in it, so the temperature rise and fall rate is slow, but 100 to 200 wafers can be placed at one time, while the Rapid Thermal Processing Furnace (RTP) only Changing the temperature of the wafer inside does not change the cavity temperature, so rapid annealing can be performed, but only a single wafer can be processed.
USD3480.00
Add To Cart
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Search For: Heat Treatment Furnace Tube Equipment
Total: 2 records, 1 pages
Heat treatment equipment, also known as furnace tube equipment, is used for heat treatment processes in semiconductor front-end processes, including oxidation furnaces, diffusion furnaces, annealing furnaces and rapid annealing furnaces, etc., which are used in oxidation, diffusion and annealing processes respectively. According to the equipment form, it can be divided into three categories: horizontal furnace, vertical furnace and rapid heat treatment furnace. The difference between horizontal furnaces and vertical furnaces lies in the shape of the reaction chamber. Because vertical furnaces have the advantages of small footprint, low cost, batch heat treatment, and high controllability, they are currently the most widely used. However, both horizontal furnaces and vertical furnaces heat up and cool down the cavity together with the silicon wafers placed in it, so the temperature rise and fall rate is slow, but 100 to 200 wafers can be placed at one time, while the Rapid Thermal Processing Furnace (RTP) only Changing the temperature of the wafer inside does not change the cavity temperature, so rapid annealing can be performed, but only a single wafer can be processed.
USD4480.00
Add To Cart
Heat treatment equipment, also known as furnace tube equipment, is used for heat treatment processes in semiconductor front-end processes, including oxidation furnaces, diffusion furnaces, annealing furnaces and rapid annealing furnaces, etc., which are used in oxidation, diffusion and annealing processes respectively. According to the equipment form, it can be divided into three categories: horizontal furnace, vertical furnace and rapid heat treatment furnace. The difference between horizontal furnaces and vertical furnaces lies in the shape of the reaction chamber. Because vertical furnaces have the advantages of small footprint, low cost, batch heat treatment, and high controllability, they are currently the most widely used. However, both horizontal furnaces and vertical furnaces heat up and cool down the cavity together with the silicon wafers placed in it, so the temperature rise and fall rate is slow, but 100 to 200 wafers can be placed at one time, while the Rapid Thermal Processing Furnace (RTP) only Changing the temperature of the wafer inside does not change the cavity temperature, so rapid annealing can be performed, but only a single wafer can be processed.
USD3480.00
Add To Cart
Popular Product Keywords
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Our Clients
What We Can Provide?
With better results and higher quality products,Our professional reports can achieve four things:
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Insight into the industry market information
-
Analyze market development needs
-
Prospects for future development
-
Develop industry investment strategy
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