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Total: 2 records, 1 pages

Global Solder Ball Packaging Material Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

date 02 Jan 2024

date Electronics & Semiconductor

new_biaoQian Solder Ball Packaging Material

According to our (Global Info Research) latest study, the global Solder Ball Packaging Material market size was valued at USD 249.3 million in 2023 and is forecast to a readjusted size of USD 380.4 million by 2030 with a CAGR of 6.2% during review period.

USD3480.00

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Global Solder Ball Packaging Material Supply, Demand and Key Producers, 2023-2029

date 27 Feb 2023

date Electronics & Semiconductor

new_biaoQian Solder Ball Packaging Material

In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules. The Solder Ball can be placed manually or by automated equipment, and are held in place with a tacky flux.

USD4480.00

Add To Cart

Add To Cart

industry 02 Jan 2024

industry Electronics & Semiconductor

new_biaoQian Solder Ball Packaging Material

According to our (Global Info Research) latest study, the global Solder Ball Packaging Material market size was valued at USD 249.3 million in 2023 and is forecast to a readjusted size of USD 380.4 million by 2030 with a CAGR of 6.2% during review period.

USD3480.00

addToCart

Add To Cart

industry 27 Feb 2023

industry Electronics & Semiconductor

new_biaoQian Solder Ball Packaging Material

In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules. The Solder Ball can be placed manually or by automated equipment, and are held in place with a tacky flux.

USD4480.00

addToCart

Add To Cart