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Total: 2 records, 1 pages

Global Liquid Encapsulant for Flip Chip Packaging Supply, Demand and Key Producers, 2024-2030

date 16 May 2024

date Chemical & Material

new_biaoQian Liquid Encapsulant for Flip Chip Packaging

Liquid encapsulants are much more flexible than traditional Epoxy mold compounds, removing the need for expensive molding machines and molding plates. This way, they allow manufacturers to produce smaller and and more flexible batches, making the products better suited for diverse low quantity orders.

USD4480.00

Add To Cart

Add To Cart

Global Liquid Encapsulant for Flip Chip Packaging Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

date 16 May 2024

date Chemical & Material

new_biaoQian Liquid Encapsulant for Flip Chip Packaging

Liquid encapsulants are much more flexible than traditional Epoxy mold compounds, removing the need for expensive molding machines and molding plates. This way, they allow manufacturers to produce smaller and and more flexible batches, making the products better suited for diverse low quantity orders.

USD3480.00

Add To Cart

Add To Cart

industry 16 May 2024

industry Chemical & Material

new_biaoQian Liquid Encapsulant for Flip Chip Packaging

Liquid encapsulants are much more flexible than traditional Epoxy mold compounds, removing the need for expensive molding machines and molding plates. This way, they allow manufacturers to produce smaller and and more flexible batches, making the products better suited for diverse low quantity orders.

USD4480.00

addToCart

Add To Cart

industry 16 May 2024

industry Chemical & Material

new_biaoQian Liquid Encapsulant for Flip Chip Packaging

Liquid encapsulants are much more flexible than traditional Epoxy mold compounds, removing the need for expensive molding machines and molding plates. This way, they allow manufacturers to produce smaller and and more flexible batches, making the products better suited for diverse low quantity orders.

USD3480.00

addToCart

Add To Cart