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Total: 2 records, 1 pages

Global Power Module Packaging Materials Supply, Demand and Key Producers, 2024-2030

date 11 Jun 2024

date Electronics & Semiconductor

new_biaoQian Power Module Packaging Materials

This report studies the Power Module Packaging Materials, include Encapsulation (Silicone Gel and Epoxy), Die Attach (soldering, sintering), ceramic substrates (DBC and AMB), Baseplate (copper, ALSiC, Thermal Interface Materials (crease, PCM), Electrical Interconnection (aluminum-based and copper-based).

USD4480.00

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Global Power Module Packaging Materials Market 2024 by Company, Regions, Type and Application, Forecast to 2030

date 11 Jun 2024

date Electronics & Semiconductor

new_biaoQian Power Module Packaging Materials

This report studies the Power Module Packaging Materials, include Encapsulation (Silicone Gel and Epoxy), Die Attach (soldering, sintering), ceramic substrates (DBC and AMB), Baseplate (copper, ALSiC, Thermal Interface Materials (crease, PCM), Electrical Interconnection (aluminum-based and copper-based).

USD3480.00

Add To Cart

Add To Cart

industry 11 Jun 2024

industry Electronics & Semiconductor

new_biaoQian Power Module Packaging Materials

This report studies the Power Module Packaging Materials, include Encapsulation (Silicone Gel and Epoxy), Die Attach (soldering, sintering), ceramic substrates (DBC and AMB), Baseplate (copper, ALSiC, Thermal Interface Materials (crease, PCM), Electrical Interconnection (aluminum-based and copper-based).

USD4480.00

addToCart

Add To Cart

industry 11 Jun 2024

industry Electronics & Semiconductor

new_biaoQian Power Module Packaging Materials

This report studies the Power Module Packaging Materials, include Encapsulation (Silicone Gel and Epoxy), Die Attach (soldering, sintering), ceramic substrates (DBC and AMB), Baseplate (copper, ALSiC, Thermal Interface Materials (crease, PCM), Electrical Interconnection (aluminum-based and copper-based).

USD3480.00

addToCart

Add To Cart