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Total: 2 records, 1 pages
Search For: Metal Shell for Microelectronic Packages
Global Metal Shell for Microelectronic Packages Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030
02 Jan 2024
Packaging
Metal Shell for Microelectronic Packages
According to our (Global Info Research) latest study, the global Metal Shell for Microelectronic Packages market size was valued at USD 2051.9 million in 2023 and is forecast to a readjusted size of USD 2038.2 million by 2030 with a CAGR of -0.1% during review period.
USD3480.00
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Global Metal Shell for Microelectronic Packages Market 2023 by Manufacturers, Regions, Type and Application, Forecast to 2029
18 Mar 2023
Packaging
Metal Shell for Microelectronic Packages
Metal is still the main material of electronic packaging because of its advantages such as good mechanical strength, good thermal conductivity, electromagnetic shielding function and convenient machining. Metal packaging refers to the metal as the main material of the tube shell, directly or indirectly through the substrate to install the chip on the tube seat, with a lead wire connected to the internal and external circuit of an electronic packaging form. It is widely used in the packaging of hybrid circuits, mainly for military, civil and customized special airtight packaging, among which, it has been widely used in the military and aerospace fields. The various forms of metal packaging and flexible processing can be integrated with some components (such as hybrid integrated A/D or D/A converters), suitable for low I/O single chip and multi-chip applications, RF, microwave, optoelectronic, surface acoustic wave and high power devices, can meet the requirements of small batch, high reliability. In addition, in order to solve the problem of packaging heat dissipation, all kinds of packaging also mostly use metal as heat sink and heat sink.
USD3480.00
Add To Cart
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Search For: Metal Shell for Microelectronic Packages
Total: 2 records, 1 pages
According to our (Global Info Research) latest study, the global Metal Shell for Microelectronic Packages market size was valued at USD 2051.9 million in 2023 and is forecast to a readjusted size of USD 2038.2 million by 2030 with a CAGR of -0.1% during review period.
USD3480.00
Add To Cart
Metal is still the main material of electronic packaging because of its advantages such as good mechanical strength, good thermal conductivity, electromagnetic shielding function and convenient machining. Metal packaging refers to the metal as the main material of the tube shell, directly or indirectly through the substrate to install the chip on the tube seat, with a lead wire connected to the internal and external circuit of an electronic packaging form. It is widely used in the packaging of hybrid circuits, mainly for military, civil and customized special airtight packaging, among which, it has been widely used in the military and aerospace fields. The various forms of metal packaging and flexible processing can be integrated with some components (such as hybrid integrated A/D or D/A converters), suitable for low I/O single chip and multi-chip applications, RF, microwave, optoelectronic, surface acoustic wave and high power devices, can meet the requirements of small batch, high reliability. In addition, in order to solve the problem of packaging heat dissipation, all kinds of packaging also mostly use metal as heat sink and heat sink.
USD3480.00
Add To Cart
Popular Product Keywords
- We Provide Professional, Accurate Market Analysis to Help You Stay Ahead of Your Competition.Speak to our analyst >>
Our Clients
What We Can Provide?
With better results and higher quality products,Our professional reports can achieve four things:
-
Insight into the industry market information
-
Analyze market development needs
-
Prospects for future development
-
Develop industry investment strategy
-
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