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Total: 2 records, 1 pages
Search For: LTCC Ceramic Substrates for Probe Cards
Global LTCC Ceramic Substrates for Probe Cards Supply, Demand and Key Producers, 2024-2030
28 Apr 2024
Electronics & Semiconductor
LTCC Ceramic Substrates for Probe Cards
IC testing packages require increased size and greater precision in silicon wafer pad positioning to reduce the number of tests. These test tool ceramic packages are used in running electrical tests with probes (needles) brought into contact with IC (wafer) terminals. They are used as relay substrates to mechanically and electrically connect the probe and PCB in the probe card.
USD4480.00
Add To Cart
Global LTCC Ceramic Substrates for Probe Cards Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030
28 Apr 2024
Electronics & Semiconductor
LTCC Ceramic Substrates for Probe Cards
IC testing packages require increased size and greater precision in silicon wafer pad positioning to reduce the number of tests. These test tool ceramic packages are used in running electrical tests with probes (needles) brought into contact with IC (wafer) terminals. They are used as relay substrates to mechanically and electrically connect the probe and PCB in the probe card.
USD3480.00
Add To Cart
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With better results and higher quality products,Our professional reports can achieve four things:
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Search For: LTCC Ceramic Substrates for Probe Cards
Total: 2 records, 1 pages
IC testing packages require increased size and greater precision in silicon wafer pad positioning to reduce the number of tests. These test tool ceramic packages are used in running electrical tests with probes (needles) brought into contact with IC (wafer) terminals. They are used as relay substrates to mechanically and electrically connect the probe and PCB in the probe card.
USD4480.00
Add To Cart
IC testing packages require increased size and greater precision in silicon wafer pad positioning to reduce the number of tests. These test tool ceramic packages are used in running electrical tests with probes (needles) brought into contact with IC (wafer) terminals. They are used as relay substrates to mechanically and electrically connect the probe and PCB in the probe card.
USD3480.00
Add To Cart
Popular Product Keywords
- We Provide Professional, Accurate Market Analysis to Help You Stay Ahead of Your Competition.Speak to our analyst >>
Our Clients
What We Can Provide?
With better results and higher quality products,Our professional reports can achieve four things:
-
Insight into the industry market information
-
Analyze market development needs
-
Prospects for future development
-
Develop industry investment strategy
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