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Total: 5 records, 1 pages

Global LTCC and HTCC Supply, Demand and Key Producers, 2024-2030

date 07 May 2024

date Electronics & Semiconductor

new_biaoQian LTCC and HTCC

The global LTCC and HTCC market size is expected to reach $ 7076 million by 2030, rising at a market growth of 5.3% CAGR during the forecast period (2024-2030).

USD4480.00

Add To Cart

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Global LTCC and HTCC Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

date 07 May 2024

date Electronics & Semiconductor

new_biaoQian LTCC and HTCC

According to our (Global Info Research) latest study, the global LTCC and HTCC market size was valued at US$ 4961 million in 2023 and is forecast to a readjusted size of USD 7076 million by 2030 with a CAGR of 5.3% during review period.

USD3480.00

Add To Cart

Add To Cart

Global LTCC and HTCC Market 2023 by Manufacturers, Regions, Type and Application, Forecast to 2029

date 29 Jun 2023

date Electronics & Semiconductor

new_biaoQian LTCC and HTCC

According to our (Global Info Research) latest study, the global LTCC and HTCC market size was valued at USD 4713.1 million in 2022 and is forecast to a readjusted size of USD 6706.3 million by 2029 with a CAGR of 5.2% during review period.

USD3480.00

Add To Cart

Add To Cart

Global LTCC and HTCC Supply, Demand and Key Producers, 2023-2029

date 29 Jun 2023

date Electronics & Semiconductor

new_biaoQian LTCC and HTCC

The global LTCC and HTCC market size is expected to reach $ 6706.3 million by 2029, rising at a market growth of 5.2% CAGR during the forecast period (2023-2029).

USD4480.00

Add To Cart

Add To Cart

Global LTCC and HTCC Market 2023 by Company, Regions, Type and Application, Forecast to 2029

date 18 Mar 2023

date Electronics & Semiconductor

new_biaoQian LTCC and HTCC

HTCC Substrate means High Temperature Co-fired Ceramics Substrate, that is a kind of multilayer ceramic substrate obtained by co-firing a ceramic with a metal pattern such as tungsten or molybdenum which as a high melting point property. Generally, the fired temperature of HTCC substrate is 1500 to 1600 C. HTCC substrate provides the properties of high strength, good heat dissipation, high reliability. The technology is also used for a multi-layer packaging for the electronics industry, such as military electronics, MEMS, microprocessor and RF applications.

USD3480.00

Add To Cart

Add To Cart

industry 07 May 2024

industry Electronics & Semiconductor

new_biaoQian LTCC and HTCC

The global LTCC and HTCC market size is expected to reach $ 7076 million by 2030, rising at a market growth of 5.3% CAGR during the forecast period (2024-2030).

USD4480.00

addToCart

Add To Cart

industry 07 May 2024

industry Electronics & Semiconductor

new_biaoQian LTCC and HTCC

According to our (Global Info Research) latest study, the global LTCC and HTCC market size was valued at US$ 4961 million in 2023 and is forecast to a readjusted size of USD 7076 million by 2030 with a CAGR of 5.3% during review period.

USD3480.00

addToCart

Add To Cart

industry 29 Jun 2023

industry Electronics & Semiconductor

new_biaoQian LTCC and HTCC

According to our (Global Info Research) latest study, the global LTCC and HTCC market size was valued at USD 4713.1 million in 2022 and is forecast to a readjusted size of USD 6706.3 million by 2029 with a CAGR of 5.2% during review period.

USD3480.00

addToCart

Add To Cart

industry 29 Jun 2023

industry Electronics & Semiconductor

new_biaoQian LTCC and HTCC

The global LTCC and HTCC market size is expected to reach $ 6706.3 million by 2029, rising at a market growth of 5.2% CAGR during the forecast period (2023-2029).

USD4480.00

addToCart

Add To Cart

industry 18 Mar 2023

industry Electronics & Semiconductor

new_biaoQian LTCC and HTCC

HTCC Substrate means High Temperature Co-fired Ceramics Substrate, that is a kind of multilayer ceramic substrate obtained by co-firing a ceramic with a metal pattern such as tungsten or molybdenum which as a high melting point property. Generally, the fired temperature of HTCC substrate is 1500 to 1600 C. HTCC substrate provides the properties of high strength, good heat dissipation, high reliability. The technology is also used for a multi-layer packaging for the electronics industry, such as military electronics, MEMS, microprocessor and RF applications.

USD3480.00

addToCart

Add To Cart