Category
All
New Technology
Service & Software
Internet & Communication
Electronics & Semiconductor
Pharma & Healthcare
Other
Energy & Power
Agriculture
Consumer Goods
Machinery & Equipment
Food & Beverages
Medical Care
Automobile & Transportation
Packaging
Chemical & Material
Medical Devices & Consumables
Category
All
Total: 5 records, 1 pages
Search For: LTCC and HTCC
Global LTCC and HTCC Supply, Demand and Key Producers, 2024-2030
07 May 2024
Electronics & Semiconductor
The global LTCC and HTCC market size is expected to reach $ 7076 million by 2030, rising at a market growth of 5.3% CAGR during the forecast period (2024-2030).
USD4480.00
Add To Cart
Global LTCC and HTCC Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030
07 May 2024
Electronics & Semiconductor
According to our (Global Info Research) latest study, the global LTCC and HTCC market size was valued at US$ 4961 million in 2023 and is forecast to a readjusted size of USD 7076 million by 2030 with a CAGR of 5.3% during review period.
USD3480.00
Add To Cart
Global LTCC and HTCC Market 2023 by Manufacturers, Regions, Type and Application, Forecast to 2029
29 Jun 2023
Electronics & Semiconductor
According to our (Global Info Research) latest study, the global LTCC and HTCC market size was valued at USD 4713.1 million in 2022 and is forecast to a readjusted size of USD 6706.3 million by 2029 with a CAGR of 5.2% during review period.
USD3480.00
Add To Cart
Global LTCC and HTCC Supply, Demand and Key Producers, 2023-2029
29 Jun 2023
Electronics & Semiconductor
The global LTCC and HTCC market size is expected to reach $ 6706.3 million by 2029, rising at a market growth of 5.2% CAGR during the forecast period (2023-2029).
USD4480.00
Add To Cart
Global LTCC and HTCC Market 2023 by Company, Regions, Type and Application, Forecast to 2029
18 Mar 2023
Electronics & Semiconductor
HTCC Substrate means High Temperature Co-fired Ceramics Substrate, that is a kind of multilayer ceramic substrate obtained by co-firing a ceramic with a metal pattern such as tungsten or molybdenum which as a high melting point property. Generally, the fired temperature of HTCC substrate is 1500 to 1600 C. HTCC substrate provides the properties of high strength, good heat dissipation, high reliability. The technology is also used for a multi-layer packaging for the electronics industry, such as military electronics, MEMS, microprocessor and RF applications.
USD3480.00
Add To Cart
Popular Product Keywords
Our Clients
What We Can Provide?
With better results and higher quality products,Our professional reports can achieve four things:
Insight into the industry market information
Analyze market development needs
Prospects for future development
Develop industry investment strategy
Search For: LTCC and HTCC
Total: 5 records, 1 pages
The global LTCC and HTCC market size is expected to reach $ 7076 million by 2030, rising at a market growth of 5.3% CAGR during the forecast period (2024-2030).
USD4480.00
Add To Cart
According to our (Global Info Research) latest study, the global LTCC and HTCC market size was valued at US$ 4961 million in 2023 and is forecast to a readjusted size of USD 7076 million by 2030 with a CAGR of 5.3% during review period.
USD3480.00
Add To Cart
According to our (Global Info Research) latest study, the global LTCC and HTCC market size was valued at USD 4713.1 million in 2022 and is forecast to a readjusted size of USD 6706.3 million by 2029 with a CAGR of 5.2% during review period.
USD3480.00
Add To Cart
The global LTCC and HTCC market size is expected to reach $ 6706.3 million by 2029, rising at a market growth of 5.2% CAGR during the forecast period (2023-2029).
USD4480.00
Add To Cart
HTCC Substrate means High Temperature Co-fired Ceramics Substrate, that is a kind of multilayer ceramic substrate obtained by co-firing a ceramic with a metal pattern such as tungsten or molybdenum which as a high melting point property. Generally, the fired temperature of HTCC substrate is 1500 to 1600 C. HTCC substrate provides the properties of high strength, good heat dissipation, high reliability. The technology is also used for a multi-layer packaging for the electronics industry, such as military electronics, MEMS, microprocessor and RF applications.
USD3480.00
Add To Cart
Popular Product Keywords
- We Provide Professional, Accurate Market Analysis to Help You Stay Ahead of Your Competition.Speak to our analyst >>
Our Clients
What We Can Provide?
With better results and higher quality products,Our professional reports can achieve four things:
-
Insight into the industry market information
-
Analyze market development needs
-
Prospects for future development
-
Develop industry investment strategy
- Digging deeper into global industry information and providing market strategies.Contact Us >>