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Total: 3 records, 1 pages

Global Low Pressure Molding with Polyamides Supply, Demand and Key Producers, 2024-2030

date 20 Feb 2024

date Chemical & Material

new_biaoQian Low Pressure Molding with Polyamides

The global Low Pressure Molding with Polyamides market size is expected to reach $ 571.9 million by 2030, rising at a market growth of -0.4% CAGR during the forecast period (2024-2030).

USD4480.00

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Global Low Pressure Molding with Polyamides Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

date 02 Jan 2024

date Chemical & Material

new_biaoQian Low Pressure Molding with Polyamides

According to our (Global Info Research) latest study, the global Low Pressure Molding with Polyamides market size was valued at USD 587.4 million in 2023 and is forecast to a readjusted size of USD 571.9 million by 2030 with a CAGR of -0.4% during review period.

USD3480.00

Add To Cart

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Global Low Pressure Molding with Polyamides Market 2023 by Manufacturers, Regions, Type and Application, Forecast to 2029

date 18 Mar 2023

date Chemical & Material

new_biaoQian Low Pressure Molding with Polyamides

Low pressure molding with polyamides is a process typically used to encapsulate and environmentally protect electronic components (such as circuit boards). The purpose is to protect electronics against moisture, dust dirt and vibration. It is also used for sealing connectors and molding grommets and strain reliefs.

USD3480.00

Add To Cart

Add To Cart

industry 20 Feb 2024

industry Chemical & Material

new_biaoQian Low Pressure Molding with Polyamides

The global Low Pressure Molding with Polyamides market size is expected to reach $ 571.9 million by 2030, rising at a market growth of -0.4% CAGR during the forecast period (2024-2030).

USD4480.00

addToCart

Add To Cart

industry 02 Jan 2024

industry Chemical & Material

new_biaoQian Low Pressure Molding with Polyamides

According to our (Global Info Research) latest study, the global Low Pressure Molding with Polyamides market size was valued at USD 587.4 million in 2023 and is forecast to a readjusted size of USD 571.9 million by 2030 with a CAGR of -0.4% during review period.

USD3480.00

addToCart

Add To Cart

industry 18 Mar 2023

industry Chemical & Material

new_biaoQian Low Pressure Molding with Polyamides

Low pressure molding with polyamides is a process typically used to encapsulate and environmentally protect electronic components (such as circuit boards). The purpose is to protect electronics against moisture, dust dirt and vibration. It is also used for sealing connectors and molding grommets and strain reliefs.

USD3480.00

addToCart

Add To Cart