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Total: 2 records, 1 pages

Global Plating for Microelectronics Market 2024 by Company, Regions, Type and Application, Forecast to 2030

date 02 Jan 2024

date Electronics & Semiconductor

new_biaoQian Plating for Microelectronics

According to our (Global Info Research) latest study, the global Plating for Microelectronics market size was valued at USD million in 2023 and is forecast to a readjusted size of USD million by 2030 with a CAGR of % during review period.

USD3480.00

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Global Plating for Microelectronics Market 2023 by Company, Regions, Type and Application, Forecast to 2029

date 18 Mar 2023

date Electronics & Semiconductor

new_biaoQian Plating for Microelectronics

Metal plating (also known as electroplating or electrodeposition) is a coating technology that deposits a thin later of a metal or alloy on a conductive surface to impart particular functional or aesthetic properties. During the plating process, the object to be plated functions as the positively charged cathode while the desired plating material serves as the negatively charged anode and source of the metallic ions that will form the final coating. Immersing both materials in a bath or solution of electrolyte salts and adding an electrical current causes an oxidation/reduction reaction on the surface of the cathode where the metallic ions are deposited.

USD3480.00

Add To Cart

Add To Cart

industry 02 Jan 2024

industry Electronics & Semiconductor

new_biaoQian Plating for Microelectronics

According to our (Global Info Research) latest study, the global Plating for Microelectronics market size was valued at USD million in 2023 and is forecast to a readjusted size of USD million by 2030 with a CAGR of % during review period.

USD3480.00

addToCart

Add To Cart

industry 18 Mar 2023

industry Electronics & Semiconductor

new_biaoQian Plating for Microelectronics

Metal plating (also known as electroplating or electrodeposition) is a coating technology that deposits a thin later of a metal or alloy on a conductive surface to impart particular functional or aesthetic properties. During the plating process, the object to be plated functions as the positively charged cathode while the desired plating material serves as the negatively charged anode and source of the metallic ions that will form the final coating. Immersing both materials in a bath or solution of electrolyte salts and adding an electrical current causes an oxidation/reduction reaction on the surface of the cathode where the metallic ions are deposited.

USD3480.00

addToCart

Add To Cart