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Total: 3 records, 1 pages
Search For: SiN AMB Substrate
Global SiN AMB Substrate Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030
02 Jan 2024
Electronics & Semiconductor
According to our (Global Info Research) latest study, the global SiN AMB Substrate market size was valued at USD 136.4 million in 2023 and is forecast to a readjusted size of USD 1390.5 million by 2030 with a CAGR of 39.3% during review period.
USD3480.00
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Global SiN AMB Substrate Market 2023 by Manufacturers, Regions, Type and Application, Forecast to 2029
18 Mar 2023
Electronics & Semiconductor
Active Metal Brazing (AMB) is the latest developments in ceramic substrates and offers the ability to produce Heavy Copper with a AlN (Aluminium Nitride) or SiN (Silicon Nitride). The normal metallisation process is not used as AMB involves brazing pure copper on the ceramic in a high temperature vacuum brazing process. As well as offering a high reliability substrate with unique heat dissipation. The brazing technology also enables double sided copper weights of up to 800µm on thin ceramic substrates of just 0.25mm.
USD3480.00
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Global SiN AMB Substrate Supply, Demand and Key Producers, 2023-2029
11 Jan 2023
Electronics & Semiconductor
The global SiN AMB Substrate market size is expected to reach $ 1390.5 million by 2029, rising at a market growth of 39.3% CAGR during the forecast period (2023-2029).
USD4480.00
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Search For: SiN AMB Substrate
Total: 3 records, 1 pages
According to our (Global Info Research) latest study, the global SiN AMB Substrate market size was valued at USD 136.4 million in 2023 and is forecast to a readjusted size of USD 1390.5 million by 2030 with a CAGR of 39.3% during review period.
USD3480.00
Add To Cart
Active Metal Brazing (AMB) is the latest developments in ceramic substrates and offers the ability to produce Heavy Copper with a AlN (Aluminium Nitride) or SiN (Silicon Nitride). The normal metallisation process is not used as AMB involves brazing pure copper on the ceramic in a high temperature vacuum brazing process. As well as offering a high reliability substrate with unique heat dissipation. The brazing technology also enables double sided copper weights of up to 800µm on thin ceramic substrates of just 0.25mm.
USD3480.00
Add To Cart
The global SiN AMB Substrate market size is expected to reach $ 1390.5 million by 2029, rising at a market growth of 39.3% CAGR during the forecast period (2023-2029).
USD4480.00
Add To Cart
Popular Product Keywords
- We Provide Professional, Accurate Market Analysis to Help You Stay Ahead of Your Competition.Speak to our analyst >>
Our Clients
What We Can Provide?
With better results and higher quality products,Our professional reports can achieve four things:
-
Insight into the industry market information
-
Analyze market development needs
-
Prospects for future development
-
Develop industry investment strategy
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