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Total: 2 records, 1 pages
Search For: QFN Chip Packaging Tape
Global QFN Chip Packaging Tape Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030
24 Oct 2024
Electronics & Semiconductor
QFN chip packaging tape is a protective tape with excellent adhesion performance and high temperature resistance, used for fixing and protecting semiconductor chip packaging, with no residue after removal. Applied in the packaging process of QFN and other semiconductor chips, used to fix lead frames and prevent leakage of plastic packaging materials; High temperature protection, temporary fixation, shielding, chips, and thin films that require precise protection in electronic processes.
USD3480.00
Add To Cart
Global QFN Chip Packaging Tape Supply, Demand and Key Producers, 2024-2030
24 Oct 2024
Electronics & Semiconductor
QFN chip packaging tape is a protective tape with excellent adhesion performance and high temperature resistance, used for fixing and protecting semiconductor chip packaging, with no residue after removal. Applied in the packaging process of QFN and other semiconductor chips, used to fix lead frames and prevent leakage of plastic packaging materials; High temperature protection, temporary fixation, shielding, chips, and thin films that require precise protection in electronic processes.
USD4480.00
Add To Cart
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With better results and higher quality products,Our professional reports can achieve four things:
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Search For: QFN Chip Packaging Tape
Total: 2 records, 1 pages
QFN chip packaging tape is a protective tape with excellent adhesion performance and high temperature resistance, used for fixing and protecting semiconductor chip packaging, with no residue after removal. Applied in the packaging process of QFN and other semiconductor chips, used to fix lead frames and prevent leakage of plastic packaging materials; High temperature protection, temporary fixation, shielding, chips, and thin films that require precise protection in electronic processes.
USD3480.00
Add To Cart
QFN chip packaging tape is a protective tape with excellent adhesion performance and high temperature resistance, used for fixing and protecting semiconductor chip packaging, with no residue after removal. Applied in the packaging process of QFN and other semiconductor chips, used to fix lead frames and prevent leakage of plastic packaging materials; High temperature protection, temporary fixation, shielding, chips, and thin films that require precise protection in electronic processes.
USD4480.00
Add To Cart
Popular Product Keywords
- We Provide Professional, Accurate Market Analysis to Help You Stay Ahead of Your Competition.Speak to our analyst >>
Our Clients
What We Can Provide?
With better results and higher quality products,Our professional reports can achieve four things:
-
Insight into the industry market information
-
Analyze market development needs
-
Prospects for future development
-
Develop industry investment strategy
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