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The global Thick-Film Hybrid Integrated Circuits market size is expected to reach $ 8059.6 million by 2030, rising at a market growth of 4.7% CAGR during the forecast period (2024-2030).

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According to our (Global Info Research) latest study, the global Thick-Film Hybrid Integrated Circuits market size was valued at USD 5847.8 million in 2023 and is forecast to a readjusted size of USD 8059.6 million by 2030 with a CAGR of 4.7% during review period.

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Thick film hybrid integrated circuit (THIC) is a kind of hybrid integrated circuit, which is made of passive network on the same substrate by thick film process such as screen printing and sintering, and then assembled with discrete semiconductor chip or monolithic integrated circuit or micro component, and then packaged. The characteristics of thick film hybrid integrated circuit: compared with discrete component circuit, hybrid integrated circuit has the characteristics of high density, high reliability and better electrical performance; compared with PCB Compared with monolithic integrated circuit, it is flexible in design, simple in process, convenient in production of many varieties and small batch, and has wide parameter range, high precision, and can withstand high voltage and large output In terms of digital circuits, although semiconductor integrated circuits give full play to the characteristics of miniaturization, high reliability and large-scale low-cost production, thick film hybrid integrated circuits still maintain their advantages over semiconductor integrated circuits in many aspects, such as low-noise circuits, high-stability passive networks, high-frequency linear circuits High precision linear circuit, microwave circuit, high-voltage circuit, high-power circuit and mixed analog-to-digital circuit.

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