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Total: 2 records, 1 pages

Global LTCC Ceramic Substrates for Semiconductor Equipment Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

date 07 May 2024

date Electronics & Semiconductor

new_biaoQian LTCC Ceramic Substrates for Semiconductor Equipment

IC testing packages require increased size and greater precision in silicon wafer pad positioning to reduce the number of tests. These test tool ceramic packages are used in running electrical tests with probes (needles) brought into contact with IC (wafer) terminals. They are used as relay substrates to mechanically and electrically connect the probe and PCB in the probe card.

USD3480.00

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Global LTCC Ceramic Substrates for Semiconductor Equipment Supply, Demand and Key Producers, 2024-2030

date 07 May 2024

date Electronics & Semiconductor

new_biaoQian LTCC Ceramic Substrates for Semiconductor Equipment

IC testing packages require increased size and greater precision in silicon wafer pad positioning to reduce the number of tests. These test tool ceramic packages are used in running electrical tests with probes (needles) brought into contact with IC (wafer) terminals. They are used as relay substrates to mechanically and electrically connect the probe and PCB in the probe card.

USD4480.00

Add To Cart

Add To Cart

industry 07 May 2024

industry Electronics & Semiconductor

new_biaoQian LTCC Ceramic Substrates for Semiconductor Equipment

IC testing packages require increased size and greater precision in silicon wafer pad positioning to reduce the number of tests. These test tool ceramic packages are used in running electrical tests with probes (needles) brought into contact with IC (wafer) terminals. They are used as relay substrates to mechanically and electrically connect the probe and PCB in the probe card.

USD3480.00

addToCart

Add To Cart

industry 07 May 2024

industry Electronics & Semiconductor

new_biaoQian LTCC Ceramic Substrates for Semiconductor Equipment

IC testing packages require increased size and greater precision in silicon wafer pad positioning to reduce the number of tests. These test tool ceramic packages are used in running electrical tests with probes (needles) brought into contact with IC (wafer) terminals. They are used as relay substrates to mechanically and electrically connect the probe and PCB in the probe card.

USD4480.00

addToCart

Add To Cart