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Total: 2 records, 1 pages
Search For: Semiconductor Laser Cutting Machine
Global Semiconductor Laser Cutting Machine Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030
02 Jan 2024
Electronics & Semiconductor
Semiconductor Laser Cutting Machine
According to our (Global Info Research) latest study, the global Semiconductor Laser Cutting Machine market size was valued at USD million in 2023 and is forecast to a readjusted size of USD million by 2030 with a CAGR of % during review period.
USD3480.00
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Global Semiconductor Laser Cutting Machine Market 2023 by Manufacturers, Regions, Type and Application, Forecast to 2029
18 Mar 2023
Electronics & Semiconductor
Semiconductor Laser Cutting Machine
Laser cutting replaces traditional mechanical knives with invisible beams. It has the characteristics of high precision, fast cutting, not limited to cutting pattern restrictions, automatic typesetting to save materials, smooth incisions, and low processing costs. The semiconductor laser cutting machine is to focus the laser emitted from the laser into a high power density laser beam through the optical path system. The laser beam is irradiated on the surface of the workpiece, making the workpiece reach the melting point or boiling point, while the high-pressure gas coaxial with the beam blows the molten or vaporized metal away. With the movement of the relative position of the beam and the workpiece, the material is finally formed into a slit, so as to achieve the purpose of cutting.
USD3480.00
Add To Cart
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Search For: Semiconductor Laser Cutting Machine
Total: 2 records, 1 pages
According to our (Global Info Research) latest study, the global Semiconductor Laser Cutting Machine market size was valued at USD million in 2023 and is forecast to a readjusted size of USD million by 2030 with a CAGR of % during review period.
USD3480.00
Add To Cart
Laser cutting replaces traditional mechanical knives with invisible beams. It has the characteristics of high precision, fast cutting, not limited to cutting pattern restrictions, automatic typesetting to save materials, smooth incisions, and low processing costs. The semiconductor laser cutting machine is to focus the laser emitted from the laser into a high power density laser beam through the optical path system. The laser beam is irradiated on the surface of the workpiece, making the workpiece reach the melting point or boiling point, while the high-pressure gas coaxial with the beam blows the molten or vaporized metal away. With the movement of the relative position of the beam and the workpiece, the material is finally formed into a slit, so as to achieve the purpose of cutting.
USD3480.00
Add To Cart
Popular Product Keywords
- We Provide Professional, Accurate Market Analysis to Help You Stay Ahead of Your Competition.Speak to our analyst >>
Our Clients
What We Can Provide?
With better results and higher quality products,Our professional reports can achieve four things:
-
Insight into the industry market information
-
Analyze market development needs
-
Prospects for future development
-
Develop industry investment strategy
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